Holt HI-4853 Process control and factory automation Datasheet

High-Speed 3.0V to 5.5V,Slew-Rate Controlled RS-485/422
Transceivers with Extended Common-Mode Range
February 2013
GENERAL DESCRIPTION
The HI-485x devices are high-speed slew-rated controlled TIA-485/
TIA-422-B and ISO 8482:1993 compliant transceivers with
extended receiver common-mode range for avionic and industrial
control applications. The devices can operate over an extended
supply (3.0V to 5.5V) and temperature (-55˚C to 125˚C) range. The
receiver input common-mode range of [-15, 20]V and ±24V for the
half and full duplex configurations respectively, is valid over the full
supply and temperature specification. The HI-4853 has a halfduplex configuration, and the HI-4854 and HI-4855 are full-duplex.
Slew rates are optimized for data rates below 25Mbps. The drivers
slew-rate control and pre-emphasis reduces high-frequency
components in the output signal transitions and also compensates
for impedance mismatch. These features provide optimum EMI and
jitter performance, essential in EMI sensitive environments and
high-integrity data link applications such as in aerospace and
industrial controls.
FEATURES
Slew Rate Control and Pre-Emphasis for superior EMI
Extended Power Supply Operating Range 3.0V to 5.5V
Extended Receiver Common-Mode Range:
-15.0V to 20.0V Half-Duplex
±24V Full-Duplex
ESD Protection
±16KV HBM (Bus Pins)
±8KV HBM (Logic Pins)
20 Mbps Data Rate up to 100 ft. CAT-5 UTP
12 Mbps Data Rate up to 1000 ft. CAT-5 UTP
Current Limiting Protection
Extended Temperature Range -55°C to 125°C
Industry Standard 75176 Pin-out
PIN CONFIGURATIONS (Top Views)
8 - VDD
RO - 1
The devices deliver at least ± 1.50V (VDD=3.0V), and ± 2.45V
(VDD= 4.5V) output levels at an extended temperature range of
-55°C to +125°C into a differential load of 54Ω and 50pF.
RE - 2
7-B
HI-4853PSx
DE - 3
6-A
DI - 4
The receiver offers true Fail-Safe operation, providing a
guaranteed logic high on RO when the bus is open-circuit, shortcircuit, or idle (terminated but not driven). The receiver’s worst
case minimum input resistance is at least 90KΩ, supporting up to
224 nodes.
5 - GND
VDD - 1
8-A
RO - 2
7-B
HI-4854PSx
DI - 3
6-Z
GND - 4
5-Y
654 VDD
3-
8-Pin Plastic SOIC package (Narrow Body)
APPLICATIONS
Extended Temperature Range RS-485/422 Networks
Process Control and Factory Automation
EMI Emission Sensitive Avionics
Industrial Field Bus Networks
Networks requiring extended common-mode range
Miniature Munitions Stores Interface (MMSI / EBR-1553)
Device Selection Table
Part
Half/Full
Number Duplex
Package
Half
≤ 20.0
8-pin SOIC
HI-4854
Full
≤ 20.0
8-pin SOIC
Full
≤ 20.0
12 A
11 B
10 Z
9 Y
HI-4855PCx
Data Rate
(Mbps)*
HI-4853
HI-4855
1
2
3
4
-5
GND 6
GND 7
-8
RO
RE
DE
DI
14-pin SOIC
16-pin QFN
* For RS-485 Transceivers optimized for data rates up
to 5Mbps please refer to the HI-4850 data sheet.
16- pin 4mm x 4mm Chip-scale package
- 1
14 VDD
RO 2
13 -
RE 3
12 A
DE 4
HI-4855PSx
11 B
DI 5
10 Z
GND 6
9 Y
GND 7
8
-
14-Pin Plastic SOIC package (Narrow Body)
(DS4853 Rev. C)
HOLT INTEGRATED CIRCUITS
www.holtic.com
02/13
HI-4853
PIN DESCRIPTIONS
SIGNAL
FUNCTION
DESCRIPTION
Receiver Output. If VID ≥ -50mV, then RO is high. If VID < -150mV then RO is low. If the
bus is shorted, open or terminated but not driven by another terminal, RO will be high.
__
__
Receiver Enable. RE= Low enables the receiver. RE High forces the receiver output
(RO) into a high impedance state. Internal 450KΩ pull-down resistor
RO
OUTPUT
__
RE
INPUT
DE
INPUT
DI
INPUT
GND
A, Y
B, Z
POWER
ANALOG I/O
ANALOG I/O
POWER
VDD
Driver Enable. DE = high enables the driver. DE = low will force the driver
__output into
a high impedance state and the device will function as a line receiver if RE is also low.
Internal 450KΩ pull-up resistor
Driver Input. Forces the logic state of the Driver’s output, if Driver is enabled. Internal
450KΩ pull-up resistor
Chip ground, 0V Supply
Non-inverting Receiver Input / Driver Output.
Inverting Receiver Input / Driver Output.
Positive Supply: 3.0V ≤ VDD ≤ 5.5V
RX FUNCTION TABLE
TX FUNCTION TABLE
TRANSMITTING
INPUTS
RE DE DI
1
1
X
1
X
0
0
0
X
1
0
X
LINE
CONDITION
Transmit logic high
Transmit logic low
Disable
Shutdown
RECEIVING
OUTPUTS
B
A
0
1
1
0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
INPUTS
__
RE DE
0
0
0
X
0
X
0
0
0
0
1
1
1
0
Typical Operating Circuit
RO
RX
VDD
DI
RX
X
1
0
1
1
Hi-Z
Hi-Z
RO
RE
A
GND
GND
A
HI-4853
X
X
OUTPUT
OPERATION
RO
RT
A
TX
-50mV ≤ VID
VID ≤ -150mV
Open or Shorted
Idle and terminated
B
RT
DE
-150mV < VID < -50mV
VDD
B
RE
BUS PINS
VID = VA - VB
B
HI-4853
B
DE
TX
DI
A
HI-4853
HI-4853
Short unterminated stubs
Figure 1 - Typical half-duplex configuration
A
VDD
RT
RX
RO
DI
RT
Z
Z
B
RT
Y
GND
TX
B
TX
GND
Y
RT
DI
RO
RX
A
VDD
HI-4854
HI-4854
Figure 2 - Typical full-duplex 8-pin configuration
HOLT INTEGRATED CIRCUITS
2
Undefined Input
Receiver logic high
Receiver logic low
Default
Default
Disabled
Shutdown
HI-4853
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND = 0V)
Supply Voltage, VDD:...............................................................................7 V
Control Input Currents: ...................................................-100mA to 100mA
Control Input Voltages:..................................................-0.5V
to VDD + 0.5V
__
-0.5V to VDD + 0.5V
Digital Input Voltages (DI, DE, RE):.................................
Bus Voltage (AY, BZ):............................................................................±25V
Digital Output Voltage (RO):............................................... -0.5V to V + 0.5V
Short-Circuit Duration, Driver (V: ±15V).....................................................∞
ESD (Human Body Model):
AY, BZ,VDD,GND
pins:.......................................................±16KV
__
DI, DE, RE, RO pins:.............................................................±8KV
Operating Temperature Range:(Industrial).........................-40°C to +85°C
(Hi-Temp)........................-55°C to +125°C
Internal Power Dissipation:..............................................................900mW
Storage Temperature Range: .........................................-65°C to +150°C
Solder Temperature:
(Reflow)............................................260°C
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
SPECIFIED OPERATING CONDITIONS
PARAMETERS
SYMBOL
LIMITS
CONDITIONS
MIN
VDD
Supply Voltage
Temperature
TX Common-Mode Bus Loading
RX Input Common-Mode Voltage
Differential Load Resistance
Differential Load Capacitance
Digital Input High Voltage
Digital Input Low Voltage
Digital Input Current high
Digital Input Pull-Down Current
Digital Input Current low
Digital Input Pull-Up Current
VICM
RL
CL
VIH
VIL
IIH
IPD
IIL
IPU
See Figure 4
Half-Duplex
V
˚C
-7
12
V
-16
20
V
∞
Ω
pF
%VDD
30
1
%VDD
μA
μA
3.3 / 5.0
54
__
DE, DI, RE
__
DE, DI, RE
DE,
__DI, VIH = VDD
RE,
__ VIH = VDD
RE, VIH = 0
DE, DI, VIH = 0V
UNIT
MAX
5.5
125
3.0
-55
T
VOCM
TYP
60
100
70
6
18
μA
-1
-18
-6
μA
DRIVER DC ELECTRICAL CHARACTERISTICS
VDD = 3.0V to 3.6V or 4.5V to 5.5V; T = -55˚C to 125˚C; MIN and MAX values are at range boundaries
PARAMETER
Differential Output Voltage with
no load
Differential Output Voltage into load
with no common-mode voltage
Differential Output Voltage into load
with applied common-mode voltage
Differential Output Over/Under Shoot
Change in Differential Output
Voltage between logic states
Output Common-Mode Voltage
Change in output Common-Mode
Voltage between logic states
Bus Pin Leakage Current
(High-Z Power On)
Bus Pin Leakage Current (Power Off)
SYMBOL
CONDITIONS
FIGURE
|VOD1|
RL = ∞
3
|VOD2|
RL = 54Ω, CL = 50pF
|VOD3|
-7V ≤ VOCM ≤ 12V
TA = 25ºC
VDD = 3.3V ± 10%
VDD = 5.0V ± 10%
MIN
VDD -0.1
VDD
VDD -0.1
VDD
V
3
1.5
3.0
2.45
4.0
V
4
1.5
3.0
2.45
4.0
V
3.2
%VOD
125
mV
3.0
V
TYP
TYP
UNIT
MAX
MIN
5.5
MAX
125
-125
2.0
2.15
-125
125
-150
150
mV
-200
200
-200
200
μA
IOHZ2
DE=0, -15V≤ VOCM ≤ 15V
DE=0, -12V≤ VOCM ≤ 15V
VOCM = ±15V
-200
200
-200
200
μA
ISCPK
DE = VDD, Bus Pin = ±15
-230
230
-250
250
mA
Steady State Short Circuit Current
ISC
DE = VDD, Bus Pin = ±15
0
50
0
50
μA
Differential Output Capacitance
COD
16
pF
Peak Short Circuit Current
∆VOD
RL = 54Ω, CL = 50pF
3
-125
VOCM
RL = 54Ω, CL = 50pF
4
1.40
∆VOCM
RL = 54Ω, CL = 50pF
4
IOHZ1
1.60
DE = 0
16
Static Supply Current
IDD
DE=VDD, RE=0, RL=∞
8
Supply Current (Shutdown)
IDDQ
DE=0, RE=VDD, RL=∞
90
HOLT INTEGRATED CIRCUITS
3
2.45
10
10
12
mA
110
125
400
μA
HI-4853
HI-4850
DRIVER SWITCHING CHARACTERISTICS
VDD = 3.0V - 3.6V or 4.5V - 5.5V as noted , Operating temperature range.
PARAMETER
VDD = 3.3V ± 10%
VDD = 5.0V ± 10%
MIN
TYP
MAX
MIN
TYP
MAX
5&6
110
17
145
26
33
200
16
108
24
150
30
205
ns
5&6
110
17
145
26
200
33
108
16
24
150
30
205
ns
120
15
115
8
11
135
16
155
ns
15
120
8
115
11
135
16
125
ns
8
2
8
ns
95
120
90
117
ns
7
95
120
90
117
ns
RL = 500, CL=50pF
7
20
33
18
30
ns
tLZ
RL = 500, CL=50pF
7
20
33
18
30
ns
tON
RL = 500, CL=50pF
7
10
10
µs
8
10
10
µs
SYMBOL
CONDITIONS
FIGURE
Propagation Delay Low - to - High
tPDR
RL = 54. CL=50pF
Propagation Delay High - to - Low
tPDF
RL = 54, CL=50pF
Differential Rise Time
tr
RL = 54, CL=50pF
5&6
90
9
105
12
Differential Fall Time
tf
RL = 54, CL=50pF
5&6
9
90
12
105
Output Pulse Skew
tMSK
RL = 54, CL=50pF
5&6
2
Driver Enable to Output High
tZH
RL = 500, CL=50pF
7
Driver Enable to output Low
tZL
RL = 500, CL=50pF
Driver Disable from Output High
tHZ
Driver Disable from Output Low
Shutdown to Active Output Delay
Shutdown Delay
tOFF
UNIT
RECEIVER DC ELECTRICAL CHARACTERISTICS
VDD = 3.0V - 3.6V or 4.5V - 5.5V as noted , Operating temperature range.
PARAMETER
SYMBOL
Differential Input Threshold Voltage
VTH
Input Hysteresis
VHYS
Input Resistance
RIN
RO Output High Level
VOH
RO Output Low Level
VOL
RO Output Hi-Z Leakage Current
IOZH
CONDITIONS
FIGURE
-15V ≤ VICM ≤ +15V≤
-15 ≤ VICM ≤ +20
-12V ≤ VICM ≤ +15V≤
VICM = 0V
≤ +15V≤
VDD-20V
VICM
-15 ≤ ≤
VICM
≤ +20
-12V ≤ VICM ≤ +15V≤
VID
= +200mV
+200mV
ICM=
V
IIOUT
=-3.0mA
-5.0mA
OUT =
VID
-200mV
V
ICM==-200mV
IIOUT
= 5.0mA
OUT = +3.0mA
VDD = 3.3V ± 10%
VDD = 5.0V ± 10%
MIN
TYP
MAX
MIN
TYP
MAX
-200
-100
-50
-200
-100
-50
mV
mV
17
20
28
25
33
30
17
20
28
25
33
30
mV
80
92
80
92
90%
K
K
90%
VDD
10%
0V ≤ VRO ≤ VDD ≤
-1
1
UNIT
-1
10%
VDD
1
µA
RECEIVER SWITCHING CHARACTERISTICS
VDD = 3.0V - 3.6V or 4.5V - 5.5V as noted , Operating temperature range.
PARAMETER
SYMBOL
CONDITIONS
FIGURE
Propagation Delay Low - to - High
tRPDR
VID = +1.5V, CL=15pF
9
8
Propagation Delay High - to - Low
VDD = 3.3V ± 10%
VDD = 5.0V ± 10%
MIN
TYP
MAX
MIN
TYP
MAX
20
26
32
20
26
32
ns
UNIT
tRPDF
VID = -1.5V, CL=15pF
98
20
26
32
20
26
32
ns
RO Output Rise Time
tRr
VID = +1.5V, CL=15pF
9
8
1.1
1.9
3.3
1.1
1.9
3.3
ns
RO Output Fall Time
Output Pulse Skew
tRf
8
9
9
8
1.1
1.9
0.8
3.3
1.6
1.1
tRMSK
VID = -1.5V, CL=15pF
VID = +1.5V, CL=15pF
1.9
0.8
3.3
1.6
ns
ns
Receiver Enable to RO Output High
tRZH
RL = 1K, CL =15pF
7
9
12
16
12
16
ns
Receiver Enable to output Low
tRZL
RL = 1K, CL =15pF
7
9
12
16
12
16
ns
Receiver Disable from Output High
tRHZ
RL = 1K, CL=15pF
7
9
6
10
6
10
ns
Receiver Disable from Output Low
tRLZ
RL = 1K, CL =15pF
97
6
10
6
10
ns
Shutdown to RO Active Output Delay
tRON
RL = 1K, CL =15pF
7
9
5
µs
Shutdown Delay to RO HiZ
tROFF
RL = 1K, CL =15pF
9
7
60
100
60
100
ns
HOLT INTEGRATED
INTEGRATED CIRCUITS
CIRCUITS
4
5
HI-4853
TEST CIRCUITS
DE
+
AY
DI
|VOD|
TX
54Ω
50pF
BZ
Figure 3 - Driver DC Characteristics ( VOD1, VOD2, and ∆VOD)
DE
DE
+
AY
DI
|VOD3|
TX
+
27Ω
50pF
BZ
AY
VOCM
DI
|VOD3|
TX
60Ω
BZ
27Ω
-
375Ω
375Ω
-
Figure 4 - Driver DC Characteristics with and without Common-Mode Loading ( VOCM, VOD3, and ∆VOD)
DE
12Mbps
1Mpbs
DI
AY
TX
50pF
54Ω
BZ
Figure 5 - Driver Switching Characteristics (tPDR, tPDF, tr and tf)
VDD
DI
1.5V
1.5V
0V
t PDR
1/2V O
t PDF
BZ
VO
AY
1/2V O
t MSK
VO
VOD =
V(AY) - V(BZ)
90%
t MSK
90%
0V
-VO
10%
tr
Figure 6. Driver Switching Waveforms
HOLT INTEGRATED CIRCUITS
5
10%
tf
VOCM
HI-4853
HI-4850
1MHz
12Mbps

DE
GND / VDD
DI
AY
50pF
BZ
50pF
VDD / GND
TX

GND / V DD
VDD
DE
50%
50%
0V
t ZL
t LZ
VDD
AY, BZ
VDD /2
OUTPUT NORMALLY LOW
VDD /2
OUTPUT NORMALLY HIGH
0.5V
V OL
V OH
AY, BZ
0.5V
0V
t ZH
t HZ
Figure7.8. Driver Enable / Disable Switching
Figure
1Mbps
12Mbps
RE
AY
RX
RO
15pF
BZ
V OD2
0V
AY - BZ
0V
INPUT
-V OD2
t PHL
t PLH
V OH
VDD/2
RO
V OL
VDD/2
OUTPUT
Figure
Figure8.
9. Receiver Propagation Delays
1MHz
12Mbps
+200 mV / -200 mV
RE
AY
RX
BZ
RO

VDD / GND
15pF
3V
RE
1.5V
1.5V
0V
t ZL
t LZ
5V
RO
2.5V
OUTPUT NORMALLY LOW
0.5V
2.5V
OUTPUT NORMALLY HIGH
0.5V
V OL
V OH
RO
0V
t ZH
t HZ
Figure 10.
9. Receiver Enable and Disable Times
HOLT INTEGRATED CIRCUITS
6
HI-4853
EXTENED COMMON-MODE PERFORMANCE CHARACTERISITICS
RX Extended Common-Mode Range:
Typical Supply, Maximum (-) Common-Mode
VDD = 3.3V
Tbit = 50ns
TA = 27˚C
RX Extended Common-Mode Range:
Typical Supply, Maximum (+) Common-Mode
B
B
A
A
VDD = 5.0V
Tbit = 50ns
TA = 27˚C
A-B
A-B
Input CM = +21V
Input CM = -16V
RO
20Mbps
20Mbps
RO
RX Extended Common-Mode Range:
Maximum Supply, Maximum (-) Common-Mode
RX Extended Common-Mode Range:
Maximum Supply, Maximum (+) Common-Mode
A
A
B
B
A-B
A-B
VDD = 5.5V
Tbit = 50ns
TA = 27˚C
VDD = 5.5V
Tbit = 50ns
TA = 27˚C
RO
20Mbps
RO
Input CM = +21V
Input CM = -15V
RX Extended Common-Mode Range:
Minimum Supply, Maximum (-) Common-Mode
VDD = 3.0V
Tbit = 100ns
TA = 27˚C
RX Extended Common-Mode Range:
Minimum Supply, Maximum (+) Common-Mode
A
A
B
B
A-B
A-B
RO
Input CM = -16V
VDD = 3.0V
Tbit = 100ns
TA = 27˚C
Input CM = +22V
RO
HOLT INTEGRATED CIRCUITS
7
HI-4853
High-Speed Performance Characteristics Over Distance
10Mbps Data Pulse Over 1000ft 2 CAT-5 UTP
12Mbps Data Pulse Over 1000ft 2 CAT-5 UTP
2V/DIV
2V/DIV
VDD = 3.0V
fdata = 10Mbps
TA = 27˚C
DITX
DITX
BTX
BTX
ATX
ATX
100ns/DIV
100ns/DIV
RORX
RORX
VDD = 3.0V
fdata = 12Mbps
TA = 27˚C
20Mbps Data Pulse Over 1000ft 2 CAT-5 UTP
2V/DIV
DITX
BTX
ATX
VDD = 3.0V
fdata = 20Mbps
TA = 27˚C
100ns/DIV
RORX
20Mbps Data Over 250ft CAT-5 UTP
20Mbps Data Over 250ft CAT-5 UTP
DITX
2V/DIV
2V/DIV
BTX
BTX
VDD = 3.0V
fdata = 20Mbps
TA = 27˚C
ATX
50ns/DIV
VDD = 3.0V
fdata = 20Mbps
TA = 27˚C
RORX
HOLT INTEGRATED CIRCUITS
8
ATX
50ns/DIV
RORX
HI-4853
PERFORMANCE CHARACTERISTICS OVER SUPPLY AND TEMPERATURE
TX Differential Rise/Fall Time vs. Temperature
13
VDD = 5.5V
12
Tbit = 100ns
RL = 54Ω
CL = 50pF
11
VDD = 3.0V
10
9
-55
-30
-5
20
45
70
TX Differential Rise/Fall Time vs. Temperature
TX Propagation Delay (ns)
TX Rise/Fall Time (ns)
14
95
74
69
VDD = 5.5V
64
Tbit = 100ns
RL = 54Ω
CL = 50pF
59
VDD = 3.0V
54
49
-55
120
-30
-5
20
45
70
95
120
TEMPERATURE (˚C)
TEMPERATURE (˚C)
TX Propagation Delay (ns)
TX Differential Zero To Peak Amplitude
3.5
VDD = 5.5V
3
Tbit = 100ns
RL = 54Ω
CL = 50pF
2.5
2
VDD = 3.0V
1.5
-55
-30
-5
20
45
70
95
120
TEMPERATURE (˚C)
RX Propagation Delay vs. Common-Mode
RX Propagation Delay (ns)
RX Propagation Delay (ns)
RX Propagation Delay vs. Temperature
60
55
50
VDD = 3.0V
45
40
Tbit = 100ns
CL = 15pF
VDD = 5.5V
35
30
-55
-30
-5
20
45
70
TEMPERATURE (˚C)
95
120
49
48
47
46
45
Tbit = 100ns
VDD = 3.3V
T = 27˚C
CL = 14pF
44
43
42
41
-15
-10
-5
0
5
10
Input Common-Mode (V)
HOLT INTEGRATED CIRCUITS
9
15
20
HI-4853
TYPICAL TRANSCEIVER PERFORMANCE CHARACTERISITICS
Typical 20Mb/s Operation: RL = 54Ω; CL = 50pF
Typical 10Mb/s Operation: RL = 54Ω; CL = 50pF
Single 4853 Device
Single 4853 Device
DI
DI
B
B
A
A
2V/DIV
VDD = 3.3V
fdata = 10Mbps
TA = 27˚C
2V/DIV
VDD = 3.3V
fdata = 20Mbps
TA = 27˚C
100ns/DIV
50ns/DIV
RO
RO
Typical 10Mb/s Operation: RL = 54Ω; CL = 50pF
Typical 20Mb/s Operation: RL = 54Ω; CL = 50pF
Single 4853 Device
VDD = 5.0V
fdata = 10Mbps
TA = 27˚C
Single 4853 Device
DI
DI
B
B
A
A
5V/DIV
100ns/DIV
VDD = 5.0V
fdata = 20Mbps
TA = 27˚C
RO
5V/DIV
50ns/DIV
RO
RX Output Jitter Over CM and Input Amplitude (3.0V)
0.6
0.45
Timing Jitter: 0.5UI = 50nsPK-PK
Resulting in a 5% Duty Error
0.5
0.4
VCM
=
0.3
VCM
= 0V
0.2
VCM
=
RX Output Jitter (UI)
RX Output Jitter (UI)
RX Output Jitter Over CM and Input Amplitude (5.5V)
+20V
-15V
0.1
Timing Jitter: 0.5UI = 50nsPK-PK
Resulting in a 5% Duty Error
0.4
0.35
0.3
VCM
0.25
=
+20V
0.2
VCM = 0V
VCM = -15V
0.15
0.1
0.05
0
0
0.1
0.6
1.1
1.6
2.1
Input Signal Amplitude (V)
2.6
0.1
HOLT INTEGRATED CIRCUITS
10
0.6
1.1
1.6
2.1
Input Signal Amplitude (V)
2.6
HI-4853
HI-4850
ORDERING INFORMATION
HI-485x xx x x
LEAD
FINISH
Blank
F
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
I
-40°C TO +85°C
I
NO
T
-55°C TO +125°C
T
NO
M
-55°C TO +125°C
M
YES
PC
16 PIN PLASTIC 4 x 4 mm CHIP SCALE (16PCS) (HI-4855 only. No M-flow)
PS
8 PIN PLASTIC NARROW BODY SOIC (8HN) (HI-4853, HI-4854)
PS
14 PIN PLASTIC NARROW BODY SOIC (14HN) (HI-4855 only)
CR
8 PIN CERDIP
(8D) not available Pb-free (HI-4853, HI-4854)
4853
HALF DUPLEX TRANSCEIVER
4854
FULL DUPLEX TRANCEIVER ALWAYS ENABLED
4855
FULL DUPLEX TRANSCEIVER WITH ENABLE PINS
HOLT INTEGRATED CIRCUITS
11
7
HI-4853
REVISION HISTORY
Revision
DS4853, Rev New
Date
Description of Change
03/30/2012
Initial Release
Rev. A
05/21/2012
Fix typos on package ordering information
Rev. B
08/2/2012
Updated Rx Function Table rows 2 and 3 on p. 2 for DE = X. Updated
package drawings for SOIC-8 (8HN), QFN-16 (16PCS) and SOIC-14
(14HN) packages.
02/25/2013
Correct typo on nRE pull-up resistor (should be pull-down).
Update Digital Input pull-up/pull-down current.
Update typo in Figure 4 resistors.
Update solder temperature (reflow) in Max. Ratings
Rev. C
HOLT INTEGRATED CIRCUITS
12
HI-4853 PACKAGE DIMENSIONS
8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
inches (millimeters)
Package Type: 8HN
.193
BSC
(4.90)
.007 ± .003
(.175 ± .075)
.236 BSC
(6.00)
PIN 1
.154
BSC
(3.90)
See Detail A
.016 ± .004
(.410 ± .100)
.056 ± .006
(1.413 ± .163)
0 to 8 
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. J( EDEC Standard 95)
.050 BSC
(1.27)
.007 ± .003
(.175 ± .075)
.033 ± .017
(.835 ± .435)
Detail A
16-PIN PLASTIC CHIP-SCALE PACKAGE
.157
(4.000) BSC
.157
(4.000) BSC
inches (millimeters)
Package Type: 16PCS
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.102 ± .002
(2.600 ± .050)
Bottom
View
.102 ± .002
(2.600 ± .050)
Top View
.016 ± .002
(.400 ± .050)
.039
max.
(1.000)
.008
(.200) typ.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. J( EDEC Standard 95)
HOLT INTEGRATED CIRCUITS
8
13
.026
(.650) BSC
.012 ± .002
(.300 ± .050)
HI-4853 PACKAGE DIMENSIONS
14-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
Package Type: 14HN
.007 ± .003
(.175 ± .075)
.341
(8.65) BSC
.236 BSC
(5.99)
inches (millimeters)
.154
(3.90) BSC
Top View
See Detail A
.016 ± .004
(.410 ± .100)
.069
(1.750) max.
.050 BSC
(1.27)
0  to 8 
.033 ± .017
(.835 ± .435)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. J( EDEC Standard 95)
.007 ± .003
(.175 ± .075)
Detail A
8-PIN CERDIP
inches (millimeters)
Package Type: 8D
.380 .004
(9.652 .102)
.005 min
(.127 min)
.248 .003
(6.299 .076)
.039 .006
(.991 .154)
.100
BSC
(2.54)
.015 min
(.381min)
.200 max
(5.080 max)
.314 .003
(7.976 .076)
Base Plane
.010 .006
(.254 .152)
Seating Plane
.163 .037
(4.140 .940)
.056 .006
(1.422 .152)
.018
(.457
.006
.152)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. ( JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
149
.350 .030
(8.890 .762)