ON NCS20071XV53T2G Operational amplifier, railto- rail output Datasheet

NCS20071, NCV20071,
NCS20072, NCV20072,
NCS20074, NCV20074
Operational Amplifier, Railto-Rail Output, 3 MHz BW
The NCx2007x series operational amplifiers provide rail−to−rail
output operation, 3 MHz bandwidth, and are available in single, dual,
and quad configurations. Rail−to−rail operation enables the user to
make optimal use of the entire supply voltage range while taking
advantage of 3 MHz bandwidth. The NCx2007x can operate on supply
voltages as low as 2.7 V over the temperature range of −40°C to
125°C. At a 2.7 V supply, the high bandwidth provides a slew rate of
2.8 V/ms while only consuming 405 mA of quiescent current per
channel. The wide supply range allows the NCx2007x to run on
supply voltages as high as 36 V, making it ideal for a broad range of
applications. Since this is a CMOS device, high input impedance and
low bias currents make it ideal for interfacing to a wide variety of
signal sensors. The NCx2007x devices are available in a variety of
compact packages. Automotive qualified options are available under
the NCV prefix.
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5
1
TSOP−5
CASE 483
SOT−553
CASE 463B
8
1
Micro8]
CASE 846A
SOIC−8
CASE 751
Features
•
•
•
•
•
•
•
•
•
•
Rail−To−Rail Output
Wide Supply Range: 2.7 V to 36 V
Wide Bandwidth: 3 MHz typical at VS = 2.7 V
High Slew Rate: 2.8 V/ms typical at VS = 2.7 V
Low Supply Current: 405 mA per channel at VS = 2.7 V
Low Input Bias Current: 5 pA typical
Wide Temperature Range: −40°C to 125°C
Available in a variety of packages
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
14
1
TSSOP−14
CASE 948G
TSSOP−8
CASE 948S
14
1
SOIC−14 NB
CASE 751A
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 2 of this data sheet.
Applications
• Current Sensing
• Signal Conditioning
• Automotive
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
End Products
• Notebook Computers
• Portable Instruments
• Power Supplies
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. 11
1
Publication Order Number:
NCS20071/D
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
MARKING DIAGRAMS
Single Channel Configuration
NCS20071, NCV20071
5
XXXAYWG
G
XXMG
G
1
TSOP−5
CASE 483
SOT−553
CASE 463B
Dual Channel Configuration
NCS20072, NCV20072
8
8
K72
YWW
AG
G
NCS20072
ALYW
G
0072
AYWG
G
1
1
Micro8]
CASE 846A
SOIC−8
CASE 751
TSSOP−8
CASE 948S
Quad Channel Configuration
NCS20074, NCV20074
14
14
NCS2
0074
ALYWG
G
NCS20074G
AWLYWW
1
1
TSSOP−14
CASE 948G
XXXXX
A
WL, L
Y
WW, W
G or G
SOIC−14 NB
CASE 751A
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
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2
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
Single Channel Configuration
NCS20071, NCV20071
OUT
1
5
IN+
VDD
1
5
VDD
4
OUT
+
IN+
3
VSS
2
IN−
3
−
−
2
+
VSS
4
IN−
SOT23−5
(TSOP−5)
SOT553−5
Quadruple Channel Configuration
NCS20074, NCV20074
Dual Channel Configuration
NCS20072, NCV20072
OUT 1
1
IN− 1
2
−
IN+ 1
3
+
VSS
4
OUT 1 1
14 OUT 4
8
VDD
IN− 1 2
−
− 13 IN− 4
7
OUT 2
IN+ 1 3
+
+ 12 IN+ 4
−
6
IN− 2
+
5
IN+ 2
11 VSS
VDD 4
IN+ 2 5
+
+ 10 IN+ 3
IN− 2 6
−
−
OUT 2 7
Figure 1. Pin Connections
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3
9 IN− 3
8 OUT 3
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ORDERING INFORMATION
Device
Configuration
Automotive
NCS20071SN2T1G
(In Development)**
No
NCS20071XV53T2G
(In Development)**
NCV20071SN2T1G*
(In Development)**
Single
Yes
NCV20071XV53T2G*
(In Development)**
NCS20072DMR2G
NCS20072DR2G
No
NCS20072DTBR2G
NCV20072DMR2G*
Dual
NCV20072DR2G*
Yes
NCV20072DTBR2G*
NCS20074DR2G
No
NCS20074DTBR2G
NCV20074DR2G*
NCV20074DTBR2G*
Quad
Yes
Marking
Package
Shipping†
TBD
TSOP−5
(Pb−Free)
3000 / Tape and Reel
TBD
SOT553−5
(Pb−Free)
4000 / Tape and Reel
TBD
TSOP−5
(Pb−Free)
3000 / Tape and Reel
TBD
SOT553−5
(Pb−Free)
4000 / Tape and Reel
0072
Micro8 (MSOP8)
(Pb−Free)
4000 / Tape and Reel
NCS20072
SOIC−8
(Pb−Free)
2500 / Tape and Reel
K72
TSSOP−8
(Pb−Free)
2500 / Tape and Reel
0072
Micro8 (MSOP8)
(Pb−Free)
4000 / Tape and Reel
NCS20072
SOIC−8
(Pb−Free)
2500 / Tape and Reel
K72
TSSOP−8
(Pb−Free)
2500 / Tape and Reel
NCS20074
SOIC−14
(Pb−Free)
2500 / Tape and Reel
NCS2
0074
TSSOP−14
(Pb−Free)
2500 / Tape and Reel
NCS20074
SOIC−14
(Pb−Free)
2500 / Tape and Reel
NCS2
0074
TSSOP−14
(Pb−Free)
2500 / Tape and Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
**Contact local sales office for availability.
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4
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Supply Voltage (VDD – VSS) (Note 4)
Limit
Unit
VS
40
V
Input Voltage
VCM
VSS − 0.2 to VDD + 0.2
V
Differential Input Voltage (Note 2)
VID
±Vs
V
Maximum Input Current
IIN
±10
mA
Maximum Output Current (Note 3)
IO
±100
mA
Continuous Total Power Dissipation (Note 4)
PD
200
mW
Maximum Junction Temperature
TJ
150
°C
TSTG
−65 to 150
°C
Storage Temperature Range
Mounting Temperature (Infrared or Convection – 20 sec)
Tmount
260
°C
ESD Capability (Note 5)
HBM
MM
MM
CDM
CDM
2000
200
150
2000 (C6)
1000 (C6)
V
ILU
100
mA
MSL
Level 1
Human Body Model
Machine Model − NCx20071
Machine Model − NCx20072, NCx20074
Charged Device Model − NCx20071/NCx20072
Charged Device Model − NCx20074
Latch−Up Current (Note 6)
Moisture Sensitivity Level (Note 7)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Maximum input current must be limited to ±10 mA. Series connected resistors of at least 500 W on both inputs may be used to limit the
maximum input current to ±10 mA.
3. Total power dissipation must be limited to prevent the junction temperature from exceeding the 150°C limit.
4. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability.
Shorting output to either VDD or VSS will adversely affect reliability.
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per ANSI/ANSI/ESDA/JEDEC JS-001−2010 (AEC−Q100−002)
ESD Machine Model tested per JESD22−A115 (AEC−Q100−003)
ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 (AEC−Q100−011)
6. Latch−up Current tested per JEDEC standard: JESD78 (AEC−Q100−004)
7. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
THERMAL INFORMATION
Parameter
Symbol
Package
Single Layer
Board (Note 8)
Multi−Layer
Board (Note 9)
Unit
SOT23−5 / TSOP5
SOT553−5
qJA
Junction−to−Ambient
178
Micro8 / MSOP8
236
167
SOIC−8
190
131
TSSOP−8
253
194
SOIC−14
142
101
TSSOP−14
179
°C/W
128
mm2
8. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300
copper area
9. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
OPERATING RANGES
Parameter
Symbol
Min
Max
Unit
VS
2.7
36
V
Operating Supply Voltage (Split Supply)
VS
±1.35
±18
V
Differential Input Voltage (Note 10)
VID
VS
V
Input Common Mode Voltage Range
VCM
VSS
VDD − 1.35
V
TA
−40
125
°C
Operating Supply Voltage (Single Supply)
Ambient Temperature
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
10. Maximum input current must be limited to ±10 mA. See Absolute Maximum Ratings for more information.
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5
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 11, 12)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3
±3
mV
INPUT CHARACTERISTICS
Input Offset Voltage
VOS
Offset Voltage Drift
DVOS/DT
+4
TA = 25°C to 125°C
5
Input Bias Current (Note 12)
IIB
2
Input Offset Current (Note 12)
XTLK
2
DC
pA
75
500
IOS
NCx20074
Channel Separation
200
1500
NCx20072
mV
mV/°C
2
75
pA
200
NCx20072
100
NCx20074
115
dB
Differential Input Resistance
RID
50
GW
Common Mode Input Resistance
RIN
5
GW
Differential Input Capacitance
CID
1.5
pF
Common Mode Input Capacitance
CCM
3.5
pF
Common Mode Rejection Ratio
90
VCM = VSS + 0.2 V to
VDD − 1.35 V
NCx20072
VCM = VSS to VDD −
1.35 V (Note 13)
NCx20074
CMRR
110
dB
69
90
110
dB
69
OUTPUT CHARACTERISTICS
96
Open Loop Voltage Gain
Output Current Capability (Note 14)
AVOL
IO
118
dB
86
Op amp sinking current
70
Op amp sourcing current
50
0.006
mA
0.15
Output Voltage High
VOH
Voltage output swing from positive rail
Output Voltage Low
VOL
Voltage output swing from negative rail
UGBW
CL = 25 pF
3
MHz
SR
CL = 20 pF, RL = 2 kW
2.8
V/ms
Phase Margin
öm
CL = 25 pF
50
°
Gain Margin
Am
CL = 25 pF
14
dB
Settling Time
tS
0.22
0.005
V
0.15
0.22
V
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
VO = 1 Vpp,
Gain = 1, CL = 20 pF
Settling time to 0.1%
0.6
Settling time to 0.01%
1.2
ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
12. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
13. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
14. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
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NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 11, 12)
Parameter
Symbol
Conditions
Min
Typ
THD+N
VIN = 0.5 Vpp, f = 1 kHz, Av = 1
0.05
Max
Unit
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
f = 1 kHz
30
f = 10 kHz
20
in
f = 1 kHz
0.25
PSRR
No Load
IDD
Per channel, no load
Input Referred Voltage Noise
en
Input Referred Current Noise
%
nV/√Hz
fA/√Hz
SUPPLY CHARACTERISTICS
114
Power Supply Rejection Ratio
135
dB
100
405
Power Supply Quiescent Current
525
mA
625
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
12. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
13. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
14. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
ELECTRICAL CHARACTERISTICS AT VS = 5 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 15, 16)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3
±3
mV
+4
mV
INPUT CHARACTERISTICS
Input Offset Voltage
VOS
Offset Voltage Drift
DVOS/DT
TA = 25°C to 125 °C
5
Input Bias Current (Note 16)
IIB
2
IOS
XTLK
2
DC
pA
75
500
NCx20074
Channel Separation
200
1500
NCx20072
Input Offset Current (Note 16)
mV/°C
2
75
pA
200
NCx20072
100
NCx20074
115
dB
Differential Input Resistance
RID
50
GW
Common Mode Input Resistance
RIN
5
GW
Differential Input Capacitance
CID
1.5
pF
Common Mode Input Capacitance
CCM
3.5
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
16. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
17. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
18. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
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7
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 5 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 15, 16)
Parameter
Symbol
Conditions
Min
Typ
102
125
Max
Unit
INPUT CHARACTERISTICS
Common Mode Rejection Ratio
VCM = VSS + 0.2 V to
VDD − 1.35 V
NCx20072
VCM = VSS to VDD −
1.35 V (Note 17)
NCx20074
CMRR
dB
80
102
125
dB
80
OUTPUT CHARACTERISTICS
Open Loop Voltage Gain
Output Current Capability (Note 18)
96
AVOL
IO
120
dB
86
Op amp sinking current
50
Op amp sourcing current
60
0.013
Output Voltage High
VOH
Voltage output swing from positive rail
Output Voltage Low
VOL
Voltage output swing from negative rail
mA
0.20
0.25
0.01
V
0.10
0.15
V
AC CHARACTERISTICS
UGBW
CL = 25 pF
3.2
MHz
Slew Rate at Unity Gain
SR
CL = 20 pF, RL = 2 kW
2.7
V/ms
Phase Margin
öm
CL = 25 pF
50
°
Gain Margin
Am
CL = 25 pF
14
dB
Settling Time
tS
Unity Gain Bandwidth
VO = 3 Vpp,
Gain = 1, CL = 20 pF
Settling time to 0.1%
1.2
Settling time to 0.01%
5.6
ms
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
VIN = 2.5 Vpp, f = 1 kHz, Av = 1
0.009
f = 1 kHz
30
f = 10 kHz
20
0.25
Input Referred Voltage Noise
en
Input Referred Current Noise
in
f = 1 kHz
PSRR
No Load
IDD
Per channel, no load
%
nV/√Hz
fA/√Hz
SUPPLY CHARACTERISTICS
114
Power Supply Rejection Ratio
135
dB
100
410
Power Supply Quiescent Current
530
630
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
16. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
17. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
18. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
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8
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 10 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 19, 20)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3
±3
mV
INPUT CHARACTERISTICS
Input Offset Voltage
VOS
Offset Voltage Drift
DVOS/DT
+4
TA = 25°C to 125°C
5
Input Bias Current (Note 20)
IIB
2
Input Offset Current (Note 20)
XTLK
2
DC
pA
75
500
IOS
NCx20074
Channel Separation
200
1500
NCx20072
mV
mV/°C
2
75
pA
200
NCx20072
100
NCx20074
115
dB
Differential Input Resistance
RID
50
GW
Common Mode Input Resistance
RIN
5
GW
Differential Input Capacitance
CID
1.5
pF
Common Mode Input Capacitance
CCM
3.5
pF
Common Mode Rejection Ratio
110
VCM = VSS + 0.2 V to
VDD − 1.35 V
NCx20072
VCM = VSS to VDD −
1.35 V (Note 21)
NCx20074
CMRR
130
dB
87
110
130
dB
87
OUTPUT CHARACTERISTICS
98
Open Loop Voltage Gain
Output Current Capability (Note 22)
AVOL
IO
120
dB
88
Op amp sinking current
50
Op amp sourcing current
65
0.023
mA
0.08
Output Voltage High
VOH
Voltage output swing from positive rail
Output Voltage Low
VOL
Voltage output swing from negative rail
UGBW
CL = 25 pF
3.2
MHz
SR
CL = 20 pF, RL = 2 kW
2.2
V/ms
Phase Margin
öm
CL = 25 pF
50
°
Gain Margin
Am
CL = 25 pF
14
dB
Settling Time
tS
0.10
0.022
V
0.3
0.35
V
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
VO = 8.5 Vpp,
Gain = 1, CL = 20 pF
Settling time to 0.1%
3.4
Settling time to 0.01%
6.8
ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
19. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
20. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
21. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
22. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
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9
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 10 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 19, 20)
Parameter
Symbol
Conditions
Min
Typ
THD+N
VIN = 7.5 Vpp, f = 1 kHz, Av = 1
0.004
Max
Unit
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
f = 1 kHz
30
f = 10 kHz
20
in
f = 1 kHz
0.25
PSRR
No Load
IDD
Per channel, no load
Input Referred Voltage Noise
en
Input Referred Current Noise
%
nV/√Hz
fA/√Hz
SUPPLY CHARACTERISTICS
114
Power Supply Rejection Ratio
135
dB
100
416
Power Supply Quiescent Current
540
mA
640
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
19. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
20. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
21. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
22. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
ELECTRICAL CHARACTERISTICS AT VS = 36 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 23, 24)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3
±3
mV
+4
mV
INPUT CHARACTERISTICS
Input Offset Voltage
VOS
Offset Voltage Drift
DVOS/DT
TA = 25°C to 125°C
IIB
NCx20072
2000
NCx20074
1500
5
Input Bias Current (Note 24)
2
NCx20072
Input Offset Current (Note 24)
IOS
XTLK
2
DC
200
pA
75
1000
NCx20074
Channel Separation
mV/°C
2
75
pA
200
NCx20072
100
NCx20074
115
dB
Differential Input Resistance
RID
50
GW
Common Mode Input Resistance
RIN
5
GW
Differential Input Capacitance
CID
1.5
pF
Common Mode Input Capacitance
CCM
3.5
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
23. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
24. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
25. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
26. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
www.onsemi.com
10
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 36 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 23, 24)
Parameter
Symbol
Conditions
Min
Typ
120
145
Max
Unit
INPUT CHARACTERISTICS
VCM = VSS + 0.2 V to
VDD − 1.35 V
Common Mode Rejection Ratio
NCx20072
CMRR
95
120
VCM = VSS to VDD −
1.35 V (Note 25)
NCx20074
dB
145
95
OUTPUT CHARACTERISTICS
98
Open Loop Voltage Gain
Output Current Capability (Note 26)
AVOL
IO
120
dB
88
Op amp sinking current
50
Op amp sourcing current
65
0.074
Output Voltage High
VOH
Voltage output swing
from positive rail
0.10
NCx20072
0.15
NCx20074
0.12
0.065
Output Voltage Low
mA
V
0.3
VOL
Voltage output swing from negative rail
UGBW
CL = 25 pF
3.2
MHz
Slew Rate at Unity Gain
SR
CL = 20 pF, RL = 2 kW
2.4
V/ms
Phase Margin
öm
CL = 25 pF
50
°
Gain Margin
Am
CL = 25 pF
14
dB
Settling Time
tS
0.35
V
AC CHARACTERISTICS
Unity Gain Bandwidth
VO = 10 Vpp,
Gain = 1, CL = 20 pF
Settling time to 0.1%
3.2
Settling time to 0.01%
6.8
ms
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
VIN = 28.5 Vpp, f = 1 kHz, Av = 1
0.001
f = 1 kHz
30
f = 10 kHz
20
0.25
Input Referred Voltage Noise
en
Input Referred Current Noise
in
f = 1 kHz
PSRR
No Load
%
nV/√Hz
fA/√Hz
SUPPLY CHARACTERISTICS
114
Power Supply Rejection Ratio
135
dB
100
465
NCx20072
Power Supply Quiescent Current
IDD
Per channel, no load
700
465
NCx20074
570
600
mA
700
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
23. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
24. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
25. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM
= VSS + 0.2 V to VDD − 1.35 V.
26. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information.
www.onsemi.com
11
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
0.7
0.6
SUPPLY CURRENT (mA)
T = 125°C
T = 85°C
0.5
T = 25°C
0.4
T = −40°C
0.3
0.2
0.6
VS = 36 V
0.5
VS = 2.7 V
0.4
VS = 5 V
VS = 10 V
0.3
0.2
0
6
12
18
24
SUPPLY VOLTAGE (V)
30
36
−40 −20
Figure 2. Quiescent Current Per Channel vs.
Supply Voltage
20
40
60
80
TEMPERATURE (°C)
5
VCM = mid−supply
OFFSET VOLTAGE (mV)
OFFSET VOLTAGE (mV)
−0.4
T = −40°C
T = 85°C
T = 25°C
T = 125°C
−0.8
120
VS = ±18 V
10 units
4
−0.2
−0.6
100
Figure 3. Quiescent Current vs. Temperature
0
−1
3
2
1
0
−1
−2
−3
−4
−5
−18
−1.2
0
6
12
18
24
SUPPLY VOLTAGE (V)
30
36
−14
Figure 4. Offset Voltage vs. Supply Voltage
2.5
−10 −6
−2
2
6
10
COMMON MODE VOLTAGE (V)
14
125
Normal
operation
VS = ±18 V
10 units
−2.5
50
GAIN (dB)
75
−7.5
180
VS = 2.7 V, Gain
VS = 36 V, Gain
VS = 2.7 V, Phase
VS = 36 V, Phase
100
0
−5
18
Figure 5. Input Offset Voltage vs. Common
Mode Voltage
5
OFFSET VOLTAGE (mV)
0
−10
GAIN
135
90
45
25
0
0
RL = 10 kW
CL = 15 pF
−45
−25
PHASE (°)
SUPPLY CURRENT (mA)
0.7
−90
PHASE
−12.5
−15
15.5
−50
16
16.5
17
17.5
COMMON MODE VOLTAGE (V)
18
18.5
−75
10
Figure 6. Input Offset Voltage vs. Common
Mode Voltage
−135
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
−180
100M
Figure 7. Gain and Phase vs. Frequency
www.onsemi.com
12
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
60
1E+1
VS = 5 V
RL = 10 kW
TA = 25°C
1E+0
40
THD+N (%)
PHASE MARGIN (°)
50
VS = 36 V
FIN = 1 kHz
AV = 1
30
1E−1
1E−2
20
1E−3
10
0
1E−4
0
100
200
300
CAPACITIVE LOAD (pF)
400
500
0
Figure 8. Phase Margin vs. Capacitive Load
1E+1
275
AV = 1
VS = 2.7 V
VS = 5 V
VS = 10 V
1E−3
30
36
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
250
VOLTAGE NOISE (nV/√Hz)
THD+N (%)
1E−2
12
18
24
OUTPUT VOLTAGE (Vpp)
Figure 9. THD+N vs. Output Voltage
1E+0
1E−1
6
VS = 36 V
225
200
175
150
125
100
75
50
25
1E−4
10
100
1k
0
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10. THD+N vs. Frequency
Figure 11. Input Voltage Noise vs. Frequency
140
5
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
4
VS = 2.7 V, VDD
VS = 5 V, VSS
VS = 10 V, VDD
VS = 36 V VSS
120
100
3
PSRR (dB)
CURRENT NOISE (fA/√Hz)
10k
2
1
60
40
0
−1
10
80
20
0
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12. Input Current Noise vs. Frequency
Figure 13. PSRR vs. Frequency
www.onsemi.com
13
1M
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
120
1.4
100
OUTPUT VOLTAGE RELATIVE TO
VDD (V)
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
CMRR (dB)
80
60
40
20
RL = 10 kW
TA = 25°C
0
10
1k
10k
100k
0.6
0.4
0.2
VS = 36 V
1M
0
2
4
6
8
10
12
14
16
18
OUTPUT CURRENT (mA)
Figure 14. CMRR vs. Frequency
Figure 15. High Level Output vs. Output
Current
18.1
Input
Output
20
VS = 36 V
AV = +1
RL = 10 kW
18.05
VOLTAGE (V)
OUTPUT VOLTAGE RELATIVE TO
VSS (V)
0.8
FREQUENCY (Hz)
T = −40°C
T = 25°C
T = 85°C
T = 125°C
0.8
1
0
100
1
T = −40°C
T = 25°C
T = 85°C
T = 125°C
1.2
0.6
0.4
18
17.95
0.2
VS = 36 V
0
0
2
4
6
8
10
12
14
16
18
17.9
−20
20
0
20
40
OUTPUT CURRENT (mA)
TIME (ms)
Figure 16. Low Level Output vs. Output
Current
Figure 17. Non−inverting Small Signal
Transient Response
18.075
60
25
Input
Output
18.025
VOLTAGE (V)
VOLTAGE (V)
18.05
18
VS = 36 V
AV = +1
RL = 10 kW
17.975
20
15
VS = 36 V
AV = +1
RL = 10 kW
17.95
17.925
−20
0
20
40
60
10
−20
Input
Output
0
20
40
TIME (ms)
TIME (ms)
Figure 18. Inverting Small Signal Transient
Response
Figure 19. Non−inverting Large Signal
Transient Response
www.onsemi.com
14
60
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
24
1200
VS = 36 V
22
CURRENT (pA)
20
VOLTAGE (V)
1000
VS = 36 V
AV = −1
RL = 10 kW
18
16
14
12
10
−20
IIB+
IIB−
IOS
800
600
400
200
0
Input
Output
0
20
40
−200
−25
60
0
25
50
75
100
125
TIME (ms)
TEMPERATURE (°C)
Figure 20. Inverting Large Signal Transient
Response
Figure 21. Input Bias and Offset Current vs.
Temperature
50
30
20
10
2 mV/div
CURRENT (pA)
0.1 Hz to 10 Hz noise
VS = ±18 V, VCM = VS/2
RL = 10 kW, CL = 100 pF
AV = −1, VIN = 0 V
VS = 36 V
IIB+
IIB−
IOS
40
0
−10
−20
−30
−40
−50
0
6
12
18
30
24
36
0
4
5
6
7
8
TIME (s)
Figure 23. 0.1 Hz to 10 Hz Noise
500
RL = 10 kW
CL = 25 pF
400
−60
−80
−100
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
−120
−140
100
1k
10k
100k
9
10
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
450
IMPEDANCE (W)
CHANNEL SEPARATION (dB)
3
COMMON MODE VOLTAGE (V)
−40
−160
10
2
Figure 22. Input Bias Current vs. Common
Mode Voltage
0
−20
1
350
300
250
200
150
100
50
0
1M
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 24. Channel Separation vs. Frequency
Figure 25. Open Loop Output Impedance
www.onsemi.com
15
1M
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
1000
VS = 36 V
10 V step
AV = −1
8
D FROM FINAL VALUE (mV)
OFFSET VOLTAGE (mV)
500
10
VS = 36 V
5 Units
VCM = mid−supply
0
−500
−1000
−1500
−2000
6
4
2
12−bit Setting
0
±1/2LSB = ±0.024%
−2
−4
−6
−8
−2500
−50
−25
25
0
50
75
125
100
−10
0
15
20
25
30
35
40
Figure 26. Offset Voltage vs. Temperature
Figure 27. Large Signal Settling Time
SR+
SR−
VS = 36 V
4
SLEW RATE (V/ms)
10
TIME (ms)
5
3
2
1
0
−40
5
TEMPERATURE (°C)
−20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 28. Slew Rate vs. Temperature
www.onsemi.com
16
45
50
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
D
−X−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
A
L
4
1
2
E
−Y−
3
b
e
HE
c
5 PL
0.08 (0.003)
DIM
A
b
c
D
E
e
L
HE
M
X Y
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.65
1.20
1.25
0.50 BSC
0.10
0.20
0.30
1.55
1.60
1.65
MIN
0.50
0.17
0.08
1.55
1.15
RECOMMENDED
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
17
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.008
0.004
0.061
0.063
MIN
0.020
0.007
0.003
0.061
0.045
MAX
0.024
0.011
0.007
0.065
0.049
0.012
0.065
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
18
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
Micro8t
CASE 846A−02
ISSUE J
D
HE
PIN 1 ID
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
E
b 8 PL
0.08 (0.003)
−T−
DIM
A
A1
b
c
D
E
e
L
HE
e
M
T B
S
A
S
SEATING
PLANE
A
0.038 (0.0015)
A1
MILLIMETERS
NOM
MAX
−−
1.10
0.08
0.15
0.33
0.40
0.18
0.23
3.00
3.10
3.00
3.10
0.65 BSC
0.40
0.55
0.70
4.75
4.90
5.05
MIN
−−
0.05
0.25
0.13
2.90
2.90
L
c
RECOMMENDED
SOLDERING FOOTPRINT*
8X
8X
0.48
0.80
5.25
0.65
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
19
INCHES
NOM
−−
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.021
0.016
0.187
0.193
MIN
−−
0.002
0.010
0.005
0.114
0.114
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
20
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
TSSOP−8
CASE 948S
ISSUE C
8x
0.20 (0.008) T U
K REF
0.10 (0.004)
S
2X
L/2
8
B
−U−
1
PIN 1
IDENT
S
T U
5
L
0.20 (0.008) T U
M
S
V
ÉÉÉÉ
ÇÇÇ
ÉÉÉÉ
ÇÇÇ
ÉÉÉÉ
ÇÇÇ
J J1
4
K1
K
A
−V−
SECTION N−N
−W−
C
0.076 (0.003)
D
−T− SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
DETAIL E
G
0.25 (0.010)
N
M
N
F
DETAIL E
www.onsemi.com
21
DIM
A
B
C
D
F
G
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
4.30
4.50
--1.10
0.05
0.15
0.50
0.70
0.65 BSC
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.114
0.122
0.169
0.177
--0.043
0.002
0.006
0.020
0.028
0.026 BSC
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
22
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.020 0.024
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
D
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
8
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
DIM
A
A1
A3
b
D
E
e
H
h
L
M
b
0.25
M
C A
S
B
S
0.10
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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