AD AD8392AACPZ-RL Low power, high output current, quad op amp, dual-channel adsl/adsl2 line driver Datasheet

Low Power, High Output Current, Quad Op
Amp, Dual-Channel ADSL/ADSL2+ Line Driver
AD8392A
PIN CONFIGURATIONS
VEE 1
2
27 NC
PD1 1, 2
3
26 NC
+VIN1
4
–VIN1
5
VOUT1
6
VCC
7
NC
8
VOUT3
9
24 –VIN2
22 NC
AD8392A
21 VCC
20 VOUT4
3
19 –VIN4
4
18
+VIN4
NC 12
17 PD1 3, 4
NC 13
16
PD0 3, 4
GND 14
15
VEE
NC = NO CONNECT
+VIN2
NC
GND
VCOM1, 2
VEE
PD0 1, 2
+VIN1
PD1 1, 2
Figure 1. AD8392AARE, 28-Lead TSSOP/EP
32 31 30 29 28 27 26 25
4
NC
5
VOUT3
6
–VIN3
7
NC
8
AD8392A
3
9
4
NC
23
–VIN2
22
VOUT2
21
NC
20
VCC
19
VOUT4
18
–VIN4
17
NC
10 11 12 13 14 15 16
NC = NO CONNECT
+VIN4
VCC
PD1 3, 4
3
24
2
PD0 3, 4
VOUT1
1
VEE
2
GND
–VIN1
06477-002
NC 1
VCOM3, 4
The AD8392A is comprised of four high output current, low
power consumption, operational amplifiers. It is particularly
well suited for the CO driver interface in digital subscriber line
systems, such as ADSL and ADSL2+. The driver is capable of
providing enough power to deliver 20.4 dBm to a line, while
compensating for losses due to hybrid insertion and back
termination resistors.
25 +VIN2
2
23 VOUT2
+VIN3 11
+VIN3
GENERAL DESCRIPTION
1
–VIN3 10
APPLICATIONS
ADSL/ADSL2+ CO line drivers
XDSL line drives
28 GND
PD0 1, 2
NC
Four current feedback, high current amplifiers
Ideal for use as ADSL/ADSL2+ dual-channel central office
(CO) line drivers
Low power operation
Power supply operation from ±5 V (+10 V) up to ±12 V (+24 V)
Less than 3 mA/amp quiescent supply current for full
power ADSL/ADSL2+ CO applications (20.4 dBm line
power, 5.5 CF)
Three active power modes plus shutdown
High output voltage and current drive
500 mA peak output drive current
42.6 V p-p differential output voltage
Low distortion
−93 dBc @1 MHz second harmonic
−103 dBc @ 1 MHz third harmonic
High speed: 515 V/μs differential slew rate
Additional functionality of AD8392AACP
On-chip, common-mode voltage generation
06477-001
FEATURES
Figure 2. AD8392AACP, 5 mm × 5 mm, 32-Lead LFCSP
The AD8392A is available in two thermally enhanced packages,
a 28-lead TSSOP/EP (AD8392AARE) and a 5 mm × 5 mm,
32-lead LFCSP (AD8392AACP). Four bias modes are available
via the use of two digital bits (PD1, PD0).
Additionally, the AD8392AACP provides VCOM pins for on-chip,
common-mode voltage generation.
The low power consumption, high output current, high output
voltage swing, and robust thermal packaging enable the
AD8392A to be used as the CO line drivers in ADSL and other
xDSL systems.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2006 Analog Devices, Inc. All rights reserved.
AD8392A
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications........................................................................................8
Applications....................................................................................... 1
Supplies, Grounding, and Layout................................................8
General Description ......................................................................... 1
Power Management ......................................................................8
Pin Configurations ........................................................................... 1
Thermal Considerations...............................................................8
Specifications..................................................................................... 3
Typical ADSL/ADSL2+ Application...........................................9
Absolute Maximum Ratings............................................................ 4
Multitone Power Ratio............................................................... 10
Thermal Resistance ...................................................................... 4
Outline Dimensions ....................................................................... 11
ESD Caution.................................................................................. 4
Ordering Guide .......................................................................... 11
Typical Performance Characteristics ............................................. 5
Theory of Operation ........................................................................ 7
REVISION HISTORY
10/06—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
AD8392A
SPECIFICATIONS
VS = ±12 V or +24 V, RL = 100 Ω, G = +5, PD = (0, 0), T = 25°C, unless otherwise noted.
Table 1.
Parameter
DYNAMIC PERFORMANCE
−3 dB Small Signal Bandwidth
−3 dB Large Signal Bandwidth
Peaking
Slew Rate
NOISE/DISTORTION PERFORMANCE
Second Harmonic Distortion
Third Harmonic Distortion
Multitone Input Power Ratio
Voltage Noise (RTI)
+Input Current Noise
−Input Current Noise
INPUT CHARACTERISTICS
RTI Offset Voltage
+Input Bias Current
−Input Bias Current
Input Resistance
Input Capacitance
Common-Mode Rejection Ratio
OUTPUT CHARACTERISTICS
Differential Output Voltage Swing
Single-Ended Output Voltage Swing
Linear Output Current
POWER SUPPLY
Operating Range (Dual Supply)
Operating Range (Single Supply)
Total Quiescent Current
PD1, PD0 = (0, 0)
PD1, PD0 = (0, 1)
PD1, PD0 = (1, 0)
PD1, PD0 = (1, 1) (Shutdown State)
PD = 0 Threshold
PD = 1 Threshold
+Power Supply Rejection Ratio
−Power Supply Rejection Ratio
Min
Typ
25
23
−4
63
41.2
20.6
Unit
Test Conditions/Comments
37
30
0.06
515
MHz
MHz
dB
V/μs
VOUT = 0.1 V p-p, RF = 2 kΩ
VOUT = 4 V p-p, RF = 2 kΩ
VOUT = 0.1 V p-p, RF = 2 kΩ
VOUT = 20 V p-p, RF = 2 kΩ
−93
−103
70
2.5
7.6
12.5
dBc
dBc
dBc
nV/√Hz
pA/√Hz
pA/√Hz
fC = 1 MHz, VOUT = 2 V p-p
fC = 1 MHz, VOUT = 2 V p-p
26 kHz to 2.2 MHz, ZLINE = 100 Ω differential load
f = 10 kHz
f = 10 kHz
f = 10 kHz
mV
μA
μA
MΩ
pF
dB
V+IN − V−IN
(ΔVOS, DM (RTI))/(ΔVIN, CM)
V p-p
V p-p
mA
ΔVOUT
ΔVOUT, RL = 50 Ω
RL = 10 Ω, fC = 100 kHz
±2
2
3
8
1
66
+4
7
10
42.6
21.3
500
±5
10
5.8
3.0
2.6
0.4
1.8
72
65
Max
74
69
±12
24
V
V
6.5
3.5
3.0
0.08
0.8
mA/amp
mA/amp
mA/amp
mA/amp
V
V
dB
dB
Rev. 0 | Page 3 of 12
ΔVOS, DM (RTI)/ΔVCC, ΔVCC = ±1 V
ΔVOS, DM (RTI)/ΔVEE, ΔVEE = ±1 V
AD8392A
ABSOLUTE MAXIMUM RATINGS
Rating
±13 V (+26 V)
See Figure 3
−65°C to +150°C
−40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
In single supply with RL to VS−, worst case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the LFCSP-32 and
TSSOP-28/EP packages on a JEDEC standard 4-layer board.
θJA values are approximations.
7
TJ = 150°C
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for the device soldered in the circuit board for surface-mount
packages.
Table 3.
Package Type
LFCSP-32 (CP)
TSSOP-28/EP (RE)
θJA
27.27
35.33
Unit
°C/W
°C/W
6
5
LFCSP-32
4
3
TSSOP-28/EP
2
1
0
–40 –30 –20 –10
Maximum Power Dissipation
0
10 20 30 40 50
TEMPERATURE (°C)
60
70
80
90
06477-003
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
RMS output voltages should be considered. If RL is referenced
to VS− as in single-supply operation, the total power is VS × IOUT.
MAXIMUM POWER DISSIPATION (W)
Table 2.
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming that the load (RL) is midsupply,
the total drive power is VS/2 × IOUT, some of which is dissipated
in the package and some in the load (VOUT × IOUT).
See the Thermal Considerations section for additional thermal
design guidance.
ESD CAUTION
Rev. 0 | Page 4 of 12
AD8392A
TYPICAL PERFORMANCE CHARACTERISTICS
900
0
850
SIGNAL FEEDTHROUGH (dB)
POWER CONSUMPTION (mW)
–20
800
PD (0, 0)
750
700
PD (0, 1)
650
600
PD (1, 0)
550
–40
–60
–80
–100
16
17
18
19
21
20
OUTPUT POWER (dBm)
–120
100k
1M
10M
100M
1G
FREQUENCY (Hz)
Figure 4. Power Consumption vs. Output Power (138 kHz to 2.2 MHz),
ADSL/ADSL2+ Circuit (Figure 15), VS = ±12 V, RLOAD = 100 Ω, CF = 5.5
Figure 7. Signal Feedthrough vs. Frequency
VS = ±12 V, G = +5, VIN = 800 mV p-p, PD (1, 1), RF = 2 kΩ
15
10
PD (0, 0)
GAIN (dB)
5
PD (0, 1)
0
2
–5
PD (1, 0)
–10
1
100k
1M
10M
1G
100M
FREQUENCY (Hz)
CH1 500mV CH2 500mV
100ns
06477-042
–20
10k
06477-049
–15
Figure 8. Power-Up Time: PD (1, 1) to PD (0, 0)
VS = ±12 V, RLOAD = 100 Ω, G = +5, VOUT = 1 V p-p, RF = 2 kΩ
Figure 5. Small Signal Frequency Response
VS = ±12 V, RLOAD = 100 Ω, G = +5, VOUT = 100 mV p-p, RF = 2 kΩ
15
10
PD (0, 0)
0
2
–5
PD (0, 1)
–10
1
PD (1, 0)
–20
10k
100k
1M
10M
100M
FREQUENCY (Hz)
1G
CH1 500mV CH2 500mV
400ns
Figure 9. Power-Down Time: PD (0, 0) to PD (1, 1)
VS = ±12 V, RLOAD = 100 Ω, G = +5, VOUT = 1 V p-p, RF = 2 kΩ
Figure 6. Large Signal Frequency Response
VS = ±12 V, RLOAD = 100 Ω, G = +5, VOUT = 4 V p-p, RF = 2 kΩ
Rev. 0 | Page 5 of 12
06477-041
–15
06477-045
GAIN (dB)
5
06477-048
450
15
06477-046
500
AD8392A
100
OUTPUT IMPEDANCE (Ω)
OUTPUT
CHANNEL 2
CH1 200mV CH2 2V
06477-040
2
400ns
10
PD (0, 0)
1
PD (0, 1)
PD (1, 0)
0.1
0.01
10k
100k
1M
10M
1G
100M
FREQUENCY (Hz)
Figure 13. Output Impedance vs. Frequency
VS = ±12 V, G = +5, RF = 2 kΩ
Figure 10. Output Overdrive Recovery, ADSL/ADSL2+ Circuit (Figure 15),
DMT Waveform, VS = ±12 V
0
–10
–20
CROSSTALK (dB)
–30
49.9Ω
DIFF CHANNEL 1, 2
–40
–50
2kΩ
DIFF CHANNEL 3, 4
–60
100Ω
499Ω
2kΩ
–70
–80
1M
100M
10M
FREQUENCY (Hz)
49.9Ω
06477-025
–100
100k
06477-053
–90
Figure 14. Dual Differential Driver Circuit
Figure 11. Crosstalk vs. Frequency, Dual Differential Driver Circuit (Figure 14),
VS = ±12 V, VIN = 800 mV p-p
45
1.78kΩ
35
0.01µF
634Ω
4.99Ω
30
77Ω
VCM
1µF
20
77Ω
15
87Ω
100Ω
2kΩ
4.99Ω
0.01µF
634Ω
0
10
20
30
40
50
60
70
80
LOAD RESISTANCE (Ω)
90
100
Figure 12. Differential Output Swing vs. RLOAD
Dual Differential Driver Circuit (Figure 14)
1.78kΩ
Figure 15. ADSL/ADSL2+ Circuit
Rev. 0 | Page 6 of 12
06477-021
10
87Ω
2kΩ
25
06477-054
DIFFERENTIAL OUTPUT (V p-p)
40
06477-047
INPUT
CHANNEL 1
AD8392A
THEORY OF OPERATION
Of course, for a real amplifier there are additional poles that
contribute excess phase, and there is a value for RF below which
the amplifier is unstable. Tolerance for peaking and desired
flatness determines the optimum RF in each application.
RF
The open-loop transimpedance is analogous to the open-loop
voltage gain of a voltage feedback amplifier. Figure 16 shows a
simplified model of a current feedback amplifier. Because RIN is
proportional to 1/gm, the equivalent voltage gain is TZ × gm,
where gm is the transconductance of the input stage. Basic
analysis of the follower with gain circuit yields
RG
RIN
IIN
G = 1+
R IN =
RF
RG
1
≈ 50 Ω
gm
VOUT
RN
VIN
VO
TZ (S )
= G×
VIN
TZ (S ) + G × RIN + RF
where:
TZ
06477-022
The AD8392A is a current feedback amplifier with high
(500 mA) output current capability. With a current feedback
amplifier, the current into the inverting input is the feedback
signal, and the open-loop behavior is that of a transimpedance,
dVO/dIIN or TZ.
Figure 16. Simplified Block Diagram
The AD8392A is capable of delivering 500 mA of output
current while swinging to within 2 V of either power supply
rail. The AD8392A also has a power management system
included on-chip. It features four user-programmable power
levels (three active power modes as well as the provision for
complete shutdown).
Because G × RIN << RF for low gains, a current feedback
amplifier has relatively constant bandwidth vs. gain, the 3 dB
point being set when |TZ| = RF.
Rev. 0 | Page 7 of 12
AD8392A
APPLICATIONS
SUPPLIES, GROUNDING, AND LAYOUT
The information in Table 3 and Figure 3 is based on a standard
JEDEC 4-layer board and a maximum die temperature of 150°C.
To provide additional guidance and design suggestions, a
thermal study was performed under a set of conditions more
closely aligned with an actual ADSL/ADSL2+ application.
The AD8392A can be powered from either single or dual
supplies, with the total supply voltage ranging from 10 V to
24 V. For optimum performance, a well regulated low ripple
supply should be used.
As with all high speed amplifiers, close attention should be paid
to supply decoupling, grounding, and overall board layout. Low
frequency supply decoupling should be provided with 10 μF
tantalum capacitors from each supply to ground. In addition, all
supply pins should be decoupled with 0.1 μF quality ceramic
chip capacitors placed as close as possible to the driver. An
internal low impedance ground plane should be used to provide
a common ground point for all driver and decoupling capacitor
ground requirements. Whenever possible, separate ground
planes should be used for analog and digital circuitry.
High speed layout techniques should be followed to minimize
parasitic capacitance around the inverting inputs. Some practical
examples of these techniques are keeping feedback traces as
short as possible and clearing away ground plane in the area of
the inverting inputs. Input and output traces should be kept
short and as far apart from each other as practical to avoid
crosstalk. When used as a differential driver, all differential
signal traces should be kept as symmetrical as possible.
POWER MANAGEMENT
In a typical ADSL/ADSL2+ line card, component density
usually dictates that most of the copper plane used for thermal
dissipation be internal. Additionally, each ADSL/ADSL2+ port
may be allotted only 1 square inch, or even less, of board space.
For these reasons, a special thermal test board was constructed
for this study. The 4-layer board measured approximately
4 inches × 4 inches and contained two internal 1 oz copper
ground planes, each measuring 2 inches × 3 inches. The top
layer contained signal traces and an exposed copper strip
¼ inch × 3 inches to accommodate heat sinking, with no
other copper on the top or bottom of the board.
Three 28-lead TSSOPs were placed on the board representing
six ADSL channels, or one channel per square inch of copper,
with each channel dissipating 700 mW on-chip (1.4 W per
package). The die temperature is then measured in still air and
in a wind tunnel with calibrated airflow of 100 LFM, 200 LFM,
and 400 LFM. Figure 17 shows the power dissipation vs. the
ambient temperature for each airflow condition. The figure
assumes a maximum die temperature of 135°C. No heat sink
was used.
The AD8392A can be configured in any of three active bias
states as well as a shutdown state via the use of two sets of
digitally programmable logic pins. Pin PD0 (1, 2) and Pin PD1
(1, 2) control Amplifier 1 and Amplifier 2, while PD0 (3, 4) and
Pin PD1 (3, 4) control Amplifier 3 and Amplifier 4. These pins
can be controlled directly with either 3.3 V or 5 V CMOS logic
by using the GND pins as a reference. If left unconnected, the
PD pins float low, placing the amplifier in the full bias mode.
Refer to the Specifications for the per amplifier quiescent
current for each of the available bias states.
4.5
TJ = 135°C
4.0
POWER DISSIPATION (W)
400LFM
3.5
200LFM
3.0
2.5
STILL AIR
2.0
100LFM
1.0
5
15
25
35
45
55
65
AMBIENT TEMPERATURE (°C)
75
85
06477-051
1.5
As is shown in Figure 13, the AD8392A exhibits low output
impedance for the three active states. The shutdown state
(PD1, PD0 = 1, 1) provides a high impedance output.
Figure 17. Power Dissipation vs. Ambient
Temperature and Air Flow 28-Lead TSSOP/EP
THERMAL CONSIDERATIONS
When using a quad, high output current amplifier, such as the
AD8392A, special consideration should be given to system level
thermal design. In applications such as the ADSL/ADSL2+,
the AD8392A could be required to dissipate as much as 1.4 W
or more on-chip. Under these conditions, particular attention
should be paid to the thermal design to maintain safe operating
temperatures on the die. To aid in the thermal design, the
thermal information in the Thermal Resistance section can
be combined with what follows here.
This data is only provided as guidance to assist in the thermal
design process. Due diligence should be performed with regards
to power dissipation because there are many factors that can
affect thermal performance.
Rev. 0 | Page 8 of 12
AD8392A
TYPICAL ADSL/ADSL2+ APPLICATION
Additional definitions for calculating resistor values include:
In a typical ADSL/ADSL2+ application, a differential line driver
is used to take the signal from the analog front end (AFE) and
drive it onto the twisted pair telephone line. Referring to the
typical circuit representation in Figure 18, the differential input
appears at VIN+ and VIN− from the AFE, while the differential
output is transformer coupled to the telephone line at tip and
ring. The common-mode operating point, generally midway
between the supplies, is set through VCOM.
Value
Definition
VOA
Voltage at the amplifier outputs
k
Matching resistance reduction factor
AV
Gain from VIN to transformer primary
Negative feedback factor
β
Positive feedback factor
α
Note: R1 must be calculated before β and α.
R3
R4
VOA =
VOA
VP
RIN
R4
Rm
RING
VOA
R3
Figure 18. Typical ADSL/ADSL2+ Application Circuit
In ADSL/ADSL2+ applications, it is common practice to
conserve power by using positive feedback to synthesize the
output resistance, thereby lowering the required ohmic value
of the line matching resistors, Rm. The circuit in Figure 18 is
somewhat unique in that the positive feedback introduced via
R3 has the effect of synthesizing the input resistance as well.
The following definitions and equations can be used to calculate
the resistor values necessary to obtain the desired gain, input
resistance, and output resistance for a given application. For
simplicity, the following calculations assume a lossless
transformer.
R2
VP
RL
AV =
R1
R1 + 2 R2
VLINE
N VIN
α = β (1 − k )
R1 =
2VP R2
VOA − VP
R4 =
R IN (VIN − VP )
2 VIN
R3 =
AV R4 (2 R1 Rm + R1 RL − α R1 RL − 2α R2 RL )
α RL (R1 + 2 R2 )
R BIAS =
α R3 R4
R4 − α (R3 + R4 )
After building the circuit with the closest 1% resistor values,
the actual gain, input resistance, and output resistance can be
verified with the following equations.
The following values are used in the design equations and are
assumed already known or chosen by the designer.
Value
VIN
RIN
N
VLINE
Rm
2 Rm
RL
With the above known quantities and definitions, the remaining
resistors can readily be calculated.
R2
VP
k=
ROUT
1:N
R1
RBIAS
VIN–
β=
R2
VCOM
VLINE (1 + k )
N
TIP
Rm
RBIAS
06477-024
VIN+
Definition
Differential input voltage
Desired differential input resistance
Transformer turns ratio
Differential output voltage at tip and ring
Each is typically 5% to 15% of the transformer reflected
line impedance
Recommended in the amplifier data sheet
Voltage at the + inputs to the amplifier, approximately
½ VIN (must be less than VIN for positive input resistance)
Transformer reflected line impedance
Rev. 0 | Page 9 of 12
GAIN (VIN to LINE ) =
R IN =
N
R4 ⎞ R4
⎛ R4
β (k + 1)⎜1 +
+
⎟−
R3
R
BIAS ⎠ R3
⎝
2
⎛ 2 Rm + RL
1
− AV β⎜⎜
R4
⎝ R4 RL
ROUT =
⎞
⎟
⎟
⎠
2 Rm N 2
⎛
⎜
⎞⎜
⎛ R4 R BIAS
R1 + 2R2
⎟
1 − ⎜⎜
⎟⎜
R4 R BIAS
(
)
+
R1
R4
R
BIAS
⎠ R3 +
⎝
⎜
+ R BIAS
R4
⎝
⎞
⎟
⎟
⎟
⎟
⎠
AD8392A
0
MULTITONE POWER RATIO
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
Figure 20. MTPR at 1.966 MHz
0
–10
–20
–30
–50
–60
–70
–80
–90
CENTER 646.9kHz
SPAN 10kHz
06477-043
(dBm)
–40
–100
CENTER 1.9664kHz
Figure 19. MTPR at 647 kHz
Rev. 0 | Page 10 of 12
SPAN 10kHz
06477-044
(dBm)
The DMT signal used in ADSL/ADSL2+ systems carries data in
discrete tones or bins, which appear in the frequency domain in
evenly spaced 4.3125 kHz intervals. In applications using this
type of waveform, multitone power ratio (MTPR) is a commonly
used measure of linearity. MTPR is defined as the measured
difference from the peak of one tone that is loaded with data to
the peak of an adjacent tone that is intentionally left empty.
Figure 19 and Figure 20 show the AD8392A MTPR for a 5.5
crest factor waveform for empty bins in the ADSL and extended
ADSL2+ bandwidths.
AD8392A
OUTLINE DIMENSIONS
9.80
9.70
9.60
3.55
3.50
3.45
15
28
4.50
4.40
4.30
1
3.05
3.00
2.95
EXPOSED
PAD
(Pins Up)
6.40
BSC
14
BOTTOM VIEW
TOP VIEW
1.05
1.00
0.80
0.15
0.05
0.65 BSC
SEATING
PLANE
COPLANARITY
0.10
8°
0°
0.20
0.09
0.30
0.19
0.75
0.60
0.45
050806-A
1.20 MAX
COMPLIANT TO JEDEC STANDARDS MO-153-AET
Figure 21. 28-Lead Thin Shrink Small Outline with Exposed Pad [TSSOP/EP]
(RE-28-1)
Dimensions shown in millimeters
0.60 MAX
5.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
TOP
VIEW
0.50
BSC
4.75
BSC SQ
0.50
0.40
0.30
32
1
3.25
3.10 SQ
2.95
EXPOSED
PAD
(BOTTOM VIEW)
17
16
9
8
0.25 MIN
3.50 REF
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
PIN 1
INDICATOR
25
24
0.05 MAX
0.02 NOM
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 22. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad (CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8392AAREZ 1
AD8392AAREZ-RL1
AD8392AAREZ-R71
AD8392AACPZ-R21
AD8392AACPZ-RL1
AD8392AACPZ-R71
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Z = Pb-free part.
Rev. 0 | Page 11 of 12
Package Option
RE-28-1
RE-28-1
RE-28-1
CP-32-2
CP-32-2
CP-32-2
AD8392A
NOTES
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06477-0-10/06(0)
Rev. 0 | Page 12 of 12
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