Product Folder Order Now Support & Community Tools & Software Technical Documents INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 INAx180 Low- and High-Side Voltage Output, Current-Sense Amplifier 1 Features 3 Description • • • The INA180 and INA2180 (INAx180) current sense amplifiers are designed for cost-optimized applications. These devices are part of a family of current-sense amplifiers (also called current-shunt monitors) that sense voltage drops across currentsense resistors at common-mode voltages from –0.2 V to +26 V, independent of the supply voltage. The INAx180 integrate a matched resistor gain network in four, fixed-gain device options: 20 V/V, 50 V/V, 100 V/V, or 200 V/V. This matched gain resistor network minimizes gain error and reduces the temperature drift. 1 • • • • Common-Mode Range (VCM): –0.2 V to +26 V High Bandwidth: 350 kHz Offset Voltage: – ±150 µV (Max) at VCM = 0 V – ±500 µV (Max) at VCM = 12 V Output Slew Rate: 2 V/µs Accuracy: – ±1% Gain Error (Max) – 1-µV/°C Offset Drift (Max) Gain Options: – 20 V/V (A1 Devices) – 50 V/V (A2 Devices) – 100 V/V (A3 Devices) – 200 V/V (A4 Devices) Quiescent Current: 260 µA (Max) Both the INA180 and INA2180 operate from a single 2.7-V to 5.5-V power supply. The single-channel INA180 draws a maximum supply current of 260 µA; whereas, the dual-channel INA2180 draws a maximum supply current of 520 µA.. The INA180 is available in a 5-pin, SOT-23 package with two different pin configurations. The INA2180 is available in an 8-pin VSSOP package. All device options are specified over the extended operating temperature range of –40°C to +125°C. 2 Applications • • • • • • Motor Control Battery Monitoring Power Management Lighting Control Overcurrent Detection Solar Inverters Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) INA180 SOT-23 (5) 2.90 mm × 1.60 mm INA2180(2) VSSOP (10) 3.00 mm × 3.00 mm (1) For all available packages, see the package option addendum at the end of the datasheet. (2) INA2180 is preview device. Typical Application Circuit Bus Voltage, VCM Up To 26 V Power Supply, VS 2.7 V to 5.5 V CBYPASS 0.1 µF RSENSE Load INA2180 (dual-channel) INA180 (single-channel) VS Microcontroller IN± ± OUT ADC + IN+ GND Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configurations and Functions ....................... Specifications......................................................... 1 1 1 2 3 3 5 7.1 7.2 7.3 7.4 7.5 7.6 5 5 5 5 6 7 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 13 8.1 8.2 8.3 8.4 Overview ................................................................. Functional Block Diagrams ..................................... Feature Description................................................. Device Functional Modes........................................ 13 13 14 15 9 Application and Implementation ........................ 17 9.1 Application Information............................................ 17 9.2 Typical Application .................................................. 21 10 Power Supply Recommendations ..................... 23 10.1 Common-Mode Transients Greater Than 26 V .... 23 11 Layout................................................................... 24 11.1 Layout Guidelines ................................................. 24 11.2 Layout Example .................................................... 24 12 Device and Documentation Support ................. 25 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 25 25 25 25 25 25 25 13 Mechanical, Packaging, and Orderable Information ........................................................... 25 4 Revision History Changes from Original (April 2017) to Revision A • 2 Page Added INA2180 device and associated content to data sheet............................................................................................... 1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 5 Device Comparison Table PRODUCT CHANNEL GAIN (V/V) INA180A1 1 20 INA180A2 1 50 INA180A3 1 100 INA180A4 1 200 INA2180A1 2 20 INA2180A2 2 50 INA2180A3 2 100 INA2180A4 2 200 6 Pin Configurations and Functions INA180: DBV Package 5-Pin SOT-23 (Pinout A) Top View OUT 1 GND 2 IN+ 3 5 4 INA180: DBV Package 5-Pin SOT-23 (Pinout B) Top View VS IN± IN+ 1 GND 2 IN± 3 Not to scale 5 VS 4 OUT Not to scale Pin Functions: INA180 PIN NAME SOT-23 Pinout A SOT-23 Pinout B I/O DESCRIPTION GND 2 2 Analog IN– 4 3 Analog input Current-sense amplifier negative input. For high-side applications, connect to load side of sense resistor. For low-side applications, connect to ground side of sense resistor. IN+ 3 1 Analog input Current-sense amplifier positive input. For high-side applications, connect to bus-voltage side of sense resistor. For low-side applications, connect to load side of sense resistor. OUT 1 4 Analog output VS 5 5 Analog Ground Output voltage Power supply, 2.7 V to 5.5 V Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 3 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com INA2180: DGK Package(1) 8-Pin VSSOP Top View OUT1 1 8 VS IN±1 2 7 OUT2 IN+1 3 6 IN±2 GND 4 5 IN+2 Not to scale (1) INA2180 is preview device. See Package Option Addendum at the end of the data sheet for more information. Pin Functions: INA2180 PIN NAME NO. I/O DESCRIPTION GND 4 Analog IN–1 2 Analog input Current-sense amplifier negative input for channel 1. For high-side applications, connect to load side of channel-1 sense resistor. For low-side applications, connect to ground side of channel-1 sense resistor. IN+1 3 Analog input Current-sense amplifier positive input for channel 1. For high-side applications, connect to bus-voltage side of channel-1 sense resistor. For low-side applications, connect to load side of channel-1 sense resistor. IN–2 6 Analog input Current-sense amplifier negative input for channel 2. For high-side applications, connect to load side of channel-2 sense resistor. For low-side applications, connect to ground side of channel-2 sense resistor. IN+2 5 Analog input Current-sense amplifier positive input for channel 2. For high-side applications, connect to bus-voltage side of channel-2 sense resistor. For low-side applications, connect to load side of channel-2 sense resistor. OUT1 1 Analog output Channel 1 output voltage OUT2 7 Analog output Channel 2 output voltage VS 8 Analog 4 Ground Power supply, 2.7 V to 5.5 V Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 6 V Supply voltage, VS Differential (VIN+) – (VIN–) Analog inputs, IN+, IN– (2) Common-mode (3) Output voltage –26 26 GND – 0.3 26 GND – 0.3 VS + 0.3 V 8 mA 150 °C 150 °C 150 °C Maximum output current, IOUT Operating free-air temperature, TA –55 Junction temperature, TJ Storage temperature, Tstg (1) (2) (3) –65 V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively. Input voltage at any pin can exceed the voltage shown if the current at that pin is limited to 5 mA. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) UNIT ±3000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) V ±1000 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX –0.2 12 26 V Operating supply voltage 2.7 5 5.5 V Operating free-air temperature –40 125 °C VCM Common-mode input voltage (IN+ and IN–) VS TA UNIT 7.4 Thermal Information THERMAL METRIC INA180 INA2180 (PREVIEW) DBV (SOT-23) DGK (VSSOP) (1) UNIT 6 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 197.1 TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance 95.8 TBD °C/W RθJB Junction-to-board thermal resistance 53.1 TBD °C/W ψJT Junction-to-top characterization parameter 23.4 TBD °C/W ψJB Junction-to-board characterization parameter 52.7 TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A TBD °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 5 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com 7.5 Electrical Characteristics at TA = 25°C, VS = 5 V, VIN+ = 12 V, and VSENSE = VIN+ – VIN– (unless otherwise noted) PARAMETER CONDITIONS MIN TYP 84 100 MAX UNIT INPUT CMRR Common-mode rejection ratio, RTI (1) VOS Offset voltage (2), RTI dVOS/dT PSRR VIN+ = 0 V to 26 V, VSENSE = 10 mV, TA = –40°C to +125°C dB ±100 ±500 VIN+ = 0 V ±25 ±150 Offset drift, RTI TA = –40°C to +125°C 0.2 1 μV/°C Power-supply rejection ratio, RTI VS = 2.7 V to 5.5 V, VSENSE = 10 mV ±8 ±40 μV/V VSENSE = 0 mV, VIN+ = 0 V 0.1 VSENSE = 0 mV 80 VSENSE = 0 mV ±0.05 IIB Input bias current IIO Input offset current μV µA µA OUTPUT A1 devices G Gain EG 20 A2 devices 50 A3 devices 100 A4 devices 200 Gain error VOUT = 0.5 V to VS – 0.5 V, TA = –40°C to +125°C Gain error vs temperature TA = –40°C to +125°C Nonlinearity error VOUT = 0.5 V to VS – 0.5 V Maximum capacitive load No sustained oscillation V/V ±0.1% ±1% 1.5 20 ppm/°C ±0.01% 1 nF VOLTAGE OUTPUT (3) VSP Swing to VS power-supply rail (4) VSN (4) Swing to GND RL = 10 kΩ to GND, TA = –40°C to +125°C (VS) – 0.02 (VS) – 0.03 V RL = 10 kΩ to GND, TA = –40°C to +125°C (VGND) + 0.0005 (VGND) + 0.005 V FREQUENCY RESPONSE BW Bandwidth SR Slew rate A1 devices, CLOAD = 10 pF 350 A2 devices, CLOAD = 10 pF 210 A3 devices, CLOAD = 10 pF 150 A4 devices, CLOAD = 10 pF 105 kHz 2 V/µs 40 nV/√Hz NOISE, RTI Voltage noise density POWER SUPPLY INA180 IQ Quiescent current INA2180 (preview) (1) (2) (3) (4) 6 VSENSE = 10 mV 197 VSENSE = 10 mV, TA = –40°C to +125°C VSENSE = 10 mV 260 300 394 VSENSE = 10 mV, TA = –40°C to +125°C 520 µA 600 RTI = referred-to-input. Offset voltage is obtained by linear extrapolation to VSENSE = 0 V with VSENSE = 10% to 90% of full-scale-range. See Figure 19. Swing specifications are tested with an overdriven input condition. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 7.6 Typical Characteristics -165 -150 -135 -120 -105 -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 105 120 135 150 -95 -85 -75 -65 -55 -45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85 95 105 115 Population Population at TA = 25°C, VS = 5 V, and VIN+ = 12 V (unless otherwise noted) D001 Input Offset Voltage (PV) Input Offset Voltage (PV) D002 VIN+ = 0 V VIN+ = 0 V Figure 2. Input Offset Voltage Production Distribution A2 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Population -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Population Figure 1. Input Offset Voltage Production Distribution A1 D003 Input Offset Voltage (PV) Input Offset Voltage (PV) VIN+ = 0 V D004 VIN+ = 0 V Figure 3. Input Offset Voltage Production Distribution A3 Figure 4. Input Offset Voltage Production Distribution A4 100 A1 A2 A3 A4 Population Offset Voltage (PV) 50 0 -100 -50 -25 0 25 50 75 Temperature (qC) 100 125 150 D005 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 40 45 50 -50 Common-Mode Rejection Ratio (PV/V) VIN+ = 0 V D006 Figure 5. Offset Voltage vs Temperature Figure 6. Common-Mode Rejection Production Distribution A1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 7 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com Typical Characteristics (continued) -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 Population -32 -29 -26 -23 -20 -17 -14 -11 -8 -5 -2 1 4 7 10 13 16 19 22 25 28 31 Population at TA = 25°C, VS = 5 V, and VIN+ = 12 V (unless otherwise noted) D007 Common-Mode Rejection Ratio (PV/V) D008 Common-Mode Rejection Ratio (PV/V) Figure 7. Common-Mode Rejection Production Distribution A2 Figure 8. Common-Mode Rejection Production Distribution A3 A1 A2 A3 A4 8 6 4 2 0 -2 -4 -6 -8 -10 -50 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 Population Common-Mode Rejection Ratio (PV/V) 10 -25 0 25 50 75 Temperature (qC) 100 125 150 D010 D009 Common-Mode Rejection Ratio (PV/V) Figure 10. Common-Mode Rejection Ratio vs Temperature D011 -0.11 -0.1 -0.09 -0.08 -0.07 -0.06 -0.05 -0.04 -0.03 -0.02 -0.01 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 -0.125 -0.115 -0.105 -0.095 -0.085 -0.075 -0.065 -0.055 -0.045 -0.035 -0.025 -0.015 -0.005 0.005 0.015 0.025 0.035 0.045 0.055 0.065 0.075 0.085 Population Population Figure 9. Common-Mode Rejection Production Distribution A4 Gain Error (%) Gain Error (%) Figure 11. Gain Error Production Distribution A1 8 D012 Figure 12. Gain Error Production Distribution A2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 Typical Characteristics (continued) -0.23 -0.21 -0.19 -0.17 -0.15 -0.13 -0.11 -0.09 -0.07 -0.05 -0.03 -0.01 0.01 0.03 0.05 0.07 0.09 0.11 0.13 0.15 0.17 0.19 Population -0.12 -0.11 -0.1 -0.09 -0.08 -0.07 -0.06 -0.05 -0.04 -0.03 -0.02 -0.01 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 Population at TA = 25°C, VS = 5 V, and VIN+ = 12 V (unless otherwise noted) Gain Error (%) Gain Error (%) D013 Figure 13. Gain Error Production Distribution A3 Figure 14. Gain Error Production Distribution A4 50 0.4 A1 A2 A3 A4 0.3 0.2 A1 A2 A3 A4 40 30 0.1 Gain (dB) Gain Error (%) D014 0 -0.1 20 10 -0.2 0 -0.3 -0.4 -50 -25 0 25 50 75 Temperature (qC) 100 125 -10 10 150 100 Figure 15. Gain Error vs Temperature 1M 10M D016 140 Common-Mode Rejection Ratio (dB) Power-Supply Rejection Ratio (dB) 10k 100k Frequency (Hz) Figure 16. Gain vs Frequency 120 100 80 60 40 20 0 10 1k D015 100 1k 10k Frequency (Hz) 100k 1M 100 80 60 40 20 10 D017 Figure 17. Power-Supply Rejection Ratio vs Frequency A1 A2 A3 A4 120 100 1k 10k Frequency (Hz) 100k 1M D018 Figure 18. Common-Mode Rejection Ratio vs Frequency Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 9 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com Typical Characteristics (continued) at TA = 25°C, VS = 5 V, and VIN+ = 12 V (unless otherwise noted) VS 120 –40°C 25°C 125°C 100 Input Bias Current (PA) Output Swing (V) VS – 1 VS – 2 GND + 2 GND + 1 80 60 40 20 0 GND 0 5 10 15 20 25 30 35 40 Output Current (mA) 45 50 55 -20 -5 60 0 5 10 15 20 Common-Mode Voltage (V) D019 25 30 D020 Supply voltage = 5 V Figure 19. Output Voltage Swing vs Output Current Figure 20. Input Bias Current vs Common-Mode Voltage 120 85 84 100 Input Bias Current (PA) Input Bias Current (PA) 83 80 60 40 20 82 81 80 79 78 77 0 -20 -5 76 0 5 10 15 20 Common-Mode Voltage (V) 25 75 -50 30 -25 D021 0 25 50 75 Temperature (qC) 100 125 150 D022 Supply voltage = 0 V Figure 21. Input Bias Current vs Common-Mode Voltage (Shutdown) Figure 22. Input Bias Current vs Temperature 210 400 Quiescent Current (PA) Quiescent Current (PA) 350 205 200 195 300 250 200 190 -50 -25 0 25 50 75 Temperature (qC) 100 125 150 -5 0 D023 Figure 23. Quiescent Current vs Temperature 10 150 5 10 15 20 Common-mode Voltage (V) 25 30 D031 Figure 24. Quiescent Current vs Common-Mode Voltage Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 Typical Characteristics (continued) at TA = 25°C, VS = 5 V, and VIN+ = 12 V (unless otherwise noted) Input-Referred Voltage Noise (nV/—Hz) 100 Referred-to-Input Voltage Noise (200 nV/div) 80 70 60 50 40 30 20 10 10 20 50 100 1000 10000 Frequency (Hz) 100000 Time (1 s/div) 1000000 D025 D024 Figure 25. Input-Referred Voltage Noise vs Frequency VCM VOUT VOUT (100 mV/div) Input Voltage 40 mV/div Common-Mode Voltage (5 V/div) Output Voltage 2 V/div Figure 26. 0.1-Hz to 10-Hz Voltage Noise (Referred-to-Input) Time (25 Ps/div) Time (10 Ps/div) D027 D026 80-mVPP input step Figure 27. Step Response Figure 28. Common-Mode Voltage Transient Response Inverting Input Output Voltage (2 V/div) Voltage (2 V/div) Noninverting Input Output 0V 0V Time (250 Ps/div) Time (250 Ps/div) D028 Figure 29. Inverting Differential Input Overload D029 Figure 30. Noninverting Differential Input Overload Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 11 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com Typical Characteristics (continued) at TA = 25°C, VS = 5 V, and VIN+ = 12 V (unless otherwise noted) Voltage (1 V/div) Supply Voltage Output Voltage Voltage (1 V/div) Supply Voltage Output Voltage 0V 0V Time (10 Ps/div) Time (100 Ps/div) D030 D032 Figure 31. Start-Up Response Output Impedance (:) 1000 500 200 100 50 Figure 32. Brownout Recovery A1 A2 A3 A4 20 10 5 2 1 0.5 0.2 0.1 10 100 1k 10k 100k Frequency (Hz) 1M 10M D033 Figure 33. Output Impedance vs Frequency 12 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 8 Detailed Description 8.1 Overview The INA180 and INA2180 (INAx180) are 26-V, common-mode, current-sensing amplifiers used in both low-side and high-side configurations. These specially-designed, current-sensing amplifiers accurately measures voltages developed across current-sensing resistors on common-mode voltages that far exceed the supply voltage powering the device. Current can be measured on input voltage rails as high as 26 V, and the devices can be powered from supply voltages as low as 2.7 V. 8.2 Functional Block Diagrams VS INA180 IN± ± OUT + IN+ GND Copyright © 2017, Texas Instruments Incorporated Figure 34. INA180 Functional Block Diagram VS INA2180 IN1± ± OUT1 + IN1+ IN2± ± OUT2 + IN2+ GND Copyright © 2017, Texas Instruments Incorporated Figure 35. INA2180 Functional Block Diagram Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 13 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com 8.3 Feature Description 8.3.1 High Bandwidth and Slew Rate The INAx180 support small-signal bandwidths as high as 350 kHz, and large-signal slew rates of 2 V/µs. The ability to detect rapid changes in the sensed current, as well as the ability to quickly slew the output, make the INAx180 a good choice for applications that require a quick response to input current changes. One application that requires high bandwidth and slew rate is low-side motor control, where the ability to follow rapid changing current in the motor allows for more accurate control over a wider operating range. Another application that requires higher bandwidth and slew rates is system fault detection, where the INAx180 are used with an external comparator and a reference to quickly detect when the sensed current is out of range. 8.3.2 Wide Input Common-Mode Voltage Range The INAx180 support input common-mode voltages from –0.2 V to +26 V. Because of the internal topology, the common-mode range is not restricted by the power-supply voltage (VS) as long as VS stays within the operational range of 2.7 V to 5.5 V. The ability to operate with common-mode voltages greater or less than VS allow the INAx180 to be used in high-side, as well as low-side, current-sensing applications, as shown in Figure 36. Bus Supply ±0.2 V to +26 V Direction of Positive Current Flow IN+ RSENSE High-Side Sensing Common-mode voltage (VCM) is bus-voltage dependent. IN± LOAD Direction of Positive Current Flow IN+ RSENSE Low-Side Sensing Common-mode voltage (VCM) is always near ground and is isolated from bus-voltage spikes. IN± Figure 36. High-Side and Low-Side Sensing Connections 8.3.3 Precise Low-Side Current Sensing When used in low-side current sensing applications the offset voltage of the INAx180 is less than 150 µV. The low offset performance of the INAx180 has several benefits. First, the low offset allows the device to be used in applications that must measure current over a wide dynamic range. In this case, the low offset improves the accuracy when the sensed currents are on the low end of the measurement range. Another advantage of low offset is the ability to sense lower voltage drop across the sense resistor accurately, thus allowing a lower-value shunt resistor. Lower-value shunt resistors reduce power loss in the current sense circuit, and help improve the power efficiency of the end application. The gain error of the INAx180 is specified to be within 1% of the actual value. As the sensed voltage becomes much larger than the offset voltage, this voltage becomes the dominant source of error in the current sense measurement. 14 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 Feature Description (continued) 8.3.4 Rail-to-Rail Output Swing The INAx180 allow linear current sensing operation with the output close to the supply rail and GND. The maximum specified output swing to the positive rail is 30 mV, and the maximum specified output swing to GND is only 5 mV. In order to compare the output swing of the INAx180 to an equivalent operational amplifier (op amp), the inputs are overdriven to approximate the open-loop condition specified in op amp data sheets. The currentsense amplifier is a closed-loop system; therefore, the output swing to GND can be limited by the product of the offset voltage and amplifier gain. For devices that have positive offset voltages, the swing to GND is limited by the larger of either the offset voltage multiplied by the gain or the swing to GND specified in the Electrical Characteristics table. For example, in an application where the INA180A4 (gain = 200 V/V) is used for low-side current sensing and the device has an offset of 40 µV, the product of the device offset and gain results in a value of 8 mV, greater than the specified negative swing value. Therefore, the swing to GND for this example is 8 mV. If the same device has an offset of –40 µV, then the calculated zero differential signal is –8 mV. In this case, the offset helps overdrive the swing in the negative direction, and swing performance is consistent with the value specified in the Electrical Characteristics table. The offset voltage is a function of the common-mode voltage as determined by the CMRR specification; therefore, the offset voltage increases when higher common-mode voltages are present. The increase in offset voltage limits how low the output voltage can go during a zero-current condition when operating at higher common-mode voltages. The typical limitation of the zero-current output voltage vs common-mode voltage for each gain option is shown in Figure 37. 0.06 A1 A2 A3 A4 Zero Current Output Voltage (V) 0.054 0.048 0.042 0.036 0.03 0.024 0.018 0.012 0.006 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Common Mode Voltage (V) D033 Figure 37. Zero-Current Output Voltage vs Common-Mode Voltage 8.4 Device Functional Modes 8.4.1 Normal Mode The INAx180 is in normal operation when the following conditions are met: • The power supply voltage (VS) is between 2.7 V and 5.5 V. • The common-mode voltage (VCM) is within the specified range of –0.2 V to +26 V. • The maximum differential input signal times gain is less than VS minus the output voltage swing to VS. • The minimum differential input signal times gain is greater than the swing to GND (see the Rail-to-Rail Output Swing section). During normal operation, the device produces an output voltage that is the gained-up representation of the difference voltage from IN+ to IN–. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 15 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com Device Functional Modes (continued) 8.4.2 Input Differential Overload If the differential input voltage (VIN+ – VIN–) times gain exceeds the voltage swing specification, the INAx180 drive the output as close as possible to the positive supply, and does not provide accurate measurement of the differential input voltage. If this input overload occurs during normal circuit operation, then reduce the value of the shunt resistor or use a lower-gain version with the chosen sense resistor to avoid this mode of operation. If a differential overload occurs in a fault event, then the output of the INAx180 return to the expected value approximately 20 µs after the fault condition is removed. 8.4.3 Shutdown Mode Although the INAx180 do not have a shutdown pin, the low power consumption of the device allows the output of a logic gate or transistor switch to power the INAx180. This gate or switch turns on and off the INAx180 powersupply quiescent current. However, in current shunt monitoring applications, there is also a concern for how much current is drained from the shunt circuit in shutdown conditions. Evaluating this current drain involves considering the simplified schematic of the INAx180 in shutdown mode, as shown in Figure 38. VS 2.7 V to 5.5 V RPULL-UP 10 k Bus Voltage ±0.2 V to +26 V Shutdown RSENSE Load CBYPASS 0.1 µF VS INA180 IN± OUT ± Output + IN+ GND Copyright © 2017, Texas Instruments Incorporated Figure 38. Basic Circuit to Shut Down the INxA180 There is typically slightly more than 500 kΩ of impedance (from the combination of 500-kΩ feedback and input gain set resistors) from each input of the INAx180 to the OUT pin and to the GND pin. The amount of current flowing through these pins depends on the voltage at the connection. Regarding the 500-kΩ path to the output pin, the output stage of a disabled INAx180 does constitute a good path to ground. Consequently, this current is directly proportional to a shunt common-mode voltage present across a 500-kΩ resistor. As a final note, as long as the shunt common-mode voltage is greater than VS when the device is powered up, there is an additional and well-matched 55-µA typical current that flows in each of the inputs. If less than VS, the common-mode input currents are negligible, and the only current effects are the result of the 500-kΩ resistors. 16 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The INAx180 amplify the voltage developed across a current-sensing resistor as current flows through the resistor to the load or ground. 9.1.1 Basic Connections Figure 39 shows the basic connections of the INA180. Connect the input pins (IN+ and IN–) as closely as possible to the shunt resistor to minimize any resistance in series with the shunt resistor. Bus Voltage ±0.2 V to +26 V Power Supply, VS 2.7 V to 5.5 V CBYPASS 0.1 µF RSENSE Load VS INA180 IN± Microcontroller OUT ± ADC + IN+ GND Copyright © 2017, Texas Instruments Incorporated NOTE: For best measurement accuracy, connect analog-to-digital converter (ADC) reference or microcontroller ground as closely as possible to the INAx180 GND pin. Figure 39. Basic Connections for the INA180 A power-supply bypass capacitor of at least 0.1 µF is required for proper operation. Applications with noisy or high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise. Connect bypass capacitors close to the device pins. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 17 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com Application Information (continued) 9.1.2 RSENSE and Device Gain Selection The accuracy of the INAx180 is maximized by choosing the current-sense resistor to be as large as possible. A large sense resistor maximizes the differential input signal for a given amount of current flow and reduces the error contribution of the offset voltage. However, there are practical limits as to how large the current-sense resistor can be in a given application. The INAx180 have a typical input bias currents of 80 µA for each input when operated at a 12-V common-mode voltage input. When large current-sense resistors are used, these bias currents cause increased offset error and reduced common-mode rejection. Therefore, using current-sense resistors larger than a few ohms is generally not recommended for applications that require current-monitoring accuracy. A second common restriction on the value of the current-sense resistor is the maximum allowable power dissipation that is budgeted for the resistor. Equation 1 gives the maximum value for the current sense resistor for a given power dissipation budget: PDMAX RSENSE IMAX2 where: • • PDMAX is the maximum allowable power dissipation in RSENSE. IMAX is the maximum current that will flow through RSENSE. (1) An additional limitation on the size of the current-sense resistor and device gain is due to the power-supply voltage, VS, and device swing to rail limitations. In order to make sure that the current-sense signal is properly passed to the output, both positive and negative output swing limitations must be examined. Equation 2 provides the maximum values of RSENSE and GAIN to keep the device from hitting the positive swing limitation. IMAX u RSENSE u GAIN < VS VSP where: • • • • IMAX is the maximum current that will flow through RSENSE. GAIN is the gain of the current sense-amplifier. VS is the minimum supply voltage of the device. VSP is the positive output swing as specified in the data sheet. (2) To avoid positive output swing limitations when selecting the value of RSENSE, there is always a trade-off between the value of the sense resistor and the gain of the device under consideration. If the sense resistor selected for the maximum power dissipation is too large, then it is possible to select a lower-gain device in order to avoid positive swing limitations. The negative swing limitation places a limit on how small of a sense resistor can be used in a given application. Equation 3 provides the limit on the minimum size of the sense resistor. IMIN u RSENSE u GAIN > VSN where: • • • 18 IMIN is the minimum current that will flow through RSENSE. GAIN is the gain of the current sense amplifier. VSN is the negative output swing of the device (see Rail-to-Rail Output Swing ). Submit Documentation Feedback (3) Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 Application Information (continued) 9.1.3 Signal Filtering Provided that the INAx180 output is connected to a high impedance input, the best location to filter is at the device output using a simple RC network from OUT to GND. Filtering at the output attenuates high-frequency disturbances in the common-mode voltage, differential input signal, and INAx180 power-supply voltage. If filtering at the output is not possible, or filtering of only the differential input signal is required, it is possible to apply a filter at the input pins of the device. Figure 40 provides an example of how a filter can be used on the input pins of the device. Bus Voltage ±0.2 V to +26 V RSENSE Load VS 2.7 V to 5.5 V VS INA180 RF < 10 RINT IN± CF ± OUT VOUT Bias + RF < 10 IN+ RINT GND Copyright © 2017, Texas Instruments Incorporated Figure 40. Filter at Input Pins The addition of external series resistance creates an additional error in the measurement; therefore, the value of these series resistors must be kept to 10 Ω (or less, if possible) to reduce impact to accuracy. The internal bias network shown in Figure 40 present at the input pins creates a mismatch in input bias currents when a differential voltage is applied between the input pins. If additional external series filter resistors are added to the circuit, the mismatch in bias currents results in a mismatch of voltage drops across the filter resistors. This mismatch creates a differential error voltage that subtracts from the voltage developed across the shunt resistor. This error results in a voltage at the device input pins that is different than the voltage developed across the shunt resistor. Without the additional series resistance, the mismatch in input bias currents has little effect on device operation. The amount of error these external filter resistors add to the measurement can be calculated using Equation 5, where the gain error factor is calculated using Equation 4. The amount of variance in the differential voltage present at the device input relative to the voltage developed at the shunt resistor is based both on the external series resistance (RF) value as well as internal input resistor RINT, as shown in Figure 40. The reduction of the shunt voltage reaching the device input pins appears as a gain error when comparing the output voltage relative to the voltage across the shunt resistor. A factor can be calculated to determine the amount of gain error that is introduced by the addition of external series resistance. Calculate the expected deviation from the shunt voltage to what is measured at the device input pins is given using Equation 4: 1250 u RINT Gain Error Factor (1250 u RF ) (1250 u RINT ) (RF u RINT ) where: • • RINT is the internal input resistor. RF is the external series resistance. (4) Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 19 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com Application Information (continued) With the adjustment factor from Equation 4, including the device internal input resistance, this factor varies with each gain version, as shown in Table 1. Each individual device gain error factor is shown in Table 2. Table 1. Input Resistance PRODUCT GAIN RINT (kΩ) INAx180A1 20 25 INAx180A2 50 10 INAx180A3 100 5 INAx180A4 200 2.5 Table 2. Device Gain Error Factor PRODUCT SIMPLIFIED GAIN ERROR FACTOR INAx180A1 25000 (21u RF ) 25000 INAx180A2 10000 (9 u RF ) 10000 INAx180A3 1000 RF 1000 INAx180A4 2500 (3 u RF ) 2500 The gain error that can be expected from the addition of the external series resistors can then be calculated based on Equation 5: Gain Error (%) = 100 - (100 ´ Gain Error Factor) (5) For example, using an INA180A2 and the corresponding gain error equation from Table 2, a series resistance of 10 Ω results in a gain error factor of 0.991. The corresponding gain error is then calculated using Equation 5, resulting in an additional gain error of approximately 0.89% solely because of the external 10-Ω series resistors. 20 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 9.2 Typical Application Power Supply, VS 2.7 V to 5.5 V CBYPASS 0.1 µF Load Supply RSENSE Load VS INA180 IN± ± OUT VOUT + IN+ GND Copyright © 2017, Texas Instruments Incorporated Figure 41. Low-Side Sensing 9.2.1 Design Requirements The design requirements for the circuit shown in Figure 41, are listed in Table 3 Table 3. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Power-supply voltage, VS 5V Low-side current sensing VCM = 0 V Mode of operation Unidirectional RSENSE power loss < 900 mW Maximum sense current, IMAX 40 A Accuracy Less than 1.5% at maximum current, TJ = 25°C Small-signal bandwidth > 80 kHz 9.2.2 Detailed Design Procedure The maximum value of the current sense resistor is calculated based on the maximum power loss requirement. By applying Equation 1, the maximum value of the current-sense resistor is calculated to be 0.563 mΩ. This is the maximum value for sense resistor RSENSE; therefore, select RSENSE to be 0.5 mΩ because it is the closest standard resistor value that meets the power-loss requirement. The next step is to select the appropriate gain and reduce RSENSE, if needed, to keep the output signal swing within the VS range. Using Equation 2, and given that IMAX = 40 A and RSENSE = 0.5 mΩ, the maximum currentsense gain calculated to avoid the positive swing-to-rail limitations on the output is 248.5. To maximize the output signal range, the INA180A4 (gain = 200) device is selected for this application. To calculate the accuracy at peak current, the two factors that must be determined are the gain error and the offset error. The gain error of the INAx180 is specified to be a maximum of 1%. The error due to the offset is constant, and is specified to be 125 µV (maximum) for the conditions where VCM = 0 V and VS = 5 V. Using Equation 6, the percentage error contribution of the offset voltage is calculated to be 0.75%, with total offset error = 150 µV, RSENSE = 0.5 mΩ, and ISENSE = 40 A. Total Offset Error (V) Total Offset Error (%) = u 100% ISENSE u RSENSE (6) Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 21 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com One method of calculating the total error is to add the gain error to the percentage contribution of the offset error. However, in this case, the gain error and the offset error do not have an influence or correlation to each other. A more statistically accurate method of calculating the total error is to use the RMS sum of the errors, as shown in Equation 7. Total Error (%) = Total Gain Error (%)2 + Total Offset Error (%)2 (7) After applying Equation 7, the total current sense error at maximum current is calculated to be 1.25%, and that is less than the design example requirement of 1.5%. The gain-of-200 device also has a bandwidth of 105 kHz that meets the small-signal bandwidth requirement of 80 kHz. If higher bandwidth is required, lower-gain devices can be used at the expense of either reduced output voltage range or an increased value of RSENSE. 9.2.3 Application Curve Output Voltage (1 V/div) An example output response of a unidirectional configuration is shown in Figure 42. The device output swing is limited by ground; therefore, the output is biased to this zero output level. The output rises above ground for positive differential input signals, but cannot fall below ground for negative differential input signals. 0V Output Ground Time (500 µs/div) Figure 42. Output Response 22 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 10 Power Supply Recommendations The input circuitry of the INAx180 accurately measures beyond the power-supply voltage, VS. For example, VS can be 5 V, whereas the bus supply voltage at IN+ and IN– can be as high as 26 V. However, the output voltage range of the OUT pin is limited by the voltages on the VS pin. The INAx180 also withstand the full differential input signal range up to 26 V at the IN+ and IN– input pins, regardless of whether or not the device has power applied at the VS pin. 10.1 Common-Mode Transients Greater Than 26 V With a small amount of additional circuitry, the INAx180 can be used in circuits subject to transients higher than 26 V, such as automotive applications. Use only Zener diodes or Zener-type transient absorbers (sometimes referred to as transzorbs)—any other type of transient absorber has an unacceptable time delay. Start by adding a pair of resistors as a working impedance for the Zener diode; see Figure 43. Keep these resistors as small as possible; most often, around 10 Ω. Larger values can be used with an effect on gain that is discussed in the Signal Filtering section. This circuit limits only short-term transients; therefore, many applications are satisfied with a 10-Ω resistor along with conventional Zener diodes of the lowest acceptable power rating. This combination uses the least amount of board space. These diodes can be found in packages as small as SOT523 or SOD-523. Bus Supply ±0.2 V to +26 V VS 2.7 V to 5.5 V CBYPASS 0.1 µF RSENSE Load INA180 VS IN± ± RPROTECT < 10 OUT Output + IN+ GND Copyright © 2017, Texas Instruments Incorporated Figure 43. Transient Protection Using Dual Zener Diodes In the event that low-power Zener diodes do not have sufficient transient absorption capability, a higher-power transzorb must be used. The most package-efficient solution involves using a single transzorb and back-to-back diodes between the device inputs, as shown in Figure 44. The most space-efficient solutions are dual, seriesconnected diodes in a single SOT-523 or SOD-523 package. In either of the examples shown in Figure 43 and Figure 44, the total board area required by the INAx180 with all protective components is less than that of an SO-8 package, and only slightly greater than that of an MSOP-8 package. VS 2.7 V to 5.5 V Bus Supply ±0.2 V to +26 V CBYPASS 0.1 µF RSENSE Load INA180 < 10 VS IN± ± Transorb OUT Output + < 10 IN+ GND Copyright © 2017, Texas Instruments Incorporated Figure 44. Transient Protection Using a Single Transzorb and Input Clamps Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 23 INA180, INA2180 SBOS741A – APRIL 2017 – REVISED AUGUST 2017 www.ti.com 11 Layout 11.1 Layout Guidelines • • Connect the input pins to the sensing resistor using a Kelvin or 4-wire connection. This connection technique makes sure that only the current-sensing resistor impedance is detected between the input pins. Poor routing of the current-sensing resistor commonly results in additional resistance present between the input pins. Given the very low ohmic value of the current resistor, any additional high-current carrying impedance can cause significant measurement errors. Place the power-supply bypass capacitor as close as possible to the device power supply and ground pins. The recommended value of this bypass capacitor is 0.1 µF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies. 11.2 Layout Example Directio n Curr ent Flow RSHU NT IN- 4 3 IN+ 2 GND VS 5 1 OUT Curren t Sen se VIA to Gro und Plan e CBYPASS VS: 2.7 V to 5.5 V Figure 45. Recommended Layout 24 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 INA180, INA2180 www.ti.com SBOS741A – APRIL 2017 – REVISED AUGUST 2017 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: • INA180-181EVM User's Guide (SBOU183) 12.2 Related Links Table 4 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 4. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY INA180 Click here Click here Click here Click here Click here INA2181 Click here Click here Click here Click here Click here 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA180 INA2180 25 PACKAGE OPTION ADDENDUM www.ti.com 11-Sep-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) INA180A1IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 18ID INA180A1IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 18ID INA180A2IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1A8D INA180A2IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1A8D INA180A3IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1A9D INA180A3IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1A9D INA180A4IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1AAD INA180A4IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1AAD INA180B1IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 18RD INA180B1IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 18RD INA180B2IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1ABD INA180B2IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1ABD INA180B3IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1ACD INA180B3IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1ACD INA180B4IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1ADD INA180B4IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 1ADD PINA2180A1IDGKR ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Sep-2017 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) PINA2180A2IDGKR ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 PINA2180A3IDGKR ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 PINA2180A4IDGKR ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 Samples PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) INA180A1IDBVR SOT-23 DBV 5 3000 178.0 9.0 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 INA180A1IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180A2IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180A2IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180A3IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180A3IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180A4IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180A4IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B1IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B1IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B2IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B2IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B3IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B3IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B4IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 INA180B4IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) INA180A1IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180A1IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 INA180A2IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180A2IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 INA180A3IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180A3IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 INA180A4IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180A4IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 INA180B1IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180B1IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 INA180B2IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180B2IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 INA180B3IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180B3IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 INA180B4IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 INA180B4IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated