Microchip MCP1603T-150I/MC 2.0 mhz, 500 ma synchronous buck regulator Datasheet

MCP1603/B/L
2.0 MHz, 500 mA Synchronous Buck Regulator
Features
General Description
• Over 90% Typical Efficiency
• Output Current Up To 500 mA
• Low PFM Quiescent Current = 45 µA, typical
(MCP1603/L)
• Low Shutdown Current = 0.1 µA, typical
• Adjustable Output Voltage:
- 0.8V to 4.5V
• Fixed Output Voltage:
- 1.2V, 1.5V, 1.8V, 2.5V, 3.3V (MCP1603/L)
- 1.8V, 3.3V (MCP1603B)
• 2.0 MHz Fixed-Frequency PWM (Heavy Load)
• Automatic PWM-to-PFM Mode Transition
(MCP1603/L)
• PWM Mode Only Option (MCP1603B)
• 100% Duty Cycle Operation
• Internally Compensated
• Undervoltage Lockout (UVLO)
• Overtemperature Protection
• Space Saving Packages:
- 5-Lead TSOT, Two Pinout Types (MCP1603/L)
- 8-Lead 2 x 3 DFN
The MCP1603/B/L is a high-efficiency, fully-integrated
500 mA synchronous buck regulator whose 2.7V to
5.5V input voltage range makes it ideally suited for
applications powered from 1-cell Li-Ion or 2-cell/3-cell
NiMH/NiCd batteries.
Applications
•
•
•
•
•
•
•
•
Cellular Telephones
Portable Computers
Organizers / PDAs
USB Powered Devices
Digital Cameras
Portable Equipment
+5V or +3.3V Distributed Systems
Headsets
 2007-2012 Microchip Technology Inc.
At heavy loads, the MCP1603/B/L operates in the
2.0 MHz fixed frequency pulse-width modulation
(PWM) mode, which provides a low noise, low-output
ripple, small-size solution. When the load is reduced to
light levels, the MCP1603/L automatically changes
operation to a Pulse Frequency Modulation (PFM)
mode to minimize quiescent current draw from the
battery. No intervention is necessary for a smooth
transition from one mode to another. These two modes
of operation allow the MCP1603/L to achieve the
highest efficiency over the entire operating current
range.
The MCP1603B device disables the PFM mode
switching, and operates only in normal PWM mode
over the entire load range (without skipping).
MCP1603B is for applications that cannot tolerate the
low-frequency output ripple associated with PFM
switching.
The MCP1603/B/L family is available with either an
adjustable or fixed-output voltage. The available fixed
output voltage options for MCP1603/L are 1.2V, 1.5V,
1.8V, 2.5V and 3.3V, and for MCP1603B are 1.8 and
3.3V. When a fixed option is used, only three additional
small external components are needed to form a
complete solution. Couple this with the low profile,
small-foot print packages and the entire system
solution is achieved with minimal size.
Additional protection features include:
overtemperature and overcurrent protection.
UVLO,
DS22042B-page 1
MCP1603/B/L
Package Types
MCP1603L
TSOT
MCP1603/MCP1603B
TSOT
VIN
1
GND
2
SHDN
3
5
LX
SHDN
1
GND
2
LX
3
MCP1603
2 x 3 DFN*
5
LX 1
VFB/VOUT
NC 2
4
VFB/VOUT
4
SHDN 3
VFB/VOUT 4
VIN
8 GND
EP
9
7 VIN
6 NC
5 NC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
Typical Application Circuit
L1
4.7 µH
VIN
2.7V to 4.5V
VIN
CIN
4.7 µF
VOUT
1.8V @ 500 mA
LX
COUT
4.7 µF
SHDN VFB
GND
100
Efficiency (%)
90
VIN = 2.7V
VOUT = 1.8V
80
70
60
50
40
VIN = 3.6V
30
VIN = 4.5V
__ PFM/PWM (MCP1603/L)
--- PWM (MCP1603B)
20
10
0.1
1
10
100
1000
Output Current (mA)
DS22042B-page 2
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
Functional Block Diagram
VIN
Band
Gap
UVLO
Thermal
Shutdown
UVLO
VREF
Soft Start
SHDN
ILIMPWM
TSD
IPK Limit
IPEAKPWM
ILIMPFM
IPEAKPFM
Slope
Comp.
+
OSC
-ILPK
+
S
R
Q
POFF
Q
Switch Drive
Logic and Timing
NOFF
LX
PWM/PFM - PWM ONLY
PWM-ONLY
PFM Error Amp
PWM/PFM
Logic
GND
IPEAKPFM
IPEAKPWM
VREF
PWM Error Amp
-ILPK
EA
-IPK Limit
VREF
OV Threshold
Disable
Switcher
VFB / VOUT
UVLO
TSD
UV Threshold
 2007-2012 Microchip Technology Inc.
DS22042B-page 3
MCP1603/B/L
NOTES:
DS22042B-page 4
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - GND.......................................................................+6.0V
All Other I/O ............................... (GND - 0.3V) to (VIN + 0.3V)
LX to GND .............................................. -0.3V to (VIN + 0.3V)
Output Short Circuit Current ................................. Continuous
Power Dissipation (Note 5) .......................... Internally Limited
Storage Temperature ....................................-65°C to +150°C
Ambient Temp. with Power Applied ................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD Protection On All Pins:
HBM ............................................................................. 4 kV
MM ..............................................................................300V
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device
reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF,
L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C
to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VIN
2.7
—
5.5
V
Note 1
IOUT
500
—
—
mA
Note 1
IIN_SHDN
—
0.1
1
µA
SHDN = GND
Quiescent Current - PFM
IQ
—
45
60
µA
SHDN = VIN, IOUT = 0 mA,
device switching
Quiescent Current - PWM
IQ
1.0
2.7
4
mA
SHDN = VIN, IOUT = 0 mA,
device switching (MCP1603B)
—
15
%VIN VIN = 2.7V to 5.5V
%VIN VIN = 2.7V to 5.5V
Input Characteristics
Input Voltage
Maximum Output Current
Shutdown Current
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN, Logic Input Voltage Low
SHDN, Logic Input Voltage High
SHDN, Input Leakage Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Thermal Shutdown
Thermal Shutdown Hysteresis
Note 1:
2:
3:
4:
5:
6:
VIL
—
VIH
45
—
—
IL_SHDN
-1.0
±0.1
1.0
µA
VIN = 2.7V to 5.5V
UVLO
2.12
2.28
2.43
V
VIN Falling
UVLOHYS
—
140
—
mV
TSHD
—
150
—
°C
Note 4, Note 5
TSHD-HYS
—
10
—
°C
Note 4, Note 5
The input voltage should be greater then the output voltage plus headroom voltage; higher load currents
increase the input voltage required for regulation. MCP1603B device requires a minimum load for
regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
VR is the output voltage setting.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
 2007-2012 Microchip Technology Inc.
DS22042B-page 5
MCP1603/B/L
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF,
L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C
to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VOUT
0.8
—
4.5
V
—
0.8
—
V
-3.0
—
+3.0
%
TA = -40°C to +25°C
TA = +25°C to +85°C
Output Characteristics
Adjustable Output Voltage Range
Reference Feedback Voltage
VFB
Reference Feedback Voltage
Tolerance
Note 2
-2.5
—
+2.5
%
Feedback Input Bias Current
IVFB
—
0.1
—
nA
Output Voltage Tolerance Fixed
VOUT
-3.0%
VR
+3.0%
%
TA = -40°C to +25°C, Note 3
VOUT
-2.5
VR
+2.5
%
TA = +25°C to +85°C, Note 3
Line Regulation
VLINE-REG
—
0.3
—
%/V
Load Regulation
VLOAD-REG
—
0.35
—
%
FOSC
1.5
2.0
2.8
MHz
Internal Oscillator Frequency
VIN = VR + 1V to 5.5V,
IOUT = 100 mA
VIN = VR +1.5V,
ILOAD = 100 mA to 500 mA
TSS
—
0.6
—
ms
TR = 10% to 90%
RDSon P-Channel
RDSon-P
—
500
—
m
IP = 100 mA
RDSon N-Channel
RDSon-N
—
500
—
m
IN = 100 mA
ILX
-1.0
±0.1
1.0
µA
SHDN = 0V, VIN = 5.5V,
LX = 0V, LX = 5.5V
+ILX(MAX)
—
860
—
mA
Note 6
Start Up Time
LX Pin Leakage Current
Positive Current Limit Threshold
Note 1:
2:
3:
4:
5:
6:
The input voltage should be greater then the output voltage plus headroom voltage; higher load currents
increase the input voltage required for regulation. MCP1603B device requires a minimum load for
regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
VR is the output voltage setting.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 2.7V to 5.5V
Parameters
Sym
Min
Typ
Max
Units
Conditions
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Thermal Resistance, 5L-TSOT
JA
—
207.4
—
°C/W Typical 4-layer Board with
Internal Ground Plane
Thermal Resistance, 8L-2x3 DFN
JA
—
68
—
°C/W Typical 4-layer Board with
Internal Ground Plane and
2-Vias in Thermal Pad
Temperature Ranges
Steady State
Transient
Package Thermal Resistances
DS22042B-page 6
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
50
49
48
47
46
45
44
43
42
41
40
52
VOUT = 1.8V
VIN = 3.6V
VIN = 4.2V
VIN = 3.0V
3 0V
Quiiescent Current (µA)
Quie
escent Current (µA)
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
48
46
5
44
42
TA = -40oC
2.7
20 35 50 65 80 95 110 125
Ambient Temperature
3.4
Quies
scent Current (mA)
VIN = 3.0V
3.1
3
VIN = 4.2V
2.8
2.7
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
VOUT = 1.8V
2.9
3.4
FIGURE 2-4:
(MCP1603/L).
3.3
3.2
3.05
(oC)
FIGURE 2-1:
PFM IQ vs. Ambient
Temperature (MCP1603/L).
Quies
scent Current (mA)
TA = +25oC
40
-40 -25 -10
VIN = 3.6V
2.6
2.5
PFM IQ vs. Input Voltage
VOUT = 1.8V
TA = +90oC
3.2
TA = +25oC
3
2.8
2.6
2.4
TA = -40oC
2.2
2
2.4
-40
-25
-10
5
20 35 50 65
Ambient Temperature (oC)
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
80
Input Voltage (V)
FIGURE 2-2:
PWM IQ vs. Ambient
Temperature (MCP1603B).
PWM IQ vs. Input Voltage
FIGURE 2-5:
(MCP1603B).
100
100
90
VOUT = 1.2V
95
80
IOUT = 100 mA
90
85
80
IOUT = 300 mA
75
IOUT = 500 mA
70
Efficiency (%)
E
Efficiency (%)
TA = +90oC
50
70
60
50
40
65
60
10
3.05
3.4
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
FIGURE 2-3:
(VOUT = 1.2V).
Efficiency vs. Input Voltage
 2007-2012 Microchip Technology Inc.
VOUT = 1.2V
30
20
2.7
VIN = 3.6V
VIN = 2.7V
VIN = 4.2V
PFM/PWM
PWM Only
0
0.1
FIGURE 2-6:
(VOUT = 1.2V).
1
10
100
Output Current (mA)
1000
Efficiency vs. Output Load
DS22042B-page 7
MCP1603/B/L
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
0.6
100
Efficiency (%)
95
IOUT = 100 mA
90
85
IOUT = 300 mA
IOUT = 500 mA
80
75
VOUT = 1.8V
Lin
ne Regualtion (%/V)
VOUT = 1.8V
0.5
IOUT = 300 mA
0.4
0.3
IOUT = 100 mA
0.2
02
0.1
70
2.7
3.05
3.4
3.75
4.1
4.45
4.8
5.15
-40 -25 -10
5.5
Efficiency vs. Input Voltage
FIGURE 2-10:
Line Regulation vs. Ambient
Temperature (VOUT = 1.8V).
100
Output
O
Voltage (V)
70
60
50
VIN = 4.2V
40
30
VOUT = 1.8V
1 8V
20
PFM/PWM
PWM Only
10
TA = +90oC
1.80
1.79
1.78
TA = +25oC
TA = -40oC
1.77
1.76
1.75
1.74
0
1
FIGURE 2-8:
(VOUT = 1.8V).
10
100
Output Current (mA)
VOUT = 2.4V
IOUT = 100 mA
95
90
IOUT = 300 mA
IOUT = 500 mA
85
80
75
3
3.5
4
4.5
5
5.5
Input Voltage (V)
FIGURE 2-9:
(VOUT = 2.4V).
DS22042B-page 8
150
200
250
300
350
400
450
500
Output Current (mA)
Efficiency vs. Output Load
100
100
1000
Efficiency vs. Input Voltage
FIGURE 2-11:
Output Voltage vs. Load
Current (VOUT = 1.8V).
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.7V
VIN = 3.6V
Efficiency (%)
E
0.1
Efficiency (%)
TA = +125oC
1.81
VIN = 3.6V
80
Efficiency (%)
E
1.82
VIN = 2.7V
90
20 35 50 65 80 95 110 125
Ambient Temperature (oC)
Input Voltage (V)
FIGURE 2-7:
(VOUT = 1.8V).
5
VIN = 4.2V
VOUT = 2.4V
2 4V
PFM/PWM
PWM Only
0.1
1
10
100
Output Current (mA)
1000
FIGURE 2-12:
PFM/PWM Efficiency vs.
Output Load (VOUT = 2.4V).
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
100.0
VOUT = 3.3V
97.5
Efficiency (%)
IOUT = 100 mA
IOUT = 300 mA
95.0
92.5
90.0
IOUT = 500 mA
87.5
85.0
3.5 3.75
4
4.25 4.5 4.75
5
Switch
hing Frequency (MHz)
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
2.20
2.15
2.10
2.05
2.00
1.95
5.25 5.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
Ambient Temperature (oC)
Input Voltage (V)
FIGURE 2-13:
(VOUT = 3.3V).
Efficiency vs. Input Voltage
FIGURE 2-16:
Switching Frequency vs.
Ambient Temperature.
90
VIN = 3.6V
80
Efficiency (%)
E
70
60
50
VIN = 4.2V
40
30
VOUT = 3.3V
20
PFM/PWM
PWM Only
10
Switch
hing Frequency (MHz)
100
2.20
2.15
2.10
2.05
2 00
2.00
1.95
2.7
0
0.1
1
FIGURE 2-14:
(VOUT = 3.3V).
10
100
Output Current (mA)
3.4
Efficiency vs. Output Load
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
FIGURE 2-17:
Input Voltage.
10
Switching Frequency vs.
0.65
8
Regulation
7
6
TA= +25oC
5
4
TA=
-40oC
TA= +85oC
3
2
No Regulation
1
Swittch Resistance ()
9
Lo
oad Current (mA)
3.05
1000
0.60
0.55
0.50
N-Channel
P-Channel
0.45
0.40
0.35
0
2.7
1.8
2
2.2 2.4
2.6 2.8 3
VIN - VOUT (V)
3.2
FIGURE 2-15:
PWM-Only Device Minimum
Load for Regulation (MCP1603B).
 2007-2012 Microchip Technology Inc.
3.05
3.4 3.6
3.4
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
FIGURE 2-18:
Voltage.
Switch Resistance vs. Input
DS22042B-page 9
MCP1603/B/L
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
Swittch Resistance ()
0.9
0.8
N-Channel
0.7
0.6
0.5
0.4
P-Channel
0.3
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (oC)
FIGURE 2-19:
Switch Resistance vs.
Ambient Temperature.
FIGURE 2-22:
PFM Light Load Switching
Waveforms (MCP1603/L).
FIGURE 2-20:
Waveform.
Output Voltage Startup
FIGURE 2-23:
Output Voltage Load Step
Response vs. Time.
FIGURE 2-21:
Waveform.
Heavy Load Switching
FIGURE 2-24:
Output Voltage Line Step
Response vs. Time.
DS22042B-page 10
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
VLx = 2 V/div
VOUT = 50 mV/div, AC
IOUT = 5 mA
IL = 20 mA/div
0.4 µs/div
FIGURE 2-25:
PWM Light Load Switching
Waveforms (MCP1603B).
 2007-2012 Microchip Technology Inc.
DS22042B-page 11
MCP1603/B/L
NOTES:
DS22042B-page 12
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP1603/B
TSOT-23
MCP1603L
TSOT-23
MCP1603
2 x 3 DFN
1
4
7
VIN
2
2
8
GND
3
1
3
SHDN
4
5
4
VFB/VOUT
5
3
1
LX
Switch Node, Buck Inductor Connection Pin
3.1
Symbol
Shutdown Control Input Pin
Feedback / Output Voltage Pin
—
2, 5, 6
NC
No Connect
—
—
Exposed
Pad
EP
For the DFN package, the center exposed pad is a thermal
path to remove heat from the device. Electrically, this pad is
at ground potential and should be connected to GND.
Power Supply Input Voltage Pin
(VIN)
Ground Pin (GND)
Ground pin for the device. The loop area of the ground
traces should be kept as minimal as possible.
3.3
Power Supply Input Voltage Pin
Ground Pin
—
Connect the input voltage source to VIN. The input
source must be decoupled to GND with a 4.7 µF
capacitor.
3.2
Description
Shutdown Control Input Pin
(SHDN)
The SHDN pin is a logic-level input used to enable or
disable the device. A logic high (>45% of VIN) will
enable the regulator output. A logic low (<15% of VIN)
will ensure that the regulator is disabled.
 2007-2012 Microchip Technology Inc.
3.4
Feedback / Output Voltage Pin
(VFB/VOUT)
For adjustable output options, connect the center of the
output voltage divider to the VFB/VOUT pin. For fixedoutput voltage options, connect the output directly to
the VFB/VOUT pin.
3.5
Switch Node, Buck Inductor
Connection Pin (LX)
Connect the LX pin directly to the buck inductor. This
pin carries large signal-level current; all connections
should be made as short as possible.
3.6
Exposed Metal Pad (EP)
For the DFN package, connect the Exposed Pad to
GND, with vias into the GND plane. This connection to
the GND plane will aid in heat removal from the
package.
DS22042B-page 13
MCP1603/B/L
NOTES:
DS22042B-page 14
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
4.0
DETAILED DESCRIPTION
4.1
Device Overview
The MCP1603/L is a synchronous buck regulator that
operates in a Pulse Frequency Modulation (PFM)
mode or a Pulse Width Modulation (PWM) mode to
maximize system efficiency over the entire operating
current range. Capable of operating from a 2.7V to
5.5V input voltage source, the MCP1603 can deliver
500 mA of continuous output current.
The MCP1603B device disables the PFM mode
switching, and operates only in normal PWM mode.
When using the MCP1603/B/L, the PCB area required
for a complete step-down converter is minimized, since
both the main P-Channel MOSFET and the synchronous N-Channel MOSFET are integrated. Also while in
PWM mode, the device switches at a constant
frequency of 2.0 MHz (typical), which allows for small
filtering components. Both fixed and adjustable output
voltage options are available. The fixed voltage options
(1.2V, 1.5V 1.8V, 2.5V, 3.3V) do not require an external
voltage divider, which further reduces the required
circuit board footprint. The adjustable output voltage
options allow for more flexibility in the design, but
require an external voltage divider.
Additionally, the device features an undervoltage lockout (UVLO), overtemperature shutdown, overcurrent
protection and enable/disable control.
4.2
Synchronous Buck Regulator
The MCP1603/L has two distinct modes of operation
that allow the device to maintain a high level of
efficiency throughout the entire operating current and
voltage range. The device automatically switches
between PWM mode and PFM mode, depending on
the output load requirements. MCP1603B switches in
PWM mode only.
4.2.1
PFM/PWM MODE DEVICE OPTION
(MCP1603/L)
During heavy load conditions, the MCP1603/L
operates at a high, fixed switching frequency of
2.0 MHz (typical) using current mode control. This
minimizes output ripple (10 – 15 mV, typically) and
noise, while maintaining high efficiency (88% typical
with VIN = 3.6V, VOUT = 1.8V, IOUT = 300 mA).
 2007-2012 Microchip Technology Inc.
During normal PWM operation, the beginning of a
switching cycle occurs when the internal P-Channel
MOSFET is turned on. The ramping inductor current is
sensed and tied to one input of the internal high-speed
comparator. The other input to the high-speed
comparator is the error amplifier output. This is the
difference between the internal 0.8V reference and the
divided-down output voltage. When the sensed current
becomes equal to the amplified error signal, the highspeed comparator switches states and the P-Channel
MOSFET is turned off. The N-Channel MOSFET is
turned on until the internal oscillator sets an internal RS
latch, initiating the beginning of another switching
cycle.
PFM-to-PWM mode transition is initiated for any of the
following conditions:
• Continuous device switching
• Output voltage has dropped out of regulation
4.2.1.1
Light Load, PFM Mode
During light-load conditions, the MCP1603/L operates
in a PFM mode. When the MCP1603/L enters this
mode, it begins to skip pulses to minimize unnecessary
quiescent-current draw by reducing the number of
switching cycles per second. The typical quiescent current draw for this device is 45 µA.
PWM-to-PFM mode transition is initiated for any of the
following conditions:
• Discontinuous inductor current is sensed for a set
duration
• Inductor peak current falls below the transition
threshold limit
4.2.2
PWM MODE DEVICE OPTION
(MCP1603B)
There are applications that cannot tolerate the low
frequency pulse skipping mode or the output ripple
voltage associated with it, which is distinctive for PFM
switching.
The MCP1603B device has disabled the PFM mode
switching. It operates only in normal PWM mode over
the entire load range (without skipping pulses). During
periods of light load operation, the MCP1603B
continues to operate at a constant 2 MHz switching
frequency, keeping the output ripple voltage lower than
PFM mode. Because there are no skipping pulses, a
minimum load current is necessary to keep output in
regulation (see Figure 2-15, without a minimum load,
the output voltage will be greater than the set point).
The minimum load value depends on the input-tooutput ratio.
DS22042B-page 15
MCP1603/B/L
4.3
Soft Start
The output of the MCP1603 is controlled during startup. This control allows for a very minimal amount of
VOUT overshoot during start-up from VIN rising above
the UVLO voltage or SHDN being enabled.
4.4
Enable/Disable Control
The SHDN pin is used to enable or disable the
MCP1603/B/L. When the SHDN pin is pulled low, the
device is disabled. When pulled high, the device is
enabled and begins operation, unless the input voltage
is below the UVLO threshold or a fault condition exists.
Overtemperature Protection
Overtemperature protection circuitry is integrated in the
MCP1603/B/L device family. This circuitry monitors the
device junction temperature and shuts the device off, if
the junction temperature exceeds the typical +150°C
threshold. If this threshold is exceeded, the device will
automatically restart once the junction temperature
drops by approximately 10°C. The soft start is reset
during an overtemperture condition.
4.5
4.6
Overcurrent Protection
Cycle-by-cycle current limiting is used to protect the
MCP1603/B/L device family from being damaged when
an external short circuit is applied. The typical peak
current limit is 860 mA. If the sensed current reaches
the 860 mA limit, the P-Channel MOSFET is turned off,
even if the output voltage is not in regulation. The
device will attempt to start a new switching cycle when
the internal oscillator sets the internal RS latch.
DS22042B-page 16
4.7
Undervoltage Lockout (UVLO)
The UVLO feature uses a comparator to sense the
input voltage (VIN) level. If the input voltage is lower
than the voltage necessary to properly operate the
MCP1603, the UVLO feature will hold the converter off.
When VIN rises above the necessary input voltage, the
UVLO is released and soft start begins. Hysteresis is
built into the UVLO circuit to compensate for input
impedance. For example, if there is any resistance
between the input voltage source and the device when
it is operating, there will be a voltage drop at the input
to the device equal to IIN x RIN. The typical hysteresis
is 140 mV.
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
5.0
APPLICATION INFORMATION
5.1
Typical Applications
The MCP1603/B/L 500 mA synchronous buck
regulator operates over a wide input voltage range
(2.7V to 5.5V) and is ideal for single-cell Li-Ion batterypowered applications, USB-powered applications,
three cell NiMH or NiCd applications and 3V or 5V
regulated input applications. The 5-lead TSOT and 8lead 2 x 3 DFN packages provide a small footprint with
minimal external components.
5.2
Fixed Output Voltage Applications
The Typical Application Circuit shows a fixed
MCP1603/B/L in an application used to convert three
NiMH batteries into a well-regulated 1.8V @ 500 mA
output. A 4.7 µF input capacitor, 4.7 µF output
capacitor, and a 4.7 µH inductor make up the entire
external component solution for this application. No
external voltage divider or compensation is necessary.
In addition to the fixed 1.8V option, the MCP1603 is
also available in 1.2V, 1.5V, 2.5V, or 3.3V fixed voltage
options.
5.3
Adjustable Output Voltage
Applications
When the desired output for a particular application is
not covered by the fixed-voltage options, an adjustable
MCP1603/B/L can be used. The circuit listed in
Figure 6-2 shows an adjustable device being used to
convert a 5V rail to 1.0V @ 500 mA. The output voltage
is adjustable by using two external resistors as a voltage divider. For adjustable-output voltages, it is
recommended that the top resistor divider value be
200 k. The bottom resistor value can be calculated
using the following equation:
EQUATION 5-1:
V FB
R BOT = R TOP   -----------------------------
 V OUT – V FB
Example:
RTOP
=
200 k
VOUT
=
1.0V
VFB
=
0.8V
RBOT
=
200 k x (0.8V/(1.0V – 0.8V))
RBOT
=
800 k(Standard Value = 787 k)
For adjustable output applications, an additional R-C
compensation network is necessary for control loop
stability. Recommended values for any output voltage
are:
RCOMP = 4.99 k
CCOMP = 33 pF
Refer to Figure 6-2 for proper placement of RCOMP and
CCOMP.
5.4
Input Capacitor Selection
The input current to a buck converter, when operating
in Continuous Conduction mode, is a squarewave with
a duty cycle defined by the output voltage (VOUT) to
input voltage (VIN) relationship of VOUT/VIN. To prevent
undesirable input voltage transients, the input capacitor
should be a low-ESR type with an RMS current rating
given by Equation 5.5. Because of their small size and
low ESR, ceramic capacitors are often used. Ceramic
material X5R or X7R are well suited, since they have a
low-temperature coefficient and acceptable ESR.
EQUATION 5-2:
 V OUT   V IN – V OUT 
ICIN ,RMS = I OUT ,MAX   ------------------------------------------------------
V IN


Table 5-1 contains the recommend range for the input
capacitor value.
5.5
Output Capacitor Selection
The output capacitor helps provide a stable output
voltage during sudden load transients, smooths the
current that flows from the inductor to the load, and
reduces the output voltage ripple. Therefore, low-ESR
capacitors are a desirable choice for the output capacitor. As with the input capacitor, X5R and X7R ceramic
capacitors are well suited for this application.
The output ripple voltage is often a design specification. A buck converters’ output ripple voltage is a
function of the charging and discharging of the output
capacitor and the ESR of the capacitor. This ripple
voltage can be calculated by Equation 5-3.
EQUATION 5-3:
 IL
 V OUT =  I L  ESR + --------------------8fC
Table 5-1 contains the recommend range for the output
capacitor value.
TABLE 5-1:
 2007-2012 Microchip Technology Inc.
CAPACITOR VALUE RANGE
CIN
COUT
Minimum
4.7 µF
4.7 µF
Maximum
—
22 µF
DS22042B-page 17
MCP1603/B/L
5.6
TABLE 5-2:
Inductor Selection
When using the MCP1603, the inductance value can
range from 3.3 µH to 10 µH. An inductance value of
4.7 µH is recommended to achieve a good balance
between converter load transient response and
minimized noise.
The value of inductance is selected to achieve a
desired amount of ripple current. It is reasonable to
assume a ripple current that is 20% of the maximum
load current. The larger the amount of ripple current
allowed, the larger the output capacitor value becomes
to meet ripple voltage specifications. The inductor
ripple current can be calculated according to the
following equation.
EQUATION 5-4:
V OUT
V OUT
 I L = ------------------   1 – -------------
F SW  L
V IN
Where:
FSW = Switching Frequency
When considering inductor ratings, the maximum DC
current rating of the inductor should be at least equal to
the maximum load current, plus one half the peak-topeak inductor ripple current (1/2 x IL). The inductor
DC resistance adds to the total converter power loss.
An inductor with a low DC resistance allows for higher
converter efficiency.
TABLE 5-2:
MCP1603 RECOMMENDED
INDUCTORS
Value
(µH)
DCR

(max)
ISAT
(A)
Size
WxLxH (mm)
SD3110
3.3
0.195
0.81
3.1x3.1x1.0
SD3110
4.7
0.285
0.68
3.1x3.1x1.0
SD3110
6.8
0.346
0.58
3.1x3.1x1.0
SD3812
3.3
0.159
1.40
3.8x3.8x1.2
SD3812
4.7
0.256
1.13
3.8x3.8x1.2
SD3812
6.8
0.299
0.95
3.8x3.8x1.2
Part
Number
Coiltronics®
Würth Elektronik®
WE-TPC
Type XS
3.3
0.225
0.72
3.3x3.5x0.95
WE-TPC
Type XS
4.7
0.290
0.50
3.3x3.5x0.95
WE-TPC
Type S
4.7
0.105
0.90
3.8x3.8x1.65
WE-TPC
Type S
6.8
0.156
0.75
3.8x3.8x1.65
WE-TPC
Type Tiny
4.7
0.100
1.7
2.8x2.8x2.8
DS22042B-page 18
MCP1603 RECOMMENDED
INDUCTORS (CONTINUED)
Value
(µH)
DCR

(max)
ISAT
(A)
Size
WxLxH (mm)
CMD4D06
3.3
0.174
0.77
3.5x4.3x0.8
CMD4D06
4.7
0.216
0.75
3.5x4.3x0.8
CMD4D06
6.8
0.296
0.62
3.5x4.3x0.8
XFL3012332ME_
3.3
0.106
1.2
3x3x1.2
XFL3012472ME_
4.7
0.143
1.0
3x3x1.2
LPS4018103ML_
10
0.200
1.2
4x4x1.8
B82462_
G4472M
4.7
0.04
1.8
6x6x3
VLS3015E
T-4R7M
4.7
0.113
1.1
3x3x1.5
Part
Number
Sumida®
Coilcraft
®
TDK-EPC®
5.7
Thermal Calculations
The MCP1603 is available in two different packages
(TSOT-23 and 2x3 DFN). The junction temperature is
estimated by calculating the power dissipation and
applying the package thermal resistance (JA). The
maximum continuous junction temperature rating for
the MCP1603 is +125°C.
To quickly estimate the internal power dissipation for
the switching buck regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by the following equation:
EQUATION 5-5:
VOUT  IOUT
 ------------------------------------ – V
OUT  IOUT  = P Diss
 Efficiency 
The difference between the first term, input power
dissipation, and the second term, power delivered, is
the internal power dissipation. This is an estimate
assuming that most of the power lost is internal to the
MCP1603. There is some percentage of power lost in
the buck inductor, with very little loss in the input and
output capacitors.
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
5.8
PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry, and switching
power supplies are no different. When wiring the highcurrent paths, short and wide traces should be used.
This high-current path is shown with red connections in
Figure 5-1. The current in this path is switching.
Therefore, it is important that the components along the
high-current path should be placed as close as possible to the MCP1603 to minimize the loop area.
The feedback resistors and feedback signal should be
routed away from the switching node and this switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
L1
VOUT
4.7 µH 1.8V @ 500 mA
VIN
2.7V to 4.5V
VIN
CIN
4.7 µF
LX
SHDN VFB
COUT
4.7 µF
GND
FIGURE 5-1:
PCB High Current Path.
 2007-2012 Microchip Technology Inc.
DS22042B-page 19
MCP1603/B/L
NOTES:
DS22042B-page 20
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
6.0
TYPICAL APPLICATION CIRCUITS
l
L1
4.7 µH
VIN
3.0V to 4.2V
VIN
CIN
4.7 µF
VOUT
1.5V @ 500 mA
LX
COUT
4.7 µF
VFB
SHDN
GND
FIGURE 6-1:
Single Li-Ion to 1.5V @ 500 mA Application.
L1
4.7 µH
VIN
5.0V
VIN
LX
RTOP
CIN
4.7 µF
SHDN
200 k
VFB
CCOMP
33 pF
COUT
4.7 µF
RBOT
787 k
GND
FIGURE 6-2:
RCOMP
4.99 k
VOUT
1.0V @ 500 mA
5V to 1.0V @ 500 mA Application.
L1
4.7 µH
VIN
2.7V to 4.5V
VIN
CIN
4.7 µF
VOUT
1.2V @ 500 mA
LX
SHDN
VFB
COUT
4.7 µF
GND
FIGURE 6-3:
Three NiMH Batteries to 1.2V @ 500 mA Application.
 2007-2012 Microchip Technology Inc.
DS22042B-page 21
MCP1603/B/L
NOTES:
DS22042B-page 22
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
5-Lead TSOT-23
Part Number
MCP1603T-120I/OS
MCP1603T-150I/OS
MCP1603T-180I/OS
MCP1603T-250I/OS
MCP1603T-330I/OS
MCP1603T-ADJI/OS
MCP1603BT-180I/OS
MCP1603BT-330I/OS
MCP1603BT-ADJI/OS
MCP1603LT-120I/OS
MCP1603LT-150I/OS
MCP1603LT-180I/OS
MCP1603LT-250I/OS
MCP1603LT-330I/OS
MCP1603LT-ADJI/OS
8-Lead 2x3 DFN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Code
ETNN
EUNN
EVNN
EWNN
EXNN
EYNN
GBNN
GENN
GANN
FMNN
FKNN
EJNN
FGNN
FANN
FQNN
Part Number
Code
MCP1603-120I/MC
MCP1603T-120I/MC
MCP1603-150I/MC
MCP1603T-150I/MC
MCP1603-180I/MC
MCP1603T-180I/MC
MCP1603-250I/MC
MCP1603T-250I/MC
MCP1603-330I/MC
MCP1603T-330I/MC
MCP1603-ADJI/MC
MCP1603T-ADJI/MC
AFM
AFM
AFK
AFK
AFJ
AFJ
AFG
AFG
AFA
AFA
AFQ
AFQ
Example:
ET25
Example:
AFM
235
25
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2007-2012 Microchip Technology Inc.
DS22042B-page 23
MCP1603/B/L
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DS22042B-page 24
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2007-2012 Microchip Technology Inc.
DS22042B-page 25
MCP1603/B/L
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DS22042B-page 26
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2007-2012 Microchip Technology Inc.
DS22042B-page 27
MCP1603/B/L
NOTES:
DS22042B-page 28
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
APPENDIX A:
REVISION HISTORY
Revision B (October 2012)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
Added new device option (MCP1603B) with
PWM mode only. Added details on this device
throughout the document.
Updated Typical Application Circuit graphic to
show both available options for the
MCP1603/B/L family.
Added new graphics to Section 2.0, Typical
Performance Curves: Figures 2-2, 2-5, 2-15
and 2-25.
Updated
Figures 2-6, 2-8, 2-12
and 2-14.
Restructured Section 4.2, Synchronous Buck
Regulator to show both PFM/PWM and PWMonly modes.
Updated Table 5-2.
Updated
Section 7.1,
Package
Marking
Information with available marking codes and
package specification drawings.
Updated the Product Identification System
section.
Revision A (May 2007)
• Original Release of this Document.
 2007-2012 Microchip Technology Inc.
DS22042B-page 29
MCP1603/B/L
NOTES:
DS22042B-page 30
 2007-2012 Microchip Technology Inc.
MCP1603/B/L
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO. -XXX
X
/XX
Device
Voltage Temperature Package
Option
Device:
2.0 MHz, 500 mA Buck Regulator with PFM/PWM
Mode
MCP1603B: 2.0 MHz, 500 mA Buck Regulator with PWM-only
MCP1603L: 2.0 MHz, 500 mA Buck Regulator with PFM/PWM
Mode and Alternate Pinout
a)
MCP1603-180I/MC:
b)
MCP1603T-180I/MC:
c)
MCP1603T-180I/OS:
a)
MCP1603BT-180I/OS:
Tape and Reel,
1.80V Buck Regulator
with PWM Only,
Industrial Temperature,
5LD-TSOT package
a)
MCP1603LT-180I/OS:
Tape and Reel,
1.80V Buck Regulator with
Alternate TSOT Pinout,
Industrial Temperature,
5LD-TSOT package.
MCP1603:
Voltage
Option:
MCP1603
MCP1603B
MCP1603L
ADJ = Adjustable
X
X
X
120 = 1.20V Standard
X
—
X
150 = 1.50V Standard
X
—
X
180 = 1.80V Standard
X
X
X
250 = 2.50V Standard
X
—
X
330 = 3.30V Standard
X
X
X
Temperature:
I
Package
Type:
MC = Plastic Dual-Flat No-Lead Package (MC), 8-Lead
OS = Plastic Thin Small Outline Transistor (OS), 5-Lead
1.80V Buck Regulator,
Industrial Temperature,
8LD-DFN package
Tape and Reel,
1.80V Buck Regulator,
Industrial Temperature,
8LD-DFN package
Tape and Reel
1.80V Buck Regulator,
Industrial Temperature,
5LD-TSOT package
= -40°C to +85°C
 2007-2012 Microchip Technology Inc.
DS22042B-page 31
MCP1603/B/L
NOTES:
DS22042B-page 32
 2007-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2007-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-632-3
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2007-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22042B-page 33
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
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Suites 3707-14, 37th Floor
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Tel: 91-11-4160-8631
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Tel: 43-7242-2244-39
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Tel: 45-4450-2828
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Tel: 91-20-2566-1512
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Tel: 33-1-69-53-63-20
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Tel: 81-66-152-7160
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Taiwan - Taipei
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DS22042B-page 34
Italy - Milan
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11/29/11
 2007-2012 Microchip Technology Inc.