MCC MCL4448-TP 500mw 100 volt silicon epitaxial diode Datasheet

MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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$ % !"#
MCL4448
Features
•
•
•
•
•
Silicon epitaxial planar diode
Fast Switching diodes
500mW power dissipation
This diode is also available in the DO-35 case with the type
designation 1N4448, in the Minimelf case with the type designation
DL4448
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
500mW 100 Volt
Silicon Epitaxial Diode
Maximum Ratings
•
•
•
•
•
MICROMELF
O
O
Operating Temperature: -55 C to +150 C
Storage Temperature: -55OC to +150 OC
Maximum Thermal Resistance; 350K/W Junction To Ambient
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Cathode Mark
Electrical Characteristics @ 25OC Unless Otherwise Specified
Reverse Voltage
Peak Reverse
Voltage
Average Rectified
Current
Power Dissipation
Junction Temperature
Surge Forward
Current
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Minimum Reverse
Breakdown Voltage
Typical Junction
Capacitance
VR
75V
VRM
100V
IAV
150mA
PTOT
TJ
500mW1)
150OC
IFSM
500mA
VF
IR
C
A
t<1S, TJ=25OC
1.0V(MAX) IFM = 100mA;
0.62-0.72V I FM = 5.0mA
25nA
5.0uA
50uA
TJ=25OC, VR=20V
VR=75V,
VR=20V TJ=150 OC
Tested with
100uA puse
Measured at
CJ
4.0pF
VR=VF=0V
IF=10mA,
Reverse Recovery
VR = 6.0V
4.0nS
Trr
Time
RL=100OHMS
1) Valid provided that leads at a distance of 8mm from case are kept
at ambient temperature(DO-35)
V(BR)R
B
Resistive Load
f > 50Hz
TA=25OC
100V
DIMENSIONS
DIM
A
B
C
INCHES
MIN
.071
.004
.047
MM
MIN
1.8
.10
1.20
MAX
.079
.008
.051
MAX
2.0
.20
1.30
NOTE
∅
SUGGESTED SOLDER
PAD LAYOUT
Note: 1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
0.039
0.055”
0.030”
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Revision: A
2011/01/01
MCC
MCL4448
Figure 1
Typical Forward Characteristics
TM
Micro Commercial Components
200
Figure 2
Forward Derating Curve
100
600
60
40
500
20
400
MilliAmps 10
6
300
MilliWatts
4
200
2
25°C
100
1
Single Phase, Half Wave
60Hz Resistive or Inductive Load
.6
0
.4
0
50
75
100
125
150
175
°C
.2
.1
.4
.6
.8
1.0
1.2
Admissable Power Dissipation - MilliWattsversus
Ambient Temperature - °C
1.4
Volts
Instantaneous Forward Current - Amperesversus
Instantaneous Forward Voltage - Volts
Figure 3
Junction Capacitance
10
6
4
2
pF
TJ=25°C
1
.6
.4
.2
.1
.1
.2
.4
1
Volts
2
4
10
20
40
100
200
400
1000
Junction Capacitance - pFversus
Reverse Voltage - Volts
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Revision: A
2011/01/01
MCC
MCL4448
Figure 4
Typical Reverse Characteristics
Micro Commercial Components
Figure 5
Peak Forward Surge Current
600
1000
600
400
500
200
400
100
300
60
MilliAmps
40
200
100
20
0
10
NanoAmps
6
1
2
4
6
8 10
20
40
60 80 100
Cycles
4
Peak Forward Surge Current - Amperesversus
Number Of Cycles At 60Hz - Cycles
2
1
TA=25°C
.6
TA=100°C
.4
.2
.1
20
40
60
80
100
120
140
TJ
Instantaneous Reverse Leakage Current - NanoAmperesversus
Junction Temperature - °C
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Revision: A
2011/01/01
TM
MCC
TM
Micro Commercial Components
Ordering Information :
Device
Packing
Part Number-TP
Tape&Reel: 2.5Kpcs/Reel
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Revision: A
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2011/01/01
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