SO T8 9 BGA3012 1 GHz 12 dB gain wideband amplifier MMIC Rev. 3 — 26 September 2013 Product data sheet 1. Product profile 1.1 General description The BGA3012 MMIC is a wideband amplifier with internal biasing. It is designed specifically for high linearity CATV line extenders and drop amplifiers over a frequency range of 5 MHz to 1006 MHz. The LNA is housed in a lead free 3-pin SOT89 package. 1.2 Features and benefits Internally biased Flat gain High linearity with an IP3O of 40 dBm and an IP2O of 60 dBm Noise figure of 3.1 dB 75 input and output impedance Operating from 5 V to 8 V supply 1.3 Applications General wideband amplifiers. CATV return amplifier; frequency ranges of 5 MHz to 300 MHz. CATV infrastructure network driver in optical nodes (FTTx), distribution amplifiers, trunk amplifiers and line extenders in the frequency range from 40 MHz to 1006 MHz. The product is ideally suited for applications as drop amplifiers in CATV distribution systems such as FTTH 1.4 Quick reference data Table 1. Quick reference data Bandwidth 40 MHz to 1006 MHz; Tamb = 25 C; typical values at VCC = 8 V; ZS = ZL = 75 ; R1 = 100 ; R2 = 300 . Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage RF input AC coupled 7.6 8 8.4 V ICC(tot) total supply current - 110 125 mA Tamb ambient temperature 40 - +85 C NF noise figure - 3.1 3.6 dB PL(1dB) output power at 1 dB gain compression f = 500 MHz IP3O output third-order intercept point [1] IP2O output second-order intercept point [2] 21.5 23 - dBm 36 40 - dBm - 60 - dBm [1] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM3) is 2 f2 f1, where f2 = f1 6 MHz. Input power Pi = 20 dBm. [2] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM2) is f2 f1, with 40 MHz < f1-f2 < 1006 MHz. Input power Pi = 20 dBm. BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1 RF_OUT and biasing [1] 2 GND [2] 3 RF_IN [1] Graphic symbol 3 1 2 3 2 sym130 1 [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGA3012 - plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 OM7858 EVB 1 GHz 12 dB gain wideband amplifier application - OM7862 EVB 5 MHz to 300 MHz 12 dB reverse amplifier application - OM7866 EVB 40 MHz to 1006 MHz push-pull amplifier application - 4. Marking Table 4. Marking codes Type number Marking code Description BGA3012 *6W * = W : made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). BGA3012 Product data sheet Symbol Parameter Conditions Min Max Unit VCC supply voltage RF input AC coupled 0.6 +15 V single tone Pi input power - 20 dBm Tstg storage temperature 65 +150 C Tj junction temperature - 150 C Tamb ambient temperature 40 +85 C VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E 2 - kV Charged Device Model (CDM); According JEDEC standard 22-C101B 2 - kV All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 2 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions Typ Unit 40 K/W 7. Characteristics 7.1 Forward application Table 7. Characteristics at VCC = 8 V Bandwidth 40 MHz to 1006 MHz; Tamb = 25 C; typical values at VCC = 8 V; ZS = ZL = 75 ; R1 = 100 ; R2 = 300 . Symbol Parameter Typ Max Unit RF input AC coupled 7.6 8 supply voltage ICC(tot) total supply current - 110 125 mA s212 insertion power gain 11 12 13 dB SLsl slope straight line - 0.5 - dB FL flatness of frequency response - 0.5 - dB NF noise figure RLout Product data sheet Min VCC RLin BGA3012 Conditions input return loss output return loss 8.4 V f = 50 MHz - 3.0 3.5 dB f = 500 MHz - 3.1 3.6 dB f = 1000 MHz - 3.4 3.9 dB f = 50 MHz - 22 - dB f = 500 MHz - 27 - dB f = 1000 MHz - 29 - dB f = 50 MHz - 21 - dB f = 500 MHz - 22 - dB f = 1000 MHz - 15 - dB 21.5 23 - dBm [1] 36 40 - dBm output second-order intercept point [2] - 60 - composite triple beat [3] - 75 - dBc composite second-order distortion [3] - 60 - dBc PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point IP2O CTB CSO dBm [1] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM3) is 2 f2 f1, where f2 = f1 6 MHz. Input power Pi = 20 dBm. [2] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM2) is f2 f1, with 40 MHz < f1-f2 < 1006 MHz. Input power Pi = 20 dBm. [3] Measured with 132 NTSC channels VO = 30 dBmV. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 3 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC Table 8. Characteristics at VCC = 5 V Bandwidth 40 MHz to 1006 MHz; Tamb = 25 C; typical values at VCC = 5 V; ZS = ZL = 75 ; R1 = 100 ; R2 = 300 . Symbol Parameter 4.75 5 5.25 V total supply current - 70 85 mA insertion power gain - 12 - dB ICC(tot) s212 Typ Max Unit SLsl slope straight line - 0.5 - dB FL flatness of frequency response - 0.5 - dB NF noise figure f = 50 MHz - 2.9 - dB f = 500 MHz - 2.9 - dB f = 1000 MHz - 3.2 - dB f = 50 MHz - 22 - dB f = 500 MHz - 25 - dB f = 1000 MHz - 25 - dB RLout input return loss output return loss f = 50 MHz - 22 - dB f = 500 MHz - 22 - dB f = 1000 MHz - 12 - dB - 18 - dBm PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point [1] - 36 - dBm output second-order intercept point [2] - 54 - dBm composite triple beat [3] - 70 - dBc composite second-order distortion [3] - 54 - dBc IP2O CTB CSO Product data sheet Min RF input AC coupled supply voltage RLin BGA3012 Conditions VCC [1] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM3) is 2 f2 f1, where f2 = f1 6 MHz. Input power Pi = 20 dBm. [2] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM2) is f2 f1, with 40 MHz < f1-f2 < 1006 MHz. Input power Pi = 20 dBm. [3] Measured with 132 NTSC channels VO = 30 dBmV. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 4 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 7.2 Return application Table 9. Characteristics at VCC = 8 V Bandwidth 5 MHz to 300 MHz; Tamb = 25 C; typical values at VCC = 8 V; ZS = ZL = 75 ; R1 = 100 ; R2 = 300 . Symbol Parameter Product data sheet Max Unit supply voltage 7.6 8 8.4 V ICC(tot) total supply current - 110 125 mA s212 insertion power gain - 12 - dB SLsl slope straight line - 0.5 - dB FL flatness of frequency response - 0.5 - dB NF noise figure f = 50 MHz - 3.0 - dB RLin input return loss f = 5 MHz - 18.5 - dB f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB f = 5 MHz - 18.5 - dB f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB - 23 - dBm output return loss RF input AC coupled Min Typ VCC RLout BGA3012 Conditions PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point [1] - 40 - dBm IP2O output second-order intercept point [2] - 60 - dBm [1] The fundamental frequencies (f1) and (f2) lay between 5 MHz and 300 MHz. The intermodulation product (IM3) is 2 f2 f1, where f2 = f1 6 MHz. Input power Pi = 20 dBm. [2] The fundamental frequencies (f1) and (f2) lay between 5 MHz and 300 MHz. The intermodulation product (IM2) is f2 f1, with 40 MHz < f1-f2 < 300 MHz. Input power Pi = 20 dBm. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 5 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC Table 10. Characteristics at VCC = 5 V Bandwidth 5 MHz to 300 MHz; Tamb = 25 C; typical values at VCC = 5 V; ZS = ZL = 75 ; R1 = 100 ; R2 = 300 . Symbol Parameter 4.75 5 5.25 V total supply current - 70 85 mA insertion power gain - 12 - dB ICC(tot) s212 Typ Max Unit SLsl slope straight line - 0.5 - dB FL flatness of frequency response - 0.5 - dB NF noise figure f = 50 MHz - 2.9 - dB RLin input return loss f = 5 MHz - 18.5 - dB output return loss f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB f = 5 MHz - 18.5 - dB f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB - 17 - dBm PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point [1] - 40 - dBm output second-order intercept point [2] - 55 - dBm IP2O Product data sheet Min RF input AC coupled supply voltage RLout BGA3012 Conditions VCC [1] The fundamental frequencies (f1) and (f2) lay between 5 MHz and 300 MHz. The intermodulation product (IM3) is 2 f2 f1, where f2 = f1 6 MHz. Input power Pi = 20 dBm. [2] The fundamental frequencies (f1) and (f2) lay between 5 MHz and 300 MHz. The intermodulation product (IM2) is f2 f1, with 40 MHz < f1-f2 < 300 MHz. Input power Pi = 20 dBm. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 6 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 8. Application information 8.1 Forward application 40 MHz to 1006 MHz The BGA3012 can be used in other applications. Please contact your local sales representative for more information. Application notes are available on the NXP website. 8.1.1 Forward application circuit - 9&& & & / / & 5 - 5)BLQ & 5 8 / / & - 5)BRXW DDD Components are listed in Table 11. Fig 1. BGA3012 application circuit All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible. BGA3012 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 7 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC *1' %*$[[(9% YHUVLRQ 1RYHPEHU 0+]0+] 9&& *1' 8.1.2 Forward application circuit board layout - 3&%6SHF)5(U 5)OD\HU PP2KP & & - - / 8 & / / / & 5 & 5 6HPLFRQGXFWRUV 5),1 5)287 DDD PCB (Printed-Circuit Board) material = FR4; thickness = 1.5 mm; size = 40 mm 40 mm; r = 4.6; thickness of copper layer = 35 m; Components are listed in Table 11. Fig 2. BGA3012 application circuit board layout Table 11. List of components See Figure 1 and Figure 2. Component Description Value Size Remarks C1, C2, C3, C4 capacitor 10 nF SMD 0402 Murata GRM155R71E103KA01D or capacitor of same quality C5 capacitor 100 pF SMD 0402 Murata GRM1555C1H101JZ01D or capacitor of same quality J1, J2 F-connector 75 - Bomar 861V509ER6 or F-connector of same quality J3 header 3-way - - Molex 90121-0763 or header of the same quality L1, L3 inductor 3.9 nH SMD 0402 Murata LQG15HS3N9S02D or inductor of same quality L2 choke - SMD 0603 Murata BLM18HD182SN1D or choke of same quality L4 inductor 880 nH SMD 1206 Murata LQH31HNR88K03L or inductor of same quality R1 resistor 100 SMD 0402 Yageo RC0402FR-07100RL or resistor of same quality R2 resistor 300 SMD 0402 Yageo RC0402FR-07300RL or resistor of same quality U1 BGA3012 - - NXP BGA3012 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 8 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 8.2 Return application 5 MHz to 300 MHz The BGA3012 can be used in other applications. Please contact your local sales representative for more information. Application notes are available on the NXP website. 8.2.1 Return application circuit - 9&& & & / & 5 - & 5)BLQ 5 8 & - 5)BRXW DDD Components are listed in Table 11. Fig 3. BGA3012 application circuit All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible. BGA3012 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 9 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC *1' %*$[[(9% YHUVLRQ 1RYHPEHU 0+]0+] 9&& *1' 8.2.2 Return application circuit board layout - 3&%6SHF)5(U 5)OD\HU PP2KP & & - 8 - / & & 5 & 5 6HPLFRQGXFWRUV 5),1 5)287 DDD PCB (Printed-Circuit Board) material = FR4; thickness = 1.5 mm; size = 40 mm 40 mm; r = 4.6; thickness of copper layer = 35 m; Components are listed in Table 11. Fig 4. BGA3012 application circuit board layout Table 12. List of components See Figure 1 and Figure 2. Component Description Value Size Remarks C1, C2, C3, C4 capacitor 10 nF SMD 0402 Murata GRM155R71E103KA01D or capacitor of same quality C5 capacitor 100 pF SMD 0402 Murata GRM1555C1H101JZ01D or capacitor of same quality J1, J2 F-connector 75 - Bomar 861V509ER6 or F-connector of same quality J3 header 3-way - - Molex 90121-0763 or header of the same quality L2 inductor 22 H SMD 1206 Murata LQH31CN220K03L or inductor of same quality R1 resistor 100 SMD 0402 Yageo RC0402FR-07100RL or resistor of same quality R2 resistor 300 SMD 0402 Yageo RC0402FR-07300RL or resistor of same quality U1 BGA3012 - - NXP BGA3012 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 10 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 9. Package outline Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 B D A bp3 E HE Lp 1 2 3 c bp2 w M B bp1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp1 bp2 bp3 c D E e e1 HE Lp w mm 1.6 1.4 0.48 0.35 0.53 0.40 1.8 1.4 0.44 0.23 4.6 4.4 2.6 2.4 3.0 1.5 4.25 3.75 1.2 0.8 0.13 OUTLINE VERSION REFERENCES IEC SOT89 Fig 5. JEDEC JEITA TO-243 SC-62 EUROPEAN PROJECTION ISSUE DATE 06-03-16 06-08-29 Package outline SOT89 (SC-62) BGA3012 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 11 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 10. Abbreviations Table 13. Abbreviations Acronym Description CATV Community Antenna TeleVision FTTH Fiber To The Home FTTx Fiber To The “x” LNA Low-Noise Amplifier MMIC Monolithic Microwave Integrated Circuit 11. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes BGA3012 v.3 20130926 Product data sheet - BGA3012 v.2 Modifications: • Table 3 on page 2: Evaluation boards have been added. BGA3012 v.2 20130415 Product data sheet - BGA3012 v.1 BGA3012 v.1 20130319 Preliminary data sheet - - BGA3012 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 12 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BGA3012 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 13 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGA3012 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 September 2013 © NXP B.V. 2013. All rights reserved. 14 of 15 BGA3012 NXP Semiconductors 1 GHz 12 dB gain wideband amplifier MMIC 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 7.1 7.2 8 8.1 8.1.1 8.1.2 8.2 8.2.1 8.2.2 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Forward application . . . . . . . . . . . . . . . . . . . . . 3 Return application. . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 7 Forward application 40 MHz to 1006 MHz . . . . 7 Forward application circuit . . . . . . . . . . . . . . . . 7 Forward application circuit board layout . . . . . . 8 Return application 5 MHz to 300 MHz . . . . . . . 9 Return application circuit . . . . . . . . . . . . . . . . . 9 Return application circuit board layout . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 26 September 2013 Document identifier: BGA3012