Material Content Data Sheet Sales Product Name BSZ900N15NS3 G MA# MA001326358 Package PG-TSDSON-8-2 Issued 30. January 2015 Weight* 38.25 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 1.118 2.92 0.002 0.01 0.008 0.02 219 0.168 0.44 4383 6.808 17.80 18.27 177988 182645 0.027 0.07 0.07 699 699 0.035 0.09 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.92 29239 29239 55 917 1.807 4.72 15.700 41.06 45.87 410473 458629 0.387 1.01 1.01 10122 10122 0.963 2.52 2.52 25167 25167 0.034 0.09 0.027 0.07 1.285 3.36 0.001 0.00 0.004 0.01 113 0.086 0.23 2254 3.501 9.15 0.002 0.00 0.008 0.02 197 0.151 0.39 3945 6.127 16.02 47239 879 704 3.52 33596 9.39 91538 2. 3. 16.43 160196 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 93933 49 Important Remarks: 1. 35179 28 164387 1000000