PILOT TECHNICAL DATASHEET ABLEBOND® 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC performance on QFN type packages. ABLEBOND 8200C adhesive is a new version of the RP-751 series that provides improved MRT on silver and pre-plated leadframe. FEATURES • HIgh electrical conductivity • Excellent adhesion to silver and pre-plated leadframe • Oven and snap curable Typical Uncured Properties Filler Type 8200C Silver Viscosity @ 25ºC 11,500 cP Thixotropic Index 5.0 Work Life @ 25ºC 24 hours Est. Storage Life @ -40ºC 1 year Cure Process Data 8200C Weight Loss on Cure Recommended Cure Condition Snap Cure Profile Chloride Sodium Potassium Weight Loss @ 300ºC ATM-0018 Viscosity @ 0.5/Viscosity @ 5 rpm ATM-0089 25% increase in viscosity @ RT ATM-0087 Test Method Test Description 10 x 10 mm Si die on glass slide ATM-0031 30 minutes ramp to 175ºC + 15 minutes @ 175ºC 1 2 3 4 5 6 7 Time Temp ºC 140 150 160 200 220 220 220 120 sec N2 Flow Physiochemical Properties - Post Cure Brookfield CP51 @ 5 rpm ATM-0068 7% Zone Number Ionics Test Method Test Description 8200C < 10 ppm < 10 ppm < 10 ppm 1% 10 liters/minute @ 150ºC Test Description Test Method Teflon flask 5 gm sample / 20-40 mesh 50 gm DI water 100ºC for 24 hours ATM-0007 Thermogravimetric Analysis ATM-0073 Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our Standard Release Specification. This is a Pilot product that has been converted to high volume manufacturing and is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly. 02/06 Page 1 of 3 8200C Physiochemical Properties - Post Cure Glass Transition Temperature Coefficient of Thermal Expansion Dynamic Tensile Modulus Moisture Absorption @ Saturation Thermal/Electrical PropertiesPost Cure Volume Resistivity Thermal Conductivity Mechanical PropertiesPost Cure Die Shear Strength (kgf/die) vs. Temperature Chip Warpage @ 25ºC vs. Chip Size Chip Warpage 8200C Test Description Test Method 190ºC Dynamic mechanical thermal analysis ATM-0112 Below Tg 60 ppm/ºC Above Tg 130 ppm/ºC @ 25ºC 4630 MPa (670,000 psi) @ 150ºC 1170 MPa (170,000 psi) @ 250ºC 780 MPa (110,000 psi) TMA expansion mode Dynamic mechanical thermal analysis using < 0.5mm thick sample Dynamic vapor sorption after 85ºC/ 85% RH exposure 0.20% 8200C Test Description 0.00017 ohm-cm 1.2 W/mK ATM-0116 3 x 3 mm (120 x 120 mil) Si die on SPCLF Warpage 7.6x7.6mm (300 x 300 mil) 16 µm 0.38mm (15mil) thick Si die on 0.2mm Ag/Cu LF Post Dia Attach Cure 6.7 µm Post Mold Bake (4 hrs @ 175ºC) 10.9 µm Please check the state of the ABLECUBE to ensure the integrity of the shipment. If the ABLECUBE has melted upon Receiving Inspection, place the entire shipment in a -40°C freezer and contact your Ablestik Customer Service or Sales Representative. Test Method Laser Flash Chip Size APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at -80°C. Inside every dry ice shipment of Ablestik’s products is a small packet containing the ABLECUBE. This is a small blue cube which retains its shape at -40°C. If the ABLECUBE is exposed to temperatures higher than -40°C, the cube will melt. ATM-0093 ATM-0020 Test Description 19.1 kg ATM-0112 4-point probe 8200C @25ºC ATM-0055 Test Method ATM-0052 ATM-0059 ATM-0059 UNPACKING Transfer the syringes from the dry ice to a -40°C freezer without ANY delays. Freeze-thaw voids will form in the syringes if the syringes are repeatedly thawed and refrozen. STORAGE This Ablestik product must be stored at -40°C. The shelf life of the material is only valid when the material has been stored at the specified storage condition. Incorrect storage conditions will degrade the performance of the material in both handling (e.g. dispensing or screen printing) and final cured properties. Page 2 of 3 8200C THAWING Allow the container to reach room temperature before use. After removing from the freezer, set the syringes to stand vertically while thawing. Refer to Syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. DO NOT re-freeze. Once thawed to room temperature, the adhesive should not be re-frozen. ADHESIVE APPLICATION Thawed adhesive should be immediately placed on dispense equipment for use. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive. Adhesive must be completely used within the product’s recommended work life of >24 hours. Apply enough adhesive to achieve a 25-50 µm (1-2 mil) wet bondline thickness, dispensed with approximately 25% - 50% filleting on all sides of the die. Alternate dispense amounts may be used depending on the application requirements. Star or cross shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern. Contact Ablestik Technical Service Department for detailed recommendation on adhesive application, including dispensing. CURE This adhesive can be cured in box or in-line ovens. The recommended box oven cure temperature for this adhesive is 175°C. AVAILABILITY ABLEBOND® adhesives are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Ablestik Standard Package Data Set or contact your Customer Service Representative. CAUTION: This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur, wash area immediately with soap and water. Please refer to the Material Safety Data Sheet for more details. 20021 Susana Road, Rancho Dominguez, CA 90221 (310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783 For a technical contact nearest you, visit www.ablestik.com The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every case we recommend that purchasers before using any product conduct their own tests to determine whether the product is suitable for their particular purposes under their own operating conditions. No representative of ours has any authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without the authority from the owner of this patent. These materials are not designed or manufactured for implantation in the human body. Approval from FDA for such use as part of any product to be implanted in the human body has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American Chemistry Council’s Responsible Care® program. Page 3 of 3