M390S2858DTU PC133/PC100 Low Profile Registered DIMM M390S2858DTU SDRAM DIMM 128Mx72 SDRAM DIMM with PLL & Register based on Stacked 128Mx4, 4Banks 8K Ref., 3.3V SDRAMs with SPD GENERAL DESCRIPTION FEATURE The Samsung M390S2858DTU is a 128M bit x 72 Synchronous Dynamic RAM high density memory module. The Samsung M390S2858DTU consists of eighteen CMOS Stacked 128Mx4 bit Synchronous DRAMs in three TSOP-II 400mil packages, two 18-bits Drive ICs for input control signal, one PLL in 24-pin TSSOP package for clock and one 2K EEPROM in 8-pin TSSOP package for Serial Presence Detect on a 168pin glass-epoxy substrate. Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The M390S2858DTU is a Dual In-line Memory Module and is intented for mounting into 168-pin edge connector sockets. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system applications. • Performance range Part No. M390S2858DTU-C7C M390S2858DTU-C7A M390S2858DTU-C1H M390S2858DTU-C1L • • • • • Burst mode operation Auto & self refresh capability (8192 Cycles/64ms) LVTTL compatible inputs and outputs Single 3.3V ± 0.3V power supply MRS cycle with address key programs Latency (Access from column address) Burst length (1, 2, 4 , 8 & Full page) Data scramble (Sequential & Interleave) • All inputs are sampled at the positive going edge of the system clock • Serial presence detect with EEPROM • PCB : Height (1,200mil), double sided component PIN CONFIGURATIONS (Front side/back side) PIN NAMES Pin Front Pin Pin Front Pin Back Pin Back Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 VSS DQ0 DQ1 DQ2 DQ3 VDD DQ4 DQ5 DQ6 DQ7 DQ8 VSS DQ9 DQ10 DQ11 DQ12 DQ13 VDD DQ14 DQ15 CB0 CB1 VSS NC NC VDD WE DQM0 29 DQM1 57 58 CS0 30 59 31 DU 60 32 VSS 61 33 A0 62 34 A2 63 35 A4 64 36 A6 65 37 A8 38 A10/AP 66 67 39 BA1 68 40 VDD 69 41 VDD 42 CLK0 70 71 43 VSS 44 DU 72 73 45 CS2 46 DQM2 74 47 DQM3 75 76 48 DU 77 49 VDD 78 50 NC 79 51 NC 80 52 CB2 81 53 CB3 82 54 VSS 55 DQ16 83 56 DQ17 84 DQ18 DQ19 VDD DQ20 NC *VREF *CKE1 VSS DQ21 DQ22 DQ23 VSS DQ24 DQ25 DQ26 DQ27 VDD DQ28 DQ29 DQ30 DQ31 VSS *CLK2 NC NC **SDA **SCL VDD VSS 85 86 DQ32 87 DQ33 88 DQ34 89 DQ35 VDD 90 91 DQ36 92 DQ37 93 DQ38 94 DQ39 95 DQ40 96 VSS 97 DQ41 98 DQ42 99 DQ43 100 DQ44 101 DQ45 102 VDD 103 DQ46 104 DQ47 105 CB4 106 CB5 107 VSS 108 NC NC 109 110 VDD 111 CAS 112 DQM4 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 DQM5 CS1 RAS VSS A1 A3 A5 A7 A9 BA0 A11 VDD *CLK1 A12 VSS CKE0 CS3 DQM6 DQM7 *A13 VDD NC NC CB6 CB7 VSS DQ48 DQ49 141 DQ50 142 DQ51 143 VDD 144 DQ52 NC 145 146 *VREF 147 REGE VSS 148 149 DQ53 150 DQ54 151 DQ55 VSS 152 153 DQ56 154 DQ57 155 DQ58 156 DQ59 157 VDD 158 DQ60 159 DQ61 160 DQ62 161 DQ63 162 VSS 163 *CLK3 NC 164 165 **SA0 166 **SA1 167 **SA2 168 VDD Front Max Freq. (Speed) 133MHz (7.5ns @ CL=2) 133MHz (7.5ns @ CL=3) 100MHz (10ns @ CL=2) 100MHz (10ns @ CL=3) Back Pin Name Function A0 ~ A12 Address input (Multiplexed) BA0 ~ BA1 Select bank DQ0 ~ DQ63 Data input/output CB0 ~ CB7 Check bit (Data-in/data-out) CLK0 Clock input CKE0 Clock enable input CS0 ~ CS3 Chip select input RAS Row address strobe CAS Colume address strobe WE Write enable DQM0 ~ 7 DQM VDD Power supply (3.3V) VSS Ground *VREF Power supply for reference REGE Register enable SDA Serial data I/O SCL Serial clock SA0 ~ 2 Address in EEPROM DU Don′t use NC No connection * These pins are not used in this module. ** These pins should be NC in the system which does not support SPD. SAMSUNG ELECTRONICS CO., Ltd. reserves the right to change products and specifications without notice. Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM PIN CONFIGURATION DESCRIPTION Pin Name Input Function CLK System clock Active on the positive going edge to sample all inputs. CS Chip select Disables or enables device operation by masking or enabling all inputs except CLK, CKE and DQM CKE Clock enable Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby. CKE should be enabled 1CLK+tss prior to valid command. A0 ~ A12 Address Row/column addresses are multiplexed on the same pins. Row address : RA0 ~ RA12, Column address : CA0 ~ CA9, CA11 BA0 ~ BA1 Bank select address Selects bank to be activated during row address latch time. Selects bank for read/write during column address latch time. RAS Row address strobe Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge. CAS Column address strobe Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access. WE Write enable Enables write operation and row precharge. Latches data in starting from CAS, WE active. DQM0 ~ 7 Data input/output mask Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks data input when DQM active. (Byte masking) REGE Register enable The device operates in the transparent mode when REGE is low. When REGE is high, the device operates in the registered mode. In registered mode, the Address and control inputs are latched if CLK is held at a high or low logic level. the inputs are stored in the latch/flip-flop on the rising edge of CLK. REGE is tied to VDD through 10K ohm Resistor on PCB. So if REGE of module is floating, this module will be operated as registered mode. DQ0 ~ 63 Data input/output Data inputs/outputs are multiplexed on the same pins. CB0 ~ 7 Check bit Check bits for ECC. VDD/VSS Power supply/ground Power and ground for the input buffers and the core logic. Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM FUNCTIONAL BLOCK DIAGRAM BCS1 PCLK0 BCS0 B0CKE0 B0A0~B0A12,B0BA0~1, B0RAS, B0CAS, B0WE BDQM0 DQ0~3 10Ω CLK CS CKE Add,CTL DQM DQ0~3 D0L CLK CS CKE Add,CTL DQM DQ0~3 D1L CLK CS CKE Add,CTL DQM DQ0~3 D2L CLK CS CKE Add,CTL DQM DQ0~3 D3L CLK CS CKE Add,CTL DQM DQ0~3 D4L CLK CS CKE Add,CTL DQM DQ0~3 D0U BDQM4 DQ32~35 CLK CS CKE Add,CTL DQM DQ0~3 D9L CLK CS CKE Add,CTL DQM DQ0~3 D9 CLK CS CKE Add,CTL DQM DQ0~3 D10L CLK CS CKE Add,CTL DQM DQ0~3 D10 CLK CS CKE Add,CTL DQM DQ0~3 D11L CLK CS CKE Add,CTL DQM DQ0~3 D11 CLK CS CKE Add,CTL DQM DQ0~3 D12L CLK CS CKE Add,CTL DQM DQ0~3 D12 CLK CS CKE Add,CTL DQM DQ0~3 D13L CLK CS CKE Add,CTL DQM DQ0~3 D13 10Ω PCLK1 DQ4~7 10Ω PCLK2 BDQM1 DQ8~11 10Ω PCLK3 CLK CS CKE Add,CTL DQM DQ0~3 D1U CLK CS CKE Add,CTL DQM DQ0~3 D2U 10Ω DQ36~39 BDQM5 DQ40~43 10Ω DQ12~15 CLK CS CKE Add,CTL DQM DQ0~3 D3U CLK CS CKE Add,CTL DQM DQ0~3 D4U 10Ω DQ44~47 10Ω PCLK4 CB0~3 CB4~7 10Ω 10Ω PCLK5 BCS2 CLK CS CKE Add,CTL DQM DQ0~3 BDQM2 DQ16~19 D5L CLK CS CKE Add,CTL DQM DQ0~3 10Ω PCLK6 DQ20~23 CLK CS CKE Add,CTL DQM DQ0~3 D6L CLK CS CKE Add,CTL DQM DQ0~3 D7L BDQM6 DQ48~51 10Ω CLK CS CKE Add,CTL DQM DQ0~3 D6U CLK CS CKE Add,CTL DQM DQ0~3 D7U DQ52~55 CLK CS CKE Add,CTL DQM DQ0~3 D14L D14 CLK CS CKE Add,CTL DQM DQ0~3 D15L CLK CS CKE Add,CTL DQM DQ0~3 D15 CLK CS CKE Add,CTL DQM DQ0~3 D16L CLK CS CKE Add,CTL DQM DQ0~3 D16 CLK CS CKE Add,CTL DQM DQ0~3 D17L CLK CS CKE Add,CTL DQM DQ0~3 D17 10Ω 10Ω PCLK7 BDQM3 DQ24~27 CLK CS CKE Add,CTL DQM DQ0~3 D5U BDQM7 DQ56~59 10Ω 10Ω PCLK8 BCS2 B1CKE0 B1A0~B 1A12,B1BA0~1, B1RAS, B1CAS, B1WE BDQM0 DQ28~31 10Ω CLK CS CKE Add,CTL DQM DQ0~3 D8L CLK CS CKE Add,CTL DQM DQ0~3 D8U BDQM7 DQ60~63 10Ω BCS3 VSS CKE0 B0A0~B0A12,B0BA0~1, B0RAS, B0CAS B0CKE0 B1CKE0 CLK1,2,3 74ALVCF162835 VDD 10kΩ PCLK9 REGE VDD 10Ω 12pF LE 2G AGND 1G AVCL A0~A12,BA0~1, RAS, CAS CDCF2510 OE 10Ω B1A0~B1A12,B1BA0~1, B1RAS, B1CAS 74ALVCF162835 CLK0 12pF CLK FIBIN IY0 IY1 IY2 IY3 IY4 IY5 IY6 IY7 IY8 IY9 PCLK9 PCLK5 PCLK6 PCLK7 PCLK8 PCLK0 PCLK1 PCLK2 PCLK3 PCLK4 FBOUT Cb*1 LE Note 1. The actual values of Cb will depend upon the PLL chosen. OE Serial PD 74ALVCF162835 B0WE,B0CKE1 B1WE,B1CKE1 WE DQM0~7,CS0~3 BDQM0~7, BCS0~3 LE OE SCL 47KΩ WP A0 SDA A1 A2 SA0 SA1 SA2 Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM STANDARD TIMING DIAGRAM WITH PLL & REGISTER (CL=2, BL=4) *2 REG *1 *3 D Control Signal(RAS,CAS,WE) OUT *1. Register Input 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK RAS CAS WE *2. Register Output RAS td tr td tr CAS WE *3. SDRAM CAS latency(refer to *1) =2CLK+1CLK 1CLK tSAC tRAC(refer to *1) DQ Qa0 tRAC(refer to *2) Row Active Read Command Qa1 Qa2 Qa3 Db0 Db1 CAS latency(refer to *2) =2CLK Precharge Command Db2 Db3 tRDL Row Active Write Command Precharge Command td, tr = Delay of register (74ALVCF162835) Notes : 1. In case of module timing, command cycles delayed 1CLK with respect to external input timing at the address and input signal because of the buffering in register . Therefore, Input/Output signals of read/write function should be issued 1CLK earlier as compared to Unbuffered DIMMs. 2. DIN is to be issued 1clock after write command in external timing because DIN is issued directly to module. : Don′t care Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit Voltage on any pin relative to Vss VIN, VOUT -1.0 ~ 4.6 V Voltage on VDD supply relative to Vss VDD, VDDQ -1.0 ~ 4.6 V TSTG -55 ~ +150 °C Power dissipation PD 36 W Short circuit current IOS 50 mA Storage temperature Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. DC OPERATING CONDITIONS AND CHARACTERISTICS Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70°C) Parameter Symbol Min Typ Max Unit Supply voltage VDD 3.0 3.3 3.6 V Input high voltage VIH 2.0 3.0 VDDQ+0.3 V 1 Input low voltage VIL -0.3 0 0.8 V 2 Output high voltage VOH 2.4 - - V IOH = -2mA Output low voltage VOL - - 0.4 V IOL = 2mA ILI -10 - 10 uA 3 Input leakage current Note Notes : 1. VIH (max) = 5.6V AC. The overshoot voltage duration is ≤ 3ns. 2. VIL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns. 3. Any input 0V ≤ VIN ≤ VDDQ. Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs. CAPACITANCE (VDD = 3.3V, TA = 23°C, f = 1MHz, VREF =1.4V ± 200 mV) Parameter Symbol Min Max Unit Input capacitance (A0 ~ A12) CIN1 - 15 pF Input capacitance (RAS, CAS, WE) CIN2 - 15 pF Input capacitance (CKE0) CIN3 - 15 pF Input capacitance (CLK0) CIN4 - 20 pF Input capacitance (CS0, CS2) CIN5 - 15 pF Input capacitance (DQM0 ~ DQM7) CIN6 - 15 pF Input capacitance (BA0 ~ BA1) CIN7 - 15 pF Data input/output capacitance (DQ0 ~ DQ63) COUT - 22 pF Data input/output capacitance (CB0 ~ CB7) COUT1 - 22 pF Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM DC CHARACTERISTICS (Recommended operating condition unless otherwise noted, TA = 0 to 70°C) Parameter Operating current (One bank active) Precharge standby current in power-down mode Symbol ICC1 ICC2P ICC2PS ICC2N Precharge standby current in non power-down mode ICC2NS Active standby current in power-down mode Active standby current in non power-down mode (One bank active) ICC3P ICC3PS ICC3N ICC3NS Version Test Condition Burst length = 1 tRC ≥ tRC(min) IO = 0 mA - 7C -7A -1H -1L 2840 2660 2660 2660 CKE ≤ VIL(max), tCC = 10ns 422 CKE & CLK ≤ VIL(max), tCC = ∞ 74 CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns Input signals are changed one time during 20ns Unit Note mA 1 mA 1070 mA CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞ Input signals are stable 362 CKE ≤ VIL(max), tCC = 10ns 566 CKE & CLK ≤ VIL(max), tCC = ∞ 218 CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns Input signals are changed one time during 20ns 1430 mA CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞ Input signals are stable 902 mA mA ICC4 IO = 0 mA Page burst 4Banks activated tCCD = 2CLKs 3020 3020 2840 2840 mA 1 Refresh current ICC5 tRC ≥ tRC(min) 5000 4640 4460 4460 mA 2 Self refresh current ICC6 CKE ≤ 0.2V Operating current (Burst mode) 458 mA Notes : 1. Measured with outputs open. 2. Refresh period is 64ms. 3. Unless otherwise noted, input swing level is CMOS(VIH/VIL=VDDQ/VSSQ) Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = 0 to 70°C) Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition Value Unit 2.4/0.4 V 1.4 V tr/tf = 1/1 ns 1.4 V See Fig. 2 3.3V Vtt = 1.4V 1200Ω • Output 50Ω VOH (DC) = 2.4V, IOH = -2mA VOL (DC) = 0.4V, IOL = 2mA • Output Z0 = 50Ω • 50pF 50pF 870Ω • (Fig. 1) DC output load circuit (Fig. 2) AC output load circuit OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Parameter Version Symbol - 7C - 7A - 1H -1L Unit Note Row active to row active delay tRRD(min) 15 15 20 20 ns 1 RAS to CAS delay tRCD(min) 15 20 20 20 ns 1 tRP(min) 15 20 20 20 ns 1 tRAS(min) 45 45 50 50 ns 1 Row precharge time Row active time tRAS(max) Row cycle time tRC(min) Last data in to row precharge tRDL(min) Last data in to Active delay 100 ns 1 2 CLK 2,5 tDAL(min) 2 CLK + tRP - 5 Last data in to new col. address delay tCDL(min) 1 CLK 2 Last data in to burst stop tBDL(min) 1 CLK 2 Col. address to col. address delay tCCD(min) 1 CLK 3 ea 4 Number of valid output data 60 65 us 70 CAS latency=3 2 CAS latency=2 1 70 Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next higher integer. 2. Minimum delay is required to complete write. 3. All parts allow every cycle column address change. 4. In case of row precharge interrupt, auto precharge and read burst stop. 5. In 100MHz and below 100MHz operating conditions, tRDL=1CLK and tDAL=1CLK + 20ns is also supported. SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + tRP. Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM AC CHARACTERISTICS (AC operating conditions unless otherwise noted) REFER TO THE INDIVIDUAL COMPONENET, NOT THE WHOLE MODULE. Parameter - 7C Symbol Min CLK cycle time CLK to valid output delay Output data hold time CAS latency=3 tCC CAS latency=2 CAS latency=3 7.5 Max 1000 7.5 tSAC CAS latency=2 CAS latency=3 - 7A tOH CAS latency=2 Min 7.5 - 1H Max 1000 10 Min 10 - 1L Max 1000 10 Min 10 Unit Note ns 1 ns 1,2 ns 2 Max 1000 12 5.4 5.4 6 6 5.4 6 6 7 3 3 3 3 3 3 3 3 CLK high pulse width tCH 2.5 2.5 3 3 ns 3 CLK low pulse width tCL 2.5 2.5 3 3 ns 3 Input setup time tSS 1.5 1.5 2 2 ns 3 Input hold time tSH 0.8 0.8 1 1 ns 3 CLK to output in Low-Z tSLZ 1 1 1 1 ns 2 CLK to output in Hi-Z CAS latency=3 CAS latency=2 tSHZ 5.4 5.4 6 6 5.4 6 6 7 ns Notes : 1. Parameters depend on programmed CAS latency. 2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter. 3. Assumed input rise and fall time (tr & tf) = 1ns. If tr & tf is longer than 1ns, transient time compensation should be considered, i.e., [(tr + tf)/2-1]ns should be added to the parameter. Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM SIMPLIFIED TRUTH TABLE Command Register Mode register set Auto refresh Refresh CKEn-1 CKEn CS RAS CAS WE DQM H X L L L L X OP code L L L H X X H Entry Self refresh Exit H BA0,1 L H L H H H H X X X X L H H X V Read & column address Auto precharge disable H X L H L H X V Write & Column Address Auto precharge disable Auto precharge enable X L H L L X H X L H H L X H X L L H L X H L Exit L H Entry H L Precharge power down mode Exit Column address (A0~A9, A11) L V L Column address (A0~A9, A11) H All banks Entry L DQM H No operation command H H X H X X X L V V V X X X X H X X X L H H H H X X X L V V V H X X X L H H H 3 Row address H Auto precharge enable Clock suspend or active power down 3 3 L Bank selection 1,2 X X H Note 3 H Precharge A12,A11, A 9 ~ A0 L Bank active & row addr. Burst stop A10/AP X V L X H 4 4,5 4 4,5 6 X X X X X X X V X X X 7 (V=Valid, X=Don′t care, H=Logic high, L=Logic low) Notes : 1. OP Code : Operand code A0 ~ A12 & BA0 ~ BA1 : Program keys. (@ MRS) 2. MRS can be issued only at all banks precharge state. A new command can be issued after 2 clock cycles of MRS. 3. Auto refresh functions are as same as CBR refresh of DRAM. The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. 4. BA0 ~ BA1 : Bank select addresses. If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected. If BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank B is selected. If BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected. If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected. If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected. 5. During burst read or write with auto precharge, new read/write command can not be issued. Another bank read/write command can be issued after the end of burst. New row active of the associated bank can be issued at tRP after the end of burst. 6. Burst stop command is valid at every burst length. 7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0), but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2) Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM PACKAGE DIMENSIONS Units : Inches (Millimeters) 5.250 (133.350) 0.054 (1.372) 5.014 (127.350) 0.118 (3.000) R 0.079 (R 2.000) 0.157 ± 0.004 (4.000 ± 0.100) 0.250 (6.350) .450 (11.430) C 0.100 Min B A .118DIA ± 0.004 (3.000DIA ± 0.100) 0.350 (8.890) 0.700 (17.780) REG 0.250 (6.350) 1.450 (36.830) 2.150 (54.61) (2.540 Min) 0.118 REG (3.000) 1.200 (30.48) PLL 4.550 (115.57) 0.254 Max (6.452 Max) 0.157 Min (3.99 Min) REG 0.100 Min 0.250 (6.350) 0.250 (6.350) 0.123 ± 0.005 (3.125 ± 0.125) 0.079 ± 0.004 (2.000 ± 0.100) Detail A (2.540 Min) 0.050 ± 0.0039 (1.270 ± 0.10) 0.039 ± 0.002 (1.000 ± 0.050) 0.123 ± 0.005 (3.125 ± 0.125) 0.079 ± 0.004 (2.000 ± 0.100) Detail B 0.008 ± 0.006 (0.200 ± 0.150) 0.050 (1.270) Detail C Tolerances : ± 0.005(.13) unless otherwise specified SDRAM Part No. : K4S560632D - The used device is stacked 128Mx4 SDRAM - Staktek’s stacking technology is Samsung’s stacking technology of choice This module is based on JEDEC PC133 Specification Rev. 0.0 Jan. 2002 M390S2858DTU PC133/PC100 Low Profile Registered DIMM M390S2858DTU-C7C/C7A/C1H/C1L •Organization : 128MX72 •Composition : 128MX4 * 18ea •Used component part # : K4S510632D •# of banks in module : 2 Rows •# of banks in component : 4 banks •Feature : 1,200 mil height & double sided •Refresh : 8K/64ms •Contents : Byte # Function Supported Function described -7C -7A -1H Hex value -1L -7C -7A -1H 128bytes 80h 256bytes (2K-bit) 08h Note -1L 0 # of bytes written into serial memory at module manufacturer 1 Total # of bytes of SPD memory device 2 Fundamental memory type SDRAM 04h 3 # of row address on this assembly 13 0Dh 1 4 # of column address on this assembly 11 0Bh 1 5 # of module Rows on this assembly 2 row 02h 6 Data width of this assembly 72 bits 48h 7 ...... Data width of this assembly - 00h 8 Voltage interface standard of this assembly 9 SDRAM cycle time from clock @CAS latency of 3 7.5ns 10ns 10ns 10ns 75h 75h 10 SDRAM access time from clock @CAS latency of 3 5.4ns 6ns 6ns 6ns 54h 54h 11 DIMM configuration type 12 Refresh rate & type 13 14 15 Minimum clock delay for back-to-back random column address LVTTL 01h ECC 02h 7.8us, support self refresh 82h Primary SDRAM width x4 04h Error checking SDRAM width x4 04h tCCD = 1CLK 01h 1, 2, 4, 8 & full page 8Fh 4 banks 04h 16 SDRAM device attributes : Burst lengths supported 17 SDRAM device attributes : # of banks on SDRAM device 18 SDRAM device attributes : CAS latency 2&3 06h 19 SDRAM device attributes : CS latency 0 CLK 01h 20 SDRAM device attributes : Write latency 0 CLK 01h 21 SDRAM module attributes A0h A0h 2 60h 60h 2 A0h C0h 2 60h 70h 2 Registered/Buffered DQM, address & control inputs and 1Fh On-card PLL +/- 10% voltage tolerance, 22 SDRAM device attributes : General 0Eh Burst Read Single bit Write precharge all, auto precharge 23 SDRAM cycle time @CAS latency of 2 7.5ns 10ns 10ns 12ns 75h A0h 24 SDRAM access time @CAS latency of 2 5.4ns 6ns 25 SDRAM cycle time @CAS latency of 1 - 6ns 7ns 54h 60h 00h 26 SDRAM access time @CAS latency of 1 - 00h 27 Minimum row precharge time (=tRP) 15ns 20ns 20ns 20ns 0Fh 14h 14h 14h 28 Minimum row active to row active delay (tRRD) 15ns 15ns 20ns 20ns 0Fh 0Fh 14h 14h 29 Minimum RAS to CAS delay (=tRCD ) 15ns 20ns 20ns 20ns 0Fh 14h 14h 14h 30 Minimum activate precharge time (=tRAS) 45ns 45ns 50ns 50ns 2Dh 2Dh 32h 32h 31 Module Row density 32 Command and Address signal input setup time 1.5ns 1.5ns 2ns 2ns 15h 15h 20h 20h 33 Command and Address signal input hold time 0.8ns 0.8ns 1ns 1ns 08h 08h 10h 10h 34 Data signal input setup time 1.5ns 1.5ns 2ns 2ns 15h 15h 20h 20h 2 Row of 512MB 80h Rev. 0.0 Jan. 2002 M390S2858DTU Byte # 35 36~61 Data signal input hold time 63 Checksum for bytes 0 ~ 62 72 Hex value -7A -1H -1L -7C -7A -1H -1L 0.8ns 0.8ns 1ns 1ns 08h 08h 10h 10h A4h D4h 31h 31h 48h 4Ch - 00h Intel Rev 1.2B 12h - FCh 3Dh Manufacturer JEDEC ID code Samsung CEh ...... Manufacturer JEDEC ID code Samsung 00h Onyang Korea 01h 4Dh Manufacturing location 73 Manufacturer part # (Memory module) M 74 Manufacturer part # (DIMM Configuration) 3 33h 75 Manufacturer part # (Data bits) Blank 20h 76 ...... Manufacturer part # (Data bits) 9 39h 77 ...... Manufacturer part # (Data bits) 0 30h 78 Manufacturer part # (Mode & operating voltage) S 53h 79 Manufacturer part # (Module depth) 2 32h 80 ...... Manufacturer part # (Module depth) 8 38h 81 Manufacturer part # (Refresh, #of banks in Comp. & Interface) 5 35h 82 Manufacturer part # (Composition component) 8 38h 83 Manufacturer part # (Component revision) D 44h 84 Manufacturer part # (Package type) T 54h 85 Manufacturer part # (PCB revision & type) U 55h "-" 2Dh 86 Manufacturer part # (Hyphen) 87 Manufacturer part # (Power) 88 Manufacturer part # (Minimum cycle time) 7 7 89 Manufacturer part # (Minimum cycle time) C A 90 Manufacturer part # (TBD) 91 Manufacturer revision code (For PCB) 92 ...... Manufacturer revision code (For component) 93 Manufacturing date (Year) 94 Manufacturing date (Week) 95~98 Assembly serial # 99~125 Manufacturer specific data (may be used in future) 126 System frequency for 100MHz 127 PC100 specification details 128+ Unused storage locations Note -7C Superset information (maybe used in future) SPD data revision code 64 Function Supported Function Described 62 65~71 PC133/PC100 Low Profile Registered DIMM C 43h 1 1 37h 37h H L 43h 41h Blank 20h U 55h D-die (5th Gen.) 44h - - 3 - - 3 - - 4 Undefined - 100MHz Detailed PC100 Information Undefined 64h 8Fh 8Fh 8Fh 8Dh - Note : 1. The row select address is excluded in counting the total # of addresses. 2. This value is based on the component specification. 3. These bytes are programmed by code of Date Week & Date Year with BCD format. 4. These bytes are programmed by Samsung’s own Assembly Serial # system. All modules may have different unique serial #. 5. These bytes are Undefined and can be used for Samsung’s own purpose. Rev. 0.0 Jan. 2002