ON MAX810LTR Very low supply current 3-pin microprocessor reset monitor Datasheet

MAX809 Series,
MAX810 Series
Very Low Supply Current
3-Pin Microprocessor
Reset Monitors
The MAX809 and MAX810 are cost−effective system supervisor
circuits designed to monitor VCC in digital systems and provide a reset
signal to the host processor when necessary. No external components
are required.
The reset output is driven active within 10 msec of VCC falling
through the reset voltage threshold. Reset is maintained active for a
timeout period which is trimmed by the factory after VCC rises above
the reset threshold. The MAX810 has an active−high RESET output
while the MAX809 has an active−low RESET output. Both devices
are available in SOT−23 and SC−70 packages.
The MAX809/810 are optimized to reject fast transient glitches on
the VCC line. Low supply current of 0.5 mA (VCC = 3.2 V) makes these
devices suitable for battery powered applications.
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MARKING
DIAGRAM
3
SOT−23
(TO−236)
CASE 318
1
2
3
xxx MG
G
1
SC−70
(SOT−323)
CASE 419
xx MG
G
Features
1
• Precision VCC Monitor for 1.5 V, 2.5 V, 3.0 V, 3.3 V, and 5.0 V
•
•
•
•
•
•
•
•
•
Supplies
Precision Monitoring Voltages from 1.2 V to 4.9 V Available
in 100 mV Steps
Four Guaranteed Minimum Power−On Reset Pulse Width Available
(1 ms, 20 ms, 100 ms, and 140 ms)
RESET Output Guaranteed to VCC = 1.0 V.
Low Supply Current
Compatible with Hot Plug Applications
VCC Transient Immunity
No External Components
Wide Operating Temperature: −40°C to 105°C
Pb−Free Packages are Available
xxx
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
GND
1
3
RESET
RESET
Typical Applications
•
•
•
•
2
VCC
2
SOT−23/SC−70
(Top View)
Computers
Embedded Systems
Battery Powered Equipment
Critical Microprocessor Power Supply Monitoring
NOTE:
RESET is for MAX809
RESET is for MAX810
ORDERING INFORMATION
VCC
VCC
MAX809/810
RESET
RESET
GND
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
VCC
PROCESSOR
DEVICE MARKING INFORMATION
RESET
INPUT
See general marking information in the device marking
section on page 10 of this data sheet.
GND
Figure 1. Typical Application Diagram
© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 20
1
Publication Order Number:
MAX809S/D
MAX809 Series, MAX810 Series
3
VCC
Timeout
Counter
VCC
Oscillator
2
RESET
Vref
1 GND
Figure 2. MAX809 Series Complementary Active−Low Output
3
VCC
Timeout
Counter
VCC
Oscillator
2
RESET
Vref
1 GND
Figure 3. MAX810 Series Complementary Active−High Output
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2
MAX809 Series, MAX810 Series
PIN DESCRIPTION
Pin No.
Symbol
1
GND
Description
2
RESET (MAX809)
RESET output remains low while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
2
RESET (MAX810)
RESET output remains high while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
3
VCC
Ground
Supply Voltage (Typ)
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VCC
−0.3 to 6.0
V
−0.3 to (VCC + 0.3)
V
20
mA
Output Current, RESET
20
mA
dV/dt (VCC)
100
V/msec
RqJA
301
314
°C/W
Operating Junction Temperature Range
TJ
−40 to +105
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Lead Temperature (Soldering, 10 Seconds)
Tsol
+260
°C
Power Supply Voltage (VCC to GND)
RESET Output Voltage (CMOS)
Input Current, VCC
Thermal Resistance, Junction−to−Air (Note 1)
SOT−23
SC−70
ESD Protection
Human Body Model (HBM): Following Specification JESD22−A114
Machine Model (MM): Following Specification JESD22−A115
Latchup Current Maximum Rating: Following Specification JESD78 Class II
Positive
Negative
2000
200
ILatchup
200
200
V
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This based on a 35x35x1.6mm FR4 PCB with 10mm2 of 1 oz copper traces under natural convention conditions and a single component
characterization.
2. The maximum package power dissipation limit must not be exceeded.
TJ(max) * TA
with TJ(max) = 150°C
PD +
RqJA
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3
MAX809 Series, MAX810 Series
ELECTRICAL CHARACTERISTICS TA = −40°C to +105°C unless otherwise noted. Typical values are at TA = +25°C. (Note 3)
Symbol
Characteristic
VCC Range
TA = 0°C to +70°C
TA = −40°C to +105°C
Supply Current
VCC = 3.3 V
TA = −40°C to +85°C
TA = 85°C to +105°C
VCC = 5.5 V
TA = −40°C to +85°C
TA = 85°C to +105°C
ICC
Reset Threshold (Vin Decreasing) (Note 4)
VTH
Min
Typ
Max
1.0
1.2
−
−
5.5
5.5
−
−
0.5
−
1.2
2.0
−
−
0.8
−
1.8
2.5
V
4.83
4.78
4.66
4.9
−
−
4.97
5.02
5.14
MAX8xxLTR, MAX8xxSQ463
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
4.56
4.50
4.40
4.63
−
−
4.70
4.75
4.86
MAX809HTR
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
4.48
4.43
4.32
4.55
4.62
4.67
4.78
MAX8xxMTR, MAX8xxSQ438
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
4.31
4.27
4.16
4.38
4.45
4.49
4.60
MAX809JTR, MAX8xxSQ400
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
3.94
3.90
3.80
4.00
−
−
4.06
4.10
4.20
MAX8xxTTR, MAX809SQ308
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
3.04
3.00
2.92
3.08
−
−
3.11
3.16
3.24
MAX8xxSTR, MAX8xxSQ293
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
2.89
2.85
2.78
2.93
−
−
2.96
3.00
3.08
MAX8xxRTR, MAX8xxSQ263
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
2.59
2.56
2.49
2.63
−
−
2.66
2.70
2.77
MAX809SN232, MAX809SQ232
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
2.28
2.25
2.21
2.32
−
−
2.35
2.38
2.45
MAX809SN160
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
1.58
1.56
1.52
1.60
−
−
1.62
1.64
1.68
MAX809SN120, MAX8xxSQ120
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
1.18
1.17
1.14
1.20
−
−
1.22
1.23
1.26
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4
V
mA
MAX809SN490
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
3. Production testing done at TA = 25°C, over temperature limits guaranteed by design.
4. Contact your ON Semiconductor sales representative for other threshold voltage options.
Unit
MAX809 Series, MAX810 Series
ELECTRICAL CHARACTERISTICS (continued) TA = −40°C to +105°C unless otherwise noted. Typical values are at
TA = +25°C. (Note 5)
Characteristic
Symbol
Min
Typ
Max
Unit
Detector Voltage Threshold Temperature Coefficient
−
30
−
ppm/°C
VCC to Reset Delay VCC = VTH to (VTH − 100 mV)
−
10
−
msec
1.0
20
100
140
−
−
−
−
3.3
66
330
460
Reset Active TimeOut Period (Note 6)
MAX8xxSN(Q)293D1
MAX8xxSN(Q)293D2
MAX8xxSN(Q)293D3
MAX8xxSN(Q)293
tRP
RESET Output Voltage Low (No Load) (MAX809)
VCC = VTH − 0.2 V
1.6 V v VTH v 2.0 V, ISINK = 0.5 mA
2.1 V v VTH v 4.0 V, ISINK = 1.2 mA
4.1 V v VTH v 4.9 V, ISINK = 3.2 mA
VOL
−
−
0.3
V
RESET Output Voltage High (No Load) (MAX809)
VCC = VTH + 0.2 V
1.6 V v VTH v 2.4 V, ISOURCE = 200 mA
2.5 V v VTH v 4.9 V, ISOURCE = 500 mA
VOH
0.8 VCC
−
−
V
RESET Output Voltage High (No Load) (MAX810)
VCC = VTH + 0.2 V
1.6 V v VTH v 2.4 V, ISOURCE = 200 mA
2.5 V v VTH v 4.9 V, ISOURCE = 500 mA
VOH
0.8 VCC
−
−
V
RESET Output Voltage Low (No Load) (MAX810)
VCC = VTH − 0.2 V
1.6 V v VTH v 2.0 V, ISINK = 0.5 mA
2.1 V v VTH v 4.0 V, ISINK = 1.2 mA
4.1 V v VTH v 4.9 V, ISINK = 3.2 mA
VOL
−
−
0.3
V
5. Production testing done at TA = 25°C, over temperature limits guaranteed by design.
6. Contact your ON Semiconductor sales representative for timeout options availability for other threshold voltage options.
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5
msec
MAX809 Series, MAX810 Series
TYPICAL OPERATING CHARACTERISTICS
0.6
0.35
0.5
VTH = 4.9 V
0.30
85°C
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
VTH = 1.2 V
0.4
25°C
0.3
−40°C
0.2
0.1
85°C
0.25
0.20
25°C
0.15
−40°C
0.10
0.05
0
0
0.5
1.5
2.5
3.5
5.5
4.5
0.5
6.5
1.5
SUPPLY CURRENT (mA)
NORMALIZED THRESHOLD VOLTAGE
VTH = 2.93 V
85°C
0.25
25°C
0.20
−40°C
0.10
0.05
0
0.5
1.5
2.5
3.5
4.5
5.5
6.5
Figure 5. Supply Current vs. Supply Voltage
0.35
0.15
3.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 4. Supply Current vs. Supply Voltage
0.30
2.5
4.5
5.5
6.5
1.002
1.001
1.000
0.999
VTH = 4.9 V
0.998
0.997
0.996
VTH = 1.2 V
0.995
0.994
−50
−25
0
25
50
75
100
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Figure 6. Supply Current vs. Supply Voltage
Figure 7. Normalized Reset Threshold Voltage
vs. Temperature
0.40
0.40
0.32
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
MAX809L/M, VCC = 5.0 V
MAX809R/S/T, VCC = 3.3 V
0.24
0.16
0.08
0
−50
MAX809L/M/R/S/T, VCC = 1.0 V
0.32
MAX810L/M, VCC = 5.0 V
0.24
MAX810R/S/T, VCC = 3.3 V
0.16
MAX810L/M/R/S/T, VCC = 1.0 V
0.08
0
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 8. Supply Current vs. Temperature
(No Load, MAX809)
Figure 9. Supply Current vs. Temperature (No
Load, MAX810)
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6
MAX809 Series, MAX810 Series
TYPICAL OPERATING CHARACTERISTICS
80
OUTPUT VOLTAGE VCC−VOH (mV)
OUTPUT VOLTAGE VCC (mV)
30
VTH = 4.90 V
ISINK = 500 mA
RESET ASSERTED
25
20
85°C
15
25°C
10
−40°C
5.0
70
VTH = 4.63 V
ISOURCE = 100 mA
RESET ASSERTED
60
50
85°C
40
25°C
30
−40°C
20
10
0
0
0.5 1.0
2.0
1.5
2.5
3.0
3.5
4.0
4.5
0.5
5.0
1.0
1.5
POWER−DOWN RESET DELAY (msec)
VOD = 20 mV
50
VOD = 100 mV
VOD = 200 mV
0
−50
−25
0
25
75
50
3.5
4.0
4.5
100
125
VOD = VCC−VTH
VOD = 10 mV
300
VOD = 20 mV
200
100
VOD = 100 mV
VOD = 200 mV
0
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
Figure 12. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 1.2 V)
Figure 13. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 4.9 V)
1.3
1.2
1.1
1.0
0.9
0.8
0.7
−50
5.0
400
TEMPERATURE (°C)
NORMALIZED POWER−UP RESET TIMEOUT
POWER−DOWN RESET DELAY (msec)
VOD = VCC−VTH
100
25
3.0
Figure 11. Output Voltage High vs. Supply
Voltage
125
75
2.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 10. Output Voltage Low vs. Supply
Voltage
VOD = 10 mV
2.0
−25
0
25
50
75
TEMPERATURE (°C)
Figure 14. Normalized Power−Up Reset vs.
Temperature
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7
100
125
MAX809 Series, MAX810 Series
Detail Operation Description
If there is an input power interruption and VCC becomes
significantly deficient, it will fall below the lower detector
threshold (VTH−). This event causes the RESET output to be
in the low state for the MAX809, or in the high state for the
NCP810 devices. After completion of the power
interruption, VCC will rise to its nominal level and become
greater than the VTH. This sequence activates the internal
oscillator circuitry and digital counter to count. After the
count of the timeout period, the reset output will revert back
to the original state.
The MAX809/810 series microprocessor reset
supervisory circuits are designed to monitor the power
supplies in digital systems and provide a reset signal to the
processor without any external components. Figure 2 shows
the timing diagram and a typical application below. Initially
consider that input voltage VCC is at a nominal level greater
than the voltage detector upper threshold (VTH). And the
RESET (RESET) output voltage (Pin 2) will be in the high
state for MAX809, or in the low state for MAX 810 devices.
Input Voltage
VCC
VTH+
VTH–
VCC
Reset Output
MAX809, NCP803
Reset Output
MAX810
VTH–
0V
VCC
VTH–
0V
tRP
Figure 15. Timing Waveforms
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8
MAX809 Series, MAX810 Series
APPLICATIONS INFORMATION
VCC Transient Rejection
maintained valid to VCC = 0 V, a pull−down resistor must be
connected from RESET to ground to discharge stray
capacitances and hold the output low (Figure 17). This
resistor value, though not critical, should be chosen such that
it does not appreciably load RESET under normal operation
(100 kW will be suitable for most applications).
The MAX809 provides accurate VCC monitoring and
reset timing during power−up, power−down, and
brownout/sag conditions, and rejects negative−going
transients (glitches) on the power supply line. Figure 16
shows the maximum transient duration vs. maximum
negative excursion (overdrive) for glitch rejection. Any
combination of duration and overdrive which lies under the
curve will not generate a reset signal. Combinations above
the curve are detected as a brownout or power−down.
Typically, transient that goes 100 mV below the reset
threshold and lasts 5.0 ms or less will not cause a reset pulse.
Transient immunity can be improved by adding a capacitor
in close proximity to the VCC pin of the MAX809.
VCC
VCC
MAX809/810
RESET
RESET
VCC
R1
100 k
GND
VTH
Overdrive
Figure 17. Ensuring RESET Valid to VCC = 0 V
Processors With Bidirectional I/O Pins
MAXIMUM TRANSIENT DURATION (msec)
Duration
Some Microprocessor’s have bidirectional reset pins.
Depending on the current drive capability of the processor
pin, an indeterminate logic level may result if there is a logic
conflict. This can be avoided by adding a 4.7 kW resistor in
series with the output of the MAX809 (Figure 18). If there
are other components in the system which require a reset
signal, they should be buffered so as not to load the reset line.
If the other components are required to follow the reset I/O
of the Microprocessor, the buffer should be connected as
shown with the solid line.
300
250
200
VTH = 4.9 V
150
VTH = 2.93 V
100
VTH = 1.2 V
50
BUFFER
0
10
VCC
60
110
160
210
260
310
360 410
RESET COMPARATOR OVERDRIVE (mV)
VCC
VCC
MAX809/810
Figure 16. Maximum Transient Duration vs.
Overdrive for Glitch Rejection at 25°C
RESET
RESET
RESET Signal Integrity During Power−Down
GND
The MAX809 RESET output is valid to VCC = 1.0 V.
Below this voltage the output becomes an “open circuit” and
does not sink current. This means CMOS logic inputs to the
Microprocessor will be floating at an undetermined voltage.
Most digital systems are completely shutdown well above
this voltage. However, in situations where RESET must be
BUFFERED RESET
TO OTHER SYSTEM
COMPONENTS
4.7 k
Microprocessor
RESET
GND
Figure 18. Interfacing to Bidirectional Reset I/O
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MAX809 Series, MAX810 Series
ORDERING, MARKING AND THRESHOLD INFORMATION
Part Number
MAX809SN160T1
MAX809SN160T1G
VTH* (V)
1.60
1.60
Timeout* (ms)
140−460
140−460
Description
MAX809SN232T1
MAX809SN232T1G
2.32
2.32
140−460
140−460
SQP
SQP
MAX809RTR
MAX809RTRG
2.63
2.63
140−460
140−460
SPS
SPS
MAX809STR
MAX809STRG
2.93
2.93
140−460
140−460
SPT
SPT
NCV809STRG
2.93
140−460
SUC
MAX809TTR
MAX809TTRG
3.08
3.08
140−460
140−460
SPU
SPU
MAX809JTR
MAX809JTRG
4.00
4.00
140−460
140−460
SPR
SPR
MAX809MTR
MAX809MTRG
4.38
4.38
140−460
140−460
SPV
SPV
MAX809HTR
MAX809HTRG
4.55
4.55
140−460
140−460
SBD
SBD
MAX809LTR
MAX809LTRG
4.63
4.63
140−460
140−460
SPW
SPW
NCV809LTRG
4.63
140−460
STA
MAX809SN490T1
MAX809SN490T1G
4.90
4.90
140−460
140−460
MAX809SN120T1G
1.20
140−460
SSO
MAX809SN293D1T1G
2.93
1−3.3
SSP
MAX809SN293D2T1G
2.93
20−66
SSQ
MAX809SN293D3T1G
2.93
100−330
SSR
MAX809SQ120T1G
1.20
140−460
ZD
MAX809SQ232T1G
2.32
140−460
ZE
MAX809SQ263T1G
2.63
140−460
ZF
MAX809SQ293T1G
2.93
140−460
ZG
MAX809SQ308T1G
3.08
140−460
ZH
MAX809SQ400T1G
4.00
140−460
SZ
MAX809SQ438T1G
4.38
140−460
ZI
MAX809SQ463T1G
4.63
140−460
ZJ
MAX809SQ293D1T1G
2.93
1−3.3
ZK
MAX809SQ293D2T1G
2.93
20−66
ZL
MAX809SQ293D3T1G
2.93
100−330
ZM
Push−Pull RESET
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10
Marking
SAA
SAA
SBH
SBH
Package
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
(Pb−Free)
SOT23−3
SOT23−3
(Pb−Free)
SOT23−3
(Pb−Free)
SOT23−3
(Pb−Free)
SOT23−3
(Pb−Free)
SOT23−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
SC70−3
(Pb−Free)
Shipping†
3000 / Tape & Reel
MAX809 Series, MAX810 Series
ORDERING, MARKING AND THRESHOLD INFORMATION
Part Number
MAX810RTR
MAX810RTRG
VTH*
(V)
2.63
2.63
Timeout*
(ms)
140−460
140−460
MAX810STR
MAX810STRG
2.93
2.93
MAX810TTR
MAX810TTRG
Description
Marking
Package
SPX
SPX
SOT23−3
SOT23−3
(Pb−Free)
140−460
140−460
SPY
SPY
SOT23−3
SOT23−3
(Pb−Free)
3.08
3.08
140−460
140−460
SPZ
SPZ
SOT23−3
SOT23−3
(Pb−Free)
MAX810MTR
MAX810MTRG
4.38
4.38
140−460
140−460
SQA
SQA
SOT23−3
SOT23−3
(Pb−Free)
MAX810LTR
MAX810LTRG
4.63
4.63
140−460
140−460
SQB
SQB
SOT23−3
SOT23−3
(Pb−Free)
MAX810SN120T1G
1.20
140−460
SSS
SOT23−3
(Pb−Free)
MAX810SN293D1T1G
2.93
1−3.3
SST
SOT23−3
(Pb−Free)
MAX810SN293D2T1G
2.93
20−66
SSU
SOT23−3
(Pb−Free)
MAX810SN293D3T1G
2.93
100−330
SSZ
SOT23−3
(Pb−Free)
MAX810SQ120T1G
1.20
140−460
ZN
SC70−3
(Pb−Free)
MAX810SQ263T1G
2.63
140−460
ZO
SC70−3
(Pb−Free)
MAX810SQ270T1G
2.70
20−66
ZB
SC70−3
(Pb−Free)
MAX810SQ293T1G
2.93
140−460
ZP
SC70−3
(Pb−Free)
MAX810SQ400T1G
4.00
20−66
ZC
SC70−3
(Pb−Free)
MAX810SQ438T1G
4.38
140−460
ZQ
SC70−3
(Pb−Free)
MAX810SQ463T1G
4.63
140−460
ZR
SC70−3
(Pb−Free)
MAX810SQ293D1T1G
2.93
1−3.3
ZS
SC70−3
(Pb−Free)
MAX810SQ293D2T1G
2.93
20−66
ZT
SC70−3
(Pb−Free)
MAX810SQ293D3T1G
2.93
100−330
ZU
SC70−3
(Pb−Free)
Push−Pull RESET
Shipping†
3000 / Tape & Reel
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Contact your ON Semiconductor sales representative for other threshold voltage options.
http://onsemi.com
11
MAX809 Series, MAX810 Series
PACKAGE DIMENSIONS
SOT−23 (TO236)
CASE 318−08
ISSUE AN
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
SEE VIEW C
3
HE
E
c
1
2
e
b
DIM
A
A1
b
c
D
E
e
L
L1
HE
0.25
q
A
L
A1
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
VIEW C
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
12
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX809 Series, MAX810 Series
PACKAGE DIMENSIONS
SC−70 (SOT−323)
CASE 419−04
ISSUE M
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
e1
3
E
HE
1
DIM
A
A1
A2
b
c
D
E
e
e1
L
HE
2
b
e
0.05 (0.002)
c
A2
A
MIN
0.80
0.00
0.30
0.10
1.80
1.15
1.20
2.00
MILLIMETERS
NOM
MAX
0.90
1.00
0.05
0.10
0.7 REF
0.35
0.40
0.18
0.25
2.10
2.20
1.24
1.35
1.30
1.40
0.65 BSC
0.425 REF
2.10
2.40
MIN
0.032
0.000
0.012
0.004
0.071
0.045
0.047
0.079
INCHES
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
0.026 BSC
0.017 REF
0.083
MAX
0.040
0.004
0.016
0.010
0.087
0.053
0.055
0.095
L
A1
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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13
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX809S/D