ON NL7SZ19DFT2G 1−to−2 decoder/demultiplexer Datasheet

NL7SZ19
1−to−2 Decoder/
Demultiplexer
The NL7SZ19 is a 1−to−2 decoder. When the output enable (E) is
Low, the device passes data at input A to outputs Y0 (true) and Y1
(complement). The NL7SZ19 can also be used as a 1−to−2
demultiplexer. As a demultiplexer, data at input E is routed to either
Y0 or Y1 depending on the state of A. The device operates over the
voltage range from 1.65 V to 5.5 V. The device is fabricated in
sub−micron CMOS for high speed and fast decode times. Both inputs
and outputs are in high impedance state, when supply voltage is
powered down. Both inputs are tolerant of voltages up to 5.5 V,
regardless of operating voltage. This device is suitable for low power
decoding in a variety of applications.
Features
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MARKING
DIAGRAM
6
6
LE M G
G
1
SOT−363/SC70−6/SC−88
DF SUFFIX
CASE 419B
1
• High−Speed Propagation Delay:
•
•
•
•
•
•
tPD 2.7 nS (Typ), Load 50 pF @ 5.0 V
32 mA Output Drive Capability @ 5.0 V
Power Down Impedance: Inputs/Outputs in High−Z
Broad VCC Operating Range: 1.65 V to 5.5 V
Surface Mount Technology: SC−70, 6−Lead and UDFN6 Packaging
OVT* on I/Os
Pb−Free Package is Available
Typical Applications
•
•
•
•
UM
G
1
UDFN6
MU SUFFIX
CASE 517AA
LE, U
M
G
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Cell Phones
PDAs
Digital Cameras
Video Cameras
PIN/FUNCTION TABLE
Function Description
Important Information
• ESD Protection: Human Body Model >2000 V
• Latchup Max Rating: 300 mA
• Pin to Pin Compatible with NC7SZ19
A
1
6
Y0
GND
2
5
VCC
E
= Device Marking
= Date Code*
= Pb−Free Package
3
4
Pin
As Decoder
As Demultiplexer
A
Address
Select
E
Output Enable
Data
Y0
Output 0
Output 0
Y1
Output 1
Output 1
TRUTH TABLE
Y1
(TOP VIEW)
E
A
L
L
H
H
L
H
H
L
Y0 = A + E
Y1 = A + E
L
H
H
H
H
L
H
H
Figure 1. Pinout
*Over Voltage Tolerance (OVT) enables input and output pins to function outside
(higher) of their operating voltages, with no damage to the devices or to signal
integrity.
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 10
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
NL7SZ19/D
NL7SZ19
MAXIMUM RATINGS
Symbol
Rating
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VOUT
IIK
DC Input Diode Current
@ V1 t −0.5 V
−50
mA
IOK
DC Output Diode Current
@ V1 t −0.5 V
−50
mA
IOUT
DC Output Sink Current
"50
mA
ICC
DC Supply Current per Supply Pin
"100
mA
IGND
DC Ground Current per Ground Pin
"100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 1)
250
°C/W
PD
Power Dissipation in Still Air at 85°C
180
mW
Level 1
−
UL 94 V−0 @ 0125 in
−
> 2000
> 150
n/a
V
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
Oxygen Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Rating
Value
Unit
VCC
DC Supply Voltage
1.65 to 5.5
V
VCC
DC Supply Voltage, Data Retention
1.5 to 5.5
V
VIN
Input Voltage
0 to 5.5
V
Output Voltage
0 to 5.5
V
−40 to 85
°C
0 to 20
0 to 20
0 to 10
0 to 5
nS/V
350
°C/W
VOUT
TA
Operating Temperature
tr, tf
Input Rise and Fall Times
qJA
Thermal Resistance
VCC @ 1.8 " 0.15 V
VCC @ 2.5 " 0.2 V
VCC @ 3.3 " 0.3 V
VCC @ 5.0 " 0.5 V
ORDERING INFORMATION
Package
Shipping †
SC70−6
3000 / Tape & Reel
NL7SZ19DFT2G
SC70−6
(Pb−Free)
3000 / Tape & Reel
NL7SZ19MUR2G
UDFN6
(Pb−Free)
3000 / Tape & Reel
Device Order Number
NL7SZ19DFT2
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
NL7SZ19
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VIH
High−Level
Input Voltage
VIL
Low−Level
Output Voltage
VOH
High−Level
Output Voltage
VOL
Low−Level
Output Voltage
IIN
Input Leakage
Current
IOFF
Power−Off
Leakage Current
ICC
Quiescent
Supply Current
Condition
TA = 255C
VCC
(V)
Min
1.65
2.3 to 5.5
0.75 VCC
0.70 VCC
Typ
Min
Max
Unit
0.75 VCC
0.70 VCC
1.65
2.3−5.5
VIN = VIH or
VIL
TA = −405C to 855C
Max
0.25 VCC
0.30 VCC
V
0.25 VCC
0.30 VCC
V
IOH = −100 mA
1.65
2.3
3.0
4.5
1.55
2.20
2.90
4.40
1.65
2.30
3.00
4.50
1.55
2.20
2.90
4.40
IOH = −3.0 mA
IOH = −8.0 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.90
2.40
2.30
3.80
1.47
2.10
2.75
2.63
4.15
1.29
1.90
2.40
2.30
3.80
IOL = 100 mA
1.65
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
IOL = 3.0 mA
IOL = 8.0 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65
2.3
3.0
3.0
4.5
0.09
0.12
0.20
0.30
0.32
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
V
0.0 to 5.5
"0.1
"1.0
mA
0.0
1.0
10
mA
1.65 to
5.5
1.0
10
mA
VIN = VIL or
VIH
VIN = 5.5 V, GND
VIN or VOUT = 5.5 V
VIN = 5.5 V, GND
V
AC ELECTRICAL CHARACTERISTICS
TA = 255C
Symbol
tPLH
tPHL
Parameter
Propagation Delay
A or S to Y0
or Y1
TA = −405C to 855C
Condition
VCC
Min
Typ
Max
Min
Max
Unit
Figure
CL = 15 pF
RD = 1.0 MW
1.8 " 0.15
2.5 " 0.2
3.3 " 0.3
5.0 " 0.5
2.5
1.2
0.8
0.5
6.2
3.6
2.9
2.4
10.5
6.0
4.1
3.2
2.5
1.2
0.8
0.5
11
6.4
4.5
3.5
nS
Figures
1&3
CL = 50 pF
RD = 500 W
3.3 " 0.3
5.0 " 0.5
1.2
0.8
3.2
2.7
5.1
4.0
1.2
0.8
5.4
4.3
nS
Figures
1&3
Note 5
CIN
Input Capacitance
0
2.3
pF
CPD
Power Dissipation
Capacitance
3.3
5.0
10.5
12.8
pF
Figure 2
5. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle (see Figure 2). CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCDstatic).
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3
NL7SZ19
VI
OPEN
GND
VCC
A
RU
OUTPUT
A
S
INPUT
A
OUTPUT
RD
CL
Figure 1. AC Test Circuit
Figure 2. ICCD Test Circuit
CL Includes Load and Stray Capacitance
Input PRR = 1.0 MHz; tW = 500 ns
Input = AC Waveform; tr = tf = 1.8 nS
PRR = 10 MHz; Duty Cycle = 50%
S Input = GND or x
tr = 3 ns
tf = 3 ns
90%
INPUT
VCC
90%
50%
50%
10%
10%
GND
tW
tPHL
tPLH
VOH
Out of Phase
OUTPUT
50%
50%
VOL
tPLH
tPHL
VOH
In Phase
OUTPUT
50%
50%
VOL
Figure 3. AC Waveforms
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4
NL7SZ19
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
e
6
5
4
1
2
3
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
SC−88/SC70−6/SOT−363
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
NL7SZ19
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE A
PIN ONE
REFERENCE
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
ÉÉ
ÉÉ
ÉÉ
E
DIM
A
A1
A3
b
D
E
e
L
L2
TOP VIEW
2X
0.10 C
(A3)
0.10 C
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.00 BSC
1.20 BSC
0.40 BSC
0.30
0.40
0.40
0.50
A
10X
0.08 C
6X
C
A1
5X
1
MOUNTING FOOTPRINT*
SEATING
PLANE
SIDE VIEW
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
BOTTOM VIEW
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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