Linear Dimensions LTM8048 Dual 8a per channel low vin dc/dc î¼module regulator Datasheet

LTM4616
Dual 8A per Channel Low
VIN DC/DC µModule Regulator
DESCRIPTION
FEATURES
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Complete Dual DC/DC Regulator System
Input Voltage Range: 2.7V to 5.5V
Dual 8A Outputs, or Single 16A Output with a 0.6V
to 5V Range
Output Voltage Tracking and Margining
±1.75% Total DC Output Error (–55°C to 125°C)
Current Mode Control/Fast Transient Response
Power Good Tracking and Margining
Overcurrent/Thermal Shutdown Protection
Onboard Frequency Synchronization
Spread Spectrum Frequency Modulation
Multiphase Operation
Selectable Burst Mode® Operation
Output Overvoltage Protection
RoHS Compliant with Pb-Free Finish,
Gold Finish LGA (e4) or SAC 305 BGA (e1)
Small Surface Mount Footprint, Low Profile
(15mm × 15mm × 2.82mm) LGA and
(15mm × 15mm × 3.42mm) BGA Packages
APPLICATIONS
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Telecom, Networking and Industrial Equipment
Storage and ATCA, PCI Express Cards
Battery Operated Equipment
L, LT, LTC, LTM, Linear Technology, the Linear logo, Burst Mode, µModule and PolyPhase
are registered trademarks and LTpowerCAD is a trademark of Linear Technology Corporation.
All other trademarks are the property of their respective owners. Protected by U.S. Patents,
including 5481178, 6580258, 6304066, 6127815, 6498466, 6611131, 6724174.
The LTM®4616 is a complete dual 2-phase 8A per channel
switch mode DC/DC power regulator system in a 15mm
× 15mm surface mount LGA or BGA package. Included
in the package are the switching controller, power FETs,
inductor and all support components. Operating from an
input voltage range of 2.7V to 5.5V, the LTM4616 supports
two outputs within a voltage range of 0.6V to 5V, each set
by a single external resistor. This high efficiency design
delivers up to 8A continuous current (10A peak) for each
output. Only bulk input and output capacitors are needed,
depending on ripple requirement. The part can also be
configured for a 2-phase single output at up to 16A.
The low profile package enables utilization of unused space
on the back side of PC boards for high density point-ofload regulation.
Fault protection features include overvoltage protection,
overcurrent protection and thermal shutdown. The power
module is offered in space saving and thermally enhanced
15mm × 15mm × 2.82mm LGA and 15mm × 15mm ×
3.42mm BGA packages. The LTM4616 is RoHS compliant
with Pb-free finish.
Different Combinations of Input and Output
Number of Inputs
Number of Outputs
IOUT (MAX)
2
2
8A, 8A
2
1
16A
1
2
8A, 8A
1
1
16A
TYPICAL APPLICATION
Efficiency vs Load Current
Dual Output DC/DC µModule Regulator
®
VIN1
VOUT1
FB1
10µF
VIN2 3.3V TO 5V
VOUT1
3.3V/8A
LTM4616
2.21k
100µF
ITHM1
VIN2
VOUT2
2.5V/8A
VOUT2
FB2
10µF
3.09k
100µF
5VIN 3.3VOUT
90
EFFICIENCY (%)
VIN1 5V
95
5VIN 2.5VOUT
85
80
75
ITHM2
GND1
GND2
70
4616 TA01a
0
2
4
6
LOAD CURRENT (A)
8
4616 TA01b
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1
LTM4616
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VIN1, SVIN1, VIN2, SVIN2................................. –0.3V to 6V
CLKOUT1, CLKOUT2..................................... –0.3V to 2V
PGOOD1, PLLLPF1, CLKIN1, PHMODE1,
MODE1, PGOOD2, PLLLPF2, CLKIN2,
PHMODE2, MODE2...................................... –0.3V to VIN
ITH1, ITHM1, RUN1, FB1, TRACK1, MGN1,
BSEL1, ITH2 , ITHM2 , RUN2, FB2, TRACK2,
MGN2, BSEL2.............................................. –0.3V to VIN
VOUT1, VOUT2 , SW1, SW2............................. –0.3V to VIN
Internal Operating Temperature Range (Note 2)
E- and I-Grades................................... –40°C to 125°C
MP-Grade........................................... –55°C to 125°C
Junction Temperature............................................ 125°C
Storage Temperature Range................... –55°C to 125°C
PIN CONFIGURATION
VIN2
TOP VIEW
TOP VIEW
SGND2 CLKOUT2
ITH2
RUN2
SGND2 CLKOUT2
ITH2
RUN2
VIN2
VOUT2
SVIN2
PLLLPF2
BSEL2
RUN1
SVIN1
PLLLPF1
VIN1
SW1
TRACK2
L
ITHM2
K
FB2
FB2
J
SW2
GND2
H
MODE2
G
PGOOD2
F
ITH1
SGND1
TRACK1
E
VOUT1
D
C
A
MGN2
CLKOUT1
ITHM1
2
3
4
5
6
CLKIN1
7
8
9
10
11
BSEL2
RUN1
SVIN1
PLLLPF1
VIN1
SW1
BSEL1
GND2
H
MODE2
G
PGOOD2
F
ITH1
SGND1
TRACK1
E
VOUT1
D
C
MGN2
CLKOUT1
ITHM1
MGN1
1
12
PHMODE2
FB1
GND1
PGOOD1
B
A
MGN1
1
CLKIN2
PHMODE2
FB1
GND1
PGOOD1
B
BSEL1
PLLLPF2
ITHM2
J
SW2
SVIN2
TRACK2
L
K
CLKIN2
VOUT2
M
M
2
3
4
5
6
CLKIN1
MODE1 PHMODE1
7
8
9
10
11
12
MODE1 PHMODE1
BGA PACKAGE
144-LEAD (15mm × 15mm × 3.42mm)
LGA PACKAGE
144-LEAD (15mm × 15mm × 2.82mm)
TJMAX = 125°C, θJA = 10.5°C/W, θJCbottom = 2°C/W, θJCtop = 16°C/W, WEIGHT = 1.8g
θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS
TJMAX = 125°C, θJA = 10.5°C/W, θJCbottom = 2°C/W, θJCtop = 16°C/W, WEIGHT = 2.0g
θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS
ORDER INFORMATION
LEAD FREE FINISH
TRAY
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE (NOTE 2)
LTM4616EV#PBF
LTM4616EV#PBF
LTM4616V
144-Lead (15mm × 15mm × 2.82mm) LGA
–40°C to 125°C
LTM4616IV#PBF
LTM4616IV#PBF
LTM4616V
144-Lead (15mm × 15mm × 2.82mm) LGA
–40°C to 125°C
LTM4616MPV#PBF
LTM4616MPV#PBF
LTM4616V
144-Lead (15mm × 15mm × 2.82mm) LGA
–55°C to 125°C
LTM4616EY#PBF
LTM4616EY#PBF
LTM4616Y
144-Lead (15mm × 15mm × 3.42mm) BGA
–40°C to 125°C
LTM4616IY#PBF
LTM4616IY#PBF
LTM4616Y
144-Lead (15mm × 15mm × 3.42mm) BGA
–40°C to 125°C
LTM4616MPY#PBF
LTM4616MPY#PBF
LTM4616Y
144-Lead (15mm × 15mm × 3.42mm) BGA
–55°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
This product is only offered in trays. For more information go to: http://www.linear.com/packaging/
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LTM4616
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 2). TA = 25°C, VIN = 5V unless otherwise noted. Per the typical application in Figure 18. Specified
as each channel (Note 3).
SYMBOL
PARAMETER
VIN1(DC), VIN2(DC)
Input DC Voltage
VOUT1(DC), VOUT2(DC) Output Voltage, Total Variation
with Line and Load
CONDITIONS
MIN
l
CIN = 10µF × 1, COUT = 100µF Ceramic,
100µF POSCAP, RFB = 6.65k, MODE = 0V
VIN = 2.7V to 5.5V,
IOUT = IOUT(DC)MIN to IOUT(DC)MAX (Note 4)
l
TYP
2.7
MAX
UNITS
5.5
V
1.472
1.49
1.508
V
1.464
1.49
1.516
V
2.05
1.85
2.2
2.0
2.35
2.15
V
V
Input Specifications
VIN1(UVLO),
VIN2(UVLO)
Undervoltage Lockout Threshold
SVIN Rising
SVIN Falling
IQ(VIN1, VIN2)
Input Supply Bias Current
VIN = 3.3V, VOUT = 1.5V, No Switching, MODE = VIN
VIN = 3.3V, VOUT = 1.5V, No Switching, MODE = 0V
VIN = 3.3V, VOUT = 1.5V, Switching Continuous
400
1.15
55
µA
mA
mA
VIN = 5V, VOUT = 1.5V, No Switching, MODE = VIN
VIN = 5V, VOUT = 1.5V, No Switching, MODE = 0V
VIN = 5V, VOUT = 1.5V, Switching Continuous
450
1.3
75
µA
mA
mA
1
µA
4.5
2.93
A
A
Shutdown, RUN = 0, VIN = 5V
IS(VIN1, VIN2)
Input Supply Current
VIN = 3.3V, VOUT = 1.5V, IOUT = 8A
VIN = 5V, VOUT = 1.5V, IOUT = 8A
Output Specifications
IOUT1(DC), IOUT2(DC)
Output Continuous Current Range VOUT = 1.5V (Note 4)
VIN = 3.3V, 5.5V
VIN = 2.7V
ΔVOUT1(LINE)/VOUT1
ΔVOUT2(LINE)/VOUT2
Line Regulation Accuracy
VOUT = 1.5V, VIN from 2.7V to 5.5V, IOUT = 0A
l
0.1
0.25
%/V
ΔVOUT1(LOAD)/VOUT1
ΔVOUT2(LOAD)/VOUT2
Load Regulation Accuracy
VOUT = 1.5V (Note 4)
VIN = 3.3V, 5.5V, ILOAD = 0A to 8A
VIN = 2.7V, ILOAD = 0A to 5A
l
l
0.3
0.3
0.5
0.5
%
%
0
0
8
5
A
A
VOUT1(AC), VOUT2(AC) Output Ripple Voltage
IOUT = 0A, COUT = 100µF X5R Ceramic, VIN = 5V,
VOUT = 1.5V
fS1, fS2
Switching Frequency
IOUT = 8A, VIN = 5V, VOUT = 1.5V
fSYNC1, fSYNC2
SYNC Capture Range
ΔVOUT1(START),
ΔVOUT2(START)
Turn-On Overshoot
COUT = 100µF, VOUT = 1.5V, IOUT = 0A
VIN = 3.3V
VIN = 5V
10
10
tSTART1, tSTART2
Turn-On Time
COUT = 100µF, VOUT = 1.5V, VIN = 5V,
IOUT = 1A Resistive Load, Track = VIN
100
µs
ΔVOUT1(LS),
ΔVOUT2(LS)
Peak Deviation for Dynamic Load Load: 0% to 50% to 0% of Full Load,
COUT = 100µF Ceramic x2, 470µF POSCAP,
VIN = 5V, VOUT = 1.5V
20
mV
tSETTLE1, tSETTLE2
Settling Time for Dynamic Load
Step
Load: 0% to 50% to 0% of Full Load, VIN = 5V,
VOUT = 1.5V, COUT = 100µF
10
µs
IOUT1(PK), IOUT2(PK)
Output Current Limit
COUT = 100µF
VIN = 2.7V, VOUT = 1.5V
VIN = 3.3V, VOUT = 1.5V
VIN = 5V, VOUT = 1.5V
8
11
13
A
A
A
10
1.25
1.5
0.75
mVP-P
1.75
MHz
2.25
MHz
mV
mV
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LTM4616
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 2). TA = 25°C, VIN = 5V unless otherwise noted. Per the typical application in Figure 18. Specified
as each channel (Note 3).
SYMBOL
PARAMETER
CONDITIONS
Voltage at FB Pin
IOUT = 0A, VOUT = 1.5V, VIN = 2.7V to 5.5V
MIN
TYP
MAX
UNITS
0.590
0.587
0.596
0.596
0.602
0.606
V
V
Control Section
FB1, FB2
l
SS Delay
Internal Soft-Start Delay
IFB1, IFB2
VRUN1, VRUN2
RUN Pin On/Off Threshold
RUN Rising
RUN Falling
TRACK1, TRACK2
Tracking Threshold (Rising)
Tracking Threshold (Falling)
Tracking Disable Threshold
RUN = VIN
RUN = 0V
RFBHI1, RFBHI2
Resistor Between VOUT and FB
Pins
1.4
1.3
90
µs
0.2
µA
1.55
1.4
1.7
1.5
0.57
0.18
VIN – 0.5
9.95
ΔVPGOOD1, ΔVPGOOD2 PGOOD Range
10
V
V
V
10.05
±10
IPGOOD1, IPGOOD2
PGOOD Leakage Current
VPGOOD = VIN = 2.7V to 5.5V, IOUT = IOUT(DC)MAX
(Note 4)
VPGL1, VPGL2
PGOOD Voltage Low
IPGOOD = 5mA
%Margining
Output Voltage Margining
Percentage
MGN = VIN , BSEL = 0V
MGN = VIN , BSEL = VIN
MGN = VIN , BSEL = Float
MGN = 0V, BSEL = 0V
MGN = 0V, BSEL = VIN
MGN = 0V, BSEL = Float
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTM4616 is tested under pulsed load conditions, such that
TJ ≈ TA. The LTM4616E is guaranteed to meet performance specifications
over the 0°C to 125°C internal operating temperature range. Specifications
over the –40°C to 125°C internal operating temperature range are assured
by design, characterization and correlation with statistical process
controls. The LTM4616I is guaranteed to meet specifications over the
–40°C to 125°C internal operating temperature range. The LTM4616MP
is guaranteed and tested over the –55°C to 125°C internal operating
temperature range. Note that the maximum ambient temperature
consistent with these specifications is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors.
l
4
9
14
–4
–9
–14
V
V
kΩ
%
20
30
µA
0.2
0.4
V
5
10
15
–5
–10
–15
6
11
16
–6
–11
–16
%
%
%
%
%
%
Note 3: Two channels are tested separately and the same testing
conditions are applied to each channel.
Note 4: See Output Current Derating curves for different VIN, VOUT and TA.
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LTM4616
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs Load Current
Efficiency vs Load Current
100
CONTINUOUS MODE
100
CONTINUOUS MODE
95
90
90
90
85
80
5VIN 1.2VOUT
5VIN 1.5VOUT
5VIN 1.8VOUT
5VIN 2.5VOUT
5VIN 3.3VOUT
70
0
2
4
LOAD CURRENT
EFFICIENCY (%)
95
75
85
80
3.3VIN 1.2VOUT
3.3VIN 1.5VOUT
3.3VIN 1.8VOUT
3.3VIN 2.5VOUT
75
6
70
8
0
2
4
LOAD CURRENT
6
70
60
VOUT = 1.5V
VOUT = 2.5V
VOUT = 3.3V
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
LOAD CURRENT (A)
Supply Current vs VIN
VO = 1.2V PULSE-SKIPPING MODE
1
0.8
1
4
3
2
5
LOAD CURRENT (A)
3.5
3.5
3.0
3.0
2.5
2.5
2.0
1.5
1.0
0.5
0
2
3
4
VIN (V)
5
2.0
1.5
1.0
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
IOUT = 8A
VOUT = 1.2V
VOUT = 1.5V
7
6
6
0
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
IOUT = 6A
VOUT = 1.2V
VOUT = 1.5V
0.5
2
3
4
VIN (V)
4616 G05
5
6
4616 G06
Load Transient Response
ILOAD
1A/DIV
ILOAD
1A/DIV
0A
0A
VOUT
50mV/DIV
VOUT
50mV/DIV
VO = 1.2V Burst Mode OPERATION
0.4
4616 G08
VIN = 5V
20µs/DIV
VOUT = 3.3V
2A/µs STEP
COUT = 2 × 100µF X5R, 470µF 4V POSCAP
0.2
0
0
VIN to VOUT Step-Down Ratio
4.0
Load Transient Response
1.4
0.6
2.7VIN 1.0VOUT
2.7VIN 1.5VOUT
2.7VIN 1.8VOUT
4616 G03
4.0
4616 G04
1.2
70
8
VOUT (V)
80
VOUT (V)
EFFICIENCY (%)
90
1.6
80
VIN to VOUT Step-Down Ratio
100
40
85
4616 G02
Burst Mode Efficiency with
5V Input
50
CONTINUOUS MODE
75
4616 G01
SUPPLY CURRENT (mA)
Efficiency vs Load Current
95
EFFICIENCY (%)
EFFICIENCY (%)
100
Specified as Each Channel
2.5
3
3.5
4
4.5
INPUT VOLTAGE (V)
5
4616 G09
VIN = 5V
20µs/DIV
VOUT = 2.5V
2A/µs STEP
COUT = 2 × 100µF X5R, 470µF 4V POSCAP
5.5
4616 G07
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5
LTM4616
TYPICAL PERFORMANCE CHARACTERISTICS
Load Transient Response
Specified as Each Channel
Load Transient Response
Load Transient Response
ILOAD
1A/DIV
ILOAD
1A/DIV
ILOAD
1A/DIV
0A
0A
0A
VOUT
50mV/DIV
VOUT
50mV/DIV
VOUT
50mV/DIV
4616 G10
VIN = 5V
20µs/DIV
VOUT = 1.8V
2.5A/µs STEP
COUT = 2 × 100µF X5R, 470µF 4V POSCAP
4616 G11
VIN = 5V
20µs/DIV
VOUT = 1.5V
2.5A/µs STEP
COUT = 2 × 100µF X5R, 470µF 4V POSCAP
Start-Up
VIN = 5V
20µs/DIV
VOUT = 1.2V
2.5A/µs STEP
COUT = 2 × 100µF X5R, 470µF POSCAP
VFB vs Temperature
Load Regulation vs Current
0
602
–0.1
600
VOUT
0.5V/DIV
VFB (mV)
598
LOAD REGULATION (%)
VIN = 5.5V
VIN
2V/DIV
VIN = 3.3V
596
VIN = 2.7V
594
VIN = 5V
50µs/DIV
VOUT = 1.5V
COUT = 100µF NO LOAD AND 8A LOAD
(DEFAULT 100µs SOFT-START)
4616 G12
–0.2
–0.3
–0.4
4616 G13
FC MODE
VIN = 3.3V
VOUT = 1.5V
–0.5
592
590
–50
–25
0
50
75
25
TEMPERATURE (°C)
100
125
–0.6
2
0
4616 G14
4
6
LOAD CURRENT (A)
8
4616 G15
Short-Circuit Protection
(2.5V Short, No Load)
2.5V Output Current
Short-Circuit Protection
(2.5V Short, 4A Load)
3.0
2V/DIV
OUTPUT VOLTAGE (V)
2.5
2V/DIV
2.0
5A/DIV
1.5
VIN
5V/DIV
5V/DIV
VOUT
VIN
VOUT
IOUT LOAD
5A/DIV
IOUT
1.0
VIN = 5V
VOUT = 2.5V
0.5
0
0
5
10
15
OUTPUT CURRENT (A)
50µs/DIV
4616 G17
VIN = 5V
VOUT = 2.5V
50µs/DIV
4616 G18
20
4616 G16
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LTM4616
PIN FUNCTIONS
VIN1, VIN2, (BANK1 and BANK2); (F1-F4, E1-E4, C1-C2,
D1-D2) and (J1-J2, K1-K2, L1-L4, M1-M4): Power Input
Pins. Apply input voltage between these pins and GND
pins. Recommend placing input decoupling capacitance
directly between VIN pins and GND pins.
VOUT1, VOUT2 (BANK3 and BANK6); (D9-D12, E9-E12,
F9-F12) and (K9-K12, L9-L12, M9-M12): Power Output
Pins. Apply output load between these pins and GND
pins. Recommend placing output decoupling capacitance
directly between these pins and GND pins. See Table 1.
GND1 and GND2 (BANK2 and BANK5); (A1-A5, A12, B1B5, B7-B12, C3-C12, D3-D7) and (G1-G5, G12, H1-H5,
H7-H12, J3-J12, K3-K7): Power Ground Pins for Both
Input and Output Returns.
SVIN1 and SVIN2 (E5 and L5): Signal Input Voltage for Each
Channel. This pin is internally connected to VIN through
a lowpass filter.
SGND1 and SGND2 (F5 and M5): Signal Ground Pin for
Each Channel. Return ground path for all analog and low
power circuitry. Tie a single connection to the output
capacitor GND in the application. See layout guidelines
in Figure 17.
MODE1 and MODE2 (A8 and G8): Mode Select Input for
Each Channel. Tying this pin high enables Burst Mode
operation. Tying this pin low enables forced continuous
operation. Floating this pin or tying it to VIN/2 enables
pulse-skipping operation.
CLKIN1 and CLKIN2 (A7 and G7): External Synchronization Input to Phase Detector for Each Channel. This pin
is internally terminated to SGND with a 50k resistor. The
phase-locked loop will force the internal top power PMOS
turn on to be synchronized with the rising edge of the
CLKIN signal. Connect this pin to SVIN to enable spread
spectrum modulation. During external synchronization,
make sure the PLLLPF pin is not tied to VIN or GND.
PLLLPF1 and PLLLPF2 (E6 and L6): Phase-Locked Loop
Lowpass Filter for Each Channel. An internal lowpass filter
is tied to this pin. In spread spectrum mode, placing a
capacitor here to SGND controls the slew rate from one
frequency to the next. Alternatively, floating this pin allows
normal running frequency at 1.5MHz, tying this pin to SVIN
forces the part to run at 1.33 times its normal frequency
(2MHz), tying it to ground forces the frequency to run at
0.67 times its normal frequency (1MHz).
PHMODE1 and PHMODE2 (A9 and G9): Phase Selector
Input for Each Channel. This pin determines the phase
relationship between the internal oscillator and CLKOUT.
Tie it high for 2-phase operation, tie it low for 3-phase
operation, and float or tie it to VIN/2 for 4-phase operation.
MGN1 and MGN2 (A10 and G10): Voltage Margining
Pin for Each Channel. Increases or decreases the output
voltage by the amount specified by the BSEL pin. To
disable margining, tie the MGN pin to a voltage divider
with 50k resistors from VIN to ground (see Figure 5).
For margining, connect a voltage divider from VIN to GND
with the center point connected to the MGN pin for the specific channel. Each resistor should be close to 50k. Margin
High is within 0.3V of VIN , and Margin Low is within 0.3V of
GND. See the Applications Information section and Figure
18 for margining control. The specified tri-state drivers are
capable of the high and low requirements for margining.
BSEL1 and BSEL2 (A6 and G6): Margining Bit Select Pin
for Each Channel. Tying BSEL low selects ±5% margin
value, tying it high selects 10% margin value. Floating it
or tying it to VIN/2 selects 15% margin value.
TRACK1 and TRACK2 (E8 and L8): Output Voltage Tracking
Pin for Each Channel. Voltage tracking is enabled when the
TRACK voltage is below 0.57V. If tracking is not desired,
then connect the TRACK pin to SVIN. If TRACK is not tied
to SVIN , then the TRACK pin’s voltage needs to be below
0.18V before the chip shuts down even though RUN is
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7
LTM4616
PIN FUNCTIONS
already low. Do not float this pin. A resistor and capacitor
can be applied to the TRACK pin to increase the soft-start
time of the regulator. TRACK1 and TRACK2 can be tied
together for parallel operation and tracking. See the Applications Information section.
FB1 and FB2 (D8 and K8): The Negative Input of the Error
Amplifier for Each Channel. Internally, this pin is connected
to VOUT with a 10k precision resistor. Different output
voltages can be programmed with an additional resistor
between FB and GND pins. In PolyPhase® operation, tying
the FB pins together allows for parallel operation. See the
Applications Information section for details.
ITH1 and ITH2 (F8 and M8): Current Control Threshold and
Error Amplifier Compensation Point for Each Channel. The
current comparator threshold increases with this control
voltage. Tie together in parallel operation.
ITHM1 and ITHM2 (E7 and L7): Negative Input to the Internal
ITH Differential Amplifier for Each Channel. Tie this pin to
SGND for single phase operation on each channel. For
PolyPhase operation, tie the master’s ITHM to SGND while
connecting all of the ITHM pins together at the master.
PGOOD1 and PGOOD2 (A11 and G11): Output Voltage
Power Good Indicator for Each Channel. Open-drain logic
output that is pulled to ground when the output voltage
is not within ±10% of the regulation point. Power good
is disabled during margining.
RUN1 and RUN2 (F6 and M6): Run Control Pin. A voltage
above 1.7V will turn on the module.
SW1 and SW2 (B6 and H6): Switching Node of Each
Channel That is Used for Testing Purposes. This can be
connected to an electronically open circuit copper pad on
the board for improved thermal performance.
CLKOUT1 and CLKOUT2 (F7 and M7): Output Clock
Signal for PolyPhase Operation. The phase of CLKOUT is
determined by the state of the PHMODE pin.
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LTM4616
SIMPLIFIED BLOCK DIAGRAM
SVIN1
INTERNAL
FILTER
TRACK1
10µF
10µF
10µF
+
VIN1
3V TO 5.5V
CIN1
PGND1
MGN1
BSEL1
M1
PGOOD1
MODE1
0.22µH
POWER
CONTROL
RUN1
SW1
VOUT1
1.5V
8A
CLKIN1
CLKOUT1
PHMODE1
+
10µF
M2
COUT1
ITH1
PGND1
50k
PLLLPF1
INTERNAL
COMP
FB1
RSET1
6.65k
INTERNAL
FILTER
ITHM1
PGND1
10k
SGND1
SVIN2
INTERNAL
FILTER
TRACK2
10µF
10µF
10µF
+
VIN2
3V TO 5.5V
CIN2
PGND2
MGN2
BSEL2
M3
PGOOD2
MODE2
0.22µH
POWER
CONTROL
RUN2
SW2
VOUT2
1.2V
8A
CLKIN2
CLKOUT2
M4
PHMODE2
+
10µF
ITH2
PGND2
50k
PLLLPF2
ITHM2
PGND2
COUT2
INTERNAL
COMP
10k
FB2
RSET2
10k
INTERNAL
FILTER
SGND2
4616 BD
Figure 1. Simplified LTM4616 Block Diagram
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9
LTM4616
SIMPLIFIED BLOCK DIAGRAM
Table 1. Decoupling Requirements. TA = 25°C, Block Diagram Configuration.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
CIN1
CIN2
External Input Capacitor Requirement
(VIN1 = 2.7V to 5.5V, VOUT1 = 1.5V)
(VIN2 = 2.7V to 5.5V, VOUT2 = 2.5V)
IOUT1 = 8A
IOUT2 = 8A
22
22
µF
µF
COUT1
COUT2
External Output Capacitor Requirement
(VIN1 = 2.7V to 5.5V, VOUT1 = 1.5V)
(VIN2 = 2.7V to 5.5V, VOUT2 = 2.5V)
IOUT1 = 8A
IOUT2 = 8A
100
100
µF
µF
OPERATION
The LTM4616 is a dual-output standalone nonisolated
switching mode DC/DC power supply. It can provide two
8A outputs with few external input and output capacitors.
This module provides precisely regulated output voltages
programmable via external resistors from 0.6VDC to 5VDC
over 2.7V to 5.5V input voltages. The typical application
schematic is shown in Figure 18.
The LTM4616 has integrated constant frequency current
mode regulators and built-in power MOSFET devices with
fast switching speed. The typical switching frequency is
1.5MHz. For switching noise sensitive applications, it can
be externally synchronized from 0.75MHz to 2.25MHz.
Even spread spectrum switching can be implemented in
the design to reduce noise.
With current mode control and internal feedback loop
compensation, the LTM4616 module has sufficient stability margins and good transient performance with a wide
range of output capacitors, even with all ceramic output
capacitors.
Current mode control provides cycle-by-cycle fast current
limit and thermal shutdown in an overcurrent condition.
Internal overvoltage and undervoltage comparators pull
the open-drain PGOOD output low if the output feedback
voltage exits a ±10% window around the regulation point.
The power good pins are disabled during margining.
Pulling the RUN pins below 1.3V forces the regulators
into a shutdown state, by turning off both MOSFETs. The
TRACK pin is used for programming the output voltage
ramp and voltage tracking during start-up. See the Applications Information section.
The LTM4616 is internally compensated to be stable over
all operating conditions. Table 3 provides a guideline
for input and output capacitances for several operating
conditions. LTpowerCAD™ design tool is available for fine
tuning transient and stability perfromance. The FB pin is
used to program the output voltage with a single external
resistor to ground.
Multiphase operation can be easily employed with the
synchronization and phase mode controls. The LTM4616
has clock in and clock out for poly phasing multiple devices
or frequency synchronization.
High efficiency at light loads can be accomplished with
selectable Burst Mode operation using the MODE pin. These
light load features will accommodate battery operation.
Efficiency graphs are provided for light load operation in
the Typical Performance Characteristics section.
Output voltage margining is supported, and can be programed from ±5% to ±15% using the MGN and BSEL pins.
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LTM4616
APPLICATIONS INFORMATION
The typical LTM4616 application circuit is shown in
Figure 18. External component selection is primarily
determined by the maximum load current and output
voltage. Refer to Table 3 for specific external capacitor
requirements for a particular application.
VIN to VOUT Step-Down Ratios
There are restrictions in the maximum VIN to VOUT stepdown ratio that can be achieved for a given input voltage.
Each output of the LTM4616 is capable of 100% duty
cycle, but the VIN to VOUT minimum drop out is still shown
as a function of its load current. For a 5V input voltage,
both outputs can deliver 8A for any output voltage. For a
3.3V input, all outputs can deliver 8A, except 2.5VOUT and
above which is limited to 6A. All outputs derived from a
2.7V input voltage are limited to 5A.
Output Voltage Programming
Each PWM controller has an internal 0.596V reference
voltage. As shown in the Block Diagram, a 10k internal
feedback resistor connects VOUT and FB pins together.
The output voltage will default to 0.596V with no feedback resistor. Adding a resistor RFB from FB pin to GND
programs the output voltage:
VOUT = 0.596V •
10k + RFB
RFB
Table 2. FB Resistor vs Various Output Voltages
VOUT
0.596V
1.2V
1.5V
1.8V
2.5V
3.3V
RFB
Open
10k
6.65k
4.87k
3.09k
2.21k
For parallel operation of N number of outputs, the below
equation can be used to solve for RFB . Tie the FB pins
together for each paralleled output with a single resistor
to ground as determined by:
R FB =
10k / N
VOUT
−1
0.596
Input Capacitors
The LTM4616 module should be connected to a low AC
impedance DC source. For each regulator, three 10µF
ceramic capacitors are included inside the module. Additional input capacitors are only needed if a large load
step is required up to the 4A level. A 47µF to 100µF
surface mount aluminum electrolytic bulk capacitor can
be used for more input bulk capacitance. This bulk input
capacitor is only needed if the input source impedance is
compromised by long inductive leads, traces or not enough
source capacitance. If low impedance power planes are
used, then this 47µF capacitor is not needed.
For a buck converter, the switching duty-cycle can be
estimated as:
D=
VOUT
VIN
Without considering the inductor current ripple, the RMS
current of the input capacitor can be estimated as:
ICIN(RMS) =
IOUT(MAX)
η%
• D • (1– D)
In the above equation, η% is the estimated efficiency of
the power module so the RMS input current at the worst
case for 8A maximum current is about 4A. The input bulk
capacitor can be a switcher-rated aluminum electrolytic
capacitor or polymer capacitor. Each internal 10µF ceramic
input capacitor is typically rated for 2 amps of RMS ripple
current.
Output Capacitors
The LTM4616 is designed for low output voltage ripple
noise. The bulk output capacitors defined as COUT are
chosen with low enough effective series resistance (ESR)
to meet the output voltage ripple and transient requirements. COUT can be a low ESR tantalum capacitor, low
ESR polymer capacitor or ceramic capacitor. The typical
output capacitance range is from 47µF to 220µF. Additional
output filtering may be required by the system designer,
if further reduction of output ripple or dynamic transient
spikes is desired. Table 3 shows a matrix of different output
voltages and output capacitors to minimize the voltage
droop and overshoot during a 3A/µs transient. The table
optimizes total equivalent ESR and total bulk capacitance
to optimize the transient performance. Stability criteria are
considered in the Table 3 matrix. LTpowerCAD is available
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11
LTM4616
APPLICATIONS INFORMATION
Table 3. Output Voltage Response Versus Component Matrix (Refer to Figure 18) 0A to 3A Load Step
TYPICAL MEASURED VALUES
VALUE
COUT1 VENDORS
TDK
22µF, 6.3V
Murata
22µF, 16V
TDK
100µF, 6.3V
Murata
100µF, 6.3V
VOUT
(V)
1.0
1.0
1.0
1.0
1.2
1.2
1.2
1.2
1.5
1.5
1.5
1.5
1.5
1.5
1.8
1.8
CIN
(CERAMIC)
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
10µF
CIN
(BULK)*
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
100µF
PART NUMBER
C3216X7S0J226M
GRM31CR61C226K
C4532X5R0J107MZ
GRM32ER60J107M
COUT1
(CERAMIC)
100µF × 2
100µF × 2
100µF × 2
22µF × 1
100µF × 2
22µF × 1
100µF × 2
22µF × 1
100µF × 2
22µF × 1
100µF × 1
22µF × 1
100µF × 2
22µF × 1
100µF × 1
22µF × 1
COUT2
(BULK)
470µF
COUT2 VENDORS
Sanyo POSCAP
CIN (BULK) VENDORS
SUNCON
VALUE
470µF, 4V
VALUE
100µF, 10V
PART NUMBER
4TPE470M
PART NUMBER
10CE100FH
ITH
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
C1
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
C3
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
VIN
(V)
5
5
2.7
2.7
5
5
2.7
2.7
5
5
3.3
3.3
2.7
2.7
5
5
DROOP
(mV)
20
30
30
25
20
20
30
30
32
25
22
25
30
25
42
25
PEAK-TO- PEAK
DEVIATION (mV)
40
60
60
50
40
41
60
60
64
50
42
50
60
50
80
50
RECOVERY
TIME (µs)
40
25
25
25
25
25
20
25
20
25
25
25
25
25
25
30
LOAD STEP
(A/µs)
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
RFB
(kΩ)
14.7
14.7
14.7
14.7
10
10
10
10
6.65
6.65
6.65
6.65
6.65
6.65
4.87
4.87
1.8
10µF
100µF
100µF × 2
None
1.8
10µF
100µF
22µF × 1
470µF
None
1.8
10µF
100µF
100µF × 2
None
1.8
10µF
100µF
22µF × 1
470µF
None
2.5
10µF
100µF
100µF × 1
None
2.5
10µF
100µF
22µF × 1
470µF
None
2.5
10µF
100µF
100µF × 1
None
2.5
10µF
100µF
22µF × 1
470µF
None
3.3
10µF
100µF
100µF × 1
None
3.3
10µF
100µF
22µF × 1
470µF
None
*Bulk capacitance is optional if VIN has very low input impedance.
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
3.3
3.3
2.7
2.7
5
5
3.3
3.3
5
5
35
25
35
35
35
32
50
32
65
40
70
50
70
20
40
65
100
65
135
87
30
30
30
30
30
40
30
40
30
40
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
4.87
4.87
4.87
4.87
3.09
3.09
3.09
3.09
2.21
2.21
470µF
470µF
470µF
470µF
470µF
470µF
470µF
for those who wish to perform additional stability analysis.
Multiphase operation will reduce effective output ripple as
a function of the number of phases. Application Note 77
discusses this noise reduction versus output ripple current cancellation, but the output capacitance will be more
a function of stability and transient response. LTpowerCAD
also calculates the output ripple reduction as the number
of phases increases.
Burst Mode Operation
The LTM4616 is capable of Burst Mode operation on each
regulator in which the power MOSFETs operate intermittently based on load demand, thus saving quiescent current.
For applications where maximizing the efficiency at very
light loads is a high priority, Burst Mode operation should
be applied. To enable Burst Mode operation, simply tie the
MODE pin to VIN. During this operation, the peak current of
the inductor is set to approximately 20% of the maximum
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LTM4616
APPLICATIONS INFORMATION
peak current value in normal operation even though the
voltage at the ITH pin indicates a lower value. The voltage
at the ITH pin drops when the inductor’s average current
is greater than the load requirement. As the ITH voltage
drops below 0.2V, the BURST comparator trips, causing
the internal sleep line to go high and turn off both power
MOSFETs.
In Burst Mode operation, the internal circuitry is partially
turned off, reducing the quiescent current to about 450µA
for each output. The load current is now being supplied
from the output capacitors. When the output voltage drops,
causing ITH to rise above 0.25V, the internal sleep line goes
low, and the LTM4616 resumes normal operation. The next
oscillator cycle will turn on the top power MOSFET and the
switching cycle repeats. Each regulator can be configured
for Burst Mode operation.
Pulse-Skipping Mode Operation
In applications where low output ripple and high efficiency
at intermediate currents are desired, pulse-skipping mode
should be used. Pulse-skipping operation allows the
LTM4616 to skip cycles at low output loads, thus increasing
efficiency by reducing switching loss. Floating the MODE
pin or tying it to VIN /2 enables pulse-skipping operation.
This allows discontinuous conduction mode (DCM) operation down to near the limit defined by the chip’s minimum
on-time (about 100ns). Below this output current level,
the converter will begin to skip cycles in order to maintain output regulation. Increasing the output load current
slightly, above the minimum required for discontinuous
conduction mode, allows constant frequency PWM. Each
regulator can be configured for pulse-skipping mode.
Forced Continuous Operation
In applications where fixed frequency operation is more
critical than low current efficiency, and where the lowest
output ripple is desired, forced continuous operation should
be used. Forced continuous operation can be enabled by
tying the MODE pin to GND. In this mode, inductor current is allowed to reverse during low output loads, the ITH
voltage is in control of the current comparator threshold
throughout, and the top MOSFET always turns on with each
oscillator pulse. During start-up, forced continuous mode is
disabled and inductor current is prevented from reversing
until the LTM4616’s output voltage is in regulation. Each
regulator can be configured for forced continuous mode.
Multiphase Operation
For output loads that demand more than 8A of current,
two outputs in LTM4616 or even multiple LTM4616s can
be cascaded to run out-of-phase to provide more output
current without increasing input and output voltage ripple.
The CLKIN pin allows the LTC®4616 to synchronize to an
external clock (between 0.75MHz and 2.25MHz) and the
internal phase-locked loop allows the LTM4616 to lock
onto CLKIN’s phase as well. The CLKOUT signal can be
connected to the CLKIN pin of the following LTM4616
stage to line up both the frequency and the phase of the
entire system. Tying the PHMODE pin to SVIN , SGND or
SVIN /2 (floating) generates a phase difference (between
CLKIN and CLKOUT) of 180°, 120° or 90° respectively,
which corresponds to a 2-phase, 3-phase or 4-phase
operation. For a 6-phase example in Figure 2, the 2nd
stage that is 120° out-of-phase from the 1st stage can
generate a 240° (PHMODE = 0) CLKOUT signal for the 3rd
stage, which then can generate a CLKOUT signal that’s
420°, or 60° (PHMODE = SVIN) for the 4th stage. With
the 60° CLKIN input, the next two stages can shift 120°
(PHMODE = 0) for each to generate a 300° signal for the
6th stage. Finally, the signal with a 60° phase shift on the
6th stage (PHMODE is floating) goes back to the 1st stage.
Figure 3 shows the configuration for 12-phase operation.
A multiphase power supply significantly reduces the
amount of ripple current in both the input and output
capacitors. The RMS input ripple current is reduced by,
and the effective ripple frequency is multiplied by, the
number of phases used (assuming that the input voltage
is greater than the number of phases used times the output
voltage). The output ripple amplitude is also reduced by
the number of phases used.
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LTM4616
APPLICATIONS INFORMATION
0
CLKIN CLKOUT
120
+120
PHMODE
CLKIN CLKOUT
PHMODE
PHASE 1
(420)
60
240
+120
SVIN
CLKIN CLKOUT
+180
PHMODE
PHMODE
PHASE 5
PHASE 3
CLKIN CLKOUT
180
+120
CLKIN CLKOUT
300
+120
PHMODE
PHMODE
PHASE 4
PHASE 2
CLKIN CLKOUT
4616 F02
PHASE 6
Figure 2. 6-Phase Operation
0
CLKIN CLKOUT
120
+120
PHMODE
CLKIN CLKOUT
PHMODE
PHASE 1
+120
SVIN
PHASE 5
VIN
(420)
60
240
CLKIN CLKOUT
+180
PHMODE
CLKIN CLKOUT
180
+120
PHMODE
CLKIN CLKOUT
300
+120
PHMODE
CLKIN CLKOUT
PHMODE
PHASE 9
PHASE 3
PHASE 7
PHASE 11
330
(510)
150
270
(390)
30
OUT1
LTC6908-2
OUT2
90
CLKIN CLKOUT
PHMODE
PHASE 4
210
+120
CLKIN CLKOUT
PHMODE
PHASE 8
+120
SVIN
CLKIN CLKOUT
PHMODE
PHASE 12
+180
CLKIN CLKOUT
PHMODE
PHASE 6
+120
CLKIN CLKOUT
+120
PHMODE
PHASE 10
CLKIN CLKOUT
PHMODE
PHASE 2
4616 F03
Figure 3. 12-Phase Operation
The LTM4616 device is an inherently current mode controlled device, so parallel modules will have very good current sharing. This will balance the thermals on the design.
Tie the ITH pins of each LTM4616 together to share the
current. Current sharing is inherently guaranteed by the
current mode operation of the LTM4616’s DC/DC regulators. Moreover, the accuracy of current sharing between
the two outputs is approximately ±15%. To reduce ground
potential noise, tie the ITHM pins of all LTM4616s together
and then connect to the SGND of the master at the point it
connects to the output capacitor GND. See layout guideline
in Figure 17. Figure 19 shows a schematic of the parallel
design. The FB pins of the parallel module are tied together.
Input RMS Ripple Current Cancellation
Application Note 77 provides a detailed explanation of
multiphase operation. The input RMS ripple current cancellation mathematical derivations are presented, and a
graph is displayed representing the RMS ripple current
reduction as a function of the number of interleaved phases.
Figure 4 shows this graph.
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LTM4616
APPLICATIONS INFORMATION
0.60
1-PHASE
2-PHASE
3-PHASE
4-PHASE
6-PHASE
0.55
0.50
RMS INPUT RIPPLE CURRENT
DC LOAD CURRENT
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.1 0.15
0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9
DUTY FACTOR (VO/VIN)
4616 F04
Figure 4. Normalized Input RMS Ripple Current vs Duty Factor for One to Six Channels (Phases)
Spread Spectrum Operation
Switching regulators can be particularly troublesome
where electromagnetic interference (EMI) is concerned.
Switching regulators operate on a cycle-by-cycle basis to
transfer power to an output. In most cases, the frequency
of operation is fixed based on the output load. This method
of conversion creates large components of noise at the
frequency of operation (fundamental) and multiples of the
operating frequency (harmonics).
To reduce this noise, the LTM4616 can run in spread
spectrum operation by tying the CLKIN pin to SVIN .
In spread spectrum operation, the LTM4616’s internal
oscillator is designed to produce a clock pulse whose
period is random on a cycle-by-cycle basis but fixed
between 70% and 130% of the nominal frequency. This
has the benefit of spreading the switching noise over a
range of frequencies, thus significantly reducing the peak
noise. Spread spectrum operation is disabled if CLKIN is
tied to ground or if it’s driven by an external frequency
synchronization signal. A capacitor value of 0.01µF to
0.1µF be placed from the PLLLPF pin to ground to control
the slew rate of the spread spectrum frequency change.
To ensure proper start-up, add a control ramp on the
TRACK pin with a resistor, RSR, from TRACK to SVIN and
a capacitor, CSR, from TRACK to ground:
RSR ≥
1

  0.592 
– In  1–
•
500
•
C

SR
VIN 

 
Output Voltage Tracking
Output voltage tracking can be programmed externally
using the TRACK pin. The output can be tracked up and
down with another regulator. The master regulator’s output
is divided down with an external resistor divider that is the
same as the slave regulator’s feedback divider to implement
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15
LTM4616
APPLICATIONS INFORMATION
coincident tracking. The LTM4616 uses an accurate 10k
resistor internally for the top feedback resistor. Figure 5
shows an example of coincident tracking:
⎛ 10k ⎞
• VTRACK
Slave = ⎜1+
⎝ R TA ⎟⎠
VTRACK is the track ramp applied to the slave’s track pin.
VTRACK has a control range of 0V to 0.596V, or the internal
reference voltage. When the master’s output is divided
down with the same resistor values used to set the slave’s
output, then the slave will coincident track with the master
until it reaches its final value. The master will continue to its
final value from the slave’s regulation point. Voltage tracking is disabled when VTRACK is more than 0.596V. RTA in
Figure 5 will be equal to RFB for coincident tracking.
The track pin of the master can be controlled by an external
ramp or by RSR and CSR in Figure 5 referenced to VIN .
The RC ramp time can be programmed using equation:
⎛ ⎛ 0.596V ⎞
⎞
•
R
t = – ⎜ln ⎜1–
•
C
SR
SR
⎟
VIN ⎟⎠
⎝ ⎝
⎠
Ratiometric tracking can be achieved by a few simple
calculations and the slew rate value applied to the master’s track pin. As mentioned above, the TRACK pin has
a control range from 0V to 0.596V. The master’s TRACK
pin slew rate is directly equal to the master’s output slew
rate in Volts/Time:
MR
• 10k = R TB
SR
where MR is the master’s output slew rate and SR is the
slave’s output slew rate in Volts/Time. When coincident
tracking is desired, then MR and SR are equal, thus RTB
is equal to 10k. RTA is derived from equation:
R TA =
0.596V
VFB VFB VTRACK
+
–
10k RFB
R TB
where VFB is the feedback voltage reference of the regulator and VTRACK is 0.596V. Since RTB is equal to the 10k
top feedback resistor of the slave regulator in coincident
tracking, then RTA is equal to RFB2 with VFB = VTRACK .
CLKIN1
VIN 4V TO 5.5V
VIN1
RUN
10µF
RSR
SW1
CLKIN1
CLKOUT1 CLKIN2
CLKOUT2
SVIN1
FB1
RUN1
ITH1
PLLLPF1
MASTER
3.3V
RTB
10k
RTA
6.65k
10µF
VIN
100µF
50k
PGOOD1
PHMODE1
BSEL1
TRACK1
MGN1
LTM4616
VIN2
RUN
RFB1
2.21k
ITHM1
MODE1
CSR
MASTER
3.3V/7A
VOUT1
SLAVE
1.5V/8A
VOUT2
SVIN2
FB2
RUN2
ITH2
PLLLPF2
RFB2
6.65k
ITHM2
MODE2
PGOOD2
PHMODE2
BSEL2
TRACK2
MGN2
SW2
50k
SGND1
GND1
SGND2
100µF
100µF
PGOOD
BSEL
GND2
4616 F05
FOR TRACK1:
1. TIE TO VIN TO DISABLE TRACK WITH DEFAULT 100µs SOFT START
2. APPLY A CONTROL RAMP WITH RSR AND CSR TIED TO VIN WITH t = –(ln(1–0.596/VIN) • RSR • CSR))
3. APPLY AN EXTERNAL TRACKING RAMP DIRECTLY
Figure 5. Dual Outputs (3.3V and 1.5V) with Tracking
4616fe
16
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LTM4616
APPLICATIONS INFORMATION
Therefore RTB = 10k and RTA = 6.65k in Figure 5. Figure 6
shows the output voltage for coincident tracking.
In ratiometric tracking, a different slew rate maybe desired
for the slave regulator. RTB can be solved for when SR
is slower than MR. Make sure that the slave supply slew
rate is chosen to be fast enough so that the slave output
voltage will reach it final value before the master output.
For example: MR = 3.3V/ms and SR = 1.5V/ms. Then
RTB = 22.1k. Solve for RTA to equal to 4.87k.
For applications that do not require tracking or sequencing,
simply tie the TRACK pin to SVIN to let RUN control the
turn on/off. Connecting TRACK to SVIN also enables the
~100µs of internal soft-start during start-up.
OUTPUT VOLTAGE (V)
MASTER OUTPUT
SLAVE OUTPUT
TIME
4616 F06
Figure 6. Output Voltage Coincident Tracking
Power Good
The PGOOD pin is an open-drain pin that can be used to
monitor valid output voltage regulation. This pin monitors
a ±10% window around the regulation point. As shown
in Figure 20, the sequencing function can be realized in a
dual output application by controlling the RUN pins and the
PGOOD signals from each other. The 1.5V output begins
its soft starting after the PGOOD signal of 3.3V output
becomes high, and 3.3V output starts its shutdown after
the PGOOD signal of 1.5V output becomes low. This can
be applied to systems that require voltage sequencing
between the core and sub-power supplies. The PGOOD
pull-up resistor value can be determined as follows:
RPGOOD(MAX) =
SVIN – VRUN
IPGOOD(MAX)
For example: VIN = SVIN = 5V, VRUN = 1.7V and IPGOOD(MAX)
= 30µA. Solve for RPGOOD(MAX) to equal 110k. Selecting a
value of 100k provides some margin.
Stability Compensation
The module has already been internally compensated
for all output voltages. Table 2 is provided for most application requirements. LTpowerCAD is available for fine
adjustments to the control loop.
Output Margining
For a convenient system stress test on the LTM4616’s
output, the user can program each output to ±5%, ±10%
or ±15% of its normal operational voltage. Margining
can be disabled by connecting the MGN pin to a voltage
divider as shown in Figure 5. When the MGN pin is <0.3V,
it forces negative margining, in which the output voltage
is below the regulation point. When MGN is >VIN – 0.3V,
the output voltage is forced above the regulation point.
The MGN pin with a voltage divider is driven with a small
tri-state gate as shown in Figure 18 for three margin states,
(High, Low, and No Margin). The amount of output voltage
margining is determined by the BSEL pin. When BSEL is
low, it’s 5%. When BSEL is high, it’s 10%. When BSEL is
floating, it’s 15%. When margining is active, the internal
output overvoltage and undervoltage comparators are
disabled and PGOOD remains high.
4616fe
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17
LTM4616
APPLICATIONS INFORMATION
Thermal Considerations and Output Current Derating
Safety Considerations
The LTM4616 modules do not provide isolation from VIN
to VOUT. There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure. The device does support thermal shutdown and
overcurrent protection.
8
8
7
7
6
6
POWER LOSS (W)
POWER LOSS (W)
The power loss curves in Figures 7 and 8 can be used
in coordination with the load current derating curves in
Figures 9 to16 for calculating an approximate θJA thermal
resistance for the LTM4616 with various heat sinking and
airflow conditions. Both LTM4616 outputs are placed in
parallel for a total output current of 16A, and the power
loss curves are plotted for specific output voltages up to
16A. The derating curves are plotted with each output at
8A combined for a total of 16A. The output voltages are
1.2V, 2.5V and 3.3V. These are chosen to include the lower
and higher output voltage ranges for correlating the thermal resistance. Thermal models are derived from several
temperature measurements in a controlled temperature
chamber along with thermal modeling analysis. The junction temperatures are monitored while ambient temperature
increases with and without airflow. The junctions are
maintained at ~115°C while lowering output current or
power with increasing ambient temperature. The 115°C
value is chosen to allow for 10°C of margin relative to the
maximum temperature of 125°C. The decreased output current will decrease the internal module loss as ambient temperature is increased. The power loss curves in Figures 7
and 8 show this amount of power loss as a function of
load current that is specified with both channels in parallel. The monitored junction temperature of 115°C minus
the ambient operating temperature specifies how much
module temperature rise can be allowed. As an example, in
Figure 10 the load current is derated to 10A at ~ 80°C and
the power loss for the 5V to 1.2V at 10A output is ~3.2W.
If the 80°C ambient temperature is subtracted from the
115°C maximum junction temperature, then difference of
35°C divided by 3.2W equals a 10.9°C/W. Table 4 specifies
a 10.5°C/W value which is very close. Table 4 and Table 5
provide equivalent thermal resistances for 1.2V and 3.3V
outputs, with and without airflow and heat sinking. The
printed circuit board is a 1.6mm thick four layer board
with two ounce copper for the two outer layers and one
ounce copper for the two inner layers. The PCB dimensions
are 95mm × 76mm. The BGA heat sinks are listed below
Table 5. At load currents on each channel from 3A to 8A
(6A to16A in parallel on the derating curves), the thermal
resistance values in Tables 4 and 5 are fairly accurate. As
the load currents go below the 3A level on each channel
the thermal resistance starts to increase due to the reduced
power loss on the board. The approximate thermal resistance values for these lower currents is 15°C/W.
5
4
3
4
3
2
2
1
0
5
3.3VIN 1.2VOUT
3.3VIN 2.5VOUT
0
4
8
12
16
1
0
5VIN 1.2VOUT
5VIN 3.3VOUT
0
4
8
12
16
LOAD CURRENT (A)
LOAD CURRENT (A)
4616 F08
4616 F07
Figure 7. 1.2V, 2.5V Power Loss
Figure 8. 1.2V, 3.3V Power Loss
4616fe
18
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LTM4616
APPLICATIONS INFORMATION
400 LFM
12
0 LFM
LOAD CURRENT (A)
10
200 LFM
8
6
16
14
14
400 LFM
12
10
0 LFM
8
200 LFM
6
2
2
55
70
85
40
100
AMBIENT TEMPERATURE (°C)
0
115
40
50
60
70
80
90 100
AMBIENT TEMPERATURE (°C)
0
110
Figure 10. 5VIN to 1.2VOUT
with No Heat Sink
Figure 11. 5VIN to 3.3VOUT
with BGA Heat Sink
16
16
14
14
14
LOAD CURRENT (A)
400 LFM
10
0 LFM
200 LFM
6
12
400 LFM
0 LFM
10
8
200 LFM
6
12
6
4
2
2
2
50
60
70
80
110
90 100
AMBIENT TEMPERATURE (°C)
0
40
60
80
100
AMBIENT TEMPERATURE (°C)
16
16
14
14
12
400 LFM
10
0 LFM
6
200 LFM
70
90
110
AMBIENT TEMPERATURE (°C)
4616 F14
Figure 14. 3.3VIN to 2.5VOUT
with No Heat Sink
12
400 LFM
10
0 LFM
8
200 LFM
6
4
2
0
50
30
Figure 13. 3.3VIN to 1.2VOUT
with No Heat Sink
LOAD CURRENT (A)
LOAD CURRENT (A)
Figure 12. 5VIN to 1.2VOUT
with BGA Heat Sink
4
200 LFM
4616 F13
4616 F12
8
0
120
0 LFM
8
4
40
400 LFM
10
4
0
115
4616 F11
16
8
55
70
85
40
100
AMBIENT TEMPERATURE (°C)
25
4616 F10
Figure 9. 5VIN to 3.3VOUT
with No Heat Sink
12
200 LFM
6
2
25
0 LFM
8
4
4616 F09
LOAD CURRENT (A)
10
4
0
400 LFM
12
4
LOAD CURRENT (A)
LOAD CURRENT (A)
14
16
LOAD CURRENT (A)
16
2
40
50
60
70
80
90
100 110 120
AMBIENT TEMPERATURE (°C)
0
30
50
70
90
110
AMBIENT TEMPERATURE (°C)
4616 F15
Figure 15. 3.3VIN 1.2VOUT
with BGA Heat Sink
4616 F16
Figure 16. 3.3VIN 2.5VOUT
with BGA Heat Sink
4616fe
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19
LTM4616
APPLICATIONS INFORMATION
Table 4. 1.2V Output
DERATING CURVE
VIN (V)
POWER LOSS CURVE
AIR FLOW (LFM)
HEAT SINK
qJA (°C/W)
Figures 10, 13
3.3, 5
Figures 7, 8
0
None
10.5
Figures 10, 13
3.3, 5
Figures 7, 8
200
None
8.0
Figures 10, 13
3.3, 5
Figures 7, 8
400
None
7.0
Figures 12, 15
3.3, 5
Figures 7, 8
0
BGA Heat Sink
9.5
Figures 12, 15
3.3, 5
Figures 7, 8
200
BGA Heat Sink
6.3
Figures 12, 15
3.3, 5
Figures 7, 8
400
BGA Heat Sink
5.2
DERATING CURVE
VIN (V)
POWER LOSS CURVE
AIR FLOW (LFM)
HEAT SINK
qJA (°C/W)
Figure 9
5
Figure 8
0
None
10.5
Table 5. 3.3V Output
Figure 9
5
Figure 8
200
None
8.0
Figure 9
5
Figure 8
400
None
7.0
Figure 11
5
Figure 8
0
BGA Heat Sink
9.8
Figure 11
5
Figure 8
200
BGA Heat Sink
7.0
Figure 11
5
Figure 8
400
BGA Heat Sink
5.5
HEAT SINK MANUFACTURER
PART NUMBER
WEBSITE
AAVID Thermalloy
375424B00034G
www.aavidthermalloy.com
Cool Innovations
4-050503P to 4-050508P
www.coolinnovations.com
4616fe
20
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LTM4616
APPLICATIONS INFORMATION
Layout Checklist/Example
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
The high integration of LTM4616 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout considerations are still necessary.
• Do not put vias directly on the pads, unless they are
capped or plated over.
• Use large PCB copper areas for high current paths,
including VIN1, VIN2 , GND1 and GND2, VOUT1 and
VOUT2. It helps to minimize the PCB conduction loss
and thermal stress.
• Use a separated SGND ground copper area for components connected to signal pins. Connect the SGND
to GND underneath the unit.
• For parallel modules, tie the ITH, FB and ITHM pins together. Use an internal layer to closely connect these
pins together. All of the ITHM pins connect to the SGND
of the master regulator, then the master SGND connects
to GND.
• Place high frequency ceramic input and output capacitors next to the VIN, GND and VOUT pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
VIN1
Figure 17 gives a good example of the recommended layout.
VOUT1
VIA TO GND
EACH CHANNEL
CONTROL1
M
VIN1
CIN1
COUT2
VOUT1
L
K
J
GND1
H
GND1
G
CONTROL1 & 2
F
VIN2
CIN2
COUT2
VOUT2
E
D
C
B
GND2
GND2
A
1
2
GND2
3
4
5
6
7
8
9
10
11
CONTROL2
12
GND2
4616 F17
LTM4616 TOP VIEW
Figure 17. Recommended PCB Layout
(LGA and BGA PCB Layouts Are Identical with the Exception of Circle Pads for BGA. See Package Description.)
4616fe
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21
LTM4616
APPLICATIONS INFORMATION
CLKIN1
10µF
CLKIN1
CLKOUT1 CLKIN2
CLKOUT2
SVIN1
FB1
RUN1
ITH1
PLLLPF1
PGOOD1
PHMODE1
BSEL1
TRACK1
MGN1
LTM4616
VIN2
10µF
4.87k
ITHM1
MODE1
VIN2 3V TO 5.5V
VOUT1
1.8V/8A
100µF
VOUT1
PGOOD
BSEL
VOUT2
SVIN2
FB2
RUN2
ITH2
PLLLPF2
R3
50k
6.65k
ITHM2
MODE2
PGOOD2
PHMODE2
BSEL2
TRACK2
MGN2
SW2
SGND1
GND1
SGND2
VIN
R4
50k
PGOOD
BSEL
GND2
4616 F18
OUT
VOUT2
1.5V/8A
100µF
×2
R1
50k
IOE
IIN
GND
5 PIN SC70 PACKAGE
VIN
R2
50k
A2
V+
OUT
A1
V+
+
–
SW1
VIN1
+
–
VIN1 3V TO 5.5V
IOE
IIN
GND
5 PIN SC70 PACKAGE
BSEL: HIGH = 10%
FLOAT = 15%
LOW = 5%
OE
IN
OUT
H
H
L
H
L
X
H
L
Z
A1, A2 PERICOM PI74ST1G126CEX
TOSHIBA TC7SZ126AFE
MGN
MARGIN VALUE
+ Value of BSEL Selection
H
– Value of BSEL Selection
L
VIN/2 No Margin
Figure 18. Typical 3V to 5.5VIN, to 1.8V, 1.5V Outputs
4616fe
22
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LTM4616
APPLICATIONS INFORMATION
VIN 3V TO 5.5V
SW1
VIN1
10µF
RUN
ENABLE
CLKIN1
CLKOUT1 CLKIN2
CLKOUT2
SVIN1
FB1
RUN1
ITH1
PLLLPF1
100µF
3.32k
ITHM1
MODE1
PGOOD1
PHMODE1
BSEL1
TRACK1
MGN1
LTM4616
VIN2
10µF
VOUT
1.5V/16A
VOUT1
VOUT2
SVIN2
FB2
RUN2
ITH2
PLLLPF2
100µF
ITHM2
MODE2
VIN
PGOOD2
PHMODE2
BSEL2
TRACK2
MGN2
SW2
SGND1
GND1
SGND2
100µF
50k
GND2
50k
4616 F19
Figure 19. LTM4616 Two Outputs Parallel, 1.5V at 16A Design
CLKIN
VIN 5V
VIN1
22µF
SHDNB
100k
SW1
CLKIN1
CLKOUT1 CLKIN2
CLKOUT2
SVIN1
FB1
RUN1
ITH1
PLLLPF1
BSEL1
TRACK1
MGN1
LTM4616
100µF
50k
100k
SVIN1
SVIN2
FB2
RUN2
ITH2
PLLLPF2
VOUT2
1.5V/8A
6.65k
100µF
100µF
ITHM2
PGOOD2
PHMODE2
BSEL2
TRACK2
MGN2
SW2
50k
VOUT2
MODE2
PGOOD1
VIN
PGOOD1
PHMODE1
VIN2
100k
2.21k
ITHM1
MODE1
PGOOD2
VOUT1
3.3V/7A
VOUT1
SGND1
GND1
SGND2
GND2
4616 F20
100k
SVIN2
SHDNB
3.3V
1.5V
Figure 20. LTM4616 Output Sequencing Application
4616fe
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23
LTM4616
APPLICATIONS INFORMATION
SW1
VIN1
10µF
6.3V
CLKIN1
CLKOUT1 CLKIN2
CLKOUT2
SVIN1
FB1
RUN1
ITH1
PLLLPF1
MGN1
LTM4616
VIN2
VOUT2
SVIN2
FB2
RUN2
ITH2
PLLLPF2
VIN1
SGND1
SW1
CLKIN1
GND1
SGND2
CLKOUT1 CLKIN2
GND2
CLKOUT2
SVIN1
VOUT1
FB1
ITH1
RUN1
ITHM1
MODE1
PGOOD1
PHMODE1
BSEL1
TRACK1
MGN1
LTM4616
VIN2
VOUT2
SVIN2
FB2
ITH2
RUN2
PLLLPF2
BSEL2
TRACK2
MGN2
SGND1
GND1
SGND2
GND2
4616 F21
OUT
H
L
Z
A1, A2 PERICOM PI74ST1G126CEX
TOSHIBA TC7SZ126AFE
MGN
C5
22µF
6.3V
+
C4
22µF
6.3V
PGOOD2
PHMODE2
SW2
H
L
X
+
ITHM2
MODE2
IN
C3
470µF
6.3V
MGN2
SW2
PLLLPF1
H
H
L
+
BSEL2
TRACK2
OE
C2
470µF
6.3V
PGOOD2
PHMODE2
BSEL: HIGH = 10%
FLOAT = 15%
LOW = 5%
+
ITHM2
MODE2
10µF
6.3V
VOUT
1.2V AT 32A
C1
470µF
6.3V
SANYO POSCAP
10mΩ
BSEL1
TRACK1
10µF
6.3V
2.47k
PGOOD1
PHMODE1
10µF
6.3V
+
ITHM1
MODE1
TRACK INPUT
OR VIN
VOUT1
MARGIN VALUE
+ Value of BSEL Selection
H
– Value of BSEL Selection
L
VIN/2 No Margin
R1
50k
R2
50k
A1
V+
OUT
GND
VIN
3V TO 5.5V
+
–
VIN
3V TO 5.5V
IOE
IIN
6 PIN SC70 PACKAGE
OPTIONAL MARGINING CIRCUIT,
IF NOT USED TIE THE MGN PINS
TO A VOLTAGE EQUAL TO HALF
OF THE RESPECTIVE VIN
Figure 21. Four Phase in Parallel, 1.2V at 32A
4616fe
24
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LTM4616
APPLICATIONS INFORMATION
VIN
4V TO 5.5V
VIN1
10µF
SVIN1
RUN
ENABLE
RUN1
SW1
CLKIN1
CLKOUT1 CLKIN2
CLKOUT2
FB1
ITH1
PLLLPF1
BSEL1
TRACK1
FB2
RUN2
ITH2
PLLLPF2
BSEL2
TRACK2
MGN2
SW2
SGND1
SW1
CLKIN1
GND1
SGND2
CLKOUT1 CLKIN2
GND2
CLKOUT2
FB1
RUN1
ITH1
BSEL1
TRACK1
MGN1
LTM4616
VIN2
10µF
SVIN2
FB2
ITH2
PLLLPF2
10k
6.65k
100µF
ITHM2
MODE2
PGOOD2
PHMODE2
BSEL2
TRACK2
6.65k
VOUT4
1.5V/8A
100µF
VOUT2
RUN2
3.3V
100µF
PGOOD1
PHMODE1
4.99k
4.99k
ITHM1
MODE1
10k
VOUT3
1.8V/8A
100µF
VOUT1
SVIN1
PLLLPF1
3.3V
3.16k
PGOOD2
PHMODE2
10µF
50k
ITHM2
MODE2
VIN1
VOUT2
2.5V/8A
100µF
VOUT2
SVIN2
3.16k
50k
MGN1
LTM4616
VIN2
10k
VIN
PGOOD1
PHMODE1
3.3V
2.21k
ITHM1
MODE1
10µF
VOUT1
3.3V/7A
100µF
VOUT1
MGN2
SW2
SGND1
GND1
SGND2
GND2
4616 F22
Figure 22. 4-Phase, Four Outputs (3.3V, 2.5V, 1.8V and 1.5V) with Tracking
4616fe
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25
LTM4616
PACKAGE DESCRIPTION
Pin Assignment Table
(Arranged by Pin Number)
PIN NAME
PIN NAME
PIN NAME
PIN NAME
PIN NAME
PIN NAME
A1
GND1
B1
GND1
C1
VIN1
D1
VIN1
E1
VIN1
F1
VIN1
A2
GND1
B2
GND1
C2
VIN1
D2
VIN1
E2
VIN1
F2
VIN1
A3
GND1
B3
GND1
C3
GND1
D3
GND1
E3
VIN1
F3
VIN1
A4
GND1
B4
GND1
C4
GND1
D4
GND1
E4
VIN1
F4
VIN1
A5
GND1
B5
GND1
C5
GND1
D5
GND1
E5
SVIN1
F5
SGND1
A6
BSEL1
B6
SW1
C6
GND1
D6
GND1
E6
PLLLPF1
F6
RUN1
A7
CLKIN1
B7
GND1
C7
GND1
D7
GND1
E7
ITHM1
F7
CLKOUT1
A8
MODE1
B8
GND1
C8
GND1
D8
FB1
E8
TRACK1
F8
ITH1
A9
PHMODE1
B9
GND1
C9
GND1
D9
VOUT1
E9
VOUT1
F9
VOUT1
A10 MGN1
B10 GND1
C10 GND1
D10 VOUT1
E10 VOUT1
F10 VOUT1
A11 PGOOD1
B11 GND1
C11 GND1
D11 VOUT1
E11 VOUT1
F11 VOUT1
A12 GND1
B12 GND1
C12 GND1
D12 VOUT1
E12 VOUT1
F12 VOUT1
PIN NAME
PIN NAME
PIN NAME
PIN NAME
PIN NAME
PIN NAME
G1
GND2
H1
GND2
J1
VIN2
K1
VIN2
L1
VIN2
M1
VIN2
G2
GND2
H2
GND2
J2
VIN2
K2
VIN2
L2
VIN2
M2
VIN2
G3
GND2
H3
GND2
J3
GND2
K3
GND2
L3
VIN2
M3
VIN2
G4
GND2
H4
GND2
J4
GND2
K4
GND2
L4
VIN2
M4
VIN2
G5
GND2
H5
GND2
J5
GND2
K5
GND2
L5
SVIN2
M5
SGND2
G6
BSEL2
H6
SW2
J6
GND2
K6
GND2
L6
PLLLPF2
M6
RUN2
G7
CLKIN2
H7
GND2
J7
GND2
K7
GND2
L7
ITHM2
M7
CLKOUT2
G8
MODE2
H8
GND2
J8
GND2
K8
FB2
L8
TRACK2
M8
ITH2
G9
PHMODE2
H9
GND2
J9
GND2
K9
VOUT2
L9
VOUT2
M9
VOUT2
G10 MGN2
H10 GND2
J10 GND2
K10 VOUT2
L10 VOUT2
M10 VOUT2
G11 PGOOD2
H11 GND2
J11 GND2
K11 VOUT2
L11 VOUT2
M11 VOUT2
G12 GND2
H12 GND2
J12 GND2
K12 VOUT2
L12 VOUT2
M12 VOUT2
4616fe
26
For more information www.linear.com/LTM4616
4
For more information www.linear.com/LTM4616
3.1750
1.9050
3.1750
SUGGESTED PCB LAYOUT
TOP VIEW
0.6350
0.0000
0.6350
PACKAGE TOP VIEW
E
1.9050
PIN “A1”
CORNER
6.9850
5.7150
4.4450
4.4450
5.7150
6.9850
aaa Z
Y
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
X
D
aaa Z
bbb Z
0.27
2.45
MIN
2.72
0.60
NOM
2.82
0.63
15.00
15.00
1.27
13.97
13.97
0.32
2.50
DIMENSIONS
eee S X Y
H1
SUBSTRATE
0.37
2.55
0.15
0.10
0.05
MAX
2.92
0.66
NOTES
DETAIL B
PACKAGE SIDE VIEW
A
TOTAL NUMBER OF LGA PADS: 144
SYMBOL
A
b
D
E
e
F
G
H1
H2
aaa
bbb
eee
DETAIL A
0.630 ±0.025 SQ. 143x
DETAIL B
H2
MOLD
CAP
Z
(Reference LTC DWG # 05-08-1816 Rev B)
LGA Package
144-Lead (15mm × 15mm × 2.82mm)
e
b
11
10
9
3x, C (0.22 x45°)
7
G
6
e
5
PACKAGE BOTTOM VIEW
8
4
3
1
DETAIL A
2
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
TRAY PIN 1
BEVEL
LGA 144 1111 REV B
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
5. PRIMARY DATUM -Z- IS SEATING PLANE
BALL DESIGNATION PER JESD MS-028 AND JEP95
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
COMPONENT
PIN “A1”
3
SEE NOTES
F
b
12
A
B
C
D
E
F
G
H
J
K
L
M
DIA 0.630
PAD 1
LTM4616
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4616fe
27
aaa Z
0.630 ±0.025 Ø 144x
E
PACKAGE TOP VIEW
3.1750
3.1750
SUGGESTED PCB LAYOUT
TOP VIEW
1.9050
4
0.6350
0.0000
0.6350
PIN “A1”
CORNER
1.9050
28
Y
For more information www.linear.com/LTM4616
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
X
D
2.45 – 2.55
aaa Z
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
NOM
3.42
0.60
2.82
0.75
0.63
15.0
15.0
1.27
13.97
13.97
DIMENSIONS
0.15
0.10
0.20
0.30
0.15
MAX
3.62
0.70
2.92
0.90
0.66
NOTES
DETAIL B
PACKAGE SIDE VIEW
TOTAL NUMBER OF BALLS: 144
MIN
3.22
0.50
2.72
0.60
0.60
DETAIL A
b1
0.27 – 0.37
SUBSTRATE
ddd M Z X Y
eee M Z
DETAIL B
MOLD
CAP
ccc Z
A1
A2
A
Z
(Reference LTC DWG # 05-08-1902 Rev A)
Øb (144 PLACES)
// bbb Z
BGA Package
144-Lead (15mm × 15mm × 3.42mm)
e
b
11
10
9
7
G
6
e
5
PACKAGE BOTTOM VIEW
8
4
3
2
1
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
BALL DESIGNATION PER JESD MS-028 AND JEP95
TRAY PIN 1
BEVEL
BGA 144 1011 REV A
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
5. PRIMARY DATUM -Z- IS SEATING PLANE
4
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
COMPONENT
PIN “A1”
3
SEE NOTES
F
b
12
DETAIL A
A
B
C
D
E
F
G
H
J
K
L
M
PIN 1
LTM4616
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4616fe
6.9850
5.7150
4.4450
4.4450
5.7150
6.9850
LTM4616
REVISION HISTORY
REV
DATE
DESCRIPTION
C
2/11
Updated Features
(Revision history begins at Rev C)
PAGE NUMBER
1
Updated Pin Configuration
Updated Electrical Characteristics
Replaced graphs G05 and G06
5
Updated graph G18
6
Updated Pin Functions
7
Updated Simplified Block Diagram
8
Updated Operation section
D
E
3/12
4/13
2
2, 3, 4
9
Text updated in Applications Information section
10 through 20
Updated figures 3, 5, 17, 18, 19, 20, 21, 22
13 through 24
Updated Package Description table
25
Added Package Photo and updated Related Parts
28
Added BGA package option and MP temperature grade
1
Added BGA package option, MP temperature grade, thermal resistance, and device weight
2
Updated Note 2
4
Clarified Load Transient Response conditions
5
Updated recommended heat sinks Table
20
Corrected MGN Pin usage
24
Added package photo
30
Added PGOOD leakage current and voltage low limits to Electrical Characteristics table
4
Added Design Resources
30
4616fe
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its circuits
as described
herein will not infringe on existing patent rights.
For more
information
www.linear.com/LTM4616
29
LTM4616
PACKAGE PHOTO
RELATED PARTS
PART NUMBER DESCRIPTION
LTM4628
Dual 8A, 26V, Step-Down µModule Regulator
LTM4620A
Dual 16V, 13A or Single 26A Step-Down µModule
Regulator
36V, 5A Step-Down µModule Regulator with
Configurable Array of five 1A LDOs
20V, 15A Step-Down µModule Regulator
LTM8001
LTM4627
Inverting or SEPIC µModule Converter with Up to
700mA Output Current
32V, 2A Step-Down µModule Battery Charger with
Programmable Input Current Limit
1.5W, 725VDC Galvanically Isolated µModule
Converter with LDO Post Regulator
Quad Digital Power Supply Manager with EEPROM
LTM8045
LTM8061
LTM8048
LTC2974
LTC3880
Dual Output PolyPhase Step-Down DC/DC
Controller with Digital Power System Management
COMMENTS
0.6V ≤ VOUT ≤ 5V, 4.5V ≤ VIN ≤ 26.5V, Remote Sense Amplifier, Internal
Temperature Sensing Output, 15mm × 15mm × 4.3mm LGA
4.5V ≤ VIN ≤ 16V, 0.6V ≤ VOUT ≤ 5.3V, PLL input, Remote Sense Amplifier, VOUT
tracking, 15mm × 15mm × 4.41mm LGA
6V ≤ VIN ≤ 36V, 0V ≤ VOUT ≤ 24V, Five Parallelable 1.1A 90µVRMS Output Noise
LDOs, 15mm × 15mm × 4.92mm BGA
4.5V ≤ VIN ≤ 20V, 0.6V ≤ VOUT ≤ 5V, PLL input, Remote Sense Amplifier, VOUT
Tracking, 15mm × 15mm × 4.3mm LGA and 15mm × 15mm × 4.9mm BGA
2.8V ≤ VIN ≤ 18V, ±2.5V ≤ VOUT ≤ ±15V, Synchronizable, No Derating or Logic
Level Shift for Control Inputs When Inverting, 6.25mm × 11.25mm × 4.92mm BGA
Suitable for CC-CV Charging Single and Dual Cell Li-Ion or Li-Poly Batteries, 4.95V
≤ VIN ≤ 32V, C/10 or Adjustable Timer Charge Termination,
3.1V ≤ VIN ≤ 32V, 2.5V ≤ VOUT ≤ 12V, 1mVP-P Output Ripple, Internal Isolated
Transformer, 9mm × 11.25mm × 4.92mm BGA
I2C/PMBus Interface, Configuration EEPROM, Fault Logging, Per Channel Voltage,
Current and Temperature Measurements
I2C/PMBus Interface, Configuration EEPROM, Fault Logging, ±0.5% Output
Voltage Accuracy, MOSFET Gate Drivers
DESIGN RESOURCES
SUBJECT
DESCRIPTION
µModule Design and Manufacturing Resources
Design:
• Selector Guides
• Demo Boards and Gerber Files
• Free Simulation Tools
µModule Regulator Products Search
1. Sort table of products by parameters and download the result as a spread sheet.
Manufacturing:
• Quick Start Guide
• PCB Design, Assembly and Manufacturing Guidelines
• Package and Board Level Reliability
2. Search using the Quick Power Search parametric table.
TechClip Videos
Quick videos detailing how to bench test electrical and thermal performance of µModule products.
Digital Power System Management
Linear Technology’s family of digital power supply management ICs are highly integrated solutions that
offer essential functions, including power supply monitoring, supervision, margining and sequencing,
and feature EEPROM for storing user configurations and fault logging.
4616fe
30
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LTM4616
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LTM4616
LT 0413 REV E • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2008
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