Microchip MCP73861 Advanced single or dual cell, fully integrated li-ion / li-polymer charge management controller Datasheet

MCP73861/2
Advanced Single or Dual Cell, Fully Integrated Li-Ion /
Li-Polymer Charge Management Controllers
Features
Description
• Linear Charge Management Controllers
- Integrated Pass Transistor
- Integrated Current Sense
- Reverse-Blocking Protection
• High-Accuracy Preset Voltage Regulation: + 0.5%
• Four Selectable Voltage Regulation Options:
- 4.1V, 4.2V - MCP73861
- 8.2V, 8.4V - MCP73862
• Programmable Charge Current: 1.2A Maximum
• Programmable Safety Charge Timers
• Preconditioning of Deeply Depleted Cells
• Automatic End-of-Charge Control
• Optional Continuous Cell Temperature Monitoring
• Charge Status Output for Direct LED Drive
• Fault Output for Direct LED Drive
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to 85°C
• Packaging: 16-Pin, 4 x 4 QFN
The MCP7386X family of devices are highly advanced
linear charge management controllers for use in spacelimited, cost-sensitive applications. The MCP73861 and
MCP73862 combine high-accuracy constant voltage,
constant current regulation, cell preconditioning, cell
temperature monitoring, advanced safety timers, automatic charge termination, internal current sensing,
reverse-blocking protection, and charge status and fault
indication in a space-saving 16-pin, 4 x 4 QFN package.
The MCP7386X provides a complete, fully-functional,
stand-alone charge management solution with a
minimum number of external components.
Applications
The MCP7386X family of devices are fully specified
over the ambient temperature range of -40°C to +85°C.
•
•
•
•
•
•
•
Lithium-Ion/Lithium-Polymer Battery Chargers
Personal Data Assistants
Cellular Telephones
Hand Held Instruments
Cradle Chargers
Digital Cameras
MP3 Players
The MCP73861 is targeted for applicatioins utilizing
single-cell Lithium-Ion or Lithium-Polymer battery
packs, while the MCP73862 is targeted for dual series
cell Lithium-Ion or Lithium-Polymer battery packs. The
MCP73861 has two selectable voltage-regulation
options available (4.1V and 4.2V), for use with either
coke or graphite anodes, and operates with an input
voltage range of 4.5V to 12V. The MCP73862 has two
selectable voltage-regulation options available (8.2V
and 8.4V), for use with coke or graphite anodes, and
operates with an input voltage range of 8.7V to 12V.
Package Type
STAT1 STAT2
16
VSET
1
VDD1
2
VDD2
3
VSS1
4
15
EN
VSS2
14
13
12 VBAT3
11 VBAT2
MCP73861
MCP73862
10 VBAT1
9 VSS3
5
6
7
8
PROG THREF THERM TIMER
 2004 Microchip Technology Inc.
DS21893A-page 1
MCP73861/2
Typical Application
1.2A Lithium-Ion Battery Charger
5V
4.7µF
2, 3
VDD
1
VSET
14
VBAT3 12
10, 11
V
4.7 µF
BAT
THREF 6
7 6.19 kΩ
THERM
STAT1
7.32 kΩ
8
STAT2 TIMER
0.1
µF
VSS 4, 9, 13
PROG
EN
16
15
5
+ Single
Lithium-Ion
- Cell
MCP73861
Functional Block Diagram
Direction
Control
VBAT1
VDD1
VDD2
VBAT2
VDD
G=0.001
4kΩ
VREF
PROG
Charge Current
Control Amplifier
+
Voltage Control
Amplifier
+
90
kΩ
1kΩ
–
11kΩ
+
-
10kΩ
10kΩ
IREG/12
VREF
Charge_OK
Precon
Precondition
Control
Precondition
Comp.
UVLO
COMPARATOR
+
-
VBAT3
+
110kΩ
Charge
Termination
Comparator
–
VREF
600kΩ
(1.65MΩ)
148.42kΩ
Constant Voltage/
Recharge Comp.
VUVLO
+
EN
Power-On
Delay
Values in ( )
reflect the
MCP73862
device
1.58kΩ
VREF
300.04kΩ
Bias and
Reference
Generator
VUVLO
VREF(1.2V)
VSET
10.3kΩ
(8.58kΩ)
THREF
100kΩ
+
-
THERM
50kΩ
+
50kΩ
TIMER
DS21893A-page 2
Temperature
Comparators
VSS1
VSS2
VSS3
STAT1
Drv Stat 1
IREG/12
Oscillator
Charge Control,
Charge Timers,
And
Status Logic
STAT2
Drv Stat 2
Charge_OK
 2004 Microchip Technology Inc.
MCP73861/2
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings†
VDDN ...............................................................................13.5V
VBATN, VSET, EN, STAT1, STAT2 w.r.t. VSS
.................................................................. -0.3 to (VDD+0.3)V
PROG, THREF, THERM, TIMER w.r.t. VSS ..............-0.3 to 6V
Maximum Junction Temperature, TJ ............ Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5 kΩ in series with 100 pF)....≥ 4 kV
Machine Model (200 pF, No series resistance) ...........300V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typ) + 0.3V] to 12V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V]
Parameters
Sym
Min
Typ
Max
Units
Conditions
VDD
4.5
—
12
V
MCP73861
8.7
—
12
V
MCP73862
—
0.17
4
µA
Disabled
—
0.53
4
mA
Operating
4.25
4.5
4.65
V
MCP73861
8.45
8.8
9.05
V
MCP73862
4.20
4.4
4.55
V
MCP73861
8.40
8.7
8.95
V
MCP73862
Supply Input
Supply Voltage
Supply Current
UVLO Start Threshold
ISS
VSTART
VDD Low-to-High
UVLO Stop Threshold
VSTOP
VDD High-to-Low
Voltage Regulation (Constant Voltage Mode)
Regulated Output Voltage
VREG
4.079
4.1
4.121
V
MCP73861, VSET = VSS
4.179
4.2
4.221
V
MCP73861, VSET = VDD
8.159
8.2
8.241
V
MCP73862, VSET = VSS
8.358
8.4
8.442
V
MCP73862, VSET = VDD
VDD = [VREG(Typ) + 1V], IOUT=10 mA
TA = -5°C to +55°C
Line Regulation
|(∆VBAT/
VBAT)| /∆VDD
—
0.025
0.25
%/V
Load Regulation
|∆VBAT/VBAT|
—
0.01
0.25
%
IOUT = 10 mA to 150 mA
VDD = [VREG(Typ)+1V]
PSRR
—
60
—
dB
IOUT = 10 mA, 10Hz to 1 kHz
—
42
—
dB
IOUT = 10 mA, 10Hz to 10 kHz
—
28
—
dB
IOUT = 10 mA, 10Hz to 1 MHz
—
0.23
1
µA
VDD < VBAT = VREG(Typ)
85
100
115
mA
PROG = OPEN
1020
1200
1380
mA
PROG = VSS
425
500
575
mA
PROG = 1.6 kΩ
Supply Ripple Attenuation
Output Reverse-Leakage
Current
IDISCHARGE
VDD = [VREG(Typ)+1V] to 12V
IOUT = 10 mA
Current Regulation (Fast Charge Constant Current Mode)
Fast Charge Current
Regulation
IREG
TA= -5°C to +55°C
 2004 Microchip Technology Inc.
DS21893A-page 3
MCP73861/2
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typ) + 0.3V] to 12V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V]
Parameters
Sym
Min
Typ
Max
Units
Conditions
Preconditioning Current Regulation (Trickle Charge Constant Current Mode)
Precondition Current
Regulation
IPREG
5
10
15
mA
PROG = OPEN
60
120
180
mA
PROG = VSS
25
50
75
mA
PROG = 1.6 kΩ
2.70
2.80
2.90
V
MCP73861, VSET = VSS
2.75
2.85
2.95
V
MCP73861, VSET = VDD
5.40
5.60
5.80
V
MCP73862, VSET = VSS
5.50
5.70
5.90
V
MCP73862, VSET = VDD
TA=-5°C to +55°C
Precondition Threshold
Voltage
VPTH
VBAT Low-to-High
Charge Termination
Charge Termination Current
ITERM
6
8.5
11
mA
PROG = OPEN
70
90
120
mA
PROG = VSS
32
41
50
mA
PROG = 1.6 kΩ
TA=-5°C to +55°C
Automatic Recharge
Recharge Threshold
Voltage
VRTH
VREG - VREG - VREG 300mV 200mV 100mV
V
MCP73861
VREG - VREG - VREG 600mV 400mV 200mV
V
MCP73862
VBAT High-to-Low
Thermistor Reference
Thermistor Reference
Output Voltage
VTHREF
2.475
2.55
2.625
V
Thermistor Reference
Source Current
ITHREF
200
—
—
µA
|(∆VTHREF/
-
0.1
0.25
%/V
0.01
0.10
%
Thermistor Reference Line
Regulation
VTHREF)|/∆VDD
Thermistor Reference Load
Regulation
|∆VTHREF/
VTHREF|
TA = 25°C, VDD = VREG(typ.) + 1V,
ITHREF = 0 mA
VDD = [VREG(Typ) + 1V] to 12V
ITHREF = 0 mA to 0.20 mA
Thermistor Comparator
VT1
1.18
1.25
1.32
V
VT1HYS
—
-50
—
mV
Upper Trip Threshold
Upper Trip Point Hysteresis
Lower Trip Threshold
Lower Trip Point Hysteresis
VT2
0.59
0.62
0.66
V
VT2HYS
—
80
—
mV
IBIAS
—
—
2
µA
Input Bias Current
Status Indicator - STAT1, STAT2
Sink Current
ISINK
4
8
12
mA
Low Output Voltage
VOL
—
200
400
mV
ISINK = 1 mA
Input Leakage Current
ILK
—
0.01
1
µA
ISINK = 0 mA, VSTAT1,2 = 12V
Input High Voltage Level
VIH
1.4
—
—
V
Input Low Voltage Level
VIL
—
—
0.8
V
Input Leakage Current
ILK
—
0.01
1
µA
Enable Input
DS21893A-page 4
VENABLE = 12V
 2004 Microchip Technology Inc.
MCP73861/2
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typ) + 0.3V] to 12V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V]
Parameters
Sym
Min
Typ
Max
Units
TSD
—
155
—
°C
TSDHYS
—
10
—
°C
Conditions
Thermal Shutdown
Die Temperature
Die Temperature Hysteresis
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V]
Parameters
Sym
Min
Typ
Max
Units
tSTART
—
—
5
ms
VDD Low to High
tDELAY
—
—
1
ms
VBAT < VPTH to VBAT > VPTH
Current Rise Time Out of
Preconditioning
tRISE
—
—
1
ms
IOUT Rising to 90% of IREG
Fast Charge Safety Timer
Period
tFAST
1.1
1.5
1.9
Hours
tPRECON
45
60
75
tTERM
2.2
3
3.8
Hours
Status Output turn-off
tOFF
—
—
200
µs
ISINK = 1 mA to 0 mA
Status Output turn-on
tON
—
—
200
µs
ISINK = 0 mA to 1 mA
UVLO Start Delay
Conditions
Current Regulation
Transition Time Out of
Preconditioning
CTIMER = 0.1 µF
Preconditioning Current Regulation
Preconditioning Charge
Safety Timer Period
Minutes CTIMER = 0.1 µF
Charge Termination
Elapsed Time Termination
Period
CTIMER = 0.1 µF
Status Indicators
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V.
Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V]
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
θJA
—
37
—
°C/W
Thermal Package Resistances
Thermal Resistance, 16-L, 4mm x 4mm QFN
 2004 Microchip Technology Inc.
4-Layer JC51-7 Standard
Board, Natural Convection
DS21893A-page 5
MCP73861/2
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
4.207
4.201
4.199
MCP73861
VSET = VDD
VDD = 5.2V
0.90
ISS (mA)
4.203
VBAT (V)
1.00
MCP73861
VSET = VDD
VDD = 5.2V
4.205
4.197
0.80
0.70
0.60
0.50
4.195
4.193
0.40
10
100
1000
10
100
IOUT (mA)
IOUT (mA)
FIGURE 2-1:
Battery Regulation Voltage
(VBAT) vs. Charge Current (IOUT).
FIGURE 2-4:
Supply Current (ISS) vs.
Charge Current (IOUT).
4.40
1.60
MCP73861
VSET = VDD
IOUT = 1000 mA
4.20
4.10
4.00
MCP73861
VSET = VDD
IOUT = 1000 mA
1.40
ISS (mA)
VBAT (V)
4.30
3.90
1.20
1.00
0.80
0.60
3.80
0.40
4.5
6.0
7.5
9.0
10.5
12.0
4.5
6.0
VDD (V)
10.5
12.0
1.00
MCP73861
VSET = VDD
IOUT = 10 mA
MCP73861
VSET = VDD
IOUT = 10 mA
0.90
ISS (mA)
4.203
9.0
FIGURE 2-5:
Supply Current (ISS) vs.
Supply Voltage (VDD).
4.207
4.205
7.5
VDD (V)
FIGURE 2-2:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
VBAT (V)
1000
4.201
4.199
4.197
0.80
0.70
0.60
0.50
4.195
4.193
0.40
4.5
6.0
7.5
9.0
10.5
12.0
VDD (V)
FIGURE 2-3:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
DS21893A-page 6
4.5
6.0
7.5
9.0
10.5
12.0
VDD (V)
FIGURE 2-6:
Supply Current (ISS) vs.
Supply Voltage (VDD).
 2004 Microchip Technology Inc.
MCP73861/2
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1.60
MCP73861
VSET = VDD
VDD = VSS
MCP73861
VSET = VDD
IOUT = 10 mA
1.40
+85°C
+25°C
-40°C
ISS (mA)
IDISCHARGE (µA)
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
1.20
1.00
0.80
0.60
0.40
2.0
2.4
2.8
3.2
3.6
4.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
4.4
TA (°C)
VBAT (V)
FIGURE 2-7:
Output Leakage Current
(IDISCHARGE) vs. Battery Voltage (VBAT).
FIGURE 2-10:
Supply Current (ISS) vs.
Ambient Temperature (TA).
4.207
2.550
MCP73861
VSET = VDD
ITHREF = 100 µA
4.203
VBAT (V)
VTHREF (V)
2.540
MCP73861
VSET = VDD
IOUT = 10 mA
4.205
2.530
2.520
4.201
4.199
4.197
2.510
4.195
80
70
60
50
40
30
TA (°C)
VDD (V)
FIGURE 2-8:
Thermistor Reference
Voltage (VTHREF) vs. Supply Voltage (VDD).
FIGURE 2-11:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
2.520
2.520
MCP73861
VSET = VDD
2.515
VTHREF (V)
2.515
2.510
MCP73861
VSET = VDD
ITHREF = 100 µA
2.510
2.505
2.505
ITHREF (µA)
FIGURE 2-9:
Thermistor Reference
Voltage (VTHREF) vs. Thermistor Bias Current
(ITHREF).
 2004 Microchip Technology Inc.
80
0
70
200
60
175
50
150
40
125
30
100
20
75
10
50
-10
25
-20
0
-30
2.500
2.500
-40
VTHREF (V)
20
12.0
0
10.5
10
9.0
-10
7.5
-20
6.0
-40
4.5
-30
4.193
2.500
TA (°C)
FIGURE 2-12:
Thermistor Reference
Voltage (VTHREF) vs. Ambient Temperature (TA).
DS21893A-page 7
MCP73861/2
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
8.407
1.00
MCP73862
VSET = VDD
VDD = 9.4V
8.405
ISS (mA)
VBAT (V)
8.403
0.90
8.401
8.399
8.397
MCP73862
VSET = VDD
VDD = 9.4V
0.80
0.70
0.60
0.50
8.395
8.393
0.40
10
100
1000
10
100
IOUT (mA)
IOUT (mA)
FIGURE 2-13:
Battery Regulation Voltage
(VBAT) vs. Charge Current (IOUT).
FIGURE 2-16:
Supply Current (ISS) vs.
Charge Current (IOUT).
8.407
VBAT (V)
8.403
1.60
1.40
MCP73862
VSET = VDD
IOUT = 1000 mA
ISS (mA)
8.405
1000
8.401
8.399
MCP73862
VSET = VDD
IOUT = 1000 mA
1.20
1.00
0.80
8.397
0.60
8.395
0.40
8.393
10.0
10.4
10.8
11.2
11.6
9.0
12.0
9.5
10.0
FIGURE 2-14:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
VBAT (V)
8.408
11.5
12.0
FIGURE 2-17:
Supply Current (ISS) vs.
Supply Voltage (VDD).
1.00
MCP73862
VSET = VDD
IOUT = 10 mA
0.90
ISS (mA)
8.410
11.0
VDD (V)
VDD (V)
8.412
10.5
8.406
8.404
8.402
MCP73862
VSET = VDD
IOUT = 10 mA
0.80
0.70
0.60
0.50
8.400
8.398
0.40
9.0
9.5
10.0
10.5
11.0
11.5
12.0
VDD (V)
FIGURE 2-15:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
DS21893A-page 8
9.0
9.5
10.0
10.5
11.0
11.5
12.0
VDD (V)
FIGURE 2-18:
Supply Current (ISS) vs.
Supply Voltage (VDD).
 2004 Microchip Technology Inc.
MCP73861/2
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1.60
MCP73862
VSET = VDD
VDD = VSS
+85°C
+25°C
-40°C
MCP73862
VSET = VDD
IOUT = 10 mA
1.40
ISS (mA)
1.20
1.00
0.80
0.60
VBAT (V)
80
70
FIGURE 2-22:
Supply Current (ISS) vs.
Ambient Temperature (TA).
8.414
2.570
MCP73862
VSET = VDD
ITHREF = 100 µA
MCP73862
VSET = VDD
IOUT = 10 mA
8.410
8.406
VBAT (V)
2.560
60
50
40
TA (°C)
FIGURE 2-19:
Output Leakage Current
(IDISCHARGE) vs. Battery Voltage (VBAT).
VTHREF (V)
30
8.8
20
8.0
0
7.2
10
6.4
-10
5.6
-20
4.8
-30
0.40
4.0
-40
IDISCHARGE (mA)
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
2.550
8.402
8.398
8.394
2.540
8.390
VDD (V)
FIGURE 2-20:
Thermistor Reference
Voltage (VTHREF) vs. Supply Voltage (VDD).
2.550
2.550
2.544
80
70
60
MCP73862
VSET = VDD
ITHREF = 100 µA
2.546
2.546
50
40
FIGURE 2-23:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
VTHREF (V)
2.542
2.538
2.534
2.542
ITHREF (µA)
FIGURE 2-21:
Thermistor Reference
Voltage (VTHREF) vs. Thermistor Bias Current
(ITHREF).
 2004 Microchip Technology Inc.
80
70
60
50
40
30
20
100 125 150 175 200
0
75
10
50
-10
25
-20
0
-30
2.530
2.540
-40
VTHREF (V)
TA (°C)
MCP73862
VSET = VDD
2.548
30
12.0
20
11.5
10
11.0
0
10.5
-10
10.0
-20
9.5
-40
9.0
-30
8.386
2.530
TA (°C)
FIGURE 2-24:
Thermistor Reference
Voltage (VTHREF) vs. Ambient Temperature (TA).
DS21893A-page 9
MCP73861/2
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
FIGURE 2-25:
Line Transient Response.
FIGURE 2-28:
Line Transient Response.
FIGURE 2-26:
Load Transient Response.
FIGURE 2-29:
Load Transient Response.
Attenuation (dB)
-20
-30
0
MCP73861
VDD = 5.2V
VAC = 100 mVp-p
IOUT = 10 mA
COUT = 10 µF, Ceramic
-10
Attenuation (dB)
0
-10
-40
-50
-60
-70
-80
0.01
-20
-30
-40
MCP73861
VDD = 5.2V
VAC = 100 mVp-p
IOUT = 100 mA
COUT = 10 µF, X7R, Ceramic
-50
-60
-70
0.1
1
10
100
1000
-80
0.01
Frequency (kHz)
FIGURE 2-27:
Rejection.
DS21893A-page 10
Power Supply Ripple
0.1
1
10
100
1000
Frequency (kHz)
FIGURE 2-30:
Rejection.
Power Supply Ripple
 2004 Microchip Technology Inc.
MCP73861/2
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
503
800
IOUT (mA)
600
400
501
499
497
495
200
RPROG (Ω)
FIGURE 2-31:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
 2004 Microchip Technology Inc.
80
70
60
50
40
30
20
0
0
536
10
1.6K
-10
493
4.8K
-20
0
OPEN
MCP73861/2
VSET = VDD
RPROG = 1.6 kΩ
-30
IOUT (mA)
1000
505
MCP73861/2
VSET = VDD
-40
1200
TA (°C)
FIGURE 2-32:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
DS21893A-page 11
MCP73861/2
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
3.1
PIN FUNCTION TABLES
Symbol
Function
1
VSET
Voltage Regulation Selection
2
VDD1
Battery Management Input Supply
3
VDD2
Battery Management Input Supply
4
VSS1
5
PROG
Current Regulation Set
6
THREF
Cell Temperature Sensor Bias
7
THERM
Cell Temperature Sensor Input
8
TIMER
9
VSS3
Battery Management 0V Reference
10
VBAT1
Battery Charge Control Output
Battery Management 0V Reference
Timer Set
11
VBAT2
Battery Charge Control Output
12
VBAT3
Battery Voltage Sense
13
VSS2
14
EN
15
STAT2
Fault Status Output
16
STAT1
Charge Status Output
Battery Management 0V Reference
Logic Enable
Voltage Regulation Selection
(VSET)
MCP73861: Connect to VSS for 4.1V regulation
voltage, connect to VDD for 4.2V regulation voltage.
MCP73862: Connect to VSS for 8.2V regulation
voltage, connect to VDD for 8.4V regulation voltage.
3.2
Battery Management Input Supply
(VDD2, VDD1)
A supply voltage of [VREG(Typ) + 0.3V] to 12V is
recommended. Bypass to VSS with a minimum of
4.7 µF.
3.3
Battery Management 0V Reference
(VSS1, VSS2, VSS3)
3.7
Timer Set
All safety timers are scaled by CTIMER/0.1 µF.
3.8
Battery Charge Control Output
(VBAT1, VBAT2)
Connect to positive terminal of battery. Drain terminal
of internal P-channel MOSFET pass transistor. Bypass
to VSS with a minimum of 4.7 µF to ensure loop stability
when the battery is disconnected.
3.9
Battery Voltage Sense (VBAT3)
Voltage sense input. Connect to positive terminal of
battery. A precision internal resistor divider regulates
the final voltage on this pin to VREG.
3.10
Logic Enable (EN)
Connect to negative terminal of battery and input
supply.
Input to force charge termination, initiate charge, clear
faults or disable automatic recharge.
3.4
3.11
Current Regulation Set (PROG)
Preconditioning, fast and termination currents are
scaled by placing a resistor from PROG to VSS.
3.5
Cell Temperature Sensor Bias
(THREF)
Voltage reference to bias external thermistor for continuous cell-temperature monitoring and pre-qualification.
3.6
Cell Temperature Sensor Input
(THERM)
Fault Status Output (STAT2)
Current-limited, open-drain drive for direct connection
to a LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
3.12
Charge Status Output (STAT1)
Current limited, open-drain drive for direct connection
to an LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
Input for an external thermistor for continuous celltemperature monitoring and pre-qualification. Connect
to THREF/3 to disable temperature sensing.
DS21893A-page 12
 2004 Microchip Technology Inc.
MCP73861/2
DEVICE OVERVIEW
The MCP7386X family of devices are highly advanced
linear charge management controllers. Refer to the
functional block diagram. Figure 4-2 depicts the operational flow algorithm from charge initiation to
completion and automatic recharge.
4.1
Charge Qualification and
Preconditioning
Upon insertion of a battery or application of an external
supply, the MCP7386X family of devices automatically
performs a series of safety checks to qualify the
charge. The input source voltage must be above the
undervoltage lockout threshold, the enable pin must be
above the logic-high level and the cell temperature
must be within the upper and lower thresholds. The
qualification parameters are continuously monitored.
Deviation beyond the limits automatically suspends or
terminates the charge cycle. The input voltage must
deviate below the undervoltage lockout stop threshold
for at least one clock period to be considered valid.
After the qualification parameters have been met, the
MCP7386X initiates a charge cycle. The charge status
output is pulled low throughout the charge cycle (see
Table 5-1 for charge status outputs). If the battery voltage is below the preconditioning threshold (VPTH) the
MCP7386X preconditions the battery with a tricklecharge. The preconditioning current is set to approximately 10% of the fast charge regulation current. The
preconditioning trickle-charge safely replenishes
deeply depleted cells and minimizes heat dissipation
during the initial charge cycle. If the battery voltage has
not exceeded the preconditioning threshold before the
preconditioning timer has expired, a fault is indicated
and the charge cycle is terminated.
4.2
Constant Current Regulation Fast Charge
4.1V and 8.2V, respectively. With VSET tied to VDD, the
MCP73861 and MCP73862 regulate to 4.2V and 8.4V,
respectively.
4.4
Charge Cycle Completion and
Automatic Re-Charge
The MCP7386X monitors the charging current during
the constant voltage regulation phase. The charge cycle
is considered complete when the charge current has
diminished below approximately 8% of the regulation
current (IREG) or the elapsed timer has expired.
The MCP7386X automatically begins a new charge
cycle when the battery voltage falls below the recharge
threshold (VRTH) assuming all the qualification
parameters are met.
4.5
Thermal Regulation
The MCP7386X family limits the charge current based
on the die temperature. Thermal regulation optimizes
the charge cycle time while maintaining device reliability. If thermal regulation is entered, the timer is automatically slowed down to ensure that a charge cycle will
not terminate prematurely. Figure 4-1 depicts the
thermal regulation profile.
1400
Maximum Charge Current (mA)
4.0
1200
1000
800
Maximum
Minimum
600
400
200
0
0
20
40
60
80
100
120
140
Die Temperature (° C)
Preconditioning ends, and fast charging begins, when
the battery voltage exceeds the preconditioning threshold. Fast charge regulates to a constant current (IREG),
which is set via an external resistor connected to the
PROG pin. Fast charge continues until the battery voltage reaches the regulation voltage (VREG), or the fast
charge timer expires; in which case, a fault is indicated
and the charge cycle is terminated.
4.3
Constant Voltage Regulation
When the battery voltage reaches the regulation voltage (VREG) constant voltage regulation begins. The
MCP7386X monitors the battery voltage at the VBAT
pin. This input is tied directly to the positive terminal of
the battery. The MCP7386X selects the voltage regulation value based on the state of the VSET. With VSET
tied to VSS, the MCP73861 and MCP73862 regulate to
 2004 Microchip Technology Inc.
FIGURE 4-1:
Typical Maximum Charge
Current vs. Die Temperature.
4.6
Thermal Shutdown
The MCP7386X family suspends charge if the die temperature exceeds 155°C. Charging will resume when
the die temperature has cooled by approximately 10°C.
The thermal shutdown is a secondary safety feature in
the event that there is a failure within the thermal
regulation circuitry.
DS21893A-page 13
MCP73861/2
DS21893A-page 14
Initialize
Note 1:
The qualification parameters are continuously
monitored throughout the charge cycle. Refer to
Section 4.1, “Charge Qualification and
Preconditioning”, for details.
Note 2:
The charge current will be scaled based on the
die temperature during thermal regulation. Refer
to Section 4.5, “Thermal Regulation”, for
details.
NOTE 1
VDD > VUVLO
EN High
Yes
NOTE 1
Temperature OK
No
STAT1 = Off
STAT2 = Flashing
Charge Current = 0
Yes
Preconditioning Phase
Charge Current = IPREG
Reset Safety Timer
No
No
STAT1 = Off
STAT2 = Off
VBAT > VPTH
STAT1 = On
STAT2 = Off
Yes
VBAT > VPTH
Constant Current
NOTE 2 Phase
Charge Current = IREG
Reset Safety Timer
Yes
VBAT = VREG
No
Yes
Fault
Charge Current = 0
Reset Safety Timer
Yes
No
IOUT < ITERM
Elapsed Timer
Expired
 2004 Microchip Technology Inc.
Temperature OK
Yes
VDD < VUVLO
or EN Low
Operational Flow Algorithm.
No
STAT1 = Off
STAT2 = On
Yes
Charge Termination
Charge Current = 0
Reset Safety Timer
No
Safety Timer
Expired
Yes
No
No
Yes
STAT1 = Off
STAT2 = Flashing
Safety Timer Suspended
Charge Current = 0
FIGURE 4-2:
Yes
No
Safety Timer
Expired
Yes
Constant Voltage Phase
Output Voltage = VREG
Temperature OK
No
STAT1 = Off
STAT2 = Flashing
Safety Timer Suspended
Charge Current = 0
Temperature OK
No
STAT1 = Flashing
Safety Timer Suspended
Charge Current = 0
VDD < VUVLO
VBAT < VRTH
or EN Low
Yes
No
STAT1 = Flashing
STAT2 = Off
MCP73861/2
5.0
DETAILED DESCRIPTION
5.1
Analog Circuitry
5.1.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD1, VDD2)
The VDD input is the input supply to the MCP7386X.
The MCP7386X automatically enters a Power-down
mode if the voltage on the VDD input falls below the
undervoltage lockout voltage (VSTOP). This feature
prevents draining the battery pack when the VDD
supply is not present.
5.1.2
Figure 6-1 depicts a typical application circuit with
connection of the THERM input. The resistor values of
RT1 and RT2 are calculated with the following
equations.
For NTC thermistors:
2 × RCOLD × RHOT
R T1 = ---------------------------------------------RCOLD – RHOT
2 × RCOLD × RHOT
R T2 = ---------------------------------------------RCOLD – 3 × RHOT
For PTC thermistors:
2 × RCOLD × RHOT
R T1 = ---------------------------------------------RHOT – RCOLD
PROG INPUT
Fast charge current regulation can be scaled by placing
a programming resistor (RPROG) from the PROG input
to VSS. Connecting the PROG input to VSS allows for a
maximum fast charge current of 1.2A, typically. The
minimum fast charge current is 100 mA, set by letting
the PROG input float. The following formula calculates
the value for RPROG:
13.2 – 11 × I REG
R PROG = ---------------------------------------12 × I REG – 1.2
2 × RCOLD × RHOT
R T2 = ---------------------------------------------RHOT – 3 × RCOLD
Where:
RCOLD and RHOT are the thermistor
resistance values at the temperature window
of interest.
Applying a voltage equal to VTHREF/3 to the THERM
input disables temperature monitoring.
where:
IREG is the desired fast charge current in
amps
RPROG is in kΩ.
The preconditioning trickle-charge current and the
charge termination current are scaled to approximately
10% and 8% of IREG, respectively.
5.1.3
CELL TEMPERATURE SENSOR
BIAS (THREF)
A 2.5V voltage reference is provided to bias an external
thermistor for continuous cell temperature monitoring
and pre-qualification. A ratio metric window comparison is performed at threshold levels of VTHREF/2 and
VTHREF/4.
5.1.4
CELL TEMPERATURE SENSOR
INPUT (THERM)
The MCP73861 and MCP73862 continuously monitor
temperature by comparing the voltage between the
THERM input and VSS with the upper and lower
temperature thresholds. A negative or positive temperature coefficient, NTC or PTC, thermistor and an external voltage-divider typically develop this voltage. The
temperature sensing circuit has its own reference to
which it performs a ratio metric comparison. Therefore,
it is immune to fluctuations in the supply input (VDD).
The temperature-sensing circuit is removed from the
system when VDD is not applied, eliminating additional
discharge of the battery pack.
 2004 Microchip Technology Inc.
5.1.5
TIMER SET INPUT (TIMER)
The TIMER input programs the period of the safety
timers by placing a timing capacitor (CTIMER), between
the TIMER input pin and VSS. Three safety timers are
programmed via the timing capacitor.
The preconditioning safety timer period:
C TIMER
tPRECON = ------------------- × 1.0Hour s
0.1µF
The fast charge safety timer period:
C TIMER
t FAST = ------------------- × 1.5Hours
0.1µF
And, the elapsed time termination period:
C TIMER
t TERM = ------------------- × 3.0Hours
0.1µF
The preconditioning timer starts after qualification and
resets when the charge cycle transitions to the constant current, fast charge phase. The fast charge timer
and the elapsed timer start after the MCP7386X transitions from preconditioning. The fast charge timer resets
when the charge cycle transitions to the constant voltage phase. The elapsed timer will expire and terminate
the charge if the sensed current does not diminish
below the termination threshold.
During thermal regulation, the timer is slowed down
proportional to the charge current.
DS21893A-page 15
MCP73861/2
5.1.6
BATTERY VOLTAGE SENSE (VBAT3)
The MCP7386X monitors the battery voltage at the
VBAT3 pin. This input is tied directly to the positive
terminal of the battery pack.
5.1.7
BATTERY CHARGE CONTROL
OUTPUT (VBAT1, VBAT2)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP7386X
provides constant current, constant voltage regulation
to the battery pack by controlling this MOSFET in the
linear region. The battery charge control output should
be connected to the positive terminal of the battery
pack.
5.2
Digital Circuitry
5.2.1
CHARGE STATUS OUTPUTS
(STAT1,STAT2)
Two status outputs provide information on the state of
charge. The current-limited, open-drain outputs can be
used to illuminate external LEDs. Optionally, a pull-up
resistor can be used on the output for communication
with a host microcontroller. Table 5-1 summarizes the
state of the status outputs during a charge cycle.
TABLE 5-1:
CHARGE
CYCLE STAT1
STATUS OUTPUTS
STAT1
STAT2
Qualification
Off
Off
Preconditioning
On
Off
Constant
Current Fast
Charge
On
Off
Constant
Voltage
On
Off
Charge
Complete
Flashing (1Hz,
50% duty cycle)
Off
Fault
Off
On
THERM Invalid
Off
Flashing (1Hz,
50% duty cycle)
Disabled - Sleep
mode
Off
Off
Input Voltage
Disconnected
Off
Off
The flashing rate (1 Hz) is based off a timer capacitor
(CTIMER) of 0.1 µF. The rate will vary based on the
value of the timer capacitor.
During a FAULT condition, the STAT1 status output will
be off and the STAT2 status output will be on. To
recover from a FAULT condition, the input voltage must
be removed and then reapplied, or the enable input
(EN) must be de-asserted to a logic-low, then asserted
to a logic-high.
When the voltage on the THERM input is outside the
preset window, the charge cycle will not start, or will be
suspended. The charge cycle is not terminated and
recovery is automatic. The charge cycle will resume or
start once the THERM input is valid and all other qualification parameters are met. During an invalid THERM
condition, the STAT1 status output will be off and the
STAT2 status output will flash.
5.2.2
VSET INPUT
The VSET input selects the regulated output voltage of
the MCP7386X. With VSET tied to VSS, the MCP73861
and MCP73862 regulate to 4.1V and 8.2V, respectively. With VSET tied to VDD, the MCP73861 and
MCP73862 regulate to 4.2V and 8.4V, respectively.
5.2.3
LOGIC ENABLE (EN)
The logic enable input pin (EN) can be used to
terminate a charge at any time during the charge cycle,
as well as to initiate a charge cycle or initiate a recharge
cycle.
Applying a logic-high input signal to the EN pin, or tying
it to the input source, enables the device. Applying a
logic-low input signal disables the device and terminates a charge cycle. When disabled, the device’s
supply current is reduced to 0.17 µA, typically.
Note: Off state: open-drain is high-impedance;
On state: open-drain can sink current,
typically 7 mA;
Flashing: toggles between off state and
on state.
DS21893A-page 16
 2004 Microchip Technology Inc.
MCP73861/2
6.0
APPLICATIONS
cells, constant current followed by constant voltage.
Figure 6-1 depicts a typical stand-alone application
circuit and Figures 6-2 and 6-3 depict the
accompanying charge profile.
STAT1
16
VSET
VDD1
VDD2
VSS1
15
EN VSS2
14 13
1
12
2
11
MCP73861
3
10
4
9
5
6
THREF
PROG
RPROG
7
VBAT3
VBAT2
+ Single
- Lithium-Ion
Cell
VBAT1
VSS3
8
TIMER
CTIMER
THERM
Unregulated
Wall Cube
STAT2
The MCP7386X are designed to operate in conjunction with a host microcontroller or in stand-alone applications. The MCP7386X provides the preferred
charge algorithm for Lithium-Ion and Lithium-Polymer
RT1
RT2
FIGURE 6-1:
Typical Application Circuit.
Constant Current
Mode
Preconditioning
Mode
Constant Voltage
Mode
Regulation
Voltage
(VREG)
Regulation
Current
(IREG)
Charge
Voltage
Transition
Threshold
(VPTH)
Precondition
Current
(IPREG)
Charge
Current
Termination
Current
(ITERM)
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-2:
Typical Charge Profile.
 2004 Microchip Technology Inc.
DS21893A-page 17
MCP73861/2
Preconditioning
Mode
Constant Current
Mode
Constant Voltage
Mode
Regulation
Voltage
(VREG)
Regulation
Current
(IREG)
Charge
Voltage
Transition
Threshold
(VPTH)
Precondition
Current
(IPREG)
Termination
Current
(ITERM)
Charge
Current
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-3:
6.1
Typical Charge Profile in Thermal Regulation.
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation is
when the device has transitioned from the preconditioning phase to the constant current phase. In this
situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
6.1.1
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
6.1.1.1
1200 mA is the maximum charge current obtainable
from the MCP7386X. For this situation, the PROG input
should be connected directly to VSS.
6.1.1.2
Thermal Considerations
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
preconditioning phase to the constant current phase. In
this case, the power dissipation is:
PowerDissipation = ( V DDMAX – V PTHMIN ) × I REGMAX
Where:
VDDMAX is the maximum input voltage
IREGMAX is the maximum fast charge current
VPTHMIN is the minimum transition threshold
voltage.
Current Programming Resistor
(RPROG)
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAh battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times without degradation to the battery pack performance or life.
DS21893A-page 18
 2004 Microchip Technology Inc.
MCP73861/2
Power dissipation with a 5V, ±10% input voltage source
is:
PowerDissipation = ( 5.5V – 2.7V ) × 575mA = 1.61W
With the battery charger mounted on a 1 in2 pad of
1 oz. copper, the junction temperature rise is 60°C,
approximately. This would allow for a maximum operating ambient temperature of 50°C before thermal
regulation is entered.
6.1.1.3
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins.
It is recommended to minimize voltage drops along the
high current carrying PCB traces.
If the PCB layout is used as a heatsink, adding many
vias in the heatsink pad can help conduct more heat to
the back-plane of the PCB, thus reducing the maximum
junction temperature.
External Capacitors
The MCP7386X is stable with or without a battery load.
In order to maintain good AC stability in the Constant
Voltage mode, a minimum capacitance of 4.7 µF is
recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and interconnections appear inductive at high frequencies. These
elements are in the control feedback loop during
constant voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the
inductive nature of the battery pack.
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum Effective Series Resistance (ESR) value. The actual value of
the capacitor and its associated ESR depends on the
output load current. A 4.7 µF ceramic, tantalum or aluminum electrolytic capacitor at the output is usually
sufficient to ensure stability for up to a 1A output
current.
6.1.1.4
Reverse-Blocking Protection
The MCP7386X provides protection from a faulted or
shorted input, or from a reversed-polarity input source.
Without the protection, a faulted or shorted input would
discharge the battery pack through the body diode of
the internal pass transistor.
6.1.1.5
Enable Interface
In the stand-alone configuration, the enable pin is generally tied to the input voltage. The MCP7386X automatically enters a low-power mode when voltage on
the VDD input falls below the undervoltage lockout
voltage (VSTOP) reducing the battery drain current to
0.23 µA, typically.
6.1.1.6
Charge Status Interface
Two status outputs provide information on the state of
charge. The current-limited, open-drain outputs can be
used to illuminate external LEDs. Refer to Table 5-1 for
a summary of the state of the status outputs during a
charge cycle.
 2004 Microchip Technology Inc.
DS21893A-page 19
MCP73861/2
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
Example:
16-Lead QFN
16
15
14
13
1
XXXXXXXX
XXXXXXXX
YYWW
NNN
2
3
4
5
6
Legend:
Note:
*
16
12
7
XX...X
YY
WW
NNN
11
2
10
3
9
4
8
15
14
13
1
12
G3861
I/ML
0412
256
5
6
7
11
10
9
8
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21893A-page 20
 2004 Microchip Technology Inc.
MCP73861/2
16-Lead Plastic Quad Flat No Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated
D
D1
EXPOSED
METAL
PAD
e
E1
E
2
b
1
n
OPTIONAL
INDEX
AREA
TOP VIEW
L
BOTTOM VIEW
A3
A
A1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Units
Dimension Limits
n
e
A
A1
A3
E
E2
D
D2
b
L
MIN
.031
.000
.152
.100
.152
.100
.010
.012
INCHES
NOM
16
.026 BSC
.035
.001
.008 REF
.157
.106
.157
.106
.012
.016
MAX
.039
.002
.163
.110
.163
.110
.014
.020
MILLIMETERS*
NOM
16
0.65 BSC
0.80
0.90
0.00
0.02
0.20 REF
4.00
3.85
2.55
2.70
3.85
4.00
2.55
2.70
0.25
0.30
0.30
0.40
MIN
MAX
1.00
0.05
4.15
2.80
4.15
2.80
0.35
0.50
*Controlling Parameter
Notes:
JEDEC equivalent: MO-220
Drawing No. C04-127
 2004 Microchip Technology Inc.
Revised 04-24-05
DS21893A-page 21
MCP73861/2
NOTES:
DS21893A-page 22
 2004 Microchip Technology Inc.
MCP73861/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
XX
Device
Temperature
Range
Package
Examples:
a)
b)
a)
Device
MCP73861:
MCP73861T:
MCP73862:
MCP73862T:
Single-cell charge controller with temperature
monitor
Single-cell charge controller with temperature
monitor, Tape and Reel
Dual series cells charge controller with
temperature monitor
Dual series cells charge controller with
temperature monitor, Tape and Reel
Temperature Range
I
Package
ML
= Plastic Quad Flat No Lead, 4x4 mm Body (QFN),
16-lead
Lead Finish
G
= Matte Tin (Pure Sn)
b)
MCP73861T-I/MLG: Tape and Reel,
Single Cell Controller
MCP73861-I/MLG: Single Cell Controller
MCP73862T-I/MLG: Tape and Reel,
Dual Series Controller
MCP73862-I/MLG: Dual Series Controller
= -40°C to +85°C (Industrial)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2004 Microchip Technology Inc.
DS21893A-page 23
MCP73861/2
NOTES:
DS21893A-page 24
 2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2004 Microchip Technology Inc.
DS21893A-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
China - Beijing
Korea
Corporate Office
Unit 706B
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
China - Chengdu
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: www.microchip.com
3780 Mansell Road, Suite 130
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Tel: 770-640-0034
Fax: 770-640-0307
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
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Tel: 86-28-86766200
Fax: 86-28-86766599
Boston
China - Fuzhou
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Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Unit 28F, World Trade Plaza
No. 71 Wusi Road
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Tel: 86-591-7503506
Fax: 86-591-7503521
Atlanta
Chicago
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ASIA/PACIFIC
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Singapore
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Kaohsiung Branch
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Tel: 886-7-536-4818
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Taiwan
Taiwan Branch
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Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
China - Shanghai
Austria
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Durisolstrasse 2
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Austria
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China - Shenzhen
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China - Shunde
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China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
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India
Divyasree Chambers
1 Floor, Wing A (A3/A4)
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Tel: 91-80-22290061 Fax: 91-80-22290062
Japan
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
France
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
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Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany
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Italy
Via Quasimodo, 12
20025 Legnano (MI)
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Netherlands
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United Kingdom
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Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
05/28/04
DS21893A-page 26
 2004 Microchip Technology Inc.
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