Samsung K4B2G0446C Ddr3 sdram memory Datasheet

May. 2010
DDR3 SDRAM Memory
Product Guide
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SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
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ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
-1-
May. 2010
Product Guide
DDR3 SDRAM Memory
1. DDR3 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
K 4 B X X X X X X X - X X X X
Speed
SAMSUNG Memory
DRAM
Temp & Power
DRAM Type
Package Type
Density
Revision
Interface (VDD, VDDQ)
Bit Organization
# of Internal Banks
1. SAMSUNG Memory : K
7. Interface ( VDD, VDDQ)
6 : SSTL (1.5V, 1.5V)
2. DRAM : 4
8. Revision
M
A
B
C
D
E
F
G
H
3. DRAM Type
B : DDR3 SDRAM
4. Density
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen
: 8th Gen
: 9th Gen
9. Package Type
Z
H
J
M
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
:
:
:
:
FBGA (Lead-free)
FBGA (Halogen-free & Lead-free)
FBGA (Lead-free, DDP)
FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
L : Commercial Temp.( 0°C ~ 85°C) & Low Power
Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
11. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
-2-
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
May. 2010
Product Guide
DDR3 SDRAM Memory
2. DDR3 SDRAM Component Product Guide
Density
1Gb E-die
1Gb F-die
2Gb B-die
2Gb C-die
DDP 2Gb E-die
4Gb A-die
Banks
8Banks
8Banks
8Banks
8Banks
8Banks
8Banks
DDP 4Gb B-die
8Banks
DDP 4Gb C-die
8Banks
Part Number
Package & Power,
Temp. (-C/-L) & Speed
Org.
K4B1G0446E
HC(L)F7/F8/H9/K0
256M x 4
K4B1G0846E
HC(L)F7/F8/H9/K0
128M x 8
K4B1G1646E
HC(L)F7/F8/H9/K0
64M x 16
K4B1G0446E
HYF7/F8/H9
256M x 4
K4B1G0846E
HYF7/F8/H9
128M x 8
K4B1G0446F
HC(L)F8/H9/K0
256M x 4
K4B1G0846F
HC(L)F8/H9/K0
128M x 8
K4B1G0446F
HY(L)F8/H9
256M x 4
K4B1G0846F
HY(L)F8/H9
128M x 8
K4B2G0446B
HC(L)F7/F8/H9
512M x 4
K4B2G0846B
HC(L)F7/F8/H9
256M x 8
K4B2G1646B
HC(L)F7/F8/H9
128M x 16
K4B2G0446B
HYF7/F8/H9
512M x 4
K4B2G0846B
HYF7/F8/H9
256M x 8
K4B2G0446C
HC(L)F8/H9/K0
512M x 4
K4B2G0846C
HC(L)F8/H9/K0
256M x 8
K4B2G0446C
HY(L)F8/H9
512M x 4
K4B2G0846C
HY(L)F8/H9
256M x 8
K4B2G0446E
MC(L)F7/F8/H9
512M x 4
K4B2G0846E
MC(L)F7/F8/H9
256M x 8
K4B4G0446A
HC(L)F8/H9/K0
1G x 4
K4B2G0846A
HC(L)F8/H9/K0
512M x 8
K4B4G0446A
HY(L)F8/H9/K0
1G x 4
K4B2G0846A
HY(L)F8/H9/K0
512M x 8
K4B4G0446B
MC(L)F7/F8/H9
1G x 4
K4B2G0846B
MC(L)F7/F8/H9
512M x 8
K4B4G0446C
MC(L)F7/F8/H9
1G x 4
K4B2G0846C
MC(L)F7/F8/H9
512M x 8
* NOTE : 1.35V product is 1.5V operatable.
-3-
VDD Voltage
1.5V
PKG
78 ball
FBGA
96 ball
FBGA
1.35V
Avail.
Now
78 ball
FBGA
1.5V
78 ball
FBGA
Now
1.35V
1.5V
78 ball
FBGA
96 ball
FBGA
1.35V
Now
78 ball
FBGA
1.5V
78 ball
FBGA
Now
78 ball
FBGA
Now
1.35V
1.5V
1.5V
78 ball
FBGA
Now
1.35V
1.5V
78 ball
FBGA
Now
1.5V
78 ball
FBGA
Feb.’10
NOTE
May. 2010
Product Guide
DDR3 SDRAM Memory
3. DDR3 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
Speed
DRAM Component Type
Temp & Power
Depth
PCB Revision
Package
# of Banks in Comp. & Interface
Component Revision
Bit Organization
1. Memory Module : M
8. Component Revision
M : 1st Gen.
B : 3rd Gen.
D : 5th Gen.
F : 7th Gen.
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71 :
78 :
91 :
92 :
93 :
x64
x64
x72
x72
x72
204pin Unbuffered SODIMM
240pin Unbuffered DIMM
240pin ECC unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM
A
C
E
G
:
:
:
:
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
9. Package
: FBGA(Lead-free)
Z
: FBGA(Lead-free & Halogen-free)
H
: FBGA(Lead-free, DDP)
J
M : FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0 : None
2 : 2nd Rev.
4 : 4th Rev.
4. DRAM Component Type
1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer
B : DDR3 SDRAM (1.5V VDD)
5. Depth
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G : 1G
2G : 2G
33
65
29
57
52
1K
2K
: 32M (for 128Mb/512Mb)
: 64M (for 128Mb/512Mb)
: 128M (for 128Mb/512Mb)
: 256M (for 512Mb/2Gb)
: 512M (for 512Mb/2Gb)
: 1G (for 2Gb)
: 2G (for 2Gb)
6. # of Banks in comp. & Interface
7 :
11. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
12. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
8Banks & SSTL-1.5V
NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
7. Bit Organization
0 : x4
3 : x8
4 : x16
-4-
May. 2010
Product Guide
DDR3 SDRAM Memory
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Org.
Density
128Mx 64
1GB
128Mx 72
1GB
256Mx 64
2GB
256Mx 72
2GB
Part Number
Speed
M378B2873EH1
CF8/H9
M378B2873FH0
CF8/H9/K0*
M391B2873EH1
CF8/H9
M391B2873FH0
CF8/H9/K0*
M378B5673EH1
CF8/H9
M378B5673FH0
CF8/H9/K0*
M378B5773CH0
CF8/H9/K0*
M391B5673EH1
CF8/H9
M391B5673FH0
CF8/H9/K0*
M391B5773CH0
CF8/H9/K0*
M378B5273BH1
CF8/H9
M378B5273CH0
CF8/H9/K0*
M391B5273BH1
CF8/H9
M391B5273CH0
CF8/H9/K0*
8GB
M378B1G73AH0
CF8/H9/K0*
8GB
M391B1G73AH0
CF8/H9/K0*
512Mx 64
4GB
512Mx 72
4GB
1Gx 64
1Gx 72
Raw Card
A(1Rx8)
D(1Rx8)
B(2Rx8)
A(1Rx8)
E(2Rx8)
D(1Rx8)
Composition
Comp.
Version
128M x 8 * 8 pcs
1Gb
E-die
128M x 8 * 8 pcs
1Gb
F-die
128M x 8 * 9 pcs
1Gb
E-die
128M x 8 * 9 pcs
1Gb
F-die
128M x 8 * 16 pcs
1Gb
E-die
128M x 8 * 16 pcs
1Gb
F-die
256M x 8 * 8 pcs
2Gb
C-die
128M x 8 * 18 pcs
1Gb
E-die
128M x 8 * 18 pcs
1Gb
F-die
256M x 8 * 9 pcs
2Gb
C-die
256M x 8 * 16 pcs
2Gb
B-die
256M x 8 * 16 pcs
2Gb
C-die
256M x 8 * 18 pcs
2Gb
B-die
256M x 8 * 18 pcs
2Gb
C-die
B(2Rx8)
512M x 8 * 16 pcs
4Gb
E(2Rx8)
512M x 8 * 18 pcs
4Gb
B(2Rx8)
E(2Rx8)
Internal
Banks
Rank
PKG
Height
Avail.
8
1
78 ball
FBGA
30mm
Now
8
1
78 ball
FBGA
30mm
Now
8
2
78 ball
FBGA
30mm
Now
8
1
78 ball
FBGA
30mm
Now
8
2
NOTE
1
8
2
78 ball
FBGA
30mm
Now
8
2
78 ball
FBGA
30mm
Now
A-die
8
2
78 ball
FBGA
30mm
Now
A-die
8
2
78 ball
FBGA
30mm
Now
Internal
Banks
Rank
PKG
Height
Avail.
8
1
78 ball
FBGA
30mm
Now
8
2
78 ball
FBGA
30mm
Now
8
1
8
2
78 ball
FBGA
30mm
Now
8
2
78 ball
FBGA
30mm
Now
* NOTE : K0(1600Mbps) will be available by ES level
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
240Pin DDR3 Unbuffered DIMM
Org.
Density
128Mx 72
1GB
256Mx 72
2GB
512Mx 72
4GB
1Gx 72
8GB
Part Number
Speed
M391B2873EH1
YF8/H9
M391B2873FH0
YF8/H9
M391B5673EH1
YF8/H9
M391B5673FH0
YF8/H9
M391B5773CH0
YF8/H9
M391B5273BH1
YF8/H9
M391B5273CH0
YF8/H9
M391B1G73AH0
YF8/H9
Raw Card
D(1Rx8)
E(2Rx8)
D(1Rx8)
E(2Rx8)
E(2Rx8)
Composition
Comp.
Version
128M x 8 * 9 pcs
1Gb
E-die
128M x 8 * 9 pcs
1Gb
F-die
128M x 8 * 18 pcs
1Gb
E-die
128M x 8 * 18 pcs
1Gb
F-die
256M x 8 * 9 pcs
2Gb
C-die
256M x 8 * 18 pcs
2Gb
B-die
256M x 8 * 18 pcs
2Gb
C-die
512M x 8 * 18 pcs
4Gb
A-die
* NOTE : 1.35V product is 1.5V operatable.
-5-
NOTE
May. 2010
Product Guide
DDR3 SDRAM Memory
4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Org.
128Mx 64
256Mx 64
Density
1GB
2GB
512Mx 64
4GB
1Gx 64
8GB
Comp.
Version
Part Number
Speed
Raw Card
Composition
M471B2873EH1
CF8/H9
B(1Rx8)
128M x 8 * 8 pcs
1Gb
M471B2874EH1
CF8/H9
A(2Rx16)
64M x 16 * 8 pcs
1Gb
M471B2873FHS
CF8/H9
M471B5673EH1
CF8/H9
M471B5673FH0
CF8/H9
M471B5773CHS
CF8/H9
M471B5273BH1
CF8/H9
M471B5273CH0
CF8/H9
M471B1G73AH0
CF8/H9
B(1Rx8)
F(2Rx8)
B(1Rx8)
F(2Rx8)
F(2Rx8)
Internal
Banks
Rank
PKG
E-die
8
1
78 ball
FBGA
E-die
8
2
96 ball
8
1
78 ball
FBGA
8
2
8
1
8
Height
Avail.
30mm
Now
78 ball
FBGA
30mm
Now
2
78 ball
FBGA
30mm
Now
8
2
78 ball
FBGA
30mm
Now
Internal
Banks
Rank
PKG
Height
Avail.
F-die
8
1
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
64M x 16 * 8 pcs
1Gb
F-die
128M x 8 * 16 pcs
1Gb
E-die
128M x 8 * 16 pcs
1Gb
F-die
256M x 8 * 8 pcs
2Gb
C-die
256M x 8 * 16 pcs
2Gb
B-die
256M x 8 * 16 pcs
2Gb
C-die
512M x 8 * 16 pcs
4Gb
A-die
NOTE
4.4 204Pin DDR3 SoDIMM (1.35V Product)
204Pin DDR3 SODIMM
Comp.
Version
Org.
Density
Part Number
Speed
Raw Card
Composition
128Mx 64
1GB
M471B2873FHS
YF8/H9
B(1Rx8)
128M x 8 * 8 pcs
1Gb
256Mx 64
2GB
M471B5673FH0
YF8/H9
F(2Rx8)
128M x 8 * 16 pcs
1Gb
F-die
8
2
M471B5773CHS
YF8/H9
B(1Rx8)
256M x 8 * 8 pcs
2Gb
C-die
8
1
512Mx 64
4GB
8
2
78 ball
FBGA
30mm
Now
1Gx 64
8GB
8
2
78 ball
FBGA
30mm
Now
M471B5273BH1
YF8/H9
M471B5273CH0
YF8/H9
M471B1G73AH0
YF8/H9
F(2Rx8)
F(2Rx8)
256M x 8 * 16 pcs
2Gb
B-die
256M x 8 * 16 pcs
2Gb
C-die
512M x 8 * 16 pcs
4Gb
A-die
* NOTE : 1.35V product is 1.5V operatable.
-6-
NOTE
May. 2010
Product Guide
DDR3 SDRAM Memory
4.5 240Pin DDR3 Registered DIMM (1.5V Product)
240Pin DDR3 Registered DIMM
Org.
Density
128Mx 72
1GB
256Mx 72
512Mx 72
1Gx 72
2GB
4GB
8GB
Part Number
Speed
M393B2873EH1
CF8/H9
M393B2873FH0
CF8/H9
M393B5673EH1
CF8/H9
M393B5673FH0
CF8/H9
M393B5670EH1
CF8/H9
M393B5670FH0
CF8/H9
M393B5773CH0
CF8/H9
M393B5173EH1
CF8
M393B5173FH0
CF8/H9
M393B5170EH1
CF8/H9
M393B5170FH0
CF8/H9
M393B5273BH1
CF8/H9
M393B5273CH0
CF8/H9
M393B5270BH1
CF8/H9
M393B5270CH0
CF8/H9
M393B1G70EM1
CF8
M393B1K73BH1
CF8
M393B1K73CH0
CF8/H9
M393B1K70BH1
CF8/H9
M393B1K70CH0
CF8/H9
M393B2K70BM1
CF8
Raw Card
A(1Rx8)
B(2Rx8)
C(1Rx4)
A(1Rx8)
H(4Rx8
E(2Rx4)
B(2Rx8)
C(1Rx4)
F(4Rx4)
H(4Rx8)
E(2Rx4)
F(4Rx4)
2Gx 72
4Gx 72
16GB
32GB
Composition
Comp.
Version
128M x 8 * 9 pcs
1Gb
E-die
128M x 8 * 9 pcs
1Gb
F-die
128M x 8 * 18 pcs
1Gb
E-die
128M x 8 * 18 pcs
1Gb
F-die
256M x 4 * 18 pcs
1Gb
E-die
256M x 4 * 18 pcs
1Gb
F-die
256M x 8 * 9 pcs
2Gb
C-die
128M x 8 * 36 pcs
1Gb
E-die
128M x 8 * 36 pcs
1Gb
F-die
256M x 4 * 36 pcs
1Gb
E-die
256M x 4 * 36 pcs
1Gb
F-die
256M x 8 * 18 pcs
2Gb
B-die
256M x 8 * 18 pcs
2Gb
C-die
512M x 4 * 18 pcs
2Gb
B-die
512M x 4 * 18 pcs
2Gb
C-die
DDP
x 4 * 36 pcs
512M
1Gb
E-die
256M x 8 * 36 pcs
2Gb
B-die
256M x 8 * 36 pcs
2Gb
C-die
512M x 4 * 36 pcs
2Gb
B-die
512M x 4 * 36 pcs
2Gb
C-die
DDP
x 4 * 36 pcs
1G
2Gb
B-die
DDP
x 4 * 36 pcs
1G
2Gb
C-die
Internal
Banks
Rank
PKG
Height
Avail.
8
1
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
2
8
1
4
2
8
2
1
4
8
4
2
4
M393B2K70CM0
CF8/H9
M393B2G70AH0
CF8/H9
E(2Rx4)
1G x 4 * 36 pcs
4Gb
A-die
2
M393B2G73AH0
CF8/H9
H(4Rx8)
512M x 8 * 36 pcs
4Gb
A-die
4
M393B4G70AH0
CF8/H9
AB(4Rx4)
DDP
x 4 * 36 pcs
2G
4Gb
A-die
-7-
8
8
4
NOTE
May. 2010
Product Guide
DDR3 SDRAM Memory
4.6 240Pin DDR3 Registered DIMM (1.35V Product)
240Pin DDR3 Registered DIMM
Org.
Density
128Mx 72
1GB
256Mx 72
512Mx 72
1Gx 72
2GB
4GB
8GB
Part Number
Speed
M393B2873EH1
YF8/H9
M393B2873FH0
YF8/H9
M393B5673EH1
YF8/H9
M393B5673FH0
YF8/H9
M393B5670EH1
YF8/H9
M393B5670FH0
YF8/H9
M393B5773CH0
YF8/H9
M393B5173EH1
YF8
M393B5173FH0
YF8/H9
M393B5170EH1
YF8/H9
M393B5170FH0
YF8/H9
M393B5273BH1
YF8/H9
M393B5273CH0
YF8/H9
M393B5270BH1
YF8/H9
M393B5270CH0
YF8/H9
M393B1G70EM1
YF8
M393B1K73BH1
YF8
M393B1K73CH0
YF8/H9
M393B1K70BH1
YF8/H9
M393B1K70CH0
YF8/H9
M393B2K70BM1
YF8
Raw Card
A(1Rx8)
B(2Rx8)
C(1Rx4)
A(1Rx8)
H(4Rx8)
E(2Rx4)
B(2Rx8)
C(1Rx4)
F(4Rx4)
H(4Rx8)
E(2Rx4)
F(4Rx4)
2Gx 72
4Gx 72
16GB
32GB
Composition
Comp.
Version
128M x 8 *
9 pcs
1Gb
E-die
128M x 8 *
9 pcs
1Gb
F-die
128M x 8 * 18 pcs
1Gb
E-die
128M x 8 * 18 pcs
1Gb
F-die
256M x 4 * 18 pcs
1Gb
E-die
256M x 4 * 18 pcs
1Gb
F-die
256M x 8 *
2Gb
C-die
128M x 8 * 36 pcs
1Gb
E-die
128M x 8 * 36 pcs
1Gb
F-die
256M x 4 * 36 pcs
1Gb
E-die
256M x 4 * 36 pcs
1Gb
F-die
256M x 8 * 18 pcs
2Gb
B-die
256M x 8 * 18 pcs
2Gb
C-die
9 pcs
512M x 4 * 18 pcs
2Gb
B-die
512M x 4 * 18 pcs
2Gb
C-die
DDP
x 4 * 36 pcs
512M
1Gb
E-die
256M x 8 * 36 pcs
2Gb
B-die
256M x 8 * 36 pcs
2Gb
C-die
512M x 4 * 36 pcs
2Gb
B-die
512M x 4 * 36 pcs
2Gb
C-die
DDP
x 4 * 36 pcs
1G
2Gb
B-die
DDP
x 4 * 36 pcs
1G
2Gb
C-die
M393B2K70CM0
YF8/H9
M393B2G70AH0
YF8/H9
E(2Rx4)
1G x 4 * 36 pcs
4Gb
A-die
M393B2G73AH0
YF8/H9
H(4Rx8)
512M x 8 * 36 pcs
4Gb
A-die
M393B4G70AH0
YF8/H9
AB(4Rx4)
DDP
x 4 * 36 pcs
2G
4Gb
A-die
* NOTE : 1.35V product is 1.5V operatable.
-8-
Internal
Banks
Rank
PKG
Height
Avail.
8
1
78 ball
FBGA
30mm
Now
8
2
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
8
1
8
4
8
2
8
2
8
1
8
4
8
4
8
2
8
4
78 ball
FBGA
30mm
Now
8
4
78 ball
FBGA
30mm
Now
NOTE
May. 2010
Product Guide
DDR3 SDRAM Memory
4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
Org.
Density
128Mx 72
1GB
256Mx 72
2GB
Part Number
Speed
M392B2873EH1
CF8/H9
M392B2873FH0
CF8/H9
M392B5673EH1
CF8/H9
M392B5673FH0
CF8/H9
M392B5670EH1
CF8/H9
M392B5670FH0
CF8/H9
M392B5773CH0
CF8/H9
M392B5170EM1
Raw Card
K(1Rx8)
L(2Rx8
M(1Rx4)
K(1Rx8)
CF8/H9
N(2Rx4)
512Mx 72
4GB
M392B5170FM0
CF8/H9
M392B5273BH1
CF8/H9
M392B5273CH0
CF8/H9
M392B5270BH1
CF8/H9
M392B5270CH0
CF8/H9
M392B1K73BM1
CF8
L(2Rx8)
M(1Rx4)
V(4Rx8)
1Gx 72
Comp.
Version
128M x 8 *
9 pcs
1Gb
E-die
128M x 8 *
9 pcs
1Gb
F-die
128M x 8 * 18 pcs
1Gb
E-die
128M x 8 * 18 pcs
1Gb
F-die
256M x 4 * 18 pcs
1Gb
E-die
256M x 4 * 18 pcs
1Gb
F-die
128M x 8 *
9 pcs
1Gb
F-die
DDP
x 4 * 18 pcs
512M
1Gb
E-die
DDP
x 4 * 18 pcs
512M
1Gb
F-die
256M x 8 * 18 pcs
2Gb
B-die
256M x 8 * 18 pcs
2Gb
C-die
512M x 4 * 18 pcs
2Gb
B-die
512M x 4 * 18 pcs
2Gb
C-die
DDP
x 8 * 18 pcs
512M
2Gb
B-die
DDP
x 8 * 18 pcs
512M
2Gb
C-die
M392B1K70BM1
CF8/H9
DDP
x 4 * 18 pcs
1G
2Gb
B-die
M392B1K70CM0
CF8/H9
DDP
x 4 * 18 pcs
1G
2Gb
C-die
M392B2G70AM0
CF8/H9
DDP
x4 * 18 pcs
2G
4Gb
A-die
DDP
x8 * 18 pcs
1G
4Gb
N(2Rx4)
16GB
M392B2G73AM0
CF8/H9
V(4Rx8)
-9-
Rank
PKG
Height
Avail.
8
1
78 ball
FBGA
18.75mm
Now
78 ball
FBGA
18.75mm
Now
78 ball
FBGA
18.75mm
Now
78 ball
FBGA
18.75mm
Now
78 ball
FBGA
18.75mm
2
8
1
1
8
2
1
4
CF8/H9
8GB
Internal
Banks
2
M392B1K73CM0
N(2Rx4)
2Gx 72
Composition
8
2
2
8
A-die
4
Jun.’10
Jun.’10
NOTE
May. 2010
Product Guide
DDR3 SDRAM Memory
4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)
240Pin DDR3 VLP Registered DIMM
Org.
Density
128Mx 72
1GB
256Mx 72
512Mx 72
2GB
4GB
Part Number
Speed
M392B2873EH1
YF8/H9
M392B2873FH0
YF8/H9
M392B5673EH1
YF8/H9
M392B5673FH0
YF8/H9
M392B5670EH1
YF8/H9
Raw Card
K(1Rx8)
L(2Rx8)
M(1Rx4)
128M x 8 * 9 pcs
1Gb
E-die
128M x 8 * 9 pcs
1Gb
F-die
128M x 8 * 18 pcs
1Gb
E-die
128M x 8 * 18 pcs
1Gb
F-die
256M x 4 * 18 pcs
1Gb
E-die
M392B5670FH0
YF8/H9
256M x 4 * 18 pcs
1Gb
F-die
YF8/H9
K(1Rx8)
512M x 4 * 9 pcs
2Gb
C-die
M392B5170EM1
YF8/H9
N(2Rx4)
DDP
x 4 * 18 pcs
512M
1Gb
E-die
M392B5170FM0
YF8/H9
N(2Rx4)
512M x 4 * 18 pcs
1Gb
F-die
M392B5273BH1
YF8/H9
256M x 8 * 18 pcs
2Gb
B-die
M392B5273CH0
YF8/H9
256M x 8 * 18 pcs
2Gb
C-die
M392B5270BH1
YF8/H9
M392B5270CH0
YF8/H9
M392B1K73BM1
YF8
L(2Rx8)
M(1Rx4)
512M x 4 * 18 pcs
2Gb
B-die
512M x 4 * 18 pcs
2Gb
C-die
DDP
x 8 * 18 pcs
512M
2Gb
B-die
M392B1K73CM0
YF8
DDP
x 8 * 18 pcs
512M
2Gb
C-die
M392B1K70BM1
YF8/H9
DDP
x 4 * 18 pcs
1G
2Gb
B-die
M392B1K70CM0
YF8/H9
DDP
x 4 * 18 pcs
1G
2Gb
C-die
M392B2G70AM0
YF8/H9
DDP
x4 * 18 pcs
2G
4Gb
A-die
DDP
x8 * 18 pcs
1G
4Gb
8GB
N(2Rx4)
2Gx 72
Comp.
Version
M392B5773CH0
V(4Rx8)
1Gx 72
Composition
N(2Rx4)
16GB
M392B2G73AM0
YF8/H9
V(4Rx8)
* NOTE : 1.35V product is 1.5V operatable.
- 10 -
Internal
Banks
Rank
PKG
Height
Avail.
8
1
78 ball
FBGA
18.75mm
Now
8
2
78 ball
FBGA
18.75mm
Now
78 ball
18.75mm
FBGA
Now
78 ball
FBGA
18.75mm
Now
78 ball
FBGA
18.75mm
8
1
8
2
8
2
8
1
8
4
8
2
2
8
A-die
4
Now
Jun.’10
NOTE
May. 2010
Product Guide
DDR3 SDRAM Memory
5. RDIMM RCD Information
5.1 5.1 RCD Identification in JEDEC Description in Module Label
5.2 5.2 Label Example
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P1
Made in Korea
M393B5170EH1-CH9
0920
5.3 RCD Information
- Example
Voltage
Vendor
Revision
Module P/N
JEDEC Description On Label
Inphi
LV GS02 C0
M393B5170EH1-CH9
4GB 2Rx4 PC3-10600R-09-10-E1-P1
IDT
LV DDR3 B0
M393B5170EH1-CH9
4GB 2Rx4 PC3-10600R-09-10-E1-D2
Inphi
LV GS02 C0
M393B5170EH1-YF8
4GB 2Rx4 PC3L-8500R-07-10-E1-P1
IDT
LV DDR3 B0
M393B5170EH1-YF8
4GB 2Rx4 PC3L-8500R-07-10-E1-D2
1.5V
1.35V
- 11 -
May. 2010
Product Guide
DDR3 SDRAM Memory
6. Package Dimension
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
3.20
#A1
0.50 ± 0.05
0.80 x 12 = 9.60
0.80
4.80
A
B
C
D
E
F
G
H
J
K
L
M
N
0.80
(Datum B)
7.50 ± 0.10
B
9 8 7 6 5 4 3 2 1
11.00 ± 0.10
0.80 1.60
11.00 ± 0.10
(Datum A)
0.10MAX
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2 M A B
Top
Bottom
A
0.80 x 8 = 6.40
0.80 1.60
3.20
#A1 INDEX MARK
B
9 8 7 6 5 4 3 2 1
13.30 ± 0.10
13.30 ± 0.10
0.35 ± 0.05
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 M A B
0.80 x 15 = 12.00
6.00
0.40
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
7.50 ± 0.10
0.80
(Datum A)
#A1
0.50 ± 0.05
7.50 ± 0.10
0.10MAX
96Ball FBGA for 1Gb E-die (x16)
MOLDING AREA
1.10 ± 0.10
(1.90)
Top
Bottom
- 12 -
May. 2010
Product Guide
DDR3 SDRAM Memory
9.00 ± 0.10
0.80
A
#A1 INDEX MARK
3.20
1.60
#A1
11.50 ± 0.10
0.80 x 12 = 9.60
0.80
4.80
A
B
C
D
E
F
G
H
J
K
L
M
N
0.80
(Datum B)
9.00 ± 0.10
B
9 8 7 6 5 4 3 2 1
11.50 ± 0.10
(Datum A)
0.10MAX
78Ball FBGA for 2Gb B-die (x4/x8)
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2 M A B
Top
Bottom
9.00 ± 0.10
0.10MAX
96Ball FBGA for 2Gb B-die (x16)
A
#A1 INDEX MARK
1.60
3.20
#A1
9 8 7 6 5 4 3 2 1
13.30 ± 0.10
0.35 ± 0.05
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
0.80 x 12 = 12.00
6.00
0.40
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.80
(Datum A)
9.00 ± 0.10
B
13.30 ± 0.10
0.80
MOLDING AREA
1.10 ± 0.10
(1.90)
Top
Bottom
- 13 -
May. 2010
Product Guide
DDR3 SDRAM Memory
9.00 ± 0.10
A
0.80 x 8 = 6.40
0.80
1.60
#A1 INDEX MARK
3.20
#A1
11.50 ± 0.10
0.80 x 12 = 9.60
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
9.00 ± 0.10
B
9 8 7 6 5 4 3 2 1
11.50 ± 0.10
(Datum A)
0.10MAX
78Ball DDP for 1Gb E-die (x4/x8)
0.35 ± 0.05
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
1.40 ± 0.10
0.2 M A B
Top
Bottom
10.00 ± 0.10
A
0.80 x 8 = 6.40
0.80
1.60
#A1 INDEX MARK
3.20
#A1
11.50 ± 0.10
0.80 x 12 = 9.60
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
10.00 ± 0.10
B
9 8 7 6 5 4 3 2 1
11.50 ± 0.10
(Datum A)
0.10MAX
78Ball DDP for 2Gb B-die (x4/x8)
0.35 ± 0.05
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
1.40 ± 0.10
0.2 M A B
Top
Bottom
- 14 -
May. 2010
Product Guide
DDR3 SDRAM Memory
8.00 ± 0.10
0.80 x 8 = 6.40
(Datum A)
0.80
1.60
0.10MAX
78Ball DDP for 2Gb C-die (x4/x8)
A
#A1 INDEX MARK
3.20
#A1
9 8 7 6 5 4 3 2 1
11.00 ± 0.10
11.00 ± 0.10
0.80 x 12 = 9.60
0.80
0.80
4.80
A
B
C
(Datum B)
D
E
F
G
H
J
K
L
M
N
8.00 ± 0.10
B
0.35 ± 0.05
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
1.40 ± 0.10
0.2 M A B
TOP VIEW
BOTTOM VIEW
78Ball for 4Gb A-die (x4/x8)
A
0.10MAX
10.00 ± 0.10
0.80 x 8 = 6.40
3.20
#A1 INDEX MARK
1.60
B
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1
#A1
10.00 ± 0.10
12.50 ± 0.10
0.80
12.50 ± 0.10
(Datum A)
(0.95) MOLDING AREA
0.35 ± 0.05
1.10 ± 0.10
(1.90)
BOTTOM VIEW
TOP VIEW
- 15 -
May. 2010
Product Guide
DDR3 SDRAM Memory
7. Module Dimension
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
128.95
ECC
SPD
17.30
9.50
N/A
(for x64)
2.30
(for x72)
30.00 ± 0.15
(4X)3.00 ± 0.1
133.35 ± 0.15
(2)
2.50
54.675
A
B
47.00
Max 4.0
71.00
N/A
(for x64)
ECC
(for x72)
2.50 ± 0.20
1.270 ± 0.10
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.50±0.10
1.00
2.50
Detail A
Detail B
- 16 -
2x 2.10 ± 0.15
May. 2010
Product Guide
DDR3 SDRAM Memory
x64 204pin DDR3 SDRAM Unbuffered SODIMM
Units : Millimeters
67.60
0.10 M C A B
63.60
6
20.00
SPD
30.00 ± 0.15
Max 3.8
1.00 ± 0.10
24.80
A
21.00
B
39.00
2X 1.80
0.10 M C A B
(OPTIONAL HOLES)
2X 4.00 ± 0.10
0.10 M C A B
0.60
0.45 ± 0.03
1.65
4.00 ± 0.10
2.55
0.25 MAX
1.00 ± 0.10
Detail A
Detail B
- 17 -
May. 2010
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM Registered DIMM
Units : Millimeters
C
128.95
32.40
18.93
9.74
Max 4.0
54.675
2.30
2.50
A
1.0 max
B
47.00
1.27 ± 0.10
2.50 ± 0.20
71.00
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.00
10.9
R
1.50±0.10
Detail A
Detail B
Detail C
2x 2.10 ± 0.15
Register
2.50
17.30
Register
30.00 ± 0.15
18.92
0.
50
10.9
9.50
9.76
(2X)3.00
133.35 ± 0.15
Address, Command and Control lines
- 18 -
0.4
May. 2010
Product Guide
DDR3 SDRAM Memory
Registered DIMM Heat Spreader Design
1. FRONT PART
Outside
R0.2
4.65± 0.12
2
2
2 ± 0.1
2.6 ± 0.2
0.4
Inside
Green Line : TIM Attatch Line
7.45
Reg. pedestal line
80.78
119.29
128.5
2. BACK PART
Outside
Inside
0.15
1.3
Green Line : TIM Attatch Line
- 19 -
1.3
1
0.
R
127 ± 0.12
25.6 ± 0.15
31.4
23.6 ± 0.15
11.9
29.77
1
25.6 ± 0.15
0.65 ± 0.2
130.45 ± 0.15
9.26
1+0/ -0.3
133.15 ± 0.2
May. 2010
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
39.3 ± 0.2
Upper Bending
Tilting Gap
29.77
0.1 ~ 0.3
R
B
1.
5
A
C
0.5
4. DDR3 RDIMM ASS’Y View
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
1.27
1.05
132.95 ± 133.45
39.3 ± 0.2
19
19 ± 0.1
D
K
text mark ’B’ or ’K’
punch press_stamp
- 20 -
E (Clip open size)
May. 2010
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM VLP Registered DIMM
Units : Millimeters
133.35 ± 0.15
128.95
C
20.92
32.40
20.93
Max 4.0
9.74
Register
18.75 ± 0.15
9.76
54.675
A
B
12.60
47.00
1.0 max
71.00
1.27 ± 0.10
SPD/TS
2.50 ± 0.20
18.10
0.80 ± 0.05
9.9
3.80
0.6
5.00
0.2 ± 0.15
Detail B
Detail C
VTT
Register
Detail A
R
1.00
2.50
VTT
0.
50
1.50±0.10
VTT
VTT
SPD/TS
Address, Command and Control lines
- 21 -
May. 2010
Product Guide
DDR3 SDRAM Memory
VLP Registered DIMM Heat Spreader Design
1. FRONT PART
Outside
130.45
67
20.82
17.9
6.4
20.82
8.69
14.3
0.4
8.69
Driver
IC(DP:0.18mm)
DRIVER IC 0.18 -0/+0.1
Inside
Driver
IC(DP:0.18mm)
2. BACK PART
Outside
Driver
IC(DP:0.18mm)
Inside
Driver
IC(DP:0.18mm)
- 22 -
May. 2010
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
35.82
9.16 ± 0.12
7.4 ± 0.1
9.16
9.16 ± 0.12
7.4 ± 0.1
Clip open size
3.2~4.5
0.1
SIDE-L
FRONT
SIDE-R
4. ASS’Y VIEW
7.71
Reference thickness total (Maximum) : 7.71 (With Clip thickness)
TIM Thickness 0.25
* Dimension Index
Mono
DDP
Note
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
43.9
-
-
44.4
-
B
6.7
6.8
6.9
7.2
7.3
7.4
C
-
5.8
-
-
6.3
-
D
6.7
6.8
6.9
7.2
7.3
7.4
E (Clip open size)
2.5
-
3.6
2.6
-
3.8
- 23 -