Datasheet Standard LCD Segment Drivers BU97950FUV MAX 280 segments (SEG35×COM8) ●Key Specifications ■ Supply Voltage Range: +2.5V to +5.5V ■ LCD drive power supply Range: +2.5V to +5.5V ■ Operating Temperature Range: -40°C to +85°C ■ Max Segments: 280 Segments ■ Display Duty: 1/8 ■ Bias: 1/4 ■ Interface: 2wire serial interface ●Features Integrated RAM for display data (DDRAM): 35 x 8bit (Max 280 Segment) LCD drive output: 8 Common output, 35 Segment output Integrated Buffer AMP for LCD driving Integrated Oscillator circuit No external components Low power consumption design Independent power supply for LCD driving Integrated Electrical volume register (EVR) function W (Typ.) x D (Typ.) x H (Max.) ●Packages ●Applications Telephone FAX Portable equipment (POS, ECR, PDA etc.) DSC DVC Car audio Home electrical appliance Meter equipment etc. TSSOP-C48V 8.1mm x 12.5mm x 1.0mm ●Typical Application Circuit VLCD VDD COM0 …... …... VDD VLCD COM7 SD SCL Controller Segment LCD SEG0 SEG1 Figure 1. ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 …... …... SEG34 VSS Typical Application Circuit ○This product is not designed for protection against radioactive rays. 1/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Block Diagrams / Pin Configurations / Pin Descriptions BU97950FUV (TSSOP-C48V) COM0……COM7 VLCD SEG0……SEG34 VDD SDA VLCD SCL VSS SEG21 SEG20 SEG22 SEG19 SEG23 ＋ SEG18 SEG24 － SEG17 SEG25 ＋ SEG16 SEG26 SEG15 SEG27 SEG14 SEG28 SEG13 SEG29 ＋ SEG12 SEG30 － SEG11 SEG31 SEG10 SEG32 SEG9 SEG33 SEG8 SEG34 SEG7 COM0 SEG6 COM1 SEG5 COM2 SEG4 COM3 SEG3 COM4 SEG2 COM5 SEG1 COM6 SEG0 COM7 LCD voltage generator common driver Segment driver LCD BIAS SELECTOR － ＋ － common counter DDRAM VSS Command Data Decoder Command register OSCILLATOR Power On Reset serial inter face IF FILTER VDD SDA SCL Figure 2. Block Diagram Figure 3. Pin Configuration (TOP VIEW) Table 1 Pin Description Terminal Terminal No. I/O SDA 48 I/O SCL 47 I Serial data transfer clock VSS 3 I GND VDD 1 I Power supply VLCD 2 I Power supply for LCD drive SEG0 to 35 4 to 24 33 to 46 O SEGMENT output for LCD drive COM0 to 7 25 to 32 O COMMON output for LCD drive www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Function Serial data input 2/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Absolute Maximum Ratings (VSS=0V) Parameter Symbol Ratings Unit Remarks Power Supply Voltage1 VDD -0.5 to +7.0 V Power supply Power Supply Voltage2 VLCD -0.5 to +7.0 V Allowable loss Pd 0.64 W LCD drive voltage When used at more than Ta=25 ºC, subtract 6.4mW per degree. (BU97950FUV Package only) Input voltage range Operational temperature range Storage temperature range VIN -0.5 to VDD+0.5 V Topr -40 to +85 ºC Tstg -55 to +125 ºC *1 This product is not designed against radioactive ray. ●Recommended Operating Ratings(Ta=-40°C to +85°C,VSS=0V) Limits Parameter Symbol MIN TYP MAX Unit Remarks Power Supply Voltage1 VDD 2.5 - 5.5 V Power supply Power Supply Voltage2 VLCD 2.5 - 5.5 V LCD drive voltage ●Electrical Characteristics DC Characteristics (VDD=2.5 to 5.5V, VLCD=2.5 to 5.5V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX “H” level input voltage VIH 0.7VDD - VDD V SDA,SCL “L” level input voltage VIL VSS - “H” level input current IIH - - 0.3VDD V SDA,SCL 1 µA SDA,SCL “L” level input current IIL -1 - - µA SDA,SCL SEG RON COM RON - 3.5 - kΩ - 3.5 - kΩ Ist - - 5 µA Power consumption 1 IDD - 2.5 15 µA Power consumption 2 ILCD - 10 20 µA LCD Driver on resistance Standby current www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/21 Iload=±10µA Display off, Oscillation off VDD=3.3V, VLCD=5V, Ta=25°C Power save mode1, FR=80Hz 1/4 bias, Frame inversion VDD=3.3V, VLCD=5V, Ta=25°C Power save mode1, FR=80Hz 1/4 bias, Frame inversion TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV Datasheet MAX 280 segments (SEG35×COM8) ●Electrical Characteristics – continued Oscillation Characteristics (VDD=2.5 to 5.5V, VLCD=2.5 to 5.5V, VSS=0V, Ta=-40°C to 85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX Frame frequency fCLK 56 80 104 Hz FR = 80Hz setting, VDD=3.3V MPU I/F Characteristics (VDD=2.5 to 5.5V, VLCD=2.5 to 5.5V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX Input rise time tr - - 0.3 µs Input fall time tf - - 0.3 µs SCL cycle time tSCYC 2.5 - - µs “H” SCL pulse width tSHW 0.6 - - µs “L” SCL pulse width tSLW 1.3 - - µs SDA setup time tSDS 200 - - ns SDA hold time tSDH 0 - - ns Bus free time tBUF 1.3 - - µs START condition hold time tHD;STA 0.6 - - µs START condition setup time tSU;STA 0.6 - - µs STOP condition setup time tSU;STO 0.6 - - µs Figure 4. Serial Interface Timing www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●I/O equivalent circuit VDD VLCD VSS VSS SDA SCL VSS VSS VLCD SEG/COM VSS Figure 5. I/O Equivalent Circuit ●Example of Recommended Circuit VDD VLCD COM0 …... …... VDD VLCD COM7 SD SCL Controller Segment LCD SEG0 SEG1 …... …... SEG34 VSS Figure 6. Example of Recommended Circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Function Description ○Command /Data transfer method This device is controlled by 2-wire serial signal (SDA, SCL). SDA SCL START condition STOP condition Figure 7. 2-wire Serial Command/Data Transfer Format START and STOP conditions are required in 2-wire serial interface transfer method. Slave address S 0 1 1 1 1 1 0 0 A A Command C Display Data A P 0 Command or data judgment bit START condition STOP condition Acknowledge Figure 8. Interface Protocol Method of transferring command and data is as follows: 1) Generate “START condition”. 2) Send Slave address. 3) Send command and display data. 4) Generate “STOP condition”. ○Acknowledge Data format is 8-bit and an Acknowledge bit is returned after transfer of 8-bit data. When SCL 8th=‟L‟ after transfer of 8-bit data (Slave Address, Command, Display Data), output ‟L‟ and open SDA line. When SCL 9th=‟L‟, stop output function. (As Output format is NMOS-Open-Drain, can‟t output „H‟ level.) If there is no need for Acknowledge function, please input „L‟ level from SCL 8th=‟L‟ to SCL 9th=‟L‟. SDA 1-7 8 9 1-7 8 9 1-7 8 9 SCL S START condition P SLAVE ADDRESS ACK DATA ACK DATA ACK STOP condition Figure 9. Acknowledge timing www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ○Command transfer method Send the Slave Address (“01111100” for Write Mode or “01111101” for Read Mode) after the “START condition” is generated. Command input follows after the Slave Address. The least significant bit (LSB) of the Slave Address determines if the operation is Write or Read. The MSB is the command/data judgment bit. This bit determines whether succeeding byte is a command or data. When “command or data judgment bit”=„1‟, the next byte is a command. When “command or data judgment bit”=„0‟, the next byte is display data. S Slave address A 1 Command A 1 Command A 1 Command A 0 Command A Display Data … P Once the chip is in display data transfer condition, command can no longer be accepted. To input another command, a “START condition” must be generated. If “START condition” or “STOP condition” is inputted during command transmission, the current command will be cancelled. If the Slave address is continuously inputted after the “START condition”, it will be in command input condition. After “START condition” please input “Slave Address”. When Slave Address is not recognized, Acknowledge bit will not be returned and succeeding transmissions will be invalid. During an invalid state, sending the “START condition” will cause the device to return to a valid status. ＊When transferring command and data, please observe “MPU Interface characteristic” of input rise time, Setup time, and Hold time etc…（Refer to MPU Interface）. ○Write display and transfer method BU97950 enters “Write mode” when R/W bit of Slave address is „0‟ BU97950 has Display Data RAM (DDRAM) of 35×8=280bits. The relationship between data input and display data, DDRAM data and address are as follows. Slave address S 0111110 0 Command A 0 0000000 A a b c d e f g h A i j k l m n o p A … P Display Data R/W=0 (Write Mode) The 8-bit display data will be stored in the DDRAM. The address to be written is specified by Address Set command, and the address is automatically incremented after every 8-bit of data. Data can be continuously written in the DDRAM by transmitting Data continuously. BIT 0 1 0 a i COM0 1 b j COM1 2 c k COM2 3 d l COM3 4 e m COM4 5 f n COM5 6 g o COM6 7 h p SEG0 SEG1 2 3 4 5 6 7 ・・・・・・・・ 21h 22h COM7 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG33 SEG34 DDRAM address www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ○Read Command Register and Transfer Method BU97950 enters “Read mode” when R/W bit of Slave address is „1‟ During Read mode the command registers can be read. The sequence for the command register read is shown below. Slave address S 0111110 Command 0 A 1 Slave address ADSET 0111110 A S R/W 1 A A P Data R/W The following register settings can be read in this mode. Only one register setting can be read at once, after reading register setting, BU97950 will exit from read mode and wait for slave address. If all register setting needs to be read, please make sequence for “REG1” and “REG2”, respectively. Register D7 D6 D5 D4 D3 D2 D1 D0 Address REG1 0 0 P5 P4 P3 P2 P1 P0 23h REG2 P7 P6 P5 P4 P3 P2 P1 P0 24h REG1: P5 = Software reset condition P4 to P0 = EVR setting REG2: P7 to P6 = Frame Frequency (FR) setting P5 to P4 = Power Save Mode (SR) setting P3 = LCD drive waveform setting P2 = Display ON/OFF setting P1 = APON setting P0 = APOFF setting An example of the command register read sequence is shown below. S SDA P Slave Address (read) A P7 P6 P5 P4 P3 P2 P1 P0 A SCL ○ LCD Driver Bias Circuit This device generates LCD driving voltage with built in Buffer AMP. And it can drive LCD at low power consumption. *Line and frame inversion is set in DISCTL command. Refer to the “LCD driving waveform” about each LCD driving waveform. ○ Reset initialize condition Initial condition after Software Reset is as follows. ・Display is OFF. ・DDRAM address is initialized (DDRAM Data is not initialized). Refer to Command Description about initialize value of register. ●Command / Function List Description List of Command / Function Command Function DDRAM address setting (00h to 22h) Command register address setting (23h, 24h) 1 Address set (ADSET) 2 EVR set (EVRSET) 3 Display Control (DISCTL) Frame Frequency, Power save mode setting 4 IC operation set (ICSET) LCD drive mode, software reset, display on/off 5 All pixel Control (APCTL) All pixel control during display ON www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 EVR setting (0 to 31) 8/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Detailed command description D7 (MSB) is bit for command or data judgment. For more detailed information, please refer to “Command and data transfer method”. C: 0: Next byte is RAM write data. 1: Next byte is command. ○Address set (ADSET) MSB D7 C D6 0 D5 P5 D4 P4 D3 P3 D2 P2 D1 P1 LSB D0 P0 Address data is specified in P[5:0]. The address range can be set as 000000 to 100010(bin) for Write mode. When the specified address is out of range, the address will be set to “000000”. The default value of the DDRAM address is “000000” The address can be set 100011 (bin) and 100100 (bin) for Read mode. It is prohibited to set other address. P[5:0] = 23h （100011b） - REG1 Register address for Software reset condition and EVR setting P[5:0] = 24h （100100b） - REG2 Register address for the other settings (For more detailed information, please refer to “Read Command Register and Transfer Method”) ○EVR Set (EVRSET) MSB D7 C D6 1 D5 0 D4 P4 D3 P3 D2 P2 D1 P1 LSB D0 P0 It is able to control a 32-step electrical volume register (EVR). It is able to set V0 voltage level (the max level voltage of LCD driving voltage). Electrical volume register (EVR) is set to “00000” upon initialization.. In “00000” condition, V0 voltage outputs VLCD voltage. Avoid setting EVR V0 voltage under 2.5V. And ensure “VLCD – V0 > 0.6” condition is satisfied. Unstable IC output voltage may result if the above conditions are not satisfied. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ○The relationship of electrical volume register (EVR) setting and V0 voltage EVR Calculation formula 0 VLCD V0= 5.500 V0= 5.000 V0= 4.000 V0= 3.500 V0= 3.000 V0= 2.500 [V] 1 0.967*VLCD V0= 5.323 V0= 4.839 V0= 3.871 V0= 3.387 V0= 2.903 V0= 2.419 [V] 2 0.937*VLCD V0= 5.156 V0= 4.688 V0= 3.750 V0= 3.281 V0= 2.813 V0= 2.344 [V] 3 0.909*VLCD V0= 5.000 V0= 4.545 V0= 3.636 V0= 3.182 V0= 2.727 V0= 2.273 [V] 4 0.882*VLCD V0= 4.853 V0= 4.412 V0= 3.529 V0= 3.088 V0= 2.647 V0= 2.206 [V] 5 0.857*VLCD V0= 4.714 V0= 4.286 V0= 3.429 V0= 3.000 V0= 2.571 V0= 2.143 [V] 6 0.833*VLCD V0= 4.583 V0= 4.167 V0= 3.333 V0= 2.917 V0= 2.500 V0= 2.083 [V] 7 0.810*VLCD V0= 4.459 V0= 4.054 V0= 3.243 V0= 2.838 V0= 2.432 V0= 2.027 [V] 8 0.789*VLCD V0= 4.342 V0= 3.947 V0= 3.158 V0= 2.763 V0= 2.368 V0= 1.974 [V] 9 0.769*VLCD V0= 4.231 V0= 3.846 V0= 3.077 V0= 2.692 V0= 2.308 V0= 1.923 [V] 10 0.750*VLCD V0= 4.125 V0= 3.750 V0= 3.000 V0= 2.625 V0= 2.250 V0= 1.875 [V] VLCD= 5.500 VLCD= 5.000 VLCD= 4.000 VLCD= 3.500 VLCD= 3.000 VLCD= 2.500 [V] 11 0.731*VLCD V0= 4.024 V0= 3.659 V0= 2.927 V0= 2.561 V0= 2.195 V0= 1.829 [V] 12 0.714*VLCD V0= 3.929 V0= 3.571 V0= 2.857 V0= 2.500 V0= 2.143 V0= 1.786 [V] 13 0.697*VLCD V0= 3.837 V0= 3.488 V0= 2.791 V0= 2.442 V0= 2.093 V0= 1.744 [V] 14 0.681*VLCD V0= 3.750 V0= 3.409 V0= 2.727 V0= 2.386 V0= 2.045 V0= 1.705 [V] 15 0.666*VLCD V0= 3.667 V0= 3.333 V0= 2.667 V0= 2.333 V0= 2.000 V0= 1.667 [V] 16 0.652*VLCD V0= 3.587 V0= 3.261 V0= 2.609 V0= 2.283 V0= 1.957 V0= 1.630 [V] 17 0.638*VLCD V0= 3.511 V0= 3.191 V0= 2.553 V0= 2.234 V0= 1.915 V0= 1.596 [V] 18 0.625*VLCD V0= 3.438 V0= 3.125 V0= 2.500 V0= 2.188 V0= 1.875 V0= 1.563 [V] 19 0.612*VLCD V0= 3.367 V0= 3.061 V0= 2.449 V0= 2.143 V0= 1.837 V0= 1.531 [V] 20 0.600*VLCD V0= 3.300 V0= 3.000 V0= 2.400 V0= 2.100 V0= 1.800 V0= 1.500 [V] 21 0.588*VLCD V0= 3.235 V0= 2.941 V0= 2.353 V0= 2.059 V0= 1.765 V0= 1.471 [V] 22 0.576*VLCD V0= 3.173 V0= 2.885 V0= 2.308 V0= 2.019 V0= 1.731 V0= 1.442 [V] 23 0.566*VLCD V0= 3.113 V0= 2.830 V0= 2.264 V0= 1.981 V0= 1.698 V0= 1.415 [V] 24 0.555*VLCD V0= 3.056 V0= 2.778 V0= 2.222 V0= 1.944 V0= 1.667 V0= 1.389 [V] 25 0.545*VLCD V0= 3.000 V0= 2.727 V0= 2.182 V0= 1.909 V0= 1.636 V0= 1.364 [V] 26 0.535*VLCD V0= 2.946 V0= 2.679 V0= 2.143 V0= 1.875 V0= 1.607 V0= 1.339 [V] 27 0.526*VLCD V0= 2.895 V0= 2.632 V0= 2.105 V0= 1.842 V0= 1.579 V0= 1.316 [V] 28 0.517*VLCD V0= 2.845 V0= 2.586 V0= 2.069 V0= 1.810 V0= 1.552 V0= 1.293 [V] 29 0.508*VLCD V0= 2.797 V0= 2.542 V0= 2.034 V0= 1.780 V0= 1.525 V0= 1.271 [V] 30 0.500*VLCD V0= 2.750 V0= 2.500 V0= 2.000 V0= 1.750 V0= 1.500 V0= 1.250 [V] 31 0.491*VLCD V0= 2.705 V0= 2.459 V0= 1.967 V0= 1.721 V0= 1.475 V0= 1.230 [V] Prohibited setting *In case EVR is used, please satisfy VLCD-V0 >0.6 V condition. If this condition cannot be satisfied, IC output will be unstable. *Do not use V0 < 2.5V area. If EVR is set to this area, IC operation will be unstable. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ○Display control (DISCTL) MSB D7 C D6 １ D5 １ D4 ０ D3 P3 Set Power save mode FR. Power save mode FR Normal mode (80Hz) Power save mode1 (71Hz) Power save mode2 (64Hz) Power save mode3 (50Hz) D2 P2 P３ 0 0 1 1 D1 P1 P２ 0 1 0 1 LSB D0 P0 Reset initialize condition ○ ＊Operation current decrease in Normal mode > Power save mode1 > Power save mode2 > Power save mode 3 order. Set Power save mode SR. Setup Power save mode 1 Power save mode 2 Normal mode High power mode P1 0 0 1 1 P0 0 1 0 1 Reset initialize condition ○ ＊Operation current increase in order of Power save mode 1 < Power save mode 2 < Normal mode < High power mode order. Note: Power save mode FR / LCD drive waveform / Power save mode SR will affect the display image. Select the best value depending on the current consumption and display image using LCD panel (under real application). Mode Power save mode FR LCD drive waveform (ICSET) Power save mode SR www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Flicker ○ ○ - 11/21 Display grade/Contrast ○ ○ TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ○Set IC Operation (ICSET) MSB D7 C D6 1 D5 1 D4 1 D3 0 Set LCD drive waveform. Setup Line inversion mode Frame inversion mode D2 P2 P2 0 1 D1 P1 LSB D0 P0 Reset initialize condition ○ Operation current: Line inversion > Frame inversion For drive mode of Line inversion and Frame inversion, refer to LCD waveform. Set Software Reset condition. Setup No operation Software reset P1 0 1 Reset initialize condition ○ When “Software Reset” is executed, this device is reset to initial condition. (Refer to Reset initialize condition) Software reset is asserted only once when P1 is set. Other settings can be set after this. Set Display ON and OFF Setup Display OFF (DISPOFF) Display ON (DISPON) P0 0 1 Reset initialize condition ○ Display OFF : The DDRAM content is not affected. All SEGMENT and COMMON output stop after a frame. Display OFF mode ends when Display ON is set. Display ON : SEGMENT and COMMON outputs are active. Start read operation to display data from the DDRAM. ○All Pixel control (APCTL) MSB D7 C D6 1 D5 1 D4 1 All display set ON APON D3 1 D2 0 D1 P1 LSB D0 P0 P1 Reset initialize condition Normal 0 ○ All pixel ON 1 All display set OFF APOFF P0 Reset initialize condition Normal 0 ○ All pixel OFF 1 All pixels ON All pixels OFF : All pixels are ON regardless of DDRAM data. : All pixels are OFF regardless of DDRAM data. Note: All pixels ON/OFF is effective only at the time of “Display ON” status. The contents of DDRAM do not change at this time. When P1 and P0=‟1‟, APOFF is selected. APOFF has higher priority than APON. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●LCD driving waveform (1/4bias, 1/8duty) Line inversion mode Figure 10. Wave form of line inversion www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) Frame inversion mode Figure 11. Wave form of frame inversion www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Initialize sequence Please follow the sequence below after Power-On to set this device to initial condition. Power on ↓ STOP condition ↓ START condition ↓ Issue Slave address ↓ Execute Software Reset by ICSET command Each register value and DDRAM address is initialized to their default values. DDRAM data is random after power on. 1 2 3 4 5 6 7 8 9 Power on ↓ wait 100us ↓ Stop ↓ Start Slave address ↓ ICSET ↓ DISCTL ↓ EVRSET ↓ ADSET ↓ Display Data 11 12 13 14 Display Data ↓ Stop ↓ Start Slave address ↓ ICSET www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Descriptions VDD=0 to 5V (Tr=0.1ms) Initialize IC Stop condition 0 1 1 1 1 1 0 0 Start condition Issue slave address 1 1 1 1 0 * 1 * Software Reset 1 1 1 0 0 0 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Unnecessary when initial value setup (If you need to change the condition) Unnecessary when initial value setup (If you need to change the condition) RAM address set * * * * * * * * Address * * * * * * * * Address ……… 10 D7 D6 D5 D4 D3 D2 D1 D0 00h ……… ●Start sequence ○Start sequence example No. Input 22h Stop condition 0 1 1 1 1 1 0 0 Start condition Issue slave address 1 1 1 1 0 * 0 1 Display ON 15/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Caution in P.O.R circuit use This device has “P.O.R.” (Power-On Reset) circuit and Software Reset function. Please keep the following recommended Power-On conditions in order to power up properly. Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P.O.R. operation VDD tF tR tOFF Recommended condition of tR, tF, tOFF, Vbot (Ta=25 ºC) tR tF tOFF Vbot Less than Less than More than Less than 5ms 5ms 20ms 0.3V Vbot Figure 12. Power ON/OFF waveform If it is difficult to meet above conditions, execute the following sequence after Power-On. (1) STOP condition VDD SDA SCL STOP condition Figure 13. STOP condition (2) START condition. (3) Issue Slave address. (4) Execute Software Reset (ICSET) command. ●Power Up Sequence and Power Down Sequence To prevent incorrect display, malfunction and abnormal current, VDD must be turned on before VLCD In power up sequence. VDD must be turned off after VLCD In power down sequence. Please satisfies VLCD≥VDD, t1>0ns, t2>0ns t1 VLCD VDD 10% www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10% VDD min VDD min Figure 14. t2 Power On/Off Sequence 16/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Note on the number of LSIs being connected to the same bus. Do not access the other device without power supply (VDD) to the BU97950. BU97950 Controller Device1 Figure 15. Example of BUS connection To control the slope of the falling edge, a capacitor is connected between gate and drain of a NMOS transistor (Refer to Figure16). The gate is in a high-impedance state if the power supply (VDD) is not supplied. In this condition, the gate voltage is pulled up by the current flow through the capacitance as a result of the SDA signal's transition from LOW to HIGH. The NMOS transistor turns on and draws some current (Ids) from the SDA port if the gate voltage (Vg) is higher than the threshold voltage (Vth). An external resistor (R) is connected between the power line and SDA line to keep the SDA line as logic HIGH. But the line cannot be kept as logic HGH if the voltage drop (R*Ids) is large. Access the other LSIs with power supply to BU9792x to control the gate voltage as logic level of 1 or 0 if the number of LSIs are connected to the same bus. Z=1/jω C VDD SDA internal circuit Vg Figure 16. SDA output cell structure www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Operational Notes (1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. (2) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC‟s power supply terminals. (4) Power supply lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (5) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. (7) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. (8) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC‟s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. (9) Regarding input pins of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this IC. (10) GND wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. (11) External Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. (12) Unused input terminals Input terminals of an IC are often connected to the gate of a CMOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or ground line. (13) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Ordering Information B U 9 7 9 5 Part Number 0 x x x Package FUV : TSSOP-C48V - xx Packaging and forming specification E2: Embossed tape and reel (TSSOP-C48V) ●Lineup Package TSSOP-C48V Reel of 2000 Orderable Part Number BU97950FUV-E2 ●Marking Diagrams TSSOP-C48V(TOP VIEW) Part Number Marking BU97950 LOT Number 1PIN MARK www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-C48V 20/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 BU97950FUV MAX 280 segments (SEG35×COM8) ●Revision History Date Revision 14.Mar.2012 001 Changes 8.Jan.2013 002 22.Apr.2013 003 Delete BU97950KS2 8.Sep.2015 004 Add Power Up Sequence and Power Down Sequence in page 16. Changed figure number of Example of BUS connection in page 17. Changed figure number of SDA output cell structure in page 17. New Release Improved the statement in all pages. Deleted “Status of this document” in page 20. Changed format of Physical Dimension, Tape and Reel Information. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/21 TSZ02201-0A0A2D300090-1-2 08.Sep.2015 Rev.004 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU97950FUV - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU97950FUV TSSOP-C48V 2000 2000 Taping inquiry Yes