MC10EL58, MC100EL58 5.0 VECL 2:1 Multiplexer Description The MC10EL/100EL58 is a 2:1 multiplexer. The device is functionally equivalent to the E158 device with higher performance capabilities. With propagation delays and output transition times significantly faster than the E158, the EL58 is ideally suited for those applications which require the ultimate in AC performance. The 100 Series contains temperature compensation. • 230 ps Propagation Delay • PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V • NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to • • −5.7 V Internal Input Pulldown Resistors on Da, Db, and SEL Pb−Free Packages are Available MARKING DIAGRAMS* 8 1 SOIC−8 D SUFFIX CASE 751 8 8 HEL58 ALYW G 1 1 8 8 1 1 Da 2 Db 3 1 8 VCC 7 Q 6 Q 1 MUX SEL 0 4 5 8 HL58 ALYWG G 4Z M G G NC TSSOP−8 DT SUFFIX CASE 948R KEL58 ALYW G 1 4 1 KL58 ALYWG G 2O M G G Features http://onsemi.com 1 4 DFN8 MN SUFFIX CASE 506AA VEE H = MC10 K = MC100 4Z = MC10 2O = MC100 A = Assembly Location Figure 1. Logic Diagram and Pin Assignment L Y W M G = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 7 1 Publication Order Number: MC10EL58/D MC10EL58, MC100EL58 Table 1. PIN DESCRIPTION PIN FUNCTION Da, Db Q, Q SEL VCC VEE NC ECL Data Inputs ECL Data Outputs ECL Select Input Positive Supply Negative Supply No Connect EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Table 2. FUNCTION TABLE SEL* Data H L a b * Pin will default low when left open. Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor ESD Protection N/A Human Body Model Machine Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 1 kV > 100 V Level 1 UL 94 V−0 @ 0.125 in 45 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. Refer to Application Note AND8003/D for additional information. http://onsemi.com 2 MC10EL58, MC100EL58 Table 4. MAXIMUM RATINGS Rating Unit VCC Symbol PECL Mode Power Supply Parameter Condition 1 VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder 265 265 °C Pb Pb−Free Condition 2 VI VCC VI VEE 0 lfpm 500 lfpm <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 5. 10EL SERIES PECL DC CHARACTERISTICS VCC= 5.0 V; VEE= 0.0 V (Note 2) −40°C Symbol Characteristic Typ Max 14 17 3920 4010 4110 Output LOW Voltage (Note 3) 3050 3200 VIH Input HIGH Voltage VIL Input LOW Voltage IIH Input HIGH Current IIL Input LOW Current IEE Power Supply Current VOH Output HIGH Voltage (Note 3) VOL Min 25°C Min 85°C Typ Max 14 17 4020 4105 4190 3350 3050 3210 3770 4110 3050 3500 Typ Max Unit 14 17 mA 4090 4185 4280 mV 3370 3050 3227 3405 mV 3870 4190 3940 4280 mV 3050 3520 3050 3555 mV 150 mA 150 0.5 Min 150 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.06 V / −0.5 V. 3. Outputs are terminated through a 50 ohm resistor to VCC−2 volts. http://onsemi.com 3 MC10EL58, MC100EL58 Table 6. 10EL SERIES NECL DC CHARACTERISTICS VCC= 0.0 V; VEE= −5.0 V (Note 4) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 14 17 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 5) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 5) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV VIH Input HIGH Voltage −1230 −890 −1130 −810 −1060 −720 mV VIL Input LOW Voltage −1950 −1500 −1950 −1480 −1950 −1445 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 150 0.5 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary +0.06 V / −0.5 V. 5. Outputs are terminated through a 50 ohm resistor to VCC−2 volts. Table 7. 100EL SERIES PECL DC CHARACTERISTICS VCC= 5.0 V; VEE= 0.0 V (Note 6) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 16 19 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 7) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 7) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV VIH Input HIGH Voltage 3835 4120 3835 4120 3835 4120 mV VIL Input LOW Voltage 3190 3525 3190 3525 3190 3525 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 7. Outputs are terminated through a 50 ohm resistor to VCC−2 volts. http://onsemi.com 4 MC10EL58, MC100EL58 Table 8. 100EL SERIES NECL DC CHARACTERISTICS VCC= 0.0 V; VEE= −5.0 V (Note 8) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 16 19 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 9) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 9) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage −1810 −1475 −1810 −1475 −1810 −1475 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 9. Outputs are terminated through a 50 ohm resistor to VCC−2 volts. Table 9. AC CHARACTERISTICS VCC= 5.0 V; VEE= 0.0 V or VCC= 0.0 V; VEE= −5.0 V (Note 10) −40°C Symbol Characteristic Min fmax Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output tJITTER Random Clock Jitter (RMS) tr tf Output Rise/Fall Times Q (20% − 80%) D to Q SEL to Q Typ 25°C Max Min 85°C Typ Max Min Typ Max 1.5 60 90 220 250 380 410 120 150 GHz 230 260 340 370 140 170 250 280 360 390 0.9 100 225 350 100 Unit ps ps 225 350 100 225 350 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. 10 Series: VEE can vary +0.06 V / −0.5 V. 100 Series: VEE can vary +0.8 V / −0.5 V. Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 3.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) http://onsemi.com 5 MC10EL58, MC100EL58 ORDERING INFORMATION Package Shipping† SOIC−8 98 Units / Rail MC10EL58DG SOIC−8 (Pb−Free) 98 Units / Rail MC10EL58DR2 SOIC−8 2500 / Tape & Reel MC10EL58DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10EL58DT TSSOP−8 100 Units / Rail MC10EL58DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10EL58DTR2 TSSOP−8 2500 / Tape & Reel MC10EL58DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC10EL58MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel SOIC−8 98 Units / Rail MC100EL58DG SOIC−8 (Pb−Free) 98 Units / Rail MC100EL58DR2 SOIC−8 2500 / Tape & Reel MC100EL58DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100EL58DT TSSOP−8 100 Units / Rail MC100EL58DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100EL58DTR2 TSSOP−8 2500 / Tape & Reel MC100EL58DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC100EL58MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC10EL58D MC10EL58MNR4G MC100EL58D MC100EL58MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 6 MC10EL58, MC100EL58 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EL58, MC100EL58 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF S M T U V S 0.25 (0.010) B −U− 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 8 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10EL58, MC100EL58 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 0.10 C TOP VIEW 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10EL58/D