ON MC10H131 Dual d type masterâ slave flipâ flop Datasheet

MC10H131
Dual D Type Master‐Slave
Flip‐Flop
Description
The MC10H131 is a MECL 10H™ part which is a functional/pinout
duplication of the standard MECL 10K™ family part, with 100%
improvement in clock speed and propagation delay and no increase in
power-supply current.
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Features
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 235 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
•
•
•
20
16
1
1
PDIP−16
P SUFFIX
CASE 648−08
Temperature Range)
Voltage Compensated
MECL 10K Compatible
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
PLLC−20
FN SUFFIX
CASE 775−02
MARKING DIAGRAMS*
1 20
16
MC10H131P
AWLYYWWG
10H131G
AWLYYWW
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device
Package
Shipping†
MC10H131FNG
PLCC−20
(Pb-Free)
46 Units/Tube
MC10H131FNR2G
PLCC−20
(Pb-Free)
500/Tape & Reel
MC10H131PG
PDIP−16
(Pb-Free)
25 Units/Tube
†For information on tape and reel specifications, including part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 8
1
Publication Order Number:
MC10H131/D
MC10H131
S1 5
Table 1. RS TRUTH TABLE
2
Q1
D1 7
CE1 6
3
Q1
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
R1 4
CC 9
R2 13
R
S
Qn+1
L
L
Qn
L
H
H
H
L
L
H
H
ND
ND = Not Defined
CE2 11
D2 10
Q2
14
Q2
15
Table 2. CLOCKED TRUTH TABLE
S2 12
Figure 1. Logic Diagram
VCC1
1
16
VCC2
Q1
2
15
Q2
Q1
3
14
Q2
R1
4
13
R2
S1
5
12
S2
CE1
6
11
CE2
D1
7
10
D2
VEE
8
9
CC
C
D
Qn+1
L
X
Qn
H
L
L
H
H
H
C = CE + CC
A clock H is a clock transition from a low to a high state.
Pin assignment is for Dual-in-Line Package.
Figure 2. Pin Assignment
Table 3. MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
Power Supply (VCC = 0)
Characteristic
−8.0 to 0
Vdc
VI
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current
Continuous
Surge
TA
Operating Temperature Range
Tstg
Storage Temperature Range
Plastic
Ceramic
50
100
0 to +75
−55 to +150
−55 to +165
mA
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
MC10H131
Table 4. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°
Symbol
25°
75°
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
−
62
−
56
−
62
mA
IinH
Input Current High
Pins 6, 11
Pin 9
Pins 7, 10
Pins 4, 5, 12, 13
−
−
−
−
530
660
485
790
−
−
−
−
310
390
285
465
−
−
−
−
310
390
285
465
IinL
Input Current Low
0.5
−
0.5
−
0.3
−
mA
VOH
High Output Voltage
−1.02
−0.84
−0.98
−0.81
−0.92
−0.735
Vdc
VOL
Low Output Voltage
−1.95
−1.63
−1.95
−1.63
−1.95
−1.60
Vdc
VIH
High Input Voltage
−1.17
−0.84
−1.13
−0.81
−1.07
−0.735
Vdc
VIL
Low Input Voltage
−1.95
−1.48
−1.95
−1.48
−1.95
−1.45
Vdc
IE
Characteristic
mA
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 5. AC CHARACTERISTICS
0°
Symbol
75°
Min
Max
Min
Max
Min
Max
Propagation Delay
Clock, CE
Set, Reset
0.8
0.6
1.6
1.6
0.8
0.7
1.7
1.7
0.8
0.7
1.8
1.8
tr
Rise Time
0.6
2.0
0.6
2.0
0.6
2.2
ns
tf
Fall Time
0.6
2.0
0.6
2.0
0.6
2.2
ns
tset
Set-up Time
0.7
−
0.7
−
0.7
−
ns
thold
Hold Time
0.8
−
0.8
−
0.8
−
ns
ftog
Toggle Frequency
250
−
250
−
250
−
MHz
tpd
Characteristic
25°
Unit
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
APPLICATION INFORMATION
In this case, the enable inputs perform the function of
controlling the common clock.
The output states of the flip-flop change on the positive
transition of the clock. A change in the information present
at the data (D) input will not affect the output information at
any other time due to master slave construction.
The MC10H131 is a dual master-slave type D flip-flop.
Asynchronous Set (S) and Reset (R) override Clock (CC)
and Clock Enable (CE) inputs. Each flip-flop may be
clocked separately by holding the common clock in the new
low state and using the enable inputs for the clocking
function. If the common clock is to be used to clock the
flip-flop, the Clock Enable inputs must be in the low state.
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3
MC10H131
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE F
B
0.007 (0.180)
Y BRK
−N−
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
−L−
−M−
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D−D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
C
H
−T−
VIEW S
G1
0.010 (0.250) S T L-M
SEATING
PLANE
F
0.007 (0.180)
VIEW S
S
N
T L-M
S
N
S
K
0.004 (0.100)
J
M
K1
E
G
0.007 (0.180)
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
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4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
M
T L-M
S
N
S
MC10H131
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE V
D
A
16
9
E
H
E1
1
NOTE 8
b2
8
c
B
TOP VIEW
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
e/2
NOTE 3
L
A1
C
D1
e
SEATING
PLANE
M
eB
END VIEW
16X b
SIDE VIEW
0.010
M
C A
M
B
M
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10 °
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10 °
STYLE 2:
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
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MC10H131/D
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