HP HCPL270L Low input current high gain lvttl/lvcmos compatible 3.3 v optocoupler Datasheet

Agilent HCPL-270L/ 070L/273L/073L
Low Input Current High Gain
LVTTL/LVCMOS Compatible
3.3 V Optocouplers
Data Sheet
Features
• Low power consumption
• High current transfer ratio
• Low input current requirements –
0.5 mA
Description
These high gain series couplers use
a Light Emitting Diode and an
integrated high gain photodetector
to provide extremely high current
transfer ratio between input and
output. Separate pins for the
photodiode and output stage result
in LVTTL compatible saturation
voltages and high speed operation.
Where desired, the VCC and VO
terminals may be tied together to
achieve conventional photo-
darlington operation. A base
access terminal allows a gain
bandwidth adjustment to be
made.
These optocouplers are for use in
LVTTL/LVCMOS or other low
power applications. A 400%
minimum current transfer ratio is
guaranteed over 0 to +70˚C
operating range for only 0.5 mA
of LED current.
• LVTTL/LVCMOS compatible output
• Performance guaranteed over
temperature 0˚C to +70˚C
• Base access allows gain
bandwidth adjustment
• High output current – 60 mA
• Safety approval, UL, VDE, CSA
(pending)
Applications
• Ground isolate most logic
families – LVTTL/LVCMOS
• Low input current line receiver
Functional Diagram
• High voltage insulation
• EIA RS-232C line receiver
HCPL-270L/070L
NC 1
• Telephone ring detector
HCPL-273L/073L
8 VCC
ANODE 1 1
8 VCC
ANODE 2
7 VB
CATHODE 1 2
7 VO1
CATHODE 3
6 VO
CATHODE 2 3
6 VO2
NC 4
5 GND
• 117 V AC line voltage status
indicator – low input power
dissipation
• Low power systems – ground
isolation
5 GND
ANODE 2 4
SHIELD
TRUTH TABLE
LED
VO
ON
LOW
OFF
HIGH
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
The HCPL-070L and HCPL-073L
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-270L #XXX
060 = VDE 0884 VIORM = 630 Vpeak Option
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Agilent sales representative
or authorized distributor for information.
Selection Guide
8-Pin DIP (300 Mil)
Single Channel
Dual Channel
Package HCPLPackage HCPL270L
273L
Small Outline SO-8
Single Channel
Dual Channel
Package HCPLPackage HCPL070L
073L
Minimum Input
ON Current (IF)
0.5 mA
1.6 mA
Minimum CTR
400%
300%
Schematic
1
I CC
I F1
+
8
VCC
VF1
VCC
8
–
2
ANODE
I O1
VO1
2
ICC
7
IF
3
+
I F2
–
I O2
VF
CATHODE
–
6
VF2
IO
3
6
VO
VO2
+
4
5
SHIELD
2
5
SHIELD
IB
7
VB
HCPL-270L/HCPL-070L
GND
GND
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED
HCPL-273L/HCPL-073L
Package Outline Drawings
8-Pin DIP Package
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION CODE*
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
5° TYP.
4.70 (0.185) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
3
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
Small Outline SO-8 Package
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
PIN ONE 1
2
3
4
0.406 ± 0.076
(0.016 ± 0.003)
1.270 BSG
(0.050)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
3.175 ± 0.127
(0.125 ± 0.005)
45° X
0.432
(0.017)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
0.305 MIN.
(0.012)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
TEMPERATURE – °C
Solder Reflow Temperature Profile (Surface Mount Option Parts)
260
240
220
200
180
160
140
120
100
80
∆T = 145°C, 1°C/SEC
∆T = 115°C, 0.3°C/SEC
UL
Approval (pending) under UL
1577, Component Recognition
Program, File E55361.
60
40
20
0
Regulatory Information
The devices contained in this
data sheet are pending by the
following organizations:
0
1
∆T = 100°C, 1.5°C/SEC
CSA
2
Approval (pending) under CSA
Component Acceptance
Notice #5, File CA 88324.
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.)
VDE
Approval (pending) according to
VDE 0884/06.92.
4
Insulation and Safety Related Specifications
Parameter
Minimum External Air
Gap (External Clearance)
Minimum External Tracking
(External Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Minimum Internal Tracking
(Internal Creepage)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
Symbol
L (101)
8-Pin DIP
(300 Mil)
Value
7.1
SO-8
Value
4.9
Units
mm
L (102)
7.4
4.8
mm
0.08
0.08
mm
NA
NA
mm
200
200
Volts
IIIa
IIIa
CTI
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals to output
terminals, along internal cavity.
DIN IEC 112/VDE 0303 Part 1.
Material Group (DIN VDE 0110, 1/89, Table 1).
VDE 0884 Insulation Related Characteristics
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 300 V rms
for rated mains voltage ≤ 450 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec,
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VPR = 1.5 x VIORM, Type and Sample Test,
tP = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
Current (Input Current IF, P S = 0)
Output Power
Insulation Resistance at TS, V IO = 500 V
Symbol
Characteristic
Units
VIORM
I-IV
I-III
55/100/21
2
630
Vpeak
VPR
1181
Vpeak
VPR
945
Vpeak
VIOTM
6000
Vpeak
TS
IS,INPUT
PS,OUTPUT
RS
175
400
600
≥ 109
˚C
mA
mW
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884), for a detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
5
Absolute Maximum Ratings (No Derating Required up to +85˚C)
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
(< 1 µs Pulse Width, 300 pps)
Reverse Input Voltage
Input Power Dissipation
Output Current (Pin 6)
Emitter Base Reverse Voltage (Pin 5-7)
Supply Voltage and Output Voltage
Output Power Dissipation
Total Power Dissipation
Lead Solder Temperature (for Through Hole Devices)
Reflow Temperature Profile
(for SOIC-8 and Option #300)
Symbol
TS
TA
IF(AVG)
IF(PEAK)
IF(TRAN)
6
Symbol
VCC
IF(ON)
VF(OFF)
TA
Min.
2.7
0.5
0
0
Max.
125
85
20
40
Units
˚C
˚C
mA
mA
1.0
A
VR
5
V
PI
35
mW
IO
60
mA
VEB
0.5
V
VCC
–0.5
7
V
PO
100
mW
PT
135
mW
260˚C for 10 sec., 1.6 mm below seating plane.
See Package Outline Drawings section.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
Min.
–55
–40
Max.
3.3
12.0
0.8
70
Units
V
mA
V
˚C
Electrical Specifications
0˚C ≤ TA ≤ +70˚C, 2.7 V ≤ VCC ≤ 3.3 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified. All
typicals at TA = 25˚C. (See Note 8.)
Device
Parameter
Sym. HCPLCurrent Transfer CTR
Ratio
Logic Low
VOL
Output Voltage
Logic High
Output Current
Logic Low
Supply Current
Logic High
Supply Current
Input Forward
Voltage
Input Reverse
Breakdown
Voltage
Input
Capacitance
Min. Typ.* Max. Units
400 1300 5000 %
VCC = 3.3 V
VO = 0.4 V
VCC = 3.3 V
Fig. Note
1, 2 2
0.05
0.3
V
0.05
0.4
V
IOH
5
25
µA
IF = 1.6 mA,
IO = 8 mA
IF = 5.0 mA,
IO = 15 mA
VO = V CC = 3.3 V
ICCL 270L/070L
0.0015 0.15
mA
VCC = 3.3 V
IF1 = IF2 = 1.6 mA
VO1 = VO2 = Open
273L/073L
270L/070L
0.0015 0.3
0.002 1
mA
µA
VCC = 3.3 V
IF1 = IF2 = 0 mA
VO1 = VO2 = Open
273L/073L
0.002 2
1.5
1.7
µA
V
TA = 25˚C
IF = 1.6 mA
V
IR = 10 µA, TA = 25˚C
2
pF
f = 1 MHz, VF = 0
2
ICCH
VF
BVR
CIN
5.0
60
*All typical values at TA = 25˚C and VCC = 3.3 V, unless otherwise noted.
7
Test Conditions
IF = 0.5 mA
IF = 0 mA
2
3, 4
Switching Specifications (AC)
Over Recommended Operating Conditions (TA = 0˚C to +70˚C), VCC = 3.3 V, unless otherwise specified. (See Note 8.)
Parameter
Propagation
Delay Time to
Logic Low at
Output
Propagation
Delay Time to
Logic High at
Output
Common Mode
Transient
Immunity at
Logic High
Level Output
Common Mode
Transient
Immunity at
Logic Low
Level Output
Sym.
tPHL
Device
HCPL- Min. Typ.* Max. Units
µs
30
tPLH
90
µs
Fig. Note
5
2
IF = 0.5 mA
Rl = 4.7 kΩ
TA = 25˚C
5
2
IF = 0.5 mA, RL = 4.7 kΩ
|CMH|
1000 10000
V/µs
IF = 0 mA, TA = 25˚C,
Rl = 2.2 kΩ
|VCM | = 10 Vp-p
6
2, 6, 7
|CML|
1000 10000
V/µs
IF = 1.6 mA, TA = 25˚C,
Rl = 2.2 kΩ
|VCM | = 10 Vp-p
6
2, 6, 7
*All typical values at TA = 25˚C and VCC = 3.3 V, unless otherwise noted.
8
Test Conditions
TA = 25˚C
Package Characteristics
Parameter
Sym.
Input-Output
VISO
Momentary
Withstand
Voltage**
Resistance
RI-O
(Input-Output)
Capacitance
CI-O
(Input-Output)
Input-Input
II-I
Insulation
Leakage Current
Input-Input
RI-I
Insulation
Leakage Current
Capacitance
CI-I
(Input-Input)
Device HCPL- Min.
2500
Typ.* Max.
Units
V rms
Test Conditions
RH ≤ 50%,
t = 1 min.,
TA = 25˚C
1012
Ω
0.6
pF
VI-O = 500 Vdc
RH ≤ 45%
f = 1 MHz
µA
0.005
2730
2731
0730
0731
RH ≤ 45%
VI-I = 500 Vdc
Fig.
Note
4, 9
4
11
5
1011
Ω
5
0.03
pF
5
0.25
*All typical values at TA = 25˚C, unless otherwise noted.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level
safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage."
Notes:
1. Pin 5 should be the most negative voltage at the detector side.
2. Each channel.
3. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%.
4. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together.
5. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together.
6. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt of the common mode pulse, VCM, to
assure that the output will remain in a Logic High state (i.e., V O > 2.0 V). Common mode transient immunity in a Logic Low level is the
maximum tolerable (negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state
(i.e., VO < 0.8 V).
7. In applications where dV/dt may exceed 50,000 V/µs (such as static discharge) a series resistor, R CC, should be included to protect the
detector IC from destructively high surge currents. The recommended value is RCC = 110 Ω.
8. Use of a 0.1 µF bypass capacitor connected between pins 5 and 8 adjacent to the device is recommended.
9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 3000 V rms for 1 second (leakage
detection current limit, II-O < 5 µA).
10. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage
detection current limit, II-O < 5 µA).
11. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together.
12. Derate linearly above 65˚C free-air temperature at a rate of 2.3 mW/˚C for the SO-8 package.
9
25°C
1600
70°C
-40°C
1200
800
400
VCC = 3.3 V
VO = 0.4 V
0
0.1
1.0
10
IF – FORWARD CURRENT – mA
Figure 1. Current transfer ratio vs. forward
current.
VF – FORWARD VOLTAGE – V
1.6
IF = 1.6 mA
1.5
1.4
1.3
1.2
-60 -40 -20
0
20
40 60
80 100
TA – TEMPERATURE – °C
Figure 4. Forward voltage vs. temperature.
10
100
IF – FORWARD CURRENT – mA
70°C
IO – OUTPUT CURRENT – mA
CTR – CURRENT TRANSFER RATIO – %
1000
85°C
2000
10
TA = 85° C
1.0
0.1
0.01
0.01
TA = 70° C
TA = 25° C
TA = 0° C
TA = -40° C
0.1
1
10
IF – INPUT DIODE FORWARD CURRENT – mA
Figure 2. Output current vs. input diode
forward current.
100
IF
+
VF
–
10
1.0
TA = 85°C
TA = 70°C
0.1
TA = 25°C
0.01
0.001
1.1
TA = 0°C
TA = -40°C
1.2
1.3
1.4
1.5
VF – FORWARD VOLTAGE – V
Figure 3. Input diode forward current vs.
forward voltage.
1.6
IF
PULSE
GEN.
ZO = 50 Ω
t r = 5 ns
0
3.3 V
VO
(SATURATED
RESPONSE)
50%
IF
10% DUTY CYCLE
I/f < 100 µs
50%
1
8
2
7
3
6
3.3 V
RL
VO
VOL
t PHL
t PLH
0.1 µF
I F MONITOR
5
4
CL = 15 pF*
RM
VO
3.3 V
90%
(NON-SATURATED
RESPONSE)
10%
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
90%
10%
tf
tr
Figure 5. Switching test circuit.
VCM
10 V
0 V 10%
IF
tr, tf = 16 ns
90%
90%
tr
VO
8
RCC (SEE NOTE 6)
+3.3 V
2
7
RL
3
6
4
5
B
10%
tf
A
3.3 V
VFF
SWITCH AT A: IF = 0 mA
VO
1
VCM
VOL
SWITCH AT B: IF = 1.6 mA
+
–
PULSE GEN.
Figure 6. Test circuit for transient immunity and typical waveforms.
11
VO
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2000 Agilent Technologies
5988-0282EN (10/00)
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