AOS Semiconductor Product Reliability Report AOB10B65M1, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOB10B65M1. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOB10B65M1 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be routine monitored for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Reliability Stress Test Summary and Results Reliability Evaluation I. Product Description: • Latest AlphaIGBT (аIGBT) technology • 650V breakdown voltage • Very fast and soft recovery freewheeling diode • High efficient turn-on di/dt controllability • Low VCE(SAT) enables high efficiencies • Low turn-off switching loss and softness • Very good EMI behavior • High short-circuit ruggedness Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond Mold Material AOB10B65M1 Standard sub-micron TM 650V Alpha IGBT with Diode TO263 Bare Cu Solder Paste Al wire Epoxy resin with silica filler 2 III. Reliability Stress Test Summary and Results Test Item Test Condition Duration Total Sample Size Number of Failures Reference Standard HTGB Temp = 175°C , Vge=100% of Vgemax 168 / 500 / 1000 hours 924 pcs 0 JESD22-A108 HTRB Temp = 175°C , Vce=80% of Vcemax 168 / 500 / 1000 hours 924 pcs 0 JESD22-A108 96 hours 924 pcs 0 JESD22-A110 1000 hours 924 pcs 0 JESD22-A101 130°C , 85%RH, 33.3 psia, Vce = 80% of Vcemax up to 42V 85°C , 85%RH, Vce = 80% of Vcemax up to 100V HAST H3TRB Autoclave 121°C , 29.7psia, RH=100% 96 hours 924 pcs 0 JESD22-A102 Temperature Cycle -65°C to 150°C , air to air, 1000 cycles 924 pcs 0 JESD22-A104 HTSL Temp = 175°C 1000 hours 231 pcs 0 JESD22-A103 Power Cycling Tj = 100°C 3.5min on / 3.5min off 8572 cycles 924 pcs 0 AEC Q101 Resistance to Temp = 270°C 15 seconds 30 pcs 0 JESD22-B106 Solder Heat Note: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 0.65 MTTF = 174680 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 0.65 9 MTTF = 10 / FIT = 174680 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from burn-in tests H = Duration of burn-in testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 125 deg C Af 758 256 95 38 9.7 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 150 deg C 175 deg C 2.9 1 3