MP02 XXX 190 Series MP02 XXX 190 Series Phase Control Dual SCR, SCR/Diode Modules Replaces December 1998 version, DS4479-3.0 DS4479-4.0 January 2000 FEATURES KEY PARAMETERS VDRM ITSM IT(AV)(per arm) Visol ■ Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint 1400V 6800A 190A 2500V CIRCUIT OPTIONS ■ Alumina (non-toxic) Isolation Medium Code Circuit HBT APPLICATIONS ■ Motor Control ■ Controlled Rectifier Bridges HBP ■ Heater Control ■ AC Phase Control HBN VOLTAGE RATINGS Type Number MP02/190-14 MP02/190-12 MP02/190/10 Repetitive Peak Voltages VDRM VRRM 1400 1200 1000 PACKAGE OUTLINE Conditions Tvj = 125oC IDRM = IRRM = 30mA 1 2 3 VDSM & VRSM = VDRM & VRRM + 100V respectively Lower voltage grades available. For full description of part number see "Ordering Instructions" on page 3. Module type code: MP02. See Package Details for further information CURRENT RATINGS - PER ARM Parameter Symbol IT(AV) IT(RMS) Mean on-state current RMS value Conditions Halfwave, resistive load Tcase = 75oC Max. Units Tcase = 75oC 190 A Tcase = 85oC 160 A Theatsink = 75oC 150 A Theatsink = 85oC 125 A 300 A 1/10 MP02 XXX 190 Series SURGE RATINGS - PER ARM Parameter Symbol ITSM I 2t Surge (non-repetitive) on-state current 2 I t for fusing Max. Units 10ms half sine; VR = 0 Tj = 125oC VR = 50% VRRM 6800 A 5500 A 10ms half sine; VR = 0 Tj = 125oC VR = 50% VRRM 231000 A2s 150000 A 2s Max. Units dc 0.17 o C/W halfwave 0.18 o C/W 3 phase 0.19 o C/W Mounting torque = 6Nm with mounting compound 0.07 o Conditions THERMAL & MECHANICAL RATINGS Symbol Rth(j-c) Parameter Thermal resistance - junction to case per Thyristor or Diode Conditions Rth(c-hs) Thermal resistance - case to heatsink per Thyristor or Diode Tvj Virtual junction temperature 125 o C Tsto Storage temperature range -40 to 125 o C Visol Isolation voltage Commoned terminals to base plate AC RMS, 1min, 50Hz C/W 2.5 kV Max. Units 1.75 V DYNAMIC CHARACTERISTICS Symbol Parameter Conditions On-state voltage At 1000A, Tcase = 25oC - See Note 1 Peak reverse and off-state current At VRRM/VDRM, Tj = 125oC 30 mA dV/dt Linear rate of rise of off-state voltage To 60% VDRM Tj = 125oC 200* V/µs dI/dt Rate of rise of on-state current From 67% VDRM to 400A Repetitive 50Hz Gate source 20V, 20Ω Rise time 0.5µs, Tj =125oC 100 A/µs VT(TO) Threshold voltage At Tvj = 125oC - See Note 1 1.05 V On-state slope resistance At Tvj = 125oC - See Note 1 0.80 mΩ VTM IRRM/IDRM rT * Higher dV/dt values available, contact factory for particular requirements. Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor. 2/10 MP02 XXX 190 Series GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol Parameter Conditions Typ. Max. Units VGT Gate trigger voltage VDRM = 5V, Tcase = 25oC, RL = 6Ω - 3.0 V IGT Gate trigger current VDRM = 5V, Tcase = 25oC, RL = 6Ω - 200 mA VGD Gate non-trigger voltage VDRM = 5V, Tcase = 25oC - 0.2 V VRGM Peak reverse gate voltage - 5.0 V IFGM Peak forward gate current - 4 A PGM Peak gate power - 16 W PG(AV) Mean gate power - 3 W Anode positive with respect to cathode ORDERING INSTRUCTIONS Part number is made up as follows: Examples: MP02 HBT 190 - 16 MP 02 HBT 175 16 = Pressure contact module = Outline type = Circuit configuration code (see "circuit options" - front page) = Nominal average current rating at Tcase = 75oC = VRRM/100 MP02 HBP190-14 MP02 HBN190-12 Note: Diode ratings and characteristics are comparable with SCR in types HBP or HBN. Types HBP or HBN can also be supplied with diode polarity reversed, to special order. MOUNTING RECOMMENDATIONS Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of VT(TO) and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. The heatsink surface must be smooth and flat; a surface finish of N6 (32µin) and a flatness within 0.05mm (0.002") are recommended. Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 6Nm (55lb.ins) is reached at both ends. It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module. 3/10 MP02 XXX 190 Series 2500 Instantaneous on-state current IT - (A) CURVES 2000 1500 Tj = 125˚C 1000 500 0 0 1.0 2.0 3.0 Instantaneous on-state voltage VT - (V) 4.0 Fig. 1 Maximum (limit) on-state characteristics (thyristor or diode) - See Note 1 100 Pulse Width µs Pulse Frequency Hz Table gives pulse power PGM in watts 100 50 400 75W 50W 20 25 100 10 500 1ms 10ms 100 100 100 100 50 - 100 100 100 100 100 10 100 100 100 25 - 10W 5W Tj = 25˚C Tj = 125˚C 1.0 9% t9 er i lim % t1 p Up r we i lim Lo VGD 0.1 0.001 0.01 0.1 Gate trigger current IGT - (A) Fig. 2 Gate trigger characteristics 4/10 100W Tj = -40˚C Gate trigger voltage VGT - (V) VFGM 1.0 10 IFGM MP02 XXX 190 Series 0.3 0.2 Rth(j-c) 0.1 0 0.001 0.010 0.100 1.0 10 100 Time - (s) Fig. 3 Transient thermal impedance (DC) - (Thyristor or diode) 20 15 180 I2t 10 140 5 0 100 10 1 ms 1 2 3 45 10 I2t value - A2s x 103 Peak half sine wave on-state current - (kA) Thermal Impedance - (˚C/W) Rth(j-hs) 60 20 30 50 cycles at 50Hz Duration Fig. 4 Surge (non-repetitive) on-state current vs time (with 50% VRRM, Tcase = 125˚C (Thyristor or diode) 5/10 On-state power loss per device - (W) MP02 XXX 190 Series 300 180˚ 120˚ 250 90˚ 200 60˚ 30˚ 150 100 50 0 0 50 100 150 200 Mean on-state current IT(AV) - (A) 250 Fig. 5 On-state power loss per arm vs forward current at various conduction angles, sine wave, 50/60Hz 400 On-state power loss per device - (W) d.c. 350 180˚ 300 120˚ 250 90˚ 60˚ 200 30˚ 150 100 50 0 0 50 100 150 200 Mean on-state current IT(AV) - (A) 250 300 Fig. 6 On-state power loss per arm vs forward current at various conduction angles, square wave, 50/60Hz 6/10 Maximum permissible case temperature - (˚C) MP02 XXX 190 Series 140 120 100 80 60 40 20 30˚ 0 0 50 60˚ 90˚ 120˚ 180˚ 100 150 200 Mean on-state curren IT(AV) - (A) 250 Maximum permissible case temperature - (˚C) Fig. 7 Maximum permissible case temperature vs forward current per arm at various conduction angles, sine wave, 50/60Hz 140 120 100 80 60 d.c. 40 20 30˚ 0 0 50 60˚ 90˚ 120˚ 100 150 200 Mean on-state current IT(AV) - (A) 180˚ 250 300 Fig. 8 Maximum permissible case temperature vs forward current per arm at various conduction angles, square wave, 50/60Hz 7/10 MP02 XXX 190 Series 1200 0.02 Rth(hs-a) ˚C/W R - Load Total power - (W) 1000 0.04 800 0.08 0.10 0.12 0.15 0.20 0.30 0.40 600 400 200 0 0 L - Load 20 40 60 80 100 120 140 Maximum ambient temperature - (˚C) 0 200 400 D.C. output current - (A) Fig. 9 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 1200 0.04 0.02 Rth(hs-a) ˚C/W Total power - (W) 1000 R & L- Load 800 0.08 600 0.10 0.12 0.15 400 0.20 200 0.30 0.40 0 0 20 40 60 80 100 120 140 Maximum ambient temperature - (˚C) 0 200 400 D.C. output current - (A) Fig. 9 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 8/10 MP02 XXX 190 Series PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 23 24 15 2 holes Ø6.5 K2 5 12.8 24 G2 34 23 13 K1 80 1 2 3 30 3x M6 G1 94 Nominal weight: 350g Recommended fixings for mounting: M6 socket head cap screws Recommended mounting torque: 6Nm (55lb.ins) Recommended torque for electrical connections: 5Nm (44lb.ins) Maximum torque for electrical connections: 8Nm (70lb.ins) Module outline type code: MP02 CIRCUIT CONFIGURATIONS G1K1 K2 G2 2 1 3 HBT G1K1 1 2 3 HBP K2 G2 1 2 3 HBN 9/10 MP02 XXX 190 Series ASSOCIATED PUBLICATIONS Title Application Note Number Calculating the junction temperature or power semiconductors AN4506 Recommendations for clamping power semiconductors AN4839 Thyristor and diode measurement with a multi-meter AN4853 Use of V , r on-state characteristic AN5001 TO T POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS4479-4 Issue No. 4.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 10/10