NZ3FxxxT1G Series, SZNZ3FxxxT1G Series Zener Voltage Regulators 800 mW SOD−323FL Surface Mount This series of Zener diodes is packaged in a SOD−323FL surface mount package that has a power dissipation of 800 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, high density PC boards, and automotive. www.onsemi.com SOD−323FL CASE 477AC Specification Features: • • • • • Standard Zener Breakdown Voltage Range − 2.4 V to 75 V Steady State Power Rating of 800 mW ESD Rating of Class 3 (> 16 kV) per Human Body Model SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 Cathode 2 Anode MARKING DIAGRAM XX M Mechanical Characteristics: CASE: Void-free, Transfer-Molded Plastic FINISH: All External Surfaces are Corrosion Resistant MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: XX M = Specific Device Code Date Code 260°C for 10 Seconds LEADS: Plated with Pb−Sn or Sn Only (Pb−Free) POLARITY: Cathode Indicated by Polarity Band FLAMMABILITY RATING: UL 94 V−0 MOUNTING POSITION: Any ORDERING INFORMATION Device Package Shipping† NZ3FxxxT1G SOD−323FL (Pb−Free) 3,000 / Tape & Reel SZNZ3FxxxT1G SOD−323FL (Pb−Free) 3,000 / Tape & Reel MAXIMUM RATINGS Rating Total Device Dissipation FR−4 Board, (Note 1) @ TA = 25°C Derate above 25°C Symbol Max Unit 800 6.4 mW mW/°C PD Thermal Resistance, Junction−to−Ambient RqJA 156 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2. © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 1 1 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. Publication Order Number: NZ3F2V4T1/D NZ3FxxxT1G Series, SZNZ3FxxxT1G Series ELECTRICAL CHARACTERISTICS Symbol I Parameter VZ Reverse Zener Voltage @ IZT IF IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF QVZ C VZ VR V IR VF IZT Maximum Temperature Coefficient of VZ Zener Voltage Regulator Max. Capacitance @VR = 0 and f = 1 MHz ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.3 V Max. @ IF = 10 mA for all types) Zener Voltage (Note 2) Device* NZ3F2V4T1G NZ3F4V7T1G NZ3F5V1T1G NZ3F5V6T1G NZ3F9V1T1G NZ3F10VT1G NZ3F12VT1G NZ3F15VT1G NZ3F18VT1G NZ3F33VT1G NZ3F47VT1G NZ3F75VT1G Device Marking Zener Impedance @ IZT ZZT @ IZT Min Nom Max mA W 2.2 4.4 4.8 5.2 8.5 9.4 11.4 14.3 16.8 31 44 70 2.4 4.7 5.1 5.6 9.1 10 12 15 18 33 47 75 2.6 5.0 5.4 6.0 9.6 10.6 12.7 15.8 19.1 35 50 79 5 5 5 5 5 5 5 5 5 2 2 2 120 100 80 60 45 40 60 100 60 140 150 155 VZ (Volts) Leakage Current ZZK @ IZK IR @ VR W mA Volts Min Max pF 1000 800 500 200 240 175 220 220 290 310 500 780 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 50 3 2 1 0.2 0.1 0.1 0.05 0.05 0.05 0.05 0.05 1.0 2.0 2.0 2.0 7.0 8.0 8.0 10.5 12.6 23.2 32.9 52.5 −3.5 −3.5 −2.7 −2.0 3.8 4.5 6.0 9.2 12.4 27.4 42.0 73.4 0 0.2 1.2 2.5 7.0 8.0 10 13 16 33.4 51.8 88.6 450 260 225 200 130 130 130 110 100 70 40 35 TYPICAL CHARACTERISTICS 100 POWER DISSIPATION (%) 80 60 40 20 0 25 50 75 100 TEMPERATURE (°C) 125 Figure 1. Steady State Power Derating www.onsemi.com 2 C @ VR = 0 f = 1 MHz mA *Includes SZ-prefix devices where applicable. 2. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C. 0 QVZ (mV/k) @ IZT 150 NZ3FxxxT1G Series, SZNZ3FxxxT1G Series PACKAGE DIMENSIONS SOD−323FL CASE 477AC ISSUE B A1 D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS INCLUDES LEAD FINISH. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. E TOP VIEW DIM A A1 b c D E HE L END VIEW c A MILLIMETERS MIN MAX 0.90 1.08 −−− 0.10 0.50 0.70 0.10 0.25 2.00 2.20 1.30 1.60 2.40 2.80 0.35 0.65 RECOMMENDED SOLDERING FOOTPRINT* SIDE VIEW 3.00 HE 0.80 b 0.80 L DIMENSION: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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