MM5Z2V4ST1 SERIES Zener Voltage Regulators 100 mW SOD−523 Surface Mount This series of Zener diodes is packaged in a SOD−523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. http://onsemi.com Specification Features • Standard Zener Breakdown Voltage Range −2.4 V to 9.1 V • Steady State Power Rating of 100 mW • Small Body Outline Dimensions: • • • • 1 Cathode 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) ESD Rating of Class 3 (>16 kV) per Human Body Model Tight Tolerance VZ These devices are manufactured with a Pb−Free external lead finish only. 2 Anode 2 1 SOD−523 CASE 502 Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic MARKING DIAGRAM Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any XXd 1 QUALIFIED MAX REFLOW TEMPERATURE: 260°C 2 Device Meets MSL 1 Requirements XX = Specific Device Code d = Date Code MAXIMUM RATINGS Rating Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient Junction and Storage Temperature Range Symbol Max Unit 200 1.5 mW mW/°C RJA 635 °C/W TJ, Tstg −65 to +150 °C ORDERING INFORMATION PD Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR−4 Minimum Pad. Semiconductor Components Industries, LLC, 2004 September, 2004 − Rev. 2 1 Device MM5ZxxxST1 Package Shipping† SOD−523 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. Publication Order Number: MM5Z2V4ST1/D MM5Z2V4ST1 SERIES ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) I IF Parameter Symbol VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF VZ Maximum Temperature Coefficient of VZ C Max. Capacitance @VR = 0 and f = 1 MHz VZ VR V IR VF IZT Figure 1. Zener Voltage Regulator ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ ZZT IZ = IZT @ 10% Mod Max A V Min Max C pF Max @ VR = 0 f = 1 MHz Max IR @ VR dVZ/dt (mV/k) @ IZT1 = 5 mA Min Max ZZK IZ = 0.5 mA Max 5.0 2.43 2.63 1000 100 120 1.0 −3.5 0 450 T3 5.0 2.67 2.91 1000 100 100 1.0 −3.5 0 450 T6 5.0 3.60 3.85 1000 90 5.0 1.0 −3.5 0 450 MM5Z3V9ST1 T7 5.0 3.89 4.16 1000 90 3.0 1.0 −3.5 −2.5 450 MM5Z4V3ST1 T8 5.0 4.17 4.43 1000 90 3.0 1.0 −3.5 0 450 MM5Z4V7ST1 T9 5.0 4.55 4.75 800 80 3.0 2.0 −3.5 0.2 260 MM5Z5V1ST1 TA 5.0 4.98 5.2 500 60 2.0 2.0 −2.7 1.2 225 MM5Z5V6ST1 TC 5.0 5.49 5.73 200 40 1.0 2.0 −2.0 2.5 200 MM5Z6V2ST1 TE 5.0 6.06 6.33 100 10 3.0 4.0 0.4 3.7 185 MM5Z6V8ST1 TF 5.0 6.65 6.93 160 15 2.0 4.0 1.2 4.5 155 MM5Z7V5ST1 TG 5.0 7.28 7.6 160 15 1.0 5.0 2.5 5.3 140 MM5Z8V2ST1 TH 5.0 8.02 8.36 160 15 0.7 5.0 3.2 6.2 1358 MM5Z9V1ST1 TK 5.0 8.85 9.23 160 15 0.5 6.0 3.8 7.0 130 Device Device Marking Test Current Izt mA MM5Z2V4ST1 T2 MM5Z2V7ST1 MM5Z3V6ST1 http://onsemi.com 2 MM5Z2V4ST1 SERIES 100 POWER DISSIPATION (%) 80 60 40 20 0 0 25 50 75 100 125 TEMPERATURE (°C) Figure 2. Steady State Power Derating http://onsemi.com 3 150 MM5Z2V4ST1 SERIES PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE A −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A −Y− B 1 2 D 2 PL 0.08 (0.003) M DIM A B C D J K S T X Y MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM 0.047 0.032 0.024 0.012 0.0055 0.008 0.063 MAX 0.051 0.035 0.028 0.014 0.0079 0.010 0.067 C −T− K J SEATING PLANE S SOLDERING FOOTPRINT* 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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