ON MC100LVEL14DWR2G 3.3 v ecl 1:5 clock distribution chip Datasheet

MC100LVEL14
3.3 V ECL 1:5 Clock
Distribution Chip
Description
The MC100LVEL14 is a low skew 1:5 clock distribution chip
designed explicitly for low skew clock distribution applications. The
device can be driven by either a differential or single-ended ECL or, if
positive power supplies are used, PECL input signal. The LVEL14 is
functionally and pin compatible with the EL14 but is designed to
operate in ECL or PECL mode for a voltage supply range of −3.0 V to
−3.8 V ( or 3.0 V to 3.8 V).
The LVEL14 features a multiplexed clock input to allow for the
distribution of a lower speed scan or test clock along with the high speed
system clock. When LOW (or left open and pulled LOW by the input
pulldown resistor) the SEL pin will select the differential clock input.
The common enable (EN) is synchronous so that the outputs will only
be enabled/disabled when they are already in the LOW state. This
avoids any chance of generating a runt clock pulse when the device is
enabled/disabled as can happen with an asynchronous control. The
internal flip flop is clocked on the falling edge of the input clock,
therefore all associated specification limits are referenced to the
negative edge of the clock input.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB and
VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5
mA. When not used, VBB should be left open.
Features
•
•
•
•
•
•
•
•
•
•
•
•
50 ps Output-to-Output Skew
Synchronous Enable/Disable
Multiplexed Clock Input
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1
SOIC−20 WB
DW SUFFIX
CASE 751D−05
MARKING DIAGRAM
20
100LVEL14
AWLYYWWG
1
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
ORDERING INFORMATION
ESD Protection: Human Body Model > 2 kV
Device
The 100 Series Contains Temperature Compensation
MC100LVEL14DWG
PECL Mode Operating Range:
VCC = 3.0 V to 3.8 V with VEE = 0 V
NECL Mode Operating Range:
VCC = 0 V with VEE = −3.0 V to −3.8 V
Internal Input Pulldown Resistors on CLK
Package
Shipping†
SOIC−20 WB
(Pb-Free)
38 Units / Tube
MC100LVEL14DWR2G SOIC−20 WB 1000 Tape & Reel
(Pb-Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Q Output will Default LOW with Inputs Open or at VEE
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity: Level 3 (Pb-Free)
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 303 Devices
•
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 10
1
Publication Order Number:
MC100LVEL14/D
MC100LVEL14
VCC
EN
VCC NC SCLK CLK CLK VBB SEL VEE
20
19
18
17
16
15
14
13
12
Table 1. PIN DESCRIPTION
11
PIN
ECL Diff Clock Inputs
SCLK
ECL Scan Clock Input
EN
ECL Sync Enable
SEL
ECL Clock Select Input
Q0−4, Q0−4
ECL Diff Clock Outputs
10
VBB
Reference Voltage Output
Q4
VCC
Positive Supply
VEE
Negative Supply
NC
No Connect
1 0
D
Q
1
Q0
2
Q0
3
Q1
4
Q1
5
Q2
6
Q2
7
Q3
8
Q3
9
Q4
FUNCTION
CLK, CLK
Warning: All VCC and VEE pins must be externally connected
to Power Supply to guarantee proper operation.
Figure 1. Pinout (Top View) and Logic Diagram
Table 2. FUNCTION TABLE
CLK
SCLK
SEL
EN
Q
L
H
X
X
X
X
X
L
H
X
L
L
H
H
X
L
L
L
L
H
L
H
L
H
L*
*On next negative transition of CLK or SCLK
X = Don’t Care
Table 3. MAXIMUM RATINGS
Symbol
Rating
Unit
VCC
PECL Mode Power Supply
Parameter
VEE = 0 V
Condition 1
Condition 2
8 to 0
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8 to 0
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6 to 0
−6 to 0
V
Iout
Output Current
Continuous
Surge
50
100
mA
IBB
VBB Sink/Source
±0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
SOIC−20 WB
SOIC−20 WB
90
60
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
SOIC−20 WB
30 to 35
°C/W
Tsol
Wave Solder
< 2 to 3 sec @ 260°C
265
°C
VI ≤ VCC
VI ≥ VEE
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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MC100LVEL14
Table 4. LVPECL DC CHARACTERISTICS (VCC = 3.3 V; VEE = 0 V (Note 1))
−40°C
Symbol
Min
Characteristic
25°C
Typ
Max
32
40
Min
85°C
Typ
Max
32
40
Min
Typ
Max
Unit
34
42
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
2215
2295
2420
2275
2345
2420
2275
2345
2420
mV
VOL
Output LOW Voltage (Note 2)
1470
1605
1745
1490
1595
1680
1490
1595
1680
mV
VIH
Input HIGH Voltage (Single-Ended)
2135
2420
2135
2420
2135
2420
mV
VIL
Input LOW Voltage (Single-Ended)
1490
1825
1490
1825
1490
1825
mV
VBB
Output Voltage Reference
1.92
2.04
1.92
2.04
1.92
2.04
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
VPP < 500 mV
VPP ≥ 500 mV
IIH
Input HIGH Current
IIL
Input LOW Current
Others
CLK
V
1.3
1.5
2.9
2.9
1.2
1.4
2.9
2.9
150
1.2
1.4
2.9
2.9
150
0.5
−300
0.5
−300
150
mA
mA
0.5
−300
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V.
2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin
and 1.0 V.
Table 5. LVNECL DC CHARACTERISTICS (VCC = 0.0 V; VEE = −3.3 V (Note 1))
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
32
40
Min
85°C
Typ
Max
32
40
Min
Typ
Max
Unit
34
42
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
−1085
−1005
−880
−1025
−955
−880
−1025
−955
−880
mV
VOL
Output LOW Voltage (Note 2)
−1830
−1695
−1555
−1810
−1705
−1620
−1810
−1705
−1620
mV
VIH
Input HIGH Voltage (Single-Ended)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage (Single-Ended)
−1810
−1475
−1810
−1475
−1810
−1475
mV
VBB
Output Voltage Reference
−1.38
−1.26
−1.38
−1.26
−1.38
−1.26
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
VPP < 500 mV
VPP ≥ 500 mV
IIH
Input HIGH Current
IIL
Input LOW Current
Others
CLK
V
−2.0
−1.8
−0.4
−0.4
−2.1
−1.9
150
0.5
−300
−0.4
−0.4
−2.1
−1.9
150
0.5
−300
−0.4
−0.4
150
0.5
−300
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V.
2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin
and 1.0 V.
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MC100LVEL14
Table 5. AC CHARACTERISTICS (VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 1)
−40°C
Symbol
fmax
tPLH
tPHL
Min
Characteristic
Maximum Toggle Frequency (Figure 2)
Prop
Delay
Part-to-Part Skew
Within-Device Skew (Note 2)
tJITTER
Random Clock Jitter (RMS) @ 1 Ghz
(Figure 2)
25°C
Max
Min
>1
CLK to Q (Diff)
CLK to Q (SE)
SCLK to Q
tSKEW
Typ
520
470
470
Typ
Min
Typ
>1
720
770
770
580
530
530
680
680
680
200
50
0.2
85°C
Max
>1
780
830
830
630
580
580
200
50
<1
0.2
250
160
0.2
0
−125
250
175
830
880
880
ps
200
50
ps
<1
ps
Setup Time EN
0
−95
tH
Hold Time EN
250
150
Input Swing CLK (Note 3)
150
1000
150
1000
150
1000
mV
Output Rise/Fall Times Q (20%−80%)
230
500
230
500
230
500
ps
tr
tf
−110
<1
Unit
GHz
tS
VPP
0
Max
ps
ps
900
9
800
8
700
7
600
6
500
5
400
4
300
3
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
200
0
ÉÉ
ÉÉ
2
(JITTER)
100
0
300
600
900
1200
1
1500
FREQUENCY (MHz)
Figure 2. Fmax/Jitter
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JITTEROUT ps (RMS)
VOUTpp (mV)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
1. VEE can vary ±0.3 V.
2. Skews are specified for identical LOW-to-HIGH or HIGH-to-LOW transitions.
3. VPP(min) is minimum input swing for which AC parameters guaranteed.
1800
2100
2400
MC100LVEL14
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices)
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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MC100LVEL14
PACKAGE DIMENSIONS
SOIC−20 WB
DW SUFFIX
CASE 751D−05
ISSUE H
A
20
q
X 45 _
M
E
h
0.25
1
10
20X
B
b
0.25
M
T A
S
B
DIM
A
A1
b
c
D
E
e
H
h
L
q
S
A
L
H
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
18X
e
A1
SEATING
PLANE
c
T
RECOMMENDED
SOLDERING FOOTPRINT*
20X
20X
1.30
0.52
20
11
11.00
1
10
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC100LVEL14
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