ON MC78LC00 Micropower voltage regulator Datasheet

MC78LC00 Series
Micropower Voltage
Regulator
Features
MARKING DIAGRAMS AND
PIN CONNECTIONS
THIN SOT23−5
NTR SUFFIX
CASE 483
GND
1
Vin
2
Vout
3
5
Low Quiescent Current of 1.1 mA Typical
Excellent Line and Load Regulation
Maximum Operating Voltage of 12 V
Low Output Voltage Option
High Accuracy Output Voltage of 2.5%
Industrial Temperature Range of −40°C to 85°C
Two Surface Mount Packages (SOT−89, 3 Pin, or SOT−23, 5 Pin)
Pb−Free Packages are Available
Typical Applications
2
4 N/C
1
(Top View)
SOT−89
H SUFFIX
CASE 1213
GND 1
Vin 2
TAB
1
• Battery Powered Instruments
• Hand−Held Instruments
• Camcorders and Cameras
5 N/C
Vout 3
xx AYW G
G
•
•
•
•
•
•
•
•
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xxx AYW G
G
The MC78LC00 series of fixed output low dropout linear regulators
are designed for handheld communication equipment and portable
battery powered applications which require low quiescent current. The
MC78LC00 series features an ultra−low quiescent current of 1.1 mA.
Each device contains a voltage reference unit, an error amplifier, a
PMOS power transistor, and resistors for setting output voltage.
The MC78LC00 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 0.1 mF. The
device is housed in the micro−miniature Thin SOT23−5 surface mount
package and SOT−89, 3 pin. Standard voltage versions are 1.5, 1.8,
2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in
100 mV steps.
Tab
(Top View)
(Tab is connected to Pin 2)
3
Vin
VO
xxx = Version
A = Assembly Location
Y = Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Vref
1
GND
This device contains 8 active transistors.
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 9
1
Publication Order Number:
MC78LC00/D
MC78LC00 Series
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PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
1
GND
Description
2
Vin
Positive power supply input voltage
3
Vout
Regulated Output
4
N/C
No Internal Connection
5
N/C
No Internal Connection
Power supply ground
MAXIMUM RATINGS
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Symbol
Value
Unit
Input Voltage
Rating
Vin
12
V
Output Voltage
Vout
−0.3 to Vin +0.3
V
Power Dissipation and Thermal Characteristics
Case 483−01 (Thin SOT23−5) NTR Suffix
Power Dissipation @ TA = 85°C
Thermal Resistance, Junction−to−Ambient
Case 1213 (SOT−89) H Suffix
Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
PD
RqJA
140
280
mW
°C/W
PD
RqJA
300
333
mW
°C/W
Operating Junction Temperature
TJ
+125
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Tsolder
10
sec
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Lead Soldering Temperature @ 260°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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2
MC78LC00 Series
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 5)
NTR SUFFIX
Symbol
Characteristic
Output Voltage (TA = 25°C, Iout = 1.0 mA)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Vout
Output Voltage (TA = −40°C to 85°C)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Vout
Min
Typ
Max
1.455
1.746
2.425
2.646
2.744
2.94
3.234
3.9
4.90
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
1.545
1.854
2.575
2.754
2.856
3.06
3.366
4.1
5.10
1.455
1.746
2.425
2.619
2.716
2.910
3.201
3.9
4.90
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
1.545
1.854
2.575
2.781
2.884
3.09
3.399
4.1
5.10
Unit
V
V
Line Regulation (Vin = VO(nom.) + 1.0 V to 12 V, Iout = 1.0 mA)
Regline
−
0.05
0.2
%/V
Load Regulation (Iout = 1.0 mA to 10 mA)
Regload
−
40
60
mV
Output Current (Note 6)
1.5 V, 1.8 V (Vin = 4.0 V)
2.5 V, 2.7 V, 2.8 V, 3.0 V (Vin = 5.0 V)
3.3 V (Vin = 6.0 V)
4.0 V (Vin = 7.0 V)
5.0 V (Vin = 8.0 V)
Iout
35
50
50
80
80
50
80
80
80
100
−
−
−
−
−
−
−
−
−
35
30
30
30
70
60
53
38
Dropout Voltage (Iout = 1.0 mA, Measured at Vout −3.0%)
1.5 V
1.6 V−3.2 V
3.3 V−3.9 V
4.0 V−5.0 V
mA
mV
Vin−Vout
Quiescent Current (Iout = 1.0 mA to IO(nom.))
IQ
−
1.1
3.6
mA
Output Voltage Temperature Coefficient
Tc
−
"100
−
ppm/°C
Output Noise Voltage (f = 1.0 kHz to 100 kHz)
Vn
−
89
−
mVrms
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch up capability (85°C) "100 mA
3. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA.
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MC78LC00 Series
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 11)
HT SUFFIX
Symbol
Characteristic
Output Voltage
30HT1 Suffix
33HT1 Suffix
40HT1 Suffix
50HT1 Suffix
Min
Typ
Max
2.950
3.218
3.900
4.875
3.0
3.3
4.0
5.0
3.075
3.382
4.100
5.125
−
0.05
0.2
−
−
−
−
40
40
50
60
60
60
70
90
35
35
45
55
50
50
65
80
−
−
−
−
−
−
−
−
40
35
25
25
60
53
38
38
−
−
−
−
1.1
1.1
1.2
1.3
3.3
3.3
3.6
3.9
−
±100
−
Unit
V
(Vin = 5.0 V)
(Vin = 5.0 V)
(Vin = 6.0 V)
(Vin = 7.0 V)
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Line Regulation
Vin = [VO + 1.0] V to 10 V, IO = 1.0 mA
Regline
Load Regulation (IO = 1.0 to 10 mA)
30HT1 Suffix (Vin = 5.0 V)
33HT1 Suffix (Vin = 6.0 V)
40HT1 Suffix (Vin = 7.0 V)
50HT1 Suffix (Vin = 8.0 V)
Regload
Output Current (Note 12)
30HT1 Suffix (Vin = 5.0 V)
33HT1 Suffix (Vin = 6.0 V)
40HT1 Suffix (Vin = 7.0 V)
50HT1 Suffix (Vin = 8.0 V)
Dropout Voltage
30HT1 Suffix
33HT1 Suffix
40HT1 Suffix
50HT1 Suffix
mV
IO
mA
Vin − VO
(IO = 1.0 mA)
(IO = 1.0 mA)
(IO = 1.0 mA)
(IO = 1.0 mA)
Quiescent Current
30HT1 Suffix (Vin = 5.0 V)
33HT1 Suffix (Vin = 5.0 V)
40HT1 Suffix (Vin = 6.0 V)
50HT1 Suffix (Vin = 7.0 V)
ICC
Output Voltage Temperature Coefficient
TC
%/V
mV
mA
ppm/°C
7. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
8. Latch up capability (85°C) "100 mA
9. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
10. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
12. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA.
DEFINITIONS
Load Regulation
difference between the input current (measured through the
LDO input pin) and the output current.
The change in output voltage for a change in output current
at a constant temperature.
Line Regulation
Dropout Voltage
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low dissipation
or by using pulse technique such that the average chip
temperature is not significantly affected.
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3% below its
nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Line Transient Response
Typical over and undershoot response when input voltage is
excited with a given slope.
Maximum Power Dissipation
The maximum total dissipation for which the regulator will
operate within its specifications.
Maximum Package Power Dissipation
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches its
maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
Quiescent Current
The quiescent current is the current which flows through the
ground when the LDO operates without a load on its output:
internal IC operation, bias, etc. When the LDO becomes
loaded, this term is called the Ground current. It is actually the
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4
MC78LC00 Series
3.2
3.2
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
3.1
3
IO = 1 mA
2.9
IO = 10 mA
2.8
2.7
2.6
IO = 5 mA
2.5
2.4
2.2
2.5
2.8
IO = 5.0 mA
2.6
2.4
MC78LC30HT1
IO = 10 mA
2.7
2.9
3.1
3.3
2.2
2.5
3.5
Vin, Input Voltage (V)
2.9
3.1
Vin, Input Voltage (V)
Figure 2. Output Voltage versus Input Voltage
Figure 3. Output Voltage versus Input Voltage
2.7
3.3
3.5
3.2
3.05
NTR Series
3
−40°C
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
IO = 1.0 mA
3.0
TA = 25°C
2.3
2.95
80°C
2.9
2.85
2.8
2.75
25°C
2.7
2.65
3.1
TA = −30°C
3.0
2.9
0
20
40
60
80
100
TA = 25°C
2.8
MC78LC30HT1
2.7
2.6
0
0
120
20
TA = 80°C
100
120
IO, Output Current (mA)
40
60
80
IO, Output Current (mA)
Figure 4. Output Voltage versus Output Current
Figure 5. Output Voltage versus Output Current
2
2.0
Vin −VO, DROPOUT VOLTAGE (V)
Vin −VO, DROPOUT VOLTAGE (V)
TA = 25°C
NTR Series
MC78LC30NTR
TA = 25°C
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
10
20
30
40
1.6
1.2
0.8
0
0
50
MC78LC30HT1
TA = 25°C
0.4
IO, Output Current (mA)
10
20
30
40
50
IO, Output Current (mA)
Figure 6. Dropout Voltage versus Output Current
Figure 7. Dropout Voltage versus Output Current
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5
MC78LC00 Series
3.10
MC78LC30NTR
Vin = 4.0 V
IO = 10 mA
3.06
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
3.1
3.02
2.98
2.94
2.9
−40
−20
0
20
40
60
3.06
3.02
2.98
MC78LC30HT1
2.94
2.90
−40
80
−20
20
40
60
80
TA, Ambient Temperature (°C)
Figure 8. Output Voltage versus Temperature
Figure 9. Output Voltage versus Temperature
1.4
1.3
IQ, QUIESCENT CURRENT (mA)
MC78LC30NTR
TA = 25°C
IO = 0 mA
1.2
1.1
1
0.9
0.8
3
4
5
6
7
8
9
10
11
TA = 25°C
1.3
1.2
1.1
1.0
MC78LC30HT1
0.9
0.8
3.0
12
4.0
Vin, Input Voltage (V)
7.0
8.0
9.0
10
1.2
IQ, QUIESCENT CURRENT (mA)
MC78LC30NTR
Vin = 4.0 V
IO = 0 mA
1.25
1
0.75
0.5
−20
6.0
Figure 11. Quiescent Current versus Input Voltage
1.75
1.5
5.0
Vin, Input Voltage (V)
Figure 10. Quiescent Current versus Input Voltage
IQ, QUIESCENT CURRENT (mA)
0
TA, Ambient Temperature (°C)
1.4
IQ, QUIESCENT CURRENT (mA)
Vin = 5.0 V
IO = 10 mA
0
20
40
60
Vin = 5.0 V
1.1
1.0
0.9
0.8
0.6
−40
80
MC78LC30HT1
0.7
−20
0
20
40
60
80
TA, Ambient Temperature (°C)
TA, Ambient Temperature (°C)
Figure 12. Quiescent Current versus Temperature
Figure 13. Quiescent Current versus Temperature
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MC78LC00 Series
0.8
Vin − Vout, DROPOUT VOLTAGE (V)
Vin − Vout, DROPOUT VOLTAGE (V)
0.8
NTR Series
0.7
HT1 Series
0.7
0.6
IO = 10 mA
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
IO = 1.0 mA
0.1
0.1
0
0.0
2.0
1.0
3.0
4.0
5.0
0
0
6.0
1.0
2.0
VO, Set Output Voltage (V)
Output Voltage
Deviation (mV)
INPUT VOLTAGE/OUTPUT VOLTAGE (V)
Input Voltage (V)
6.0
NTR Series
5.0
4.0
Vin = 4.5 V to 5.5 V
Vout = 3.0 V
200
RL = 3 k
Cout = 0.1 mF
100
0
−100
−200
−300
0
0.5
1.0
1.5
2.0
2.5
6.0
8.0
7.5
Input Voltage
7.0
6.5
6.0
HT1 Series
5.5
Output Voltage
5.0
CO = 0.1 mF
IO = 1.0 mA
4.5
4.0
0
2.0
6.0
4.0
t, Time (ms)
Figure 16. Line Transient
Figure 17. Line Transient Response
1.5
TA = 25°C
3.0
NTR Series
Ig GROUND CURRENT (mA)
Vout, OUTPUT VOLTAGE (V)
5.0
Time (mS)
3.5
2.5
2.0
1.5
IO = 50 mA
1.0
100 mA
0.5
0
4.0
Figure 15. Dropout Voltage versus
Set Output Voltage
Figure 14. Dropout Voltage versus Set Output Voltage
300
3.0
VO, Set Output Voltage (V)
TA = 25°C
IO = 0 mA
1.0
NTR Series
50 mA
0.8
200 mA
0.6
100 mA
50 mA
0.4
200 mA
0.2
200 mA
0
0.5
1.0
1.5
2.0
0
2.5
0
0.5
Vin, Input Voltage (V)
1.0
1.5
2.0
2.5
Vin, Input Voltage (V)
Figure 18. Output Voltage versus Input Voltage
Figure 19. Ground Current versus Input Voltage
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7
MC78LC00 Series
APPLICATIONS INFORMATION
Thermal
A typical application circuit for the MC78LC00 series is
shown in Figure 20.
As power across the MC78LC00 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and also the
ambient temperature effect the rate of temperature rise for
the part. This is stating that when the MC78LC00 has good
thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation applications.
The maximum dissipation the package can handle is
given by:
Input Decoupling (C1)
A 0.1 mF capacitor either ceramic or tantalum is
recommended and should be connected close to the
MC78LC00 package. Higher values and lower ESR will
improve the overall line transient response.
Output Decoupling (C2)
The MC78LC00 is a stable component and does not
require any specific Equivalent Series Resistance (ESR) or
a minimum output current. Capacitors exhibiting ESRs
ranging from a few mW up to 3.0 W can thus safely be used.
The minimum decoupling value is 0.1 mF and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger values improve noise rejection and
load regulation transient response.
PD +
If junction temperature is not allowed above the
maximum 125°C, then the MC78LC00NTR can dissipate
up to 357 mW @ 25°C.
The power dissipated by the MC78LC00NTR can be
calculated from the following equation:
Hints
Please be sure the Vin and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a
chance to pick up noise or cause the regulator to
malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
Battery or
Unregulated
Voltage
TJ(max) * TA
RqJA
Ptot + [Vin * Ignd (Iout)] ) [Vin * Vout] * Iout
or
P ) Vout * Iout
VinMAX + tot
Ignd ) Iout
If an 80 mA output current is needed then the ground
current from the data sheet is 1.1 mA. For an
MC78LC30NTR (3.0 V), the maximum input voltage will
then be 7.4 V.
+
C1
Vout
+
C2
Figure 20. Basic Application Circuit for NTR Suffixes
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8
MC78LC00 Series
MJD32C
0.033 mF
2
100
Vin
2
Vin
3
3
VO
MC78LC00
VO
MC78LC00
R1
1
1
0.1 mF
ICC
C1
0.1 mF
GND
R2
GND
GND
Figure 21. Current Boost Circuit
R2
Figure 22. Adjustable VO
MJD32C
Q1
0.033 mF
Q2
Vin
C2
MMBT2907
ALT1
2
3
VO
MC78LC00
R1
1
0.1 mF
0.1 mF
GND
GND
Figure 23. Current Boost Circuit with
Overcurrent Limit Circuit
V
O
+ V
O(Reg)
ǒ1 ) R2
Ǔ ) ICC R2
R1
I
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9
O(short circuit)
[
V BE2
R2
)
V BE1 ) V BE2
R1
MC78LC00 Series
ORDERING INFORMATION
Nominal
Output Voltage
Marking
Package
MC78LC15NTR
1.5
LAG
Thin SOT23−5
MC78LC15NTRG
1.5
LAG
Thin SOT23−5
(Pb−Free)
MC78LC18NTR
1.8
LAH
Thin SOT23−5
MC78LC18NTRG
1.8
LAH
Thin SOT23−5
(Pb−Free)
MC78LC25NTR
2.5
LAI
Thin SOT23−5
MC78LC25NTRG
2.5
LAI
Thin SOT23−5
(Pb−Free)
MC78LC27NTR
2.7
LAJ
Thin SOT23−5
MC78LC27NTRG
2.7
LAJ
Thin SOT23−5
(Pb−Free)
MC78LC28NTR
2.8
LAK
Thin SOT23−5
MC78LC28NTRG
2.8
LAK
Thin SOT23−5
(Pb−Free)
MC78LC30NTR
3.0
LAL
Thin SOT23−5
MC78LC30NTRG
3.0
LAL
Thin SOT23−5
(Pb−Free)
MC78LC33NTR
3.3
LAM
Thin SOT23−5
MC78LC33NTRG
3.3
LAM
Thin SOT23−5
(Pb−Free)
MC78LC40NTR
4.0
LEC
Thin SOT23−5
MC78LC40NTRG
4.0
LEC
Thin SOT23−5
(Pb−Free)
MC78LC50NTR
5.0
LAN
Thin SOT23−5
MC78LC50NTRG
5.0
LAN
Thin SOT23−5
(Pb−Free)
MC78LC30HT1
3.0
0C
SOT−89
MC78LC30HT1G
3.0
0C
SOT−89
(Pb−Free)
MC78LC33HT1
3.3
3C
SOT−89
MC78LC33HT1G
3.3
3C
SOT−89
(Pb−Free)
MC78LC40HT1
4.0
0D
SOT−89
MC78LC40HT1G
4.0
0D
SOT−89
(Pb−Free)
MC78LC50HT1
5.0
0E
SOT−89
MC78LC50HT1G
5.0
0E
SOT−89
(Pb−Free)
Device
Shipping †
3000 Units/7″ Tape & Reel
1000 Units Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.
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10
MC78LC00 Series
PACKAGE DIMENSIONS
THIN SOT23−5
NTR SUFFIX
PLASTIC PACKAGE
CASE 483−02
ISSUE E
D
S
5
4
1
2
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
B
L
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
J
C
0.05 (0.002)
H
M
K
MILLIMETERS
MIN
MAX
2.90
3.10
1.30
1.70
0.90
1.10
0.25
0.50
0.85
1.05
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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11
INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0_
10 _
0.0985 0.1181
MC78LC00 Series
PACKAGE DIMENSIONS
SOT−89
H SUFFIX
PLASTIC PACKAGE
CASE 1213−02
ISSUE C
−A−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. 1213−01 OBSOLETE, NEW STANDARD 1213−02.
C
J
F
−B−
L
K
D
0.10
E
G
M
T B
S
A
S
−T−
SEATING
PLANE
2 PL
0.10
M
T B
S
A
S
DIM
A
B
C
D
E
F
G
H
J
K
L
MILLIMETERS
MIN
MAX
4.40
4.60
2.40
2.60
1.40
1.60
0.37
0.57
0.32
0.52
1.50
1.83
1.50 BSC
3.00 BSC
0.30
0.50
0.80
−−−
−−−
4.25
INCHES
MIN
MAX
0.173
0.181
0.094
0.102
0.055
0.063
0.015
0.022
0.013
0.020
0.059
0.072
0.059 BSC
0.118 BSC
0.012
0.020
0.031
−−−
−−− 0.167
H
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MC78LC00/D