LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DURL COLOR LED LAMPS Pb Lead-Free Parts LURFSDGM3392/R6/TBS-X DATA SHEET DOC. NO : QW0905-LURFSDGM3392/R6/TBS-X REV. A DATE : : 25 - Apr.- 2013 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LURFSDGM3392/R6/TBS-X Package Dimensions P2 □0.5TYP W2 H2 H1 L W0 W3 W1 -+- F D F P1 P DGM URF(S) T 1 2 3 - + - 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED LURFSDGM3392/R6-PF 5.0 7.6 5.9 8.6 10.5 ±0.5 DGM 1.5 MAX URF(S) □0.5 TYP 18.0MIN 1 2 1 3 2.0MIN 2.0MIN 2.54TYP 2.54TYP - + - Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2 3 - + - 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LURFSDGM3392/R6/TBS-X Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT URF(S) DGM Forward Current IF 50 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 100 mA Power Dissipation PD 120 120 mW ESD ---- 500 V Reverse Current @5V Ir 10 50 μA Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Electrostatic Discharge( * ) Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted AIGaInP Red LURFSDGM3392/R6/TBS-X InGaN/GaN Green Peak Dominant Spectral wave halfwidth wave length △λnm length λPnm λDnm Luminous Viewing intensity angle @20mA(mcd) 2θ 1/2 (deg) Min. Typ. Max. Min. Typ. Lens White Diffused Forward voltage @20mA(V) ---- 625 20 1.7 ---- 2.6 2700 4000 70 518 525 36 ---- 3.5 4.0 1100 2700 70 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LURFSDGM3392/R6/TBS-X •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-1 17.5 0.69 18.5 0.73 TBS-2 21.5 0.85 22.5 0.89 TBS-3 25.5 1.0 26.5 1.04 TBS-5 22.5 0.89 23.5 0.93 TBS-6 19.9 0.78 20.9 0.82 24.0 0.94 25.0 0.98 24.5 0.96 25.5 1.0 TBS-9 19.0 0.75 20.0 0.79 TBS-10 18.4 0.72 19.4 0.76 TBS-11 21.0 0.83 22.0 0.87 TBS-12 20.5 0.81 21.5 0.85 TBS-13 18.0 0.71 19.0 0.75 ------- 36 1.42 11 0.43 TBS-7 Feed Hole To Bottom Of Component H1 TBS-8 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 ------- W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2000PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/8 PART NO. LURFSDGM3392/R6/TBS-X Brightness Code For Standard LED Lamps URF(S) Bin Code Group Luminous Intensity(mcd) at 20 mA Min. Max. A26 2700 3400 A27 3400 4000 A28 4000 5000 A29 5000 6200 A30 6200 7700 DGM Bin Code Group Luminous Intensity(mcd) at 20 mA Min. Max. A22 1100 1500 A23 1500 1800 A24 1800 2200 A25 2200 2700 A26 2700 3400 A27 3400 4000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFSDGM3392/R6/TBS-X Page 5/8 Typical Electro-Optical Characteristics Curve URF(S) CHIP Fig.2 Luminous Intensity vs. Forward Current 6.0 150 Luminous Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 100 50 0 0 0.5 1.0 1.5 2.0 2.5 5.0 4.0 3.0 2.0 1.0 0.0 0 3.0 50 1.06 1.04 1.02 1.00 0.98 0.96 0.94 0 20 40 60 80 100 Fig.4 Luminous Intensity vs. Temperature Luminous Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 150 Forward Current(mA) Forward Voltage(V) -40 100 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 0° -30 ° 1.0 30° -60 ° 60° 0.5 100% 75% 50% 0 550 600 650 Wavelength (nm) 700 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFSDGM3392/R6/TBS-X Page 6/8 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.0 2.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 1000 Forward Current(mA) Forward Voltage(V) Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength 0° Relative Intensity@20mA 1.0 -30° 30 ° -60° 0.5 0.0 450 500 550 Wavelength (nm) 600 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFSDGM3392/R6/TBS-X Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO. LURFSDGM3392/R6/TBS-X Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11