CY74FCT825T 8-BIT BUS-INTERFACE REGISTER WITH 3-STATE OUTPUTS SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001 D D D D D D D D D D D Q PACKAGE (TOP VIEW) Function, Pinout, and Drive Compatible With FCT, F Logic, and AM29825 Reduced VOH (Typically = 3.3 V) Version of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 64-mA Output Sink Current 32-mA Output Source Current High-Speed Parallel Register With Positive-Edge-Triggered D-Type Flip-Flops Buffered Common Clock-Enable (EN) and Asynchronous-Clear (CLR) Inputs 3-State Outputs OE1 OE2 D0 D1 D2 D3 D4 D5 D6 D7 CLR GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC OE3 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 EN CP description This bus-interface register is designed to eliminate the extra packages required to buffer existing registers and provide extra data width for wider address/data paths or buses carrying parity. The CY74FCT825T is an 8-bit buffered register with all the CY74FCT823T controls, plus multiple enables (OE1, OE2, OE3) to allow multiuser control of the interface, e.g., CS, DMA, and RD/WR. This device is ideal for use as an output port requiring high IOL/IOH. This device is designed for high-capacitance load drive capability, while providing low-capacitance bus loading at both inputs and outputs. Outputs are designed for low-capacitance bus loading in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE† SPEED (ns) ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°C QSOP – Q Tape and reel 6 CY74FCT825CTQCT FCT825C † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY74FCT825T 8-BIT BUS-INTERFACE REGISTER WITH 3-STATE OUTPUTS SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001 PIN DESCRIPTION NAME I/O D I D flip-flop data inputs CLR I When CLR is low and OE is low, Q outputs are low. When CLR is high, data can be entered into the register. CP O Clock pulse for the register. Enters data into the register on the low-to-high clock transition. Y O Register 3-state outputs EN I Clock enable. When EN is low, data on the D input is transferred to the Q output on the low-to-high clock transition. When EN is high, the Q outputs do not change state, regardless of the data or clock input transitions. OE I Output control. When OE is high, the Y outputs are in the high-impedance state. When OE is low, true register data is present at the Y outputs. DESCRIPTION FUNCTION TABLE INTERNAL OUTPUTS INPUTS OE CLR EN D CP Q Y H H H H L L L H ↑ L Z ↑ H Z H L X X X L Z L L X X X L L H H H X X NC Z L H H X X NC NC H H L L ↑ L Z H H L H ↑ H Z L H L L ↑ L L L H L H ↑ H H FUNCTION Z Clear Hold Load H = High logic level, L = Low logic level, X = Don’t care, NC = No change, ↑ = Low-to-high transition, Z = High-impedance state logic diagram (positive logic) OE1 OE2 OE3 CLR CP EN 1 2 23 11 13 CL 14 CP Q D0 3 D To Seven Other Channels 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 22 Y0 CY74FCT825T 8-BIT BUS-INTERFACE REGISTER WITH 3-STATE OUTPUTS SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001 absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, qJA (see Note1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) MIN NOM MAX UNIT 4.75 5 5.25 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current –32 mA IOL TA Low-level output current 64 mA 85 °C High-level input voltage 2 Operating free-air temperature –40 V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY74FCT825T 8-BIT BUS-INTERFACE REGISTER WITH 3-STATE OUTPUTS SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VCC = 4.75 V, VOH VCC = 4 4.75 75 V VOL Vhys VCC = 4.75 V, All inputs II IIH VCC = 5.25 V, VCC = 5.25 V, VIN = VCC VIN = 2.7 V IIL IOZH VCC = 5.25 V, VCC = 5.25 V, VIN = 0.5 V VOUT = 2.7 V IOZL IOS‡ VCC = 5.25 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0 V Ioff ICC VCC = 0 V, VCC = 5.25 V, MIN IIN = –18 mA IOH = –32 mA TYP† MAX UNIT –0.7 –1.2 V 2 IOH = –15 mA IOL = 64 mA 2.4 V 3.3 0.3 0.55 V 5 µA ±1 µA ±1 µA 10 µA 0.2 V –10 µA –225 mA ±1 µA 0.1 0.2 mA 0.5 2 mA 0.06 0.12 mA/ MHz 0.7 1.4 VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 1.2 3.4 1.6 3.2|| VIN = 3.4 V or GND 3.9 12.2|| Ci 5 10 Co 9 12 ∆ICC ICCD¶ IC# –60 VOUT = 4.5 V VIN ≤ 0.2 V, VIN ≥ VCC – 0.2 V VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, One bit switching at 50% duty cycle, Outputs open, OE = EN = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VCC = 5.25 V, Outputs open, open OE = EN = GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V One bit switching at f1 = 5 MHz at 50% duty cycle Eight bits switching at f1 = 2.5 MHz at 50% duty cycle –120 mA pF pF † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY74FCT825T 8-BIT BUS-INTERFACE REGISTER WITH 3-STATE OUTPUTS SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER TEST LOAD CP tw Pulse duration tsu time before CP↑ Setup time, th Hold time, time after CP↑ trec Recovery time CLR low Data EN Data EN CLR before CP↑ CY74FCT825AT MIN MAX CY74FCT825BT MIN MAX CY74FCT825CT MIN CL = 50 pF,, RL = 500 Ω 7 6 6 6 6 6 CL = 50 pF,, RL = 500 Ω 4 3 3 4 3 3 CL = 50 pF,, RL = 500 Ω 2 1.5 1.5 2 0 0 6 6 6 CL = 50 pF, RL = 500 Ω MAX UNIT ns ns ns ns switching characteristics over operating free-air temperature range (see Figure 1) CY74FCT825AT CY74FCT825BT CY74FCT825CT PARAMETER FROM (INPUT) TO (OUTPUT) TEST LOAD tPLH tPHL CP Y CL = 50 pF,, RL = 500 Ω 10 7.5 6 10 7.5 6 tPLH tPHL CP Y CL = 300 pF,, RL = 500 Ω 20 15 12.5 20 15 12.5 tPLH CLR Y CL = 50 pF, RL = 500 Ω 14 9 8 tPZH tPZL OE Y CL = 50 pF,, RL = 500 Ω 12 8 7 12 8 7 tPZH tPZL OE Y CL = 300 pF,, RL = 500 Ω 23 15 12.5 23 15 12.5 tPHZ tPLZ OE Y CL = 5 pF,, RL = 500 Ω 7 6.5 6 7 6.5 6 tPHZ tPLZ OE Y CL = 50 pF, RL = 500 Ω 8 7.5 6.5 8 7.5 6.5 POST OFFICE BOX 655303 MIN MAX • DALLAS, TEXAS 75265 MIN MAX MIN MAX UNIT ns ns ns ns ns ns ns 5 CY74FCT825T 8-BIT BUS-INTERFACE REGISTER WITH 3-STATE OUTPUTS SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CY74FCT825ATSOC ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT825A CY74FCT825CTQCT ACTIVE SSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT825C CY74FCT825CTQCTG4 ACTIVE SSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT825C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device CY74FCT825CTQCT Package Package Pins Type Drawing SSOP DBQ 24 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT825CTQCT SSOP DBQ 24 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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