STMicroelectronics MIS2DHTR Ultra-low-power high-performance 3-axis accelerometer Datasheet

MIS2DH
MEMS digital output motion sensor:
ultra-low-power high-performance 3-axis accelerometer
Datasheet - production data
Description
The MIS2DH is an ultra-low-power highperformance three-axis linear accelerometer with
digital I2C/SPI serial interface standard output.
LGA-12 (2.0x2.0x1 mm)
The MIS2DH has user-selectable full scales of
2g/±4g/8g/16g and is capable of measuring
accelerations with output data rates from 1 Hz to
5.3 kHz.
Features
 Wide supply voltage, 1.71 V to 3.6 V
 Independent IOs supply (1.8 V) and supply
voltage compatible
 Ultra-low power consumption down to 2 μA
 2g/±4g/8g/16g selectable full scales
 I2C/SPI digital output interface
 3 operating modes: low-power, normal, highresolution mode
 2 independent programmable interrupt
generators for free-fall and motion detection
 6D/4D orientation detection
 Motion detection & free-fall detection
 “Sleep-to-wake” and “return-to-sleep” functions
 Embedded FIFO
The MIS2DH is a device that has been conceived
for medical and healthcare applications whenever
the sensor itself is not used as a life-sustaining
component.
The device may be configured to generate
interrupt signals by two independent inertial
wake-up/free-fall events as well as by the position
of the device itself.
The self-test capability allows the user to check
the functionality of the sensor in the final
application.
The MIS2DH is available in a small thin plastic
land grid array package (LGA) and is guaranteed
to operate over an extended temperature range
from -40 °C to +85 °C.
 Embedded self-test
Table 1. Device summary
 Embedded temperature sensor

ECOPACK®,
RoHS and “Green” compliant
Applications
Order
codes
Temperature
range [C]
Package
Packaging
MIS2DHTR
-40 to +85
LGA-12
Tape and
reel
 Activity monitoring and posture detection in
medical and healthcare applications, including
body-implantable products
 Remote patient monitoring and man-down
alerts
 Diagnostic and treatment positioning
equipment
 General motion-activated functions in the
medical domain
September 2015
This is information on a product in full production.
DocID027506 Rev 2
1/49
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Contents
MIS2DH
Contents
1
2
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 10
2.1
Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4
Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.1
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.2
I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.6
Terminology and functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.6.1
Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.6.2
Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3
High-resolution, normal mode, low-power mode . . . . . . . . . . . . . . . . . . 16
2.6.4
Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6.5
6D / 4D orientation detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6.6
“Sleep-to-wake” and “Return-to-sleep” . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.7
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.8
IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.9
Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.10
FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.11
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1
4
2.6.3
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1
FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1.1
2/49
Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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4.1.2
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1.3
Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1.4
Stream-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1.5
Retrieving data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1
I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.1
5.2
I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.2.1
SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2.2
SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.3
SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6
Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7
Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.1
STATUS_REG_AUX (07h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.2
OUT_TEMP_L (0Ch), OUT_TEMP_H (0Dh) . . . . . . . . . . . . . . . . . . . . . . 32
7.3
INT_COUNTER_REG (0Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.4
WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.5
TEMP_CFG_REG (1Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.6
CTRL_REG1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.7
CTRL_REG2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.8
CTRL_REG3 (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.9
CTRL_REG4 (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.10
CTRL_REG5 (24h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.11
CTRL_REG6 (25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.12
REFERENCE/DATACAPTURE (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.13
STATUS_REG (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.14
OUT_X_L (28h), OUT_X_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7.15
OUT_Y_L (2Ah), OUT_Y_H (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7.16
OUT_Z_L (2Ch), OUT_Z_H (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7.17
FIFO_CTRL_REG (2Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7.18
FIFO_SRC_REG (2Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7.19
INT1_CFG (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
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8
MIS2DH
7.20
INT1_SRC (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.21
INT1_THS (32h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.22
INT1_DURATION (33h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.23
INT2_CFG (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.24
INT2_SRC (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7.25
INT2_THS (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.26
INT2_DURATION (37h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.27
CLICK_CFG (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.28
CLICK_SRC (39h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.29
CLICK_THS (3Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.30
TIME_LIMIT (3Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.31
TIME_LATENCY (3Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.32
TIME_WINDOW (3Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.33
Act_THS (3Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.34
Act_DUR (3Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
8.1
9
4/49
LGA package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
DocID027506 Rev 2
MIS2DH
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Operating mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Turn-on time for operating mode transition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Current consumption of operating modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
I2C terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SAD+read/write patterns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Transfer when master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Transfer when master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Transfer when master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 25
Transfer when master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 25
Register address map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
STATUS_REG_AUX register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
STATUS_REG_AUX description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
INT_COUNTER_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
WHO_AM_I register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TEMP_CFG_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TEMP_CFG_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
CTRL_REG1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
CTRL_REG1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Data rate configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
CTRL_REG2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
CTRL_REG2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
High-pass filter mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Low-power mode - high-pass filter cutoff frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
CTRL_REG3 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
CTRL_REG3 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
CTRL_REG4 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
CTRL_REG4 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Self-test mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG5 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG5 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG6 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG6 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
REFERENCE/DATACAPTURE register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
REFERENCE/DATACAPTURE description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
STATUS_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
STATUS_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
FIFO_CTRL_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIFO_CTRL_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIFO mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
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List of tables
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
6/49
MIS2DH
FIFO_SRC_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIFO_SRC_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
INT1_CFG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
INT1_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
INT1_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
INT1_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
INT1_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
INT1_THS description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
INT1_DURATION register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
INT1_DURATION description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
INT2_CFG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
INT2_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
INT2_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
INT2_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
INT2_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
INT2_THS description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
INT2_DURATION register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
INT2_DURATION description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
CLICK_CFG register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
CLICK_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
CLICK_SRC register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
CLICK_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
CLICK_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
CLICK_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
TIME_LIMIT register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
TIME_LIMIT description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
TIME_LATENCY register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
TIME_LATENCY description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
TIME_WINDOW register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
TIME_WINDOW description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Act_THS register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Act_THS description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Act_DUR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Act_DUR description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
DocID027506 Rev 2
MIS2DH
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
MIS2DH electrical connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Multiple byte SPI read protocol (2-byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Multiple byte SPI write protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
LGA-12 package outline and mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
DocID027506 Rev 2
7/49
49
Block diagram and pin description
MIS2DH
1
Block diagram and pin description
1.1
Block diagram
Figure 1. Block diagram
;
&+$5*(
$03/,),(5
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=
D
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1.2
Pin description
9GGB,2 723 9,(:
DocID027506 Rev 2
6& /63&
*1'
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8/49
&6
5(6
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=
,17
Figure 2. Pin connections
6'$6',6'2
MIS2DH
Block diagram and pin description
Table 2. Pin description
Pin#
Name
1
SCL
SPC
Function
I2C serial clock (SCL)
SPI serial port clock (SPC)
SPI enable
2
CS
I2C/SPI mode selection:
1: SPI idle mode / I2C communication enabled
0: SPI communication mode / I2C disabled
3
SDO
SA0
SPI serial data output (SDO)
I2C less significant bit of the device address (SA0)
4
SDA
SDI
SDO
I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
5
Res
Connect to GND
6
GND
0 V supply
7
GND
0 V supply
8
GND
0 V supply
9
Vdd
Power supply
10
Vdd_IO
11
INT2
Interrupt pin 2
12
INT1
Interrupt pin 1
Power supply for I/O pins
DocID027506 Rev 2
9/49
49
Mechanical and electrical specifications
MIS2DH
2
Mechanical and electrical specifications
2.1
Mechanical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted(a)
Table 3. Mechanical characteristics
Symbol
FS
So
Parameter
Measurement range(3)
Sensitivity
Test conditions
Min.(1)
Typ.(2)
FS bits set to 00
±2.0
FS bits set to 01
±4.0
FS bits set to 10
±8.0
FS bits set to 11
±16.0
Max.(1)
g
FS bits set to 00;
Normal mode
3.52
3.91
4.30
FS bits set to 00;
High-resolution mode
0.88
0.98
1.07
FS bits set to 00;
Low-power mode
14.06
15.63
17.19
FS bits set to 01;
Normal mode
7.03
7.81
8.59
FS bits set to 01;
High-resolution mode
1.76
1.95
2.15
FS bits set to 01;
Low-power mode
28.13
31.25
34.38
FS bits set to 10;
Normal mode
14.06
15.63
17.19
FS bits set to 10;
High-resolution mode
3.52
3.91
4.30
FS bits set to 10;
Low-power mode
56.25
62.50
68.75
FS bits set to 11;
Normal mode
42.25
46.95
51.64
FS bits set to 11;
High-resolution mode
10.55
11.72
12.90
FS bits set to 11;
Low-power mode
169.81
188.68
207.55
TCSo
Sensitivity change vs.
FS bits set to 00
temperature
TyOff
Typical zero-g level
offset accuracy(4)
FS bits set to 00
±0.01
-90
±40
Unit
mg/digit
mg/digit
mg/digit
mg/digit
%/°C
+90
a. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
10/49
DocID027506 Rev 2
mg
MIS2DH
Mechanical and electrical specifications
Table 3. Mechanical characteristics (continued)
Symbol
TCOff
Vst
Top
Parameter
Min.(1)
Test conditions
Zero-g level change
vs. temperature
Typ.(2)
Max delta from 25 °C
Max.(1)
±0.5
Unit
mg/°C
FS bits set to 00
X-axis; Normal mode
17
360
LSb
FS bits set to 00
Self-test
output change(5) (6) (7) Y-axis; Normal mode
17
360
LSb
FS bits set to 00
Z-axis; Normal mode
17
360
LSb
-40
+85
°C
Operating
temperature range
1. Minimum and maximum values are based on characterization data and are not guaranteed
2. Typical specifications are not guaranteed.
3. Verified by wafer level test and measurement of initial offset and sensitivity.
4. Typical zero-g level offset value after factory calibration test at socket level.
5. The sign of “Self-test output change” is defined by the ST bit in CTRL_REG4 (23h), for all axes.
6. “Self-test output change” is defined as the absolute value of:
OUTPUT[LSb](Self test enabled) - OUTPUT[LSb](Self test disabled). 1LSb = 4 mg at 10-bit representation, ±2 g full scale
7. After enabling the ST bit, correct data is obtained after two samples (low-power mode / normal mode) or after eight samples
(high-resolution mode).
2.2
Temperature sensor characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted(b)
Table 4. Temperature sensor characteristics
Symbol
Parameter
TSDr
Temperature sensor output
change vs. temperature
TODR
Temperature refresh rate
Top
Operating temperature range
Min.
-40
Typ.(1)
Max.
Unit
1
digit/°C(2)
ODR(3)
Hz
+85
°C
1. Typical specifications are not guaranteed.
2. 8-bit resolution.
3. Refer to Table 28.
b. The product is factory calibrated at 2.5 V. Temperature sensor operation is guaranteed in the range 2 V - 3.6 V.
DocID027506 Rev 2
11/49
49
Mechanical and electrical specifications
2.3
MIS2DH
Electrical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted(c)
Table 5. Electrical characteristics
Symbol
Vdd
Vdd_IO
Parameter
Test conditions
Supply voltage
I/O pins supply voltage
(2)
Min.
Typ.(1)
Max.
Unit
1.71
2.5
3.6
V
Vdd+0.1
V
1.71
Idd
Current consumption
in normal mode
50 Hz ODR
11
μA
Idd
Current consumption
in normal mode
1 Hz ODR
2
μA
IddLP
Current consumption
in low-power mode
50 Hz ODR
6
μA
IddPdn
Current consumption
in power-down mode
0.5
μA
VIH
Digital high-level input voltage
VIL
Digital low-level input voltage
VOH
High-level output voltage
VOL
Low-level output voltage
Top
Operating temperature range
0.8*Vdd_IO
V
0.2*Vdd_IO
0.9*Vdd_IO
-40
V
0.1*Vdd_IO
V
+85
°C
1. Typical specification are not guaranteed.
2. It is possible to remove Vdd, maintaining Vdd_IO without blocking the communication busses, in this condition the
measurement chain is powered off.
c. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
12/49
DocID027506 Rev 2
V
MIS2DH
Mechanical and electrical specifications
2.4
Communication interface characteristics
2.4.1
SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 6. SPI slave timing values
Value (1)
Symbol
Parameter
Unit
Min
tc(SPC)
SPI clock cycle
fc(SPC)
SPI clock frequency
tsu(CS)
CS setup time
5
th(CS)
CS hold time
20
tsu(SI)
SDI input setup time
5
th(SI)
SDI input hold time
15
tv(SO)
SDO valid output time
th(SO)
SDO output hold time
tdis(SO)
SDO output disable time
Max
100
ns
10
MHz
ns
50
5
50
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
Figure 3. SPI slave timing diagram
&6
WF 63&
WVX &6
63&
WVX 6,
6',
WK 6,
/6%,1
06%,1
WY 62
6'2
WK &6
WGLV 62
WK 62
06%287
/6%287
1. When no communication is ongoing, data on SDO is driven by internal pull-up resistors.
Note:
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output
ports.
DocID027506 Rev 2
13/49
49
Mechanical and electrical specifications
MIS2DH
I2C - inter-IC control interface
2.4.2
Subject to general operating conditions for Vdd and top.
Table 7. I2C slave timing values
Symbol
f(SCL)
I2C standard mode (1)
Parameter
SCL clock frequency
I2C fast mode (1)
Min
Max
Min
Max
0
100
0
400
tw(SCLL)
SCL clock low time
4.7
1.3
tw(SCLH)
SCL clock high time
4.0
0.6
tsu(SDA)
SDA setup time
250
100
th(SDA)
SDA data hold time
0
th(ST)
START condition hold time
4
0.6
tsu(SR)
Repeated START condition
setup time
4.7
0.6
tsu(SP)
STOP condition setup time
4
0.6
4.7
1.3
tw(SP:SR)
Bus free time between STOP
and START condition
3.45
ns
0.9
Figure 4. I2C slave timing diagram
5(3($7('
67$57
67$57
WVX 65
67$57
WZ 6365
WK 6'$
WVX 63
6723
6&/
WK 67
Note:
14/49
WZ 6&//
WZ 6&/+
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
DocID027506 Rev 2
μs
μs
1. Data based on standard I2C protocol requirement, not tested in production.
WVX 6'$
kHz
μs
0
6'$
Unit
MIS2DH
2.5
Mechanical and electrical specifications
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8. Absolute maximum ratings
Symbol
Vdd
Vdd_IO
Vin
Note:
Ratings
Maximum value
Unit
Supply voltage
-0.3 to 4.8
V
Supply voltage on I/O pins
-0.3 to 4.8
V
-0.3 to Vdd_IO +0.3
V
Input voltage on any control pin
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)
APOW
Acceleration (any axis, powered, Vdd = 2.5 V)
AUNP
Acceleration (any axis, unpowered)
3000 g for 0.5 ms
10000 g for 0.1 ms
3000 g for 0.5 ms
10000 g for 0.1 ms
TOP
Operating temperature range
-40 to +85
°C
TSTG
Storage temperature range
-40 to +125
°C
ESD
Electrostatic discharge protection (HBM)
2
kV
Supply voltage on any pin should never exceed 4.8 V
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can
cause permanent damage to the part.
DocID027506 Rev 2
15/49
49
Mechanical and electrical specifications
2.6
MIS2DH
Terminology and functionality
Terminology
2.6.1
Sensitivity
Sensitivity describes the gain of the sensor and can be determined by applying 1 g
acceleration to it. As the sensor can measure DC accelerations, this can be done easily by
pointing the axis of interest towards the center of the Earth, noting the output value, rotating
the sensor by 180 degrees (pointing to the sky) and noting the output value again. By doing
so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This
value changes very little over temperature and time. The sensitivity tolerance describes the
range of sensitivities of a large population of sensors.
2.6.2
Zero-g level
The zero-g level offset (TyOff) describes the deviation of an actual output signal from the
ideal output signal if no acceleration is present. A sensor in a steady state on a horizontal
surface will measure 0 g for the X-axis and 0 g for the Y-axis whereas the Z-axis will
measure 1 g. The output is ideally in the middle of the dynamic range of the sensor (content
of OUT registers 00h, data expressed as two’s complement number). A deviation from the
ideal value in this case is called zero-g offset. Offset is to some extent a result of stress to
the MEMS sensor and therefore the offset can slightly change after mounting the sensor on
a printed circuit board or exposing it to extensive mechanical stress. Offset changes little
over temperature, see Table 3 “Zero-g level change vs. temperature” (TCOff). The zero-g
level tolerance (TyOff) describes the standard deviation of the range of zero-g levels of a
population of sensors.
Functionality
2.6.3
High-resolution, normal mode, low-power mode
The MIS2DH provides three different operating modes: high-resolution mode, normal mode
and low-power mode.
The table below summarizes how to select the different operating modes.
Table 9. Operating mode selection
Operating mode
16/49
CTRL_REG1[3] CTRL_REG4[3]
BW [Hz]
Turn-on
time [ms]
So @ ±2 g
(LPen bit)
(HR bit)
Low-power mode
(8-bit data output)
1
0
ODR/2
1
16
Normal mode
(10-bit data output)
0
0
ODR/2
1.6
4
High-resolution mode
(12-bit data output)
0
1
ODR/9
7/ODR
1
Not allowed
1
1
--
--
--
DocID027506 Rev 2
[mg/digit]
MIS2DH
Mechanical and electrical specifications
The turn-on time to transition to another operating mode is given in Table 10.
Table 10. Turn-on time for operating mode transition
Turn-on time
Operating mode change
[ms]
12-bit mode to 8-bit mode
1/ODR
12-bit mode to 10-bit mode
1/ODR
10-bit mode to 8-bit mode
1/ODR
10-bit mode to 12-bit mode
7/ODR
8-bit mode to 10-bit mode
1/ODR
8-bit mode to 12-bit mode
7/ODR
Table 11. Current consumption of operating modes
Operating mode [Hz]
2.6.4
High resolution
Normal mode
Low-power mode
(8-bit data output) (10-bit data output) (12-bit data output)
[μA]
[μA]
[μA]
1
2
2
2
10
3
4
4
25
4
6
6
50
6
11
11
100
10
20
20
200
18
38
38
400
36
73
73
1344
--
185
185
1620
100
--
--
5376
185
--
--
Self-test
The self-test allows the user to check the sensor functionality without moving it. When the
self-test is enabled, an actuation force is applied to the sensor, simulating a definite input
acceleration. In this case the sensor outputs will exhibit a change in their DC levels which
are related to the selected full scale through the device sensitivity. When the self-test is
activated, the device output level is given by the algebraic sum of the signals produced by
the acceleration acting on the sensor and by the electrostatic test-force. If the output signals
change within the amplitude specified inside Table 3, then the sensor is working properly
and the parameters of the interface chip are within the defined specifications.
2.6.5
6D / 4D orientation detection
The MIS2DH includes 6D / 4D orientation detection.
DocID027506 Rev 2
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Mechanical and electrical specifications
MIS2DH
6D / 4D orientation recognition
In this configuration the interrupt is generated when the device is stable in a known
direction. In 4D configuration, detection of the position of the Z-axis is disabled.
2.6.6
“Sleep-to-wake” and “Return-to-sleep”
The MIS2DH can be programmed to automatically switch to low-power mode upon
recognition of a determined event.
Once the event condition is over, the device returns back to the preset normal or highresolution mode.
To enable this function the desired threshold value must be stored inside the Act_THS (3Eh)
register while the duration value is written inside the Act_DUR (3Fh) register.
When the acceleration falls below the threshold value, the device automatically switches to
low-power mode (10Hz ODR).
During this condition, the ODR[3:0] bits and the LPen bit inside CTRL_REG1 (20h) and the
HR bit in CTRL_REG3 (22h) are not considered.
As soon as the acceleration rises above threshold, the module restores the operating mode
and ODRs as determined by the CTRL_REG1 (20h) and CTRL_REG3 (22h) settings.
2.7
Sensing element
A proprietary process is used to create a surface micromachined accelerometer. The
technology processes suspended silicon structures which are attached to the substrate in a
few points called anchors and are free to move in the direction of the sensed acceleration.
To be compatible with traditional packaging techniques, a cap is placed on top of the
sensing element to avoid blocking the moving parts during the molding phase of the plastic
encapsulation.
When an acceleration is applied to the sensor, the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the capacitor.
At steady state the nominal value of the capacitors are a few pF and when an acceleration is
applied, the maximum variation of the capacitive load is in the fF range.
2.8
IC interface
The complete measurement chain is composed of a low-noise capacitive amplifier which
converts the capacitive unbalance of the MEMS sensor into an analog voltage that will be
available to the user through an analog-to-digital converter.
The acceleration data may be accessed through an I2C/SPI interface, thus making the
device particularly suitable for direct interfacing with a microcontroller.
The MIS2DH features a data-ready signal (DRDY) which indicates when a new set of
measured acceleration data is available, thus simplifying data synchronization in the digital
system that uses the device.
The MIS2DH may also be configured to generate an inertial wake-up and free-fall interrupt
signal according to a programmed acceleration event along the enabled axes. Both free-fall
and wake-up can be available simultaneously on two different pins.
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2.9
Mechanical and electrical specifications
Factory calibration
The IC interface is factory calibrated for sensitivity (So) and zero-g level (TyOff).
The trim values are stored inside the device in non-volatile memory. Any time the device is
turned on, these values are downloaded into the registers to be used during active
operation. This allows using the device without further calibration.
2.10
FIFO
The MIS2DH contains a 10-bit, 32-level FIFO. Buffered output allows the following operation
modes: FIFO, Stream, Stream-to-FIFO and FIFO bypass. When FIFO bypass mode is
activated, FIFO is not operating and remains empty. In FIFO mode, measurement data from
acceleration detection on the x, y, and z axes are stored in the FIFO buffer.
2.11
Temperature sensor
The MIS2DH is supplied with an internal temperature sensor. Temperature data can be
enabled by setting the TEMP_EN[1:0] bits to ‘1’ in the TEMP_CFG_REG (1Fh) register.
To retrieve the temperature sensor data the BDU bit in CTRL_REG4 (23h) must be set to ‘1’.
Both the OUT_TEMP_L (0Ch), OUT_TEMP_H (0Dh) registers must be read.
Temperature data is stored inside OUT_TEMP_H as two’s complement data in 8-bit format
left-justified.
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Application hints
3
MIS2DH
Application hints
Figure 5. MIS2DH electrical connections
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The device core is supplied through the Vdd line while the I/O pads are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 μF aluminum) should
be placed as near as possible to pin 9 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5). It is possible to remove Vdd while maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I2C or SPI interfaces. When using the I2C, CS must be tied high.
The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be
completely programmed by the user through the I2C/SPI interface.
3.1
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
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Digital main blocks
4
Digital main blocks
4.1
FIFO
The MIS2DH embeds a 32-level FIFO for each of the three output channels, X, Y and Z.
This allows consistent power saving for the system, since the host processor does not need
to continuously poll data from the sensor, but it can wake up only when needed and burst
the significant data out from the FIFO.
In order to enable the FIFO buffer, the FIFO_EN bit in CTRL_REG5 (24h) must be set to ‘1’.
This buffer can work according to the following different modes: Bypass mode, FIFO mode,
Stream mode and Stream-to-FIFO mode. Each mode is selected by the FM [1:0] bits in
FIFO_CTRL_REG (2Eh). Programmable FIFO watermark level, FIFO empty or FIFO
overrun events can be enabled to generate dedicated interrupts on the INT1 pin
(configuration through CTRL_REG3 (22h)).
In the FIFO_SRC_REG (2Fh) register the EMPTY bit is equal to ‘1’ when all FIFO samples
are ready and FIFO is empty.
In the FIFO_SRC_REG (2Fh) register the WTM bit goes to ‘1’ if new data is written in the
buffer and FIFO_SRC_REG (2Fh) (FSS [4:0]) is greater than or equal to FIFO_CTRL_REG
(2Eh) (FTH [4:0]). FIFO_SRC_REG (2Fh) (WTM) goes to ‘0’ if reading an X, Y, Z data slot
from FIFO and FIFO_SRC_REG (2Fh) (FSS [4:0]) is less than or equal to
FIFO_CTRL_REG (2Eh) (FTH [4:0]).
In the FIFO_SRC_REG (2Fh) register the OVRN_FIFO bit is equal to ‘1’ if the FIFO slot is
overwritten.
4.1.1
Bypass mode
In Bypass mode the FIFO is not operational and for this reason it remains empty. For each
channel only the first address is used. The remaining FIFO levels are empty.
Bypass mode must be used in order to reset the FIFO buffer when a different mode is
operating (i.e. FIFO mode).
4.1.2
FIFO mode
In FIFO mode, the buffer continues filling data from the X, Y and Z accelerometer channels
until it is full (a set of 32 samples stored). When the FIFO is full, it stops collecting data from
the input channels and the FIFO content remains unchanged.
An overrun interrupt can be enabled, I1_OVERRUN = '1' in the CTRL_REG3 (22h) register,
in order to be raised when the FIFO stops collecting data. When the overrun interrupt
occurs, the first data has been overwritten and the FIFO stops collecting data from the input
channels.
After the last read it is necessary to exit Bypass mode in order to reset the FIFO content.
After this reset command, it is possible to restart FIFO mode just by selecting the FIFO
mode configuration (FM[1:0] bits) in register FIFO_CTRL_REG (2Eh).
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Digital main blocks
4.1.3
MIS2DH
Stream mode
In Stream mode the FIFO continues filling data from the X, Y, and Z accelerometer channels
until the buffer is full (a set of 32 samples stored) at which point the FIFO buffer index
restarts from the beginning and older data is replaced by the current data. The oldest values
continue to be overwritten until a read operation frees the FIFO slots.
An overrun interrupt can be enabled, I1_OVERRUN = '1' in the CTRL_REG3 (22h) register,
in order to read the entire contents of the FIFO at once. If, in the application, it is mandatory
not to lose data and it is not possible to read at least one sample for each axis within one
ODR period, a watermark interrupt can be enabled in order to read partially the FIFO and
leave memory slots free for incoming data.
Setting the FTH [4:0] bit in the FIFO_CTRL_REG (2Eh) register to an N value, the number
of X, Y and Z data samples that should be read at the rise of the watermark interrupt is up to
(N+1).
4.1.4
Stream-to-FIFO mode
In Stream-to-FIFO mode, data from the X, Y and Z accelerometer channels are collected in
a combination of Stream mode and FIFO mode. The FIFO buffer starts operating in Stream
mode and switches to FIFO mode when the selected interrupt occurs.
The FIFO operating mode changes according to the INT1 pin value if the TR bit is set to ‘0’
in the FIFO_CTRL_REG (2Eh) register or the INT2 pin value if the TR bit is set to‘1’ in the
FIFO_CTRL_REG (2Eh) register.
When the interrupt pin is selected and the interrupt event is configured on the corresponding
pin, the FIFO operates in Stream mode if the pin value is equal to ‘0’ and it operates in FIFO
mode if the pin value is equal to ‘1’. Switching modes is dynamically performed according to
the pin value.
Stream-to-FIFO can be used in order to analyze the sampling history that generates an
interrupt. The standard operation is to read the contents of FIFO when the FIFO mode is
triggered and the FIFO buffer is full and stopped.
4.1.5
Retrieving data from FIFO
FIFO data is read from OUT_X_L (28h), OUT_X_H (29h), OUT_Y_L (2Ah), OUT_Y_H
(2Bh) and OUT_Z_L (2Ch), OUT_Z_H (2Dh). When the FIFO is in Stream, Stream-to-FIFO
or FIFO mode, a read operation to the OUT_X_L (28h), OUT_X_H (29h), OUT_Y_L (2Ah),
OUT_Y_H (2Bh) or OUT_Z_L (2Ch), OUT_Z_H (2Dh) registers provides the data stored in
the FIFO. Each time data is read from the FIFO, the oldest X, Y and Z data are placed in the
OUT_X_L (28h), OUT_X_H (29h), OUT_Y_L (2Ah), OUT_Y_H (2Bh) and OUT_Z_L (2Ch),
OUT_Z_H (2Dh) registers and both single read and read-burst operations can be used.
The address to be read is automatically updated by the device and it rolls back to 0x28
when register 0x2D is reached. In order to read all FIFO levels in a multiple byte read,
192 bytes (6 output registers of 32 levels) have to be read.
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5
Digital interfaces
Digital interfaces
The registers embedded inside the MIS2DH may be accessed through both the I2C and SPI
serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire
interface mode.
The serial interfaces are mapped to the same pads. To select/exploit the I2C interface, the
CS line must be tied high (i.e. connected to Vdd_IO).
Table 12. Serial interface pin description
Pin name
CS
5.1
Pin description
SPI enable
I2C/SPI mode selection:
1: SPI idle mode / I2C communication enabled
0: SPI communication mode / I2C disabled
SCL
SPC
I2C serial clock (SCL)
SPI serial port clock (SPC)
SDA
SDI
SDO
I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
SA0
SDO
I2C less significant bit of the device address (SA0)
SPI serial data output (SDO)
I2C serial interface
The MIS2DH I2C is a bus slave. The I2C is employed to write data into registers whose
content can also be read back.
The relevant I2C terminology is given in the table below.
Table 13. I2C terminology
Term
Transmitter
Receiver
Description
The device which sends data to the bus
The device which receives data from the bus
Master
The device which initiates a transfer, generates clock signals and terminates a
transfer
Slave
The device addressed by the master
There are two signals associated with the I2C bus: the serial clock line (SCL) and the serial
data line (SDA). The latter is a bidirectional line used for sending and receiving data to/from
the interface. Both the lines must be connected to Vdd_IO through an external pull-up
resistor. When the bus is free, both the lines are high.
The I2C interface is compliant with fast mode (400 kHz) I2C standards as well as with the
normal mode.
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Digital interfaces
5.1.1
MIS2DH
I2C operation
The transaction on the bus is started through a START (ST) signal. A START condition is
defined as a high-to-low transition on the data line while the SCL line is held HIGH. After this
has been transmitted by the master, the bus is considered busy. The next byte of data
transmitted after the start condition contains the address of the slave in the first 7 bits and
the eighth bit tells whether the master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits
after a start condition with its address. If they match, the device considers itself addressed
by the master.
The Slave ADdress (SAD) associated to the MIS2DH is 001100xb. The SDO/SA0 pad can
be used to modify the less significant bit of the device address. If the SA0 pad is connected
to the voltage supply, LSb is ‘1’ (address 0011001b), else if the SA0 pad is connected to
ground, the LSb value is ‘0’ (address 0011000b). This solution permits to connect and
address two different accelerometers to the same I2C lines.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line
during the acknowledge pulse. The receiver must then pull the data line LOW so that it
remains stable low during the HIGH period of the acknowledge clock pulse. A receiver
which has been addressed is obliged to generate an acknowledge after each byte of data
received.
The I2C embedded inside the MIS2DH behaves like a slave device and the following
protocol must be adhered to. After the start condition (ST) a slave address is sent, once a
slave acknowledge (SAK) has been returned, an 8-bit sub-address (SUB) is transmitted: the
7 LSb represent the actual register address while the MSB enables address auto increment.
If the MSb of the SUB field is ‘1’, the SUB (register address) is automatically increased to
allow multiple data read/writes.
The slave address is completed with a Read/Write bit. If the bit was ‘1’ (Read), a repeated
START (SR) condition must be issued after the two sub-address bytes; if the bit is ‘0’ (Write)
the master will transmit to the slave with direction unchanged. Table 14 explains how the
SAD+read/write bit pattern is composed, listing all the possible configurations.
Table 14. SAD+read/write patterns
Command
SAD[6:1]
SAD[0] = SA0
R/W
SAD+R/W
Read
001100
0
1
00110001 (31h)
Write
001100
0
0
00110000 (30h)
Read
001100
1
1
00110011 (33h)
Write
001100
1
0
00110010 (32h)
Table 15. Transfer when master is writing one byte to slave
Master
Slave
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ST
SAD + W
SUB
SAK
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SAK
SP
SAK
MIS2DH
Digital interfaces
Table 16. Transfer when master is writing multiple bytes to slave
Master
ST
SAD + W
SUB
Slave
SAK
DATA
DATA
SAK
SP
SAK
SAK
Table 17. Transfer when master is receiving (reading) one byte of data from slave
Master
ST
SAD + W
Slave
SUB
SAK
SR
SAD + R
SAK
NMAK
SAK
SP
DATA
Table 18. Transfer when master is receiving (reading) multiple bytes of data from slave
Master
Slave
ST
SAD+W
SUB
SAK
SR SAD+R
SAK
MAK
SAK DATA
MAK
DATA
NMAK
SP
DATA
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL low to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function) the data line must be left HIGH by
the slave. The master can then abort the transfer. A low-to-high transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the
address of the first register to be read.
In the presented communication format MAK is Master acknowledge and NMAK is No
Master Acknowledge.
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Digital interfaces
5.2
MIS2DH
SPI bus interface
The MIS2DH SPI is a bus slave. The SPI allows writing to and reading from the registers of
the device.
The serial interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO.
Figure 6. Read and write protocol
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CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the serial port clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and
SDO are respectively the serial port data input and output. These lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in case of multiple read/write bytes. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0)
from the device is read. In the latter case, the chip will drive SDO at the start of bit 8.
bit 1: MS bit. When 0, the address will remain unchanged in multiple read/write commands.
When 1, the address is auto incremented in multiple read/write commands.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands further blocks of 8 clock periods will be added. When the
MS bit is ‘0’, the address used to read/write data remains the same for every block. When
the MS bit is ‘1’, the address used to read/write data is increased at every block.
The function and the behavior of SDI and SDO remain unchanged.
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5.2.1
Digital interfaces
SPI read
Figure 7. SPI read protocol
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The SPI read command is performed with 16 clock pulses. A multiple byte read command is
performed by adding blocks of 8 clock pulses to the previous one.
bit 0: READ bit. The value is 1.
bit 1: MS bit. When 0, does not increment the address, when 1, increments the address in
multiple reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb
first).
bit 16-... : data DO(...-8). Further data in multiple byte reads.
Figure 8. Multiple byte SPI read protocol (2-byte example)
CS
SPC
SDI
RW
M S A D5 A D4 AD 3 A D2 A D1 A D0
SD O
DO 7 DO 6 DO 5 DO 4 DO 3 DO 2 DO 1 DO 0 DO 15 DO 14 DO 13 DO 12 DO 11 DO 10 D O9 D O8
AM10131V1
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Digital interfaces
5.2.2
MIS2DH
SPI write
Figure 9. SPI write protocol
CS
SPC
SDI
D I7
RW
D I6
D I5
D I4
DI3
DI2
DI1
DI0
MS AD5 AD 4 AD 3 AD2 AD 1 AD0
AM10132V1
The SPI write command is performed with 16 clock pulses. A multiple byte write command
is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1: MS bit. When 0, does not increment the address, when 1, increments the address in
multiple writes.
bit 2 -7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb
first).
bit 16-... : data DI(...-8). Further data in multiple byte writes.
Figure 10. Multiple byte SPI write protocol (2-byte example)
CS
SPC
SDI
DI7 D I6 DI5 D I4 DI3 DI2 DI1 DI0 DI15 D I1 4 DI13 D I1 2 DI11 DI10 DI9 DI8
RW
MS AD5 AD4 AD3 AD2 AD1 AD 0
AM10133V1
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5.2.3
Digital interfaces
SPI read in 3-wire mode
3-wire mode is entered by setting bit SIM (SPI serial interface mode selection) to ‘1’ in
CTRL_REG4 (23h).
Figure 11. SPI read protocol in 3-wire mode
CS
SPC
SDI/O
D O7 D O6 D O5 DO4 DO3 DO2 DO1 DO0
RW
MS
AD5
AD 4 AD 3 AD2 AD1
AD 0
AM10134V1
The SPI read command is performed with 16 clock pulses.
bit 0: READ bit. The value is 1.
bit 1: MS bit. When 0, does not increment the address, when 1, increments the address in
multiple reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
The multiple read command is also available in 3-wire mode.
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Register mapping
6
MIS2DH
Register mapping
The table given below provides a listing of the 8-bit registers embedded in the device and
the corresponding addresses.
Table 19. Register address map
Register address
Name
Type
Default
Hex
Reserved
00 - 06
Reserved
STATUS_REG_AUX
r
07
Reserved
r
08-0B
OUT_TEMP_L
r
0C
000 1100
Output
OUT_TEMP_H
r
0D
000 1101
Output
INT_COUNTER_REG
r
0E
000 1110
WHO_AM_I
r
0F
000 1111 00110011 Dummy register
Reserved
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Comment
Binary
000 0111
Reserved
10 - 1E
Reserved
TEMP_CFG_REG
rw
1F
001 1111
CTRL_REG1
rw
20
010 0000 00000111
CTRL_REG2
rw
21
010 0001 00000000
CTRL_REG3
rw
22
010 0010 00000000
CTRL_REG4
rw
23
010 0011 00000000
CTRL_REG5
rw
24
010 0100 00000000
CTRL_REG6
rw
25
010 0101 00000000
REFERENCE/DATACAPTURE
rw
26
010 0110 00000000
STATUS_REG
r
27
010 0111 00000000
OUT_X_L
r
28
010 1000
Output
OUT_X_H
r
29
010 1001
Output
OUT_Y_L
r
2A
010 1010
Output
OUT_Y_H
r
2B
010 1011
Output
OUT_Z_L
r
2C
010 1100
Output
OUT_Z_H
r
2D
010 1101
Output
FIFO_CTRL_REG
rw
2E
010 1110 00000000
FIFO_SRC_REG
r
2F
010 1111
INT1_CFG
rw
30
011 0000 00000000
INT1_SRC
r
31
011 0001 00000000
INT1_THS
rw
32
011 0010 00000000
INT1_DURATION
rw
33
011 0011 00000000
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MIS2DH
Register mapping
Table 19. Register address map (continued)
Register address
Name
Type
Default
Hex
Comment
Binary
INT2_CFG
rw
34
011 0100 00000000
INT2_SRC
r
35
011 0101 00000000
INT2_THS
rw
36
011 0110 00000000
INT2_DURATION
rw
37
011 0111 00000000
CLICK_CFG
rw
38
011 1000 00000000
CLICK_SRC
r
39
011 1001 00000000
CLICK_THS
rw
3A
011 1010 00000000
TIME_LIMIT
rw
3B
011 1011 00000000
TIME_LATENCY
rw
3C
011 1100 00000000
TIME_WINDOW
rw
3D
011 1101 00000000
Act_THS
rw
3E
011 1110 00000000
Act_DUR
rw
3F
011 1111 00000000
Registers marked as Reserved or not listed in the table above must not be changed. Writing
to those registers may cause permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
The boot procedure is complete about 5 milliseconds after device power-up.
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Register description
MIS2DH
7
Register description
7.1
STATUS_REG_AUX (07h)
Table 20. STATUS_REG_AUX register
--
TOR
--
--
--
TDA
--
--
Table 21. STATUS_REG_AUX description
7.2
TOR
Temperature data overrun. Default value: 0
(0: no overrun has occurred;
1: new temperature data has overwritten the previous data)
TDA
Temperature new data available. Default value: 0
(0: new temperature data is not yet available;
1: new temperature data is available)
OUT_TEMP_L (0Ch), OUT_TEMP_H (0Dh)
Temperature sensor data. Refer to Section 2.11: Temperature sensor for details on how to
enable and read the temperature sensor output data.
7.3
INT_COUNTER_REG (0Eh)
Table 22. INT_COUNTER_REG register
IC7
7.4
IC6
IC5
IC4
IC3
IC2
IC1
IC0
WHO_AM_I (0Fh)
Device identification register.
Table 23. WHO_AM_I register
0
7.5
0
1
1
0
0
1
1
0
0
TEMP_CFG_REG (1Fh)
Table 24. TEMP_CFG_REG register
TEMP_EN1 TEMP_EN0
0
0
0
0
Table 25. TEMP_CFG_REG description
TEMP_EN[1:0]
32/49
Temperature sensor (T) enable. Default value: 00
(00: T disabled; 11: T enabled)
DocID027506 Rev 2
MIS2DH
7.6
Register description
CTRL_REG1 (20h)
Table 26. CTRL_REG1 register
ODR3
ODR2
ODR1
ODR0
LPen
Zen
Yen
Xen
Table 27. CTRL_REG1 description
ODR[3:0]
Data rate selection. Default value: 0000
(0000: power-down mode; others: refer to Table 28)
LPen
Low-power mode enable. Default value: 0
(0: normal mode, 1: low-power mode)
(Refer to section 2.6.3: High-resolution, normal mode, low-power mode)
Zen
Z-axis enable. Default value: 1
(0: Z-axis disabled; 1: Z-axis enabled)
Yen
Y-axis enable. Default value: 1
(0: Y-axis disabled; 1: Y-axis enabled)
Xen
X-axis enable. Default value: 1
(0: X-axis disabled; 1: X-axis enabled)
ODR[3:0] is used to set the power mode and ODR selection. The following table indicates
the frequency of each combination of ODR[3:0].
Table 28. Data rate configuration
ODR3
ODR2
ODR1
ODR0
Power mode selection
0
0
0
0
Power-down mode
0
0
0
1
HR / Normal / Low-power mode (1 Hz)
0
0
1
0
HR / Normal / Low-power mode (10 Hz)
0
0
1
1
HR / Normal / Low-power mode (25 Hz)
0
1
0
0
HR / Normal / Low-power mode (50 Hz)
0
1
0
1
HR / Normal / Low-power mode (100 Hz)
0
1
1
0
HR / Normal / Low-power mode (200 Hz)
0
1
1
1
HR/ Normal / Low-power mode (400 Hz)
1
0
0
0
Low-power mode (1.620 kHz)
1
0
0
1
HR/ Normal (1.344 kHz);
Low-power mode (5.376 kHz)
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49
Register description
7.7
MIS2DH
CTRL_REG2 (21h)
Table 29. CTRL_REG2 register
HPM1
HPM0
HPCF2
HPCF1
FDS
HPCLICK
HPIS2
HPIS1
Table 30. CTRL_REG2 description
HPM[1:0]
High-pass filter mode selection. Default value: 00
Refer to Table 31 for filter mode configuration
HPCF[2:1]
High-pass filter cutoff frequency selection. Refer to Table 32.
FDS
Filtered data selection. Default value: 0
(0: internal filter bypassed; 1: data from internal filter sent to output register and FIFO)
HPCLICK
High-pass filter enable for CLICK function.
(0: filter bypassed; 1: filter enabled)
HPIS2
High-pass filter enable for AOI function on Interrupt 2.
(0: filter bypassed; 1: filter enabled)
HPIS1
High-pass filter enable for AOI function on Interrupt 1.
(0: filter bypassed; 1: filter enabled)
Table 31. High-pass filter mode configuration
HPM1
HPM0
High-pass filter mode
0
0
Normal mode (reset by reading REFERENCE/DATACAPTURE (26h) register)
0
1
Reference signal for filtering
1
0
Normal mode
1
1
Autoreset on interrupt event
The bandwidth of the high-pass filter depends on the selected ODR and on the settings of
the HPCFx bits of CTRL_REG2. The high-pass filter cutoff frequencies (ft) are shown in
Table 32.
Table 32. Low-power mode - high-pass filter cutoff frequency
HPCF[2:1]
ft [Hz]
@ 1 Hz
00
0.02
0.2
0.5
1
2
4
8
32
100
01
0.008
0.08
0.2
0.5
1
2
4
16
50
10
0.004
0.04
0.1
0.2
0.5
1
2
8
25
11
0.002
0.02
0.05
0.1
0.2
0.5
1
4
12
34/49
ft [Hz]
ft [Hz]
ft [Hz]
@ 10 Hz @ 25 Hz @ 50 Hz
ft [Hz]
@ 100 Hz
DocID027506 Rev 2
ft [Hz]
ft [Hz]
ft [Hz]
@ 200Hz @ 400 Hz @ 1.6kHz
ft [Hz]
@ 5kHz
MIS2DH
7.8
Register description
CTRL_REG3 (22h)
Table 33. CTRL_REG3 register
I1_CLICK
I1_AOI1
I1_AOI2
I1_DRDY1
I1_DRDY2
I1_WTM
I1_OVERRUN
--
Table 34. CTRL_REG3 description
7.9
I1_CLICK
CLICK interrupt on INT1 pin. Default value 0.
(0: disable; 1: enable)
I1_AOI1
AOI1 interrupt on INT1 pin. Default value 0.
(0: disable; 1: enable)
I1_AOI2
AOI2 interrupt on INT1 pin. Default value 0.
(0: disable; 1: enable)
I1_DRDY1
DRDY1 interrupt on INT1 pin. Default value 0.
(0: disable; 1: enable)
I1_DRDY2
DRDY2 interrupt on INT1 pin. Default value 0.
(0: disable; 1: enable)
I1_WTM
FIFO watermark interrupt on INT1 pin. Default value 0.
(0: disable; 1: enable)
I1_OVERRUN
FIFO overrun interrupt on INT1 pin. Default value 0.
(0: disable; 1: enable)
CTRL_REG4 (23h)
Table 35. CTRL_REG4 register
BDU
BLE(1)
FS1
FS0
HR
ST1
ST0
SIM
1. The BLE function can be activated only in high-resolution mode
Table 36. CTRL_REG4 description
BDU
Block data update. Default value: 0
(0: continuous update; 1: output registers not updated until MSB and LSB
have been read)
BLE
Big/Little Endian data selection. Default value: 0
(0: data LSb at lower address; 1: data MSb at lower address)
The BLE function can be activated only in high-resolution mode
FS[1:0]
Full-scale selection. Default value: 00
(00: ±2 g; 01: ±4 g; 10: ±8 g; 11: ±16 g)
HR
Operating mode selection (refer to section 2.6.3: High-resolution, normal
mode, low-power mode)
ST[1:0]
Self-test enable. Default value: 00
(00: self-test disabled; other: see Table 37)
SIM
SPI serial interface mode selection. Default value: 0
(0: 4-wire interface; 1: 3-wire interface).
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49
Register description
MIS2DH
Table 37. Self-test mode configuration
ST1
7.10
ST0
Self-test mode
0
0
Normal mode
0
1
Self test 0
1
0
Self test 1
1
1
--
CTRL_REG5 (24h)
Table 38. CTRL_REG5 register
BOOT
FIFO_EN
--
--
LIR_INT1
D4D_INT1
LIR_INT2
D4D_INT2
Table 39. CTRL_REG5 description
7.11
BOOT
Reboot memory content. Default value: 0
(0: normal mode; 1: reboot memory content)
FIFO_EN
FIFO enable. Default value: 0
(0: FIFO disabled; 1: FIFO enabled)
LIR_INT1
Latch interrupt request on INT1_SRC (31h), with INT1_SRC (31h) register cleared
by reading INT1_SRC (31h) itself. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)
D4D_INT1
4D enable: 4D detection is enabled on INT1 pin when 6D bit on INT1_CFG (30h) is
set to 1.
LIR_INT2
Latch interrupt request on INT2_SRC (35h) register, with INT2_SRC (35h) register
cleared by reading INT2_SRC (35h) itself. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)
D4D_INT2
4D enable: 4D detection is enabled on INT2 pin when 6D bit on INT2_CFG (34h) is
set to 1.
CTRL_REG6 (25h)
Table 40. CTRL_REG6 register
I2_CLICKen I2_INT1
I2_INT2
BOOT_I2
P2_ACT
--
Table 41. CTRL_REG6 description
36/49
I2_CLICKen
Click interrupt on INT2 pin. Default value: 0
(0: disabled; 1: enabled)
I2_INT1
Interrupt 1 function enable on INT2 pin. Default value: 0
(0: function disabled; 1: function enabled)
DocID027506 Rev 2
H_LACTIVE
--
MIS2DH
Register description
Table 41. CTRL_REG6 description (continued)
7.12
I2_INT2
Interrupt 2 function enable on INT2 pin. Default value: 0
(0: function disabled; 1: function enabled)
BOOT_I2
Boot on INT2 pin enable. Default value: 0
(0: disabled; 1:enabled)
P2_ACT
Activity interrupt enable on INT2 pin. Default value: 0.
(0: disabled; 1:enabled)
H_LACTIVE
Interrupt active. Default value: 0.
(0: interrupt active-high; 1: interrupt active-low)
REFERENCE/DATACAPTURE (26h)
Table 42. REFERENCE/DATACAPTURE register
Ref7
Ref6
Ref5
Ref4
Ref3
Ref2
Ref1
Ref0
Table 43. REFERENCE/DATACAPTURE description
Ref [7:0]
7.13
Reference value for interrupt generation. Default value: 0
STATUS_REG (27h)
Table 44. STATUS_REG register
ZYXOR
ZOR
YOR
XOR
ZYXDA
ZDA
YDA
XDA
Table 45. STATUS_REG description
ZYXOR
X-, Y- and Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: a new set of data has overwritten the previous set)
ZOR
Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Z-axis has overwritten the previous data)
YOR
Y-axis data overrun. Default value: 0
(0: no overrun has occurred;
1: new data for the Y-axis has overwritten the previous data)
XOR
X-axis data overrun. Default value: 0
(0: no overrun has occurred;
1: new data for the X-axis has overwritten the previous data)
ZYXDA
X-, Y- and Z-axis new data available. Default value: 0
(0: a new set of data is not yet available; 1: a new set of data is available)
ZDA
Z-axis new data available. Default value: 0
(0: new data for the Z-axis is not yet available;
1: new data for the Z-axis is available)
YDA
Y-axis new data available. Default value: 0
(0: new data for the Y-axis is not yet available;
1: new data for the Y-axis is available)
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49
Register description
7.14
MIS2DH
OUT_X_L (28h), OUT_X_H (29h)
X-axis acceleration data. The value is expressed as two’s complement left-justified.
Please refer to Section 2.6.3: High-resolution, normal mode, low-power mode.
7.15
OUT_Y_L (2Ah), OUT_Y_H (2Bh)
Y-axis acceleration data. The value is expressed as two’s complement left-justified.
Please refer to Section 2.6.3: High-resolution, normal mode, low-power mode.
7.16
OUT_Z_L (2Ch), OUT_Z_H (2Dh)
Z-axis acceleration data. The value is expressed as two’s complement left-justified.
Please refer to Section 2.6.3: High-resolution, normal mode, low-power mode.
7.17
FIFO_CTRL_REG (2Eh)
Table 46. FIFO_CTRL_REG register
FM1
FM0
TR
FTH4
FTH3
FTH2
FTH1
FTH0
Table 47. FIFO_CTRL_REG description
FM[1:0]
FIFO mode selection. Default value: 00 (see Table 48)
TR
Trigger selection. Default value: 0
0: trigger event allows triggering signal on INT1
1: trigger event allows triggering signal on INT2
FTH[4:0]
Default value: 00000
Table 48. FIFO mode configuration
FM1
7.18
FM0
FIFO mode
0
0
Bypass mode
0
1
FIFO mode
1
0
Stream mode
1
1
Stream-to-FIFO mode
FIFO_SRC_REG (2Fh)
Table 49. FIFO_SRC_REG register
WTM
38/49
OVRN_FIFO
EMPTY
FSS4
DocID027506 Rev 2
FSS3
FSS2
FSS1
FSS0
MIS2DH
Register description
Table 50. FIFO_SRC_REG description
7.19
WTM
WTM bit is set high when FIFO content exceeds watermark level.
OVRN_FIFO
OVRN bit is set high when FIFO buffer is full; this means that the FIFO buffer
contains 32 unread samples. At the following ODR a new sample set replaces the
oldest FIFO value. The OVRN bit is set to 0 when the first sample set has been
read.
EMPTY
EMPTY flag is set high when all FIFO samples have been read and FIFO is empty.
FSS [4:0]
FSS [4:0] field always contains the current number of unread samples stored in the
FIFO buffer. When FIFO is enabled, this value increases at ODR frequency until
the buffer is full, whereas, it decreases every time one sample set is retrieved from
FIFO.
INT1_CFG (30h)
Table 51. INT1_CFG register
AOI
6D
ZHIE/
ZUPE
ZLIE/
ZDOWNE
YHIE/
YUPE
YLIE/
YDOWNE
XHIE/
XUPE
XLIE/
XDOWNE
Table 52. INT1_CFG description
AOI
And/Or combination of interrupt events. Default value: 0. Refer to Table 53
6D
6-direction detection function enabled. Default value: 0. Refer to Table 53
ZHIE/
ZUPE
Enable interrupt generation on Z high event or on direction recognition. Default value: 0
(0: disable interrupt request;1: enable interrupt request)
ZLIE/
Enable interrupt generation on Z low event or on direction recognition. Default value: 0
ZDOWNE (0: disable interrupt request;1: enable interrupt request)
YHIE/
YUPE
Enable interrupt generation on Y high event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request.)
YLIE/
Enable interrupt generation on Y low event or on direction recognition. Default value: 0
YDOWNE (0: disable interrupt request; 1: enable interrupt request.)
XHIE/
XUPE
Enable interrupt generation on X high event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request.)
XLIE/
Enable interrupt generation on X low event or on direction recognition. Default value: 0
XDOWNE (0: disable interrupt request; 1: enable interrupt request.)
The content of this register is loaded at boot.
A write operation to this address is possible only after system boot.
Table 53. Interrupt mode
AOI
6D
Interrupt mode
0
0
OR combination of interrupt events
0
1
6-direction movement recognition
1
0
AND combination of interrupt events
1
1
6-direction position recognition
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49
Register description
MIS2DH
The difference between AOI-6D = ‘01’ and AOI-6D = ‘11’.
AOI-6D = ‘01’ is movement recognition. An interrupt is generated when the orientation
moves from an unknown zone to a known zone. The interrupt signal remains for a duration
ODR.
AOI-6D = ‘11’ is direction recognition. An interrupt is generated when the orientation is
inside a known zone. The interrupt signal remains while the orientation is inside the zone.
7.20
INT1_SRC (31h)
Table 54. INT1_SRC register
0
IA
ZH
ZL
YH
YL
XH
XL
Table 55. INT1_SRC description
IA
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
ZH
Z high. Default value: 0
(0: no interrupt, 1: Z high event has occurred)
ZL
Z low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)
YH
Y high. Default value: 0
(0: no interrupt, 1: Y high event has occurred)
YL
Y low. Default value: 0
(0: no interrupt, 1: Y low event has occurred)
XH
X high. Default value: 0
(0: no interrupt, 1: X high event has occurred)
XL
X low. Default value: 0
(0: no interrupt, 1: X low event has occurred)
Interrupt 1 source register. Read-only register.
Reading at this address clears the INT1_SRC (31h) IA bit (and the interrupt signal on the
INT1 pin) and allows the refresh of data in the INT1_SRC (31h) register if the latched option
was chosen.
7.21
INT1_THS (32h)
Table 56. INT1_THS register
0
40/49
THS6
THS5
THS4
DocID027506 Rev 2
THS3
THS2
THS1
THS0
MIS2DH
Register description
Table 57. INT1_THS description
THS[6:0]
7.22
Interrupt 1 threshold. Default value: 000 0000
1 LSb = 16 mg @ FS = 2 g
1 LSb = 32 mg @ FS = 4 g
1 LSb = 62 mg @ FS = 8 g
1 LSb = 186 mg @ FS = 16 g
INT1_DURATION (33h)
Table 58. INT1_DURATION register
0
D6
D5
D4
D3
D2
D1
D0
Table 59. INT1_DURATION description
D[6:0]
Duration value. Default value: 000 0000
1 LSb = 1/ODR
The D[6:0] bits set the minimum duration of the interrupt 1 event to be recognized. Duration
steps and maximum values depend on the ODR chosen.
Duration time is measured in N/ODR, where N is the content of the duration register.
7.23
INT2_CFG (34h)
Table 60. INT2_CFG register
AOI
6D
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
Table 61. INT2_CFG description
AOI
AND/OR combination of interrupt events. Default value: 0
(see Table 62)
6D
6-direction detection function enabled. Default value: 0. Refer to Table 62.
ZHIE
Enable interrupt generation on Z high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
ZLIE
Enable interrupt generation on Z low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
YHIE
Enable interrupt generation on Y high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
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49
Register description
MIS2DH
Table 61. INT2_CFG description (continued)
YLIE
Enable interrupt generation on Y low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
XHIE
Enable interrupt generation on X high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
XLIE
Enable interrupt generation on X low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
The content of this register is loaded at boot.
A write operation to this address is possible only after system boot.
Table 62. Interrupt mode
AOI
6D
Interrupt mode
0
0
OR combination of interrupt events
0
1
6-direction movement recognition
1
0
AND combination of interrupt events
1
1
6-direction position recognition
The difference between AOI-6D = ‘01’ and AOI-6D = ‘11’.
AOI-6D = ‘01’ is movement recognition. An interrupt is generated when the orientation
moves from an unknown zone to a known zone. The interrupt signal remains for a duration
ODR.
AOI-6D = ‘11’ is direction recognition. An interrupt is generated when the orientation is
inside a known zone. The interrupt signal remains while the orientation is inside the zone.
7.24
INT2_SRC (35h)
Table 63. INT2_SRC register
0
IA
ZH
ZL
YH
YL
XH
XL
Table 64. INT2_SRC description
42/49
IA
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
ZH
Z high. Default value: 0
(0: no interrupt, 1: Z high event has occurred)
ZL
Z low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)
YH
Y high. Default value: 0
(0: no interrupt, 1: Y high event has occurred)
DocID027506 Rev 2
MIS2DH
Register description
Table 64. INT2_SRC description (continued)
YL
Y low. Default value: 0
(0: no interrupt, 1: Y low event has occurred)
XH
X high. Default value: 0
(0: no interrupt, 1: X high event has occurred)
XL
X low. Default value: 0
(0: no interrupt, 1: X low event has occurred)
Interrupt 2 source register. Read-only register.
Reading at this address clears the INT2_SRC (35h) IA bit (and the interrupt signal on the
INT2 pin) and allows the refresh of data in the INT2_SRC (35h) register if the latched option
was chosen.
7.25
INT2_THS (36h)
Table 65. INT2_THS register
0
THS6
THS5
THS4
THS3
THS2
THS1
THS0
D1
D0
Table 66. INT2_THS description
Interrupt 2 threshold. Default value: 000 0000
1 LSb = 16 mg @ FS = 2 g
1 LSb = 32 mg @ FS = 4 g
1 LSb = 62 mg @ FS = 8 g
1 LSb = 186 mg @ FS = 16 g
THS[6:0]
7.26
INT2_DURATION (37h)
Table 67. INT2_DURATION register
0
D6
D5
D4
D3
D2
Table 68. INT2_DURATION description
Duration value. Default value: 000 0000
1 LSb = 1/ODR(1)
D[6:0]
1. Duration time is measured in N/ODR, where N is the content of the duration register.
The D[6:0] bits set the minimum duration of the Interrupt 2 event to be recognized. Duration
time steps and maximum values depend on the ODR chosen.
7.27
CLICK_CFG (38h)
Table 69. CLICK_CFG register
--
--
ZD
ZS
YD
DocID027506 Rev 2
YS
XD
XS
43/49
49
Register description
MIS2DH
Table 70. CLICK_CFG description
7.28
ZD
Enable interrupt double-click on Z-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
ZS
Enable interrupt single-click on Z-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
YD
Enable interrupt double-click on Y-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
YS
Enable interrupt single-click on Y-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
XD
Enable interrupt double-click on X-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
XS
Enable interrupt single-click on X-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
CLICK_SRC (39h)
Table 71. CLICK_SRC register
IA
DClick
SClick
Sign
Z
Y
X
Table 72. CLICK_SRC description
44/49
IA
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
DClick
Double-click enable. Default value: 0 (0: double-click detection disabled,
1: double-click detection enabled)
SClick
Single-click enable. Default value: 0 (0: single-click detection disabled, 1: single-click
detection enabled)
Sign
Click sign. 0: positive detection, 1: negative detection
Z
Z click detection. Default value: 0
(0: no interrupt, 1: Z high event has occurred)
Y
Y click detection. Default value: 0
(0: no interrupt, 1: Y high event has occurred)
X
X click detection. Default value: 0
(0: no interrupt, 1: X high event has occurred)
DocID027506 Rev 2
MIS2DH
7.29
Register description
CLICK_THS (3Ah)
Table 73. CLICK_THS register
-
Ths6
Ths5
Ths4
Ths3
Ths2
Ths1
Ths0
TLI1
TLI0
TLA1
TLA0
TW1
TW0
Table 74. CLICK_SRC description
Ths[6:0]
7.30
Click threshold. Default value: 000 0000
TIME_LIMIT (3Bh)
Table 75. TIME_LIMIT register
-
TLI6
TLI5
TLI4
TLI3
TLI2
Table 76. TIME_LIMIT description
TLI[6:0]
7.31
Click time limit. Default value: 000 0000
TIME_LATENCY (3Ch)
Table 77. TIME_LATENCY register
TLA7
TLA6
TLA5
TLA4
TLA3
TLA2
Table 78. TIME_LATENCY description
TLA[7:0]
7.32
Click time latency. Default value: 0000 0000
TIME_WINDOW (3Dh)
Table 79. TIME_WINDOW register
TW7
TW6
TW5
TW4
TW3
TW2
Table 80. TIME_WINDOW description
TW[7:0]
Click time window
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49
Register description
7.33
MIS2DH
Act_THS (3Eh)
Table 81. Act_THS register
--
Acth6
Acth5
Acth4
Acth3
Acth2
Acth1
Acth0
Table 82. Act_THS description
Acth[6:0]
7.34
Sleep-to-wake, return-to-sleep activation threshold in low-power mode
1 LSb = 16 mg @ FS = 2 g
1 LSb = 32 mg @ FS = 4 g
1 LSb = 62 mg @ FS = 8 g
1 LSb = 186 mg @ FS = 16 g
Act_DUR (3Fh)
Table 83. Act_DUR register
ActD7
ActD6
ActD5
ActD4
ActD3
ActD2
Table 84. Act_DUR description
ActD[7:0]
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Sleep-to-wake, return-to-sleep duration
1 LSb = (8*1[LSb]+1)/ODR
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Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
8.1
LGA package information
Figure 12. LGA-12 package outline and mechanical data
Dimensions (mm)
Ref.
Min.
Typ.
A1
Outline and
mechanical data
Max.
1
A2
0.785
A3
0.200
D1
1.850
2.000
2.150
E1
1.850
2.000
2.150
L1
1.500
N1
0.500
T1
0.275
T2
0.250
P2
0.075
r
45°
M
0.100
K
0.050
LGA-12 (2.0x2.0x1 mm)
Land Grid Array Package
8365767_A
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Revision history
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Revision history
Table 85. Document revision history
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Date
Revision
Changes
23-Mar-2015
1
Initial release
03-Sep-2015
2
First public release
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