TI1 LM810M3-4.63/NOPB Lm809/lm810 3-pin microprocessor reset circuit Datasheet

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LM809/LM810 3-Pin Microprocessor Reset Circuits
1 Features
3 Description
•
The LM809 and LM810 microprocessors supervisory
circuits can be used to monitor the power supplies in
microprocessor and digital systems. They provide a
reset to the microprocessor during power-up, powerdown and brown-out conditions.
1
•
•
•
•
•
•
Precision Monitoring of Supply Voltages
– Available Threshold Options:
2.63 V, 2.93 V, 3.08 V, 4.38 V, 4.63 V
Superior Upgrade to MAX809 and MAX810
Fully Specified Over Temperature
140-ms Minimum Power-On Reset Pulse Width,
240-ms Typical
– Active-Low RESET Output (LM809)
– Active-High RESET Output (LM810)
Ensured RESET Output Valid for VCC ≥ 1 V
Low Supply Current, 15-µA Typical
Power Supply Transient Immunity
2 Applications
•
•
•
•
•
•
•
•
•
•
The function of the LM809 and LM810 are to monitor
the VCC supply voltage, and assert a reset signal
whenever this voltage declines below the factoryprogrammed reset threshold. The reset signal
remains asserted for 240 ms after VCC rises above
the threshold. The LM809 has an active-low RESET
output, while the LM810 has an active-high RESET
output.
Seven standard reset voltage options are available,
suitable for monitoring 5-V, 3.3-V, and 3-V supply
voltages.
With a low supply current of only 15 µA, the LM809
and LM810 are ideal for use in portable equipment.
Factory Automation
Building Automation
Programmable Logic Control
Renewable Energy
Microprocessor Systems
Computers
Controllers
Intelligent Instruments
Portable/Battery-Powered Equipment
Automotive
Device Information(1)
PART NUMBER
LM809, LM810
PACKAGE
SOT-23 (3)
BODY SIZE (NOM)
2.92 mm × 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application for Microprocessor Reset Circuit
VCC
VCC
VCC
LM809
µP
RESET
GND
RESET
INPUT
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM809, LM810
SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 7
7.3 Feature Description................................................... 7
7.4 Device Functional Modes.......................................... 9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 11
11 Device and Documentation Support ................. 12
11.1
11.2
11.3
11.4
11.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
12
12
12
12
12
12 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (May 2013) to Revision E
Page
•
Removed the SON package................................................................................................................................................... 1
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
2
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5 Pin Configuration and Functions
LM809
DBZ Package
3-Pin SOT-23
Top View
GND
LM810
DBZ Package
3-Pin SOT-23
Top View
1
GND
3
RESET
V
CC
1
!
3
2
RESET
V
CC
2
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
LM809
LM810
RESET
2
—
O
Active-low output. RESET remains low while VCC is below the reset threshold, and for 240 ms
after VCC rises above the reset threshold.
RESET
—
2
O
Active-high output. RESET remains high while VCC is below the reset threshold, and for 240 ms
after VCC rises above the reset threshold.
VCC
3
3
I
Supply voltage
GND
1
1
—
Ground reference
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6 Specifications
6.1 Absolute Maximum Ratings
see
(1) (2)
MIN
MAX
UNIT
Input supply voltage
VCC
–0.3
6
V
Output voltage
RESET, RESET
–0.3
VCC + 0.3
V
Input current
VCC
20
mA
Output current
RESET, RESET
20
mA
Rate of rise
VCC
100
V/µs
Continuous power dissipation
320
mW
Lead temperature (soldering, 10 s)
300
°C
105
°C
125
°C
160
°C
Ambient temperature range, TA
–40
Maximum junction temperature, TJ(MAX)
Storage temperature, Tstg
(1)
(2)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
Electrostatic discharge
(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VCC
Input voltage range
ICC
NOM
MAX
TA = 0°C to 70°C
1.0
5.5
TA = –40°C to 105°C
1.2
5.5
VCC < 5.5 V,
LM8xx: 4.63, 4.38, 4.00
TA = –40°C to 85°C
VCC < 3.6 V,
LM8xx: 3.08, 2.93, 2.63, 2.45
TA = –40°C to 85°C
18
V
60
TA = 85°C to 105°C
Supply Current
UNIT
100
15
50
TA = 85°C to 105°C
µA
100
6.4 Thermal Information
LM809, LM810
THERMAL METRIC
(1)
DBZ (SOT-23)
UNIT
3 PINS
RθJA
Junction-to-ambient thermal resistance
252.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
113.3
°C/W
RθJB
Junction-to-board thermal resistance
53.5
°C/W
ψJT
Junction-to-top characterization parameter
9.9
°C/W
ψJB
Junction-to-board characterization parameter
52.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
VCC = full range, TA = –40°C to 105°C, unless otherwise noted. Typical values are at TA = 25°C, VCC = 5 V for 4.63, 4.38, and
4.00 versions, VCC = 3.3 V for 3.08 and 2.93 versions, and VCC = 3 V for 2.63 and 2.45 version (1).
PARAMETER
TEST CONDITIONS
LM8xx: 4.63 V
LM8xx: 4.38 V
LM8xx: 4.00 V
VTH
Reset Threshold (2)
LM8xx: 3.08 V
LM8xx: 2.93 V
LM8xx: 2.63 V
LM8xx: 2.45 V
MIN
TYP
MAX
TA = 25°C
4.56
4.63
4.70
TA = –40°C to 85°C
4.50
TA = 85°C to 105°C
4.40
TA = 25°C
4.31
TA = –40°C to 85°C
4.25
TA = 85°C to 105°C
4.16
TA = 25°C
3.93
TA = –40°C to 85°C
3.89
TA = 85°C to 105°C
3.80
TA = 25°C
3.04
TA = –40°C to 85°C
3.00
TA = 85°C to 105°C
2.92
TA = 25°C
2.89
TA = –40°C to 85°C
2.85
3.00
TA = 85°C to 105°C
2.78
3.08
TA = 25°C
2.59
TA = –40°C to 85°C
2.55
2.70
TA = 85°C to 105°C
2.50
2.76
TA = 25°C
2.41
TA = –40°C to 85°C
2.38
2.52
TA = 85°C to 105°C
2.33
2.57
Reset Threshold
Temperature Coefficient
VCC to Reset Delay
(2)
Reset Active Timeout
Period
RESET Output Voltage
Low (LM809)
VOL
VOH
4.86
4.38
4.45
4.50
4.56
4.00
4.06
4.10
4.20
3.08
3.11
3.15
V
3.23
2.93
2.63
2.45
2.96
2.66
2.49
ppm/°C
20
TA = –40°C to 85°C
140
TA = 85°C to 105°C
100
240
µs
560
840
VCC = VTH(min), ISINK = 1.2 mA, LM809: 2.45, 2.63, 2.93, 3.08
0.3
VCC = VTH(min), ISINK = 3.2 mA, LM809: 4.63, 4.38, 4.00
0.4
VCC > 1 V, ISINK = 50 µA
0.3
RESET Output Voltage
Low (LM810)
VCC = VTH(max), ISINK = 1.2 mA, LM810: 2.63, 2.93, 3.08
0.3
VCC = VTH(max), ISINK = 3.2 mA, LM810: 4.63, 4.38, 4.00
0.4
RESET Output Voltage
High (LM809)
VCC > VTH(max), ISOURCE = 500 µA, LM809: 2.45, 2.63, 2.93, 3.08
0.8 × VCC
VCC > VTH(max), ISOURCE = 800 µA, LM809: 4.63, 4.38, 4.00
VCC – 1.5
1.8 V < VCC < VTH(min), ISOURCE = 150 μA
0.8 × VCC
RESET Output Voltage
High (LM810)
(1)
(2)
4.75
30
VCC = VTH to (VTH – 100 mV)
UNIT
ms
V
V
Production testing done at TA = 25°C, over temperature limits specified by design only.
RESET Output for LM809, RESET output for LM810.
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20
20
15
15
Supply Current (µA)
Supply Current (µA)
6.6 Typical Characteristics
10
5
10
5
0
0
–40
–20
0
20
40
60
80
–40
–20
0
20
40
60
80
Temperature (°C)
Temperature (°C)
Figure 1. Supply Current vs Temperature
(No Load, LM8xx: 2.63, 2.93, 3.08)
Figure 2. Supply Current vs Temperature
(No Load, LM8xx: 4.63, 4.38)
180
100
Power-Down Reset Delay (µs)
Power-Down Reset Delay (µs)
160
80
60
40
20
140
120
100
80
60
40
20
0
–40
0
–40
–20
0
20
40
60
80
–20
0
20
40
60
80
Temperature (°C)
Temperature (°C)
Figure 3. Power-Down Reset Delay vs Temp
(LM8xx: 2.63, 2.93, 3.08)
Figure 4. Power-Down Reset Delay vs Temperature
(LM8xx: 4.63, 4.38)
1.003
250
1.002
240
Normalized Threshold
Power-Up Reset Timeout (ms)
245
235
230
225
220
215
210
1.001
1.000
0.999
0.998
205
200
–40
0.997
–20
0
20
40
60
80
–40
Temperature (°C)
0
20
40
60
80
Temperature (°C)
Figure 5. Power-Up Reset Timeout vs Temperature
6
–20
Figure 6. Normalized Reset Threshold vs Temperature
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7 Detailed Description
7.1 Overview
The LM809 and LM810 microprocessor supervisory circuits provide a simple solution to monitor the power
supplies in microprocessor and digital systems and provide a reset during power-up, power-down, and brown-out
conditions. The reset signal is controlled by the factory-programmed reset threshold on the VCC supply voltage
pin. When the voltage declines below the reset threshold, the reset signal is asserted and remains asserted for
240 ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has
an active-high RESET output. The available threshold options are 2.63 V, 2.93 V, 3.08 V, 4.38 V, and 4.63 V to
provide precision monitoring of supply voltages.
7.2 Functional Block Diagram
INPUT
RD
+
RESET
VREF
GND
7.3 Feature Description
7.3.1 Benefits of Precision Reset Thresholds
A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage.
A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63-V and 3.08-V
options of the LM809 and LM810 use highly accurate circuitry to ensure that the reset threshold occurs only
within this range (for 5-V and 3.3-V supplies). The other voltage options have the same tight tolerance to ensure
a reset signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds
apply to 3-V, 3.3-V, and 5-V nominal supply voltages.
Table 1. Reset Thresholds Related to Common Supply Voltages
Reset Threshold
3V
3.3 V
5V
4.63 ± 3%
90 – 95%
4.38 ± 3%
85 – 90%
4.00 ± 3%
78 – 82%
3.08 ± 3%
90 – 95%
2.93 ± 3%
86 – 90%
2.63 ± 3%
85 – 90%
77 – 81%
2.45 ± 3%
79 – 84%
72 – 76%
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7.3.1.1 Ensuring a Valid Reset Output Down to VCC = 0 V
When VCC falls below 1 V, the LM809 RESET output no longer sinks current. A high-impedance CMOS logic
input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100-kΩ
resistor should be connected from the RESET output to ground, as shown in Figure 7.
A 100-kΩ pullup resistor to VCC is also recommended for the LM810, if RESET is required to remain valid for VCC
< 1 V.
VCC
LM809
RESET
R1
100 kΩ
GND
Figure 7. RESET Valid to VCC = Ground Circuit
7.3.1.2 Negative-Going VCC Transients
The LM809 and LM810 are relatively immune to short negative-going transients or glitches on VCC. Figure 8
shows the maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In
general, as the magnitude of the transient increases, going further below the threshold, the maximum allowable
pulse width decreases. Typically, for the 4.63-V and 4.38-V version of the LM809 or LM810, a VCC transient that
goes 100 mV below the reset threshold and lasts 20 µs or less will not cause a reset pulse. A 0.1-µF bypass
capacitor mounted as close as possible to the VCC pin will provide additional transient rejection.
Maximum Transient Duration (µs)
560
480
400
320
240
160
80
0
1
10
100
1000
Reset Comparator Overdrive (ms)
Figure 8. Maximum Transient Duration without Causing a Reset Pulse vs Reset Comparator Overdrive
8
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7.3.1.3 Interfacing to µPs with Bidirectional Reset Pins
Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the
LM809 RESET output. To ensure a correct output on the LM809 even when the microprocessor reset pin is in
the opposite state, connect a 4.7-kΩ resistor between the LM809 RESET output and the µP reset pin, as shown
in Figure 9. Buffer the LM809 RESET output to other system components.
BUFFER
VCC
Buffered RESET
to other system
components
VCC
µP
LM809
4.7 kΩ
RESET
GND
RESET
GND
Figure 9. Interfacing to Microprocessors with Bidirectional Reset I/O
7.4 Device Functional Modes
7.4.1 VCC Supply Voltage Low
When VCC supply voltage declines below the reset threshold, the RESET output is asserted. For LM809, the
active-low RESET output is low. For LM810, the active-high RESET output is high.
7.4.2 VCC Supply Voltage High
When the VCC supply voltage rises above the reset threshold, the RESET output resets after 240 ms. For LM809,
the active-low RESET output rises high. For LM810, the active-high RESET output drops low.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM809 and LM810 are a supervisor circuit for microprocessor and digital systems. With a low supply current
of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment.
8.2 Typical Application
VCC
VCC
LM809
RESET
GND
VCC
µP
RESET
INPUT
GND
Figure 10. Microprocessor RESET Circuit
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input supply voltage range
1 V to 5.5 V
Reset output voltage (high)
Input supply
Reset output voltage (low)
0V
8.2.2 Detailed Design Procedure
For the typical application circuit, all that is required is the LM809 or LM810 IC, but TI recommends an input
capacitor to help with input voltage transients. A typical input capacitor value is 0.1 uF and must be rated for the
highest expected input voltage.
10
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8.2.3 Application Curve
VCC
VCC threshold (5 V, 3.3 V, or 3 V)
240 ms
RESET (LM809)
RESET (LM810)
Figure 11. Reset Active Timeout
9 Power Supply Recommendations
The input of the LM809 is designed to handle up to the supply voltage absolute maximum rating of 6.5 V. If the
input supply is susceptible to any large transients above the maximum rating, then extra precautions should be
taken. An input capacitor is recommended to avoid false reset output triggers due to noise.
10 Layout
10.1 Layout Guidelines
Place the input capacitor as close as possible to the IC.
10.2 Layout Example
C1 U1
VCC Input
Reset
GND
Figure 12. Layout Example
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11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM809
Click here
Click here
Click here
Click here
Click here
LM810
Click here
Click here
Click here
Click here
Click here
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Nov-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM809M3-2.63
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
S3B
LM809M3-2.63/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S3B
LM809M3-2.93
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
S4B
LM809M3-2.93/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S4B
LM809M3-3.08
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
S5B
LM809M3-3.08/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S5B
LM809M3-4.38/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S7B
LM809M3-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S8B
LM809M3X-2.63/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S3B
LM809M3X-2.93/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S4B
LM809M3X-3.08/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S5B
LM809M3X-4.38/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM809M3X-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S8B
S7B
LM810M3-4.63
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 105
SEB
LM810M3-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
SEB
LM810M3X-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
SEB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
3-Nov-2015
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM809M3-2.63
SOT-23
DBZ
3
1000
178.0
8.4
LM809M3-2.63/NOPB
SOT-23
DBZ
3
1000
178.0
LM809M3-2.93
SOT-23
DBZ
3
1000
178.0
LM809M3-2.93/NOPB
SOT-23
DBZ
3
1000
LM809M3-3.08
SOT-23
DBZ
3
LM809M3-3.08/NOPB
SOT-23
DBZ
LM809M3-4.38/NOPB
SOT-23
DBZ
LM809M3-4.63/NOPB
SOT-23
LM809M3X-2.63/NOPB
LM809M3X-2.93/NOPB
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-3.08/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-4.38/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM809M3X-4.63/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM810M3-4.63
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM810M3-4.63/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM810M3X-4.63/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM809M3-2.63
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-2.63/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-2.93
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-2.93/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-3.08
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-3.08/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-4.38/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3-4.63/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM809M3X-2.63/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-2.93/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-3.08/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-4.38/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM809M3X-4.63/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM810M3-4.63
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM810M3-4.63/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM810M3X-4.63/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 2
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