TSC BAV20WS 410mw high voltage smd switching diode Datasheet

BAV19WS/BAV20WS/BAV21WS
410mW High Voltage SMD Switching Diode
Small Signal Diode
SOD-323F
B
Features
C
A
—Flat Lead SOD-323F small outline plastic package
—Surface device type mounting
D
—Moisture sensitivity level 1
—Matte Tin(Sn) lead finish with Nickel(Ni) underplate
E
—Pb free version and RoHS compliant
—Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
F
Mechanical Data
Unit (mm)
Unit (inch)
Dimensions
(mm)
Min
Max
—Terminal: Matte tin plated, solderable
per MIL-STD-202, Method 208 guaranteed
A
1.15
1.40
0.045 0.055
B
2.30
2.80
0.091 0.110
—High temperature soldering guaranteed: 260°C/10s
C
0.25
0.40
0.010 0.016
—Polarity : Indicated by cathode band
D
1.60
1.80
0.063 0.071
—Weight : 4.85±0.5 mg
E
0.80
1.10
0.031 0.043
—Marking Code : S5, S6, S7
F
0.05
0.15
0.002 0.006
—Case : Flat lead SOD-323F small outline plastic package
Ordering Information
Part No.
Package
Min
Max
Pin Configuration
Packing Code
Packing
Marking
BAV19WS SOD-323F
RR
3K / 7" Reel
S5
BAV20WS SOD-323F
RR
3K / 7" Reel
S6
BAV21WS SOD-323F
RR
3K / 7" Reel
S7
BAV19WS SOD-323F
RRG
3K / 7" Reel
S5
BAV20WS SOD-323F
RRG
3K / 7" Reel
S6
BAV21WS SOD-323F
RRG
3K / 7" Reel
S7
Suggested PAD Layout
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Symbol
Value
Units
PD
200
mW
Repetitive Peak Reverse Voltage
VRRM
250
V
Average Rectified Forward Current
IF(AV)
200
mA
Type Number
Power Dissipation
Non-Repetitive Peak Forward Surge Current
Pulse width= 1μs
Pulse width= 1s
Junction and Storage Temperature Range
IFSM
TJ, TSTG
2.5
0.5
-65 to + 150
A
°C
Note1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
Version : D10
BAV19WS/BAV20WS/BAV21WS
410mW High Voltage SMD Switching Diode
Small Signal Diode
Electrical Characteristics
Type Number
Min
120
200
250
-
Max
1.00
1.25
Units
IR
-
100
nA
CJ
Trr
-
5.0
50
pF
ns
Symbol
K
D
A
D1
D2
E
F
P0
P1
T
W
W1
Dimension(mm)
2.40 Max.
1.5 ± 0.1
178 ± 1
50 Min.
13.0 ± 0.5
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.10
0.6 Max.
8.30 Max.
14.4 Max
Symbol
BAV19W
BAV20W
BAV21W
Breakdown Voltage
(Note 2)
IF= 100mA
IF= 200mA
BAV19W
BAV20W
(Note 3)
BAV21W
VR=0, f=1.0MHz
(Note 4)
Forward Voltage
Reverse Leakage Current
Junction Capacitance
Reverse Recovery Time
VR
VF
V
V
Tape & Reel specification
TSC label
Item
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
W1
A
D2
D1
User Direction of Feed
Note 2: Test Condition : I R=100μA
Note 3: Test Condition : BAV19WS @ V R=100V, BAV20WS @ V R=150V, BAV21WS @ V R=200V
Note 4: Test Condition : I F=IR=30mA, RL=100Ω, IRR=3mA
Note 5: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10° within the determined cavity.
Note 6: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : D10
BAV19WS/BAV20WS/BAV21WS
410mW High Voltage SMD Switching Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Admissible Power Dissipation Curve
Forward Current (mA)
Power Dissipation (mW)
250
200
150
100
50
0
Tj=25°C
100
10
1
0.1
0.01
0
25
50
75
100
125
150
Ambient Temperature (°C)
0
1
2
Forward Voltage (V)
FIG 3 Leakage Current vs Junction
Temperature
100
Leakage Current (uA)
FIG 2 Typical Forward Characterisics
1000
300
10
1
0.1
0.01
0
100
200
Junction Temperature (℃)
Version : D10
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