MC10H131 Dual D Type Master‐Slave Flip‐Flop Description The MC10H131 is a MECL 10H™ part which is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in clock speed and propagation delay and no increase in power-supply current. www.onsemi.com Features • Propagation Delay, 1.0 ns Typical • Power Dissipation, 235 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and • • • 20 16 1 1 PDIP−16 P SUFFIX CASE 648−08 Temperature Range) Voltage Compensated MECL 10K Compatible These Devices are Pb-Free, Halogen Free and are RoHS Compliant PLLC−20 FN SUFFIX CASE 775−02 MARKING DIAGRAMS* 1 20 16 MC10H131P AWLYYWWG 10H131G AWLYYWW 1 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Device Package Shipping† MC10H131FNG PLCC−20 (Pb-Free) 46 Units/Tube MC10H131FNR2G PLCC−20 (Pb-Free) 500/Tape & Reel MC10H131PG PDIP−16 (Pb-Free) 25 Units/Tube †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 August, 2016 − Rev. 8 1 Publication Order Number: MC10H131/D MC10H131 S1 5 Table 1. RS TRUTH TABLE 2 Q1 D1 7 CE1 6 3 Q1 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 R1 4 CC 9 R2 13 R S Qn+1 L L Qn L H H H L L H H ND ND = Not Defined CE2 11 D2 10 Q2 14 Q2 15 Table 2. CLOCKED TRUTH TABLE S2 12 Figure 1. Logic Diagram VCC1 1 16 VCC2 Q1 2 15 Q2 Q1 3 14 Q2 R1 4 13 R2 S1 5 12 S2 CE1 6 11 CE2 D1 7 10 D2 VEE 8 9 CC C D Qn+1 L X Qn H L L H H H C = CE + CC A clock H is a clock transition from a low to a high state. Pin assignment is for Dual-in-Line Package. Figure 2. Pin Assignment Table 3. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current Continuous Surge TA Operating Temperature Range Tstg Storage Temperature Range Plastic Ceramic 50 100 0 to +75 −55 to +150 −55 to +165 mA °C °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 MC10H131 Table 4. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol 25° 75° Min Max Min Max Min Max Unit Power Supply Current − 62 − 56 − 62 mA IinH Input Current High Pins 6, 11 Pin 9 Pins 7, 10 Pins 4, 5, 12, 13 − − − − 530 660 485 790 − − − − 310 390 285 465 − − − − 310 390 285 465 IinL Input Current Low 0.5 − 0.5 − 0.3 − mA VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc IE Characteristic mA 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Table 5. AC CHARACTERISTICS 0° Symbol 75° Min Max Min Max Min Max Propagation Delay Clock, CE Set, Reset 0.8 0.6 1.6 1.6 0.8 0.7 1.7 1.7 0.8 0.7 1.8 1.8 tr Rise Time 0.6 2.0 0.6 2.0 0.6 2.2 ns tf Fall Time 0.6 2.0 0.6 2.0 0.6 2.2 ns tset Set-up Time 0.7 − 0.7 − 0.7 − ns thold Hold Time 0.8 − 0.8 − 0.8 − ns ftog Toggle Frequency 250 − 250 − 250 − MHz tpd Characteristic 25° Unit ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. APPLICATION INFORMATION In this case, the enable inputs perform the function of controlling the common clock. The output states of the flip-flop change on the positive transition of the clock. A change in the information present at the data (D) input will not affect the output information at any other time due to master slave construction. The MC10H131 is a dual master-slave type D flip-flop. Asynchronous Set (S) and Reset (R) override Clock (CC) and Clock Enable (CE) inputs. Each flip-flop may be clocked separately by holding the common clock in the new low state and using the enable inputs for the clocking function. If the common clock is to be used to clock the flip-flop, the Clock Enable inputs must be in the low state. www.onsemi.com 3 MC10H131 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE F B 0.007 (0.180) Y BRK −N− M T L-M 0.007 (0.180) U M N S T L-M S G1 0.010 (0.250) S N S D −L− −M− Z W 20 D 1 X V S T L-M S N S VIEW D−D A 0.007 (0.180) M T L-M S N S R 0.007 (0.180) M T L-M S N S Z C H −T− VIEW S G1 0.010 (0.250) S T L-M SEATING PLANE F 0.007 (0.180) VIEW S S N T L-M S N S K 0.004 (0.100) J M K1 E G 0.007 (0.180) S NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). www.onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.021 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.53 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− M T L-M S N S MC10H131 PACKAGE DIMENSIONS PDIP−16 CASE 648−08 ISSUE V D A 16 9 E H E1 1 NOTE 8 b2 8 c B TOP VIEW END VIEW WITH LEADS CONSTRAINED NOTE 5 A2 A e/2 NOTE 3 L A1 C D1 e SEATING PLANE M eB END VIEW 16X b SIDE VIEW 0.010 M C A M B M STYLE 1: PIN 1. CATHODE 2. CATHODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE 7. CATHODE 8. CATHODE 9. ANODE 10. ANODE 11. ANODE 12. ANODE 13. ANODE 14. ANODE 15. ANODE 16. ANODE NOTE 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY. 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). DIM A A1 A2 b b2 C D D1 E E1 e eB L M INCHES MIN MAX −−−− 0.210 0.015 −−−− 0.115 0.195 0.014 0.022 0.060 TYP 0.008 0.014 0.735 0.775 0.005 −−−− 0.300 0.325 0.240 0.280 0.100 BSC −−−− 0.430 0.115 0.150 −−−− 10 ° MILLIMETERS MIN MAX −−− 5.33 0.38 −−− 2.92 4.95 0.35 0.56 1.52 TYP 0.20 0.36 18.67 19.69 0.13 −−− 7.62 8.26 6.10 7.11 2.54 BSC −−− 10.92 2.92 3.81 −−− 10 ° STYLE 2: PIN 1. COMMON DRAIN 2. COMMON DRAIN 3. COMMON DRAIN 4. COMMON DRAIN 5. COMMON DRAIN 6. COMMON DRAIN 7. COMMON DRAIN 8. COMMON DRAIN 9. GATE 10. SOURCE 11. GATE 12. SOURCE 13. GATE 14. SOURCE 15. GATE 16. SOURCE MECL is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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