MC10EP16T, MC100EP16T 3.3V / 5V ECL Differential Receiver/Driver with Internal Termination Description The EP16T is a world−class differential receiver/driver. The device is functionally equivalent to the EP16 with internal termination resistors. A 50 W resistor is connected from the D input to the VT pin and from the D input to the VT pin. Tie the VT and VT pins to VTT supply (VCC − 2 V) for parallel termination or connect VT and VT pins for 100 W input series termination. Special considerations are required for differential inputs under No Signal conditions to prevent instability. The 100 Series contains temperature compensation. http://onsemi.com 8 8 1 1 SOIC−8 NB D SUFFIX CASE 751−07 TSSOP−8 DT SUFFIX CASE 948R−02 DFN−8 MN SUFFIX CASE 506AA Features • 220 ps Typical Propagation Delay • Maximum Frequency > 3 GHz Typical • PECL Mode Operating Range: • • VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode Operating Range: ♦ VCC = 0 V with VEE = −3.0 V to −5.5 V Internal 50 W Termination Resistors These Devices are Pb-Free, Halogen Free and are RoHS Compliant ♦ 1 HEP61 ALYW G 1 HP61 ALYWG G 1 KP61 ALYWG G 1 A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package 4 8 8 1 5M MG G 8 8 KEP61 ALYW G 1 H K 5M 3D M = MC10 = MC100 = MC10 = MC100 = Date Code 3D MG G • MARKING DIAGRAMS* 4 (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 7 1 Publication Order Number: MC10EP16T/D MC10EP16T, MC100EP16T VT 1 8 Table 1. PIN DESCRIPTION VCC 50 W D D 2 7 3 Q 6 Q 5 VEE PIN FUNCTION D, D Q, Q VCC VEE ECL Data Inputs ECL Data Outputs Positive Supply Negative Supply VT 50 W Termination Resistor to D VT EP 50 W Termination Resistor to D 50 W VT 4 (DFN−8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. Figure 1. 8-Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor N/A Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model Charged Device Model > 4 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 NB TSSOP−8 DFN−8 Pb-Free Pkg Level 1 Level 3 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 167 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D www.onsemi.com 2 MC10EP16T, MC100EP16T Table 3. MAXIMUM RATINGS Symbol Rating Unit VCC PECL Mode Power Supply Parameter VEE = 0 V Condition 1 Condition 2 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V Iout Output Current Continuous Surge 50 100 mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC−8 NB 190 130 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm TSSOP−8 185 140 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm DFN−8 129 84 °C/W Tsol Wave Solder (Pb-Free) 265 °C qJC Thermal Resistance (Junction-to-Case) 35 to 40 °C/W VI v VCC VI w VEE (Note 1) DFN−8 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) Table 4. 10EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1)) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 16 23 31 16 23 31 16 23 31 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV VOL Output LOW Voltage (Note 2) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV VIH Input HIGH Voltage (Single-Ended) 2090 2415 2155 2480 2215 2540 mV VIL Input LOW Voltage (Single-Ended) 1365 1690 1430 1755 1490 1815 mV Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 2.0 3.3 2.0 3.3 2.0 3.3 V RT Internal Termination Resistor 43 57 43 57 43 IIH Input HIGH Current IIL Input LOW Current VIHCMR 150 −150 50 150 −150 −150 57 W 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 3 MC10EP16T, MC100EP16T Table 5. 10EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max Min 85°C Typ Max Min Typ Max Unit IEE Power Supply Current 16 23 31 16 23 31 16 23 31 mA VOH Output HIGH Voltage (Note 2) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV VOL Output LOW Voltage (Note 2) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV VIH Input HIGH Voltage (Single-Ended) 3790 4115 3855 4180 3915 4240 mV VIL Input LOW Voltage (Single-Ended) 3065 3390 3130 3455 3190 3515 mV Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 2.0 5.0 2.0 5.0 2.0 5.0 V RT Internal Termination Resistor 43 57 43 57 43 IIH Input HIGH Current IIL Input LOW Current VIHCMR 50 150 150 −150 −150 57 W 150 mA −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 6. 10EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 1)) −40°C Symbol IEE Characteristic Power Supply Current 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 16 23 31 16 23 31 16 23 31 mA VOH Output HIGH Voltage (Note 2) −1135 −1010 −885 −1070 −945 −820 −1010 −885 −760 mV VOL Output LOW Voltage (Note 2) −1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560 mV VIH Input HIGH Voltage (Single-Ended) −1210 −885 −1145 −820 −1085 −760 mV VIL Input LOW Voltage (Single-Ended) −1935 −1610 −1870 −1545 −1810 −1485 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 0.0 V 57 W 150 mA RT Internal Termination Resistor IIH Input HIGH Current IIL Input LOW Current VEE + 2.0 0.0 43 VEE + 2.0 57 43 150 −150 50 0.0 57 VEE + 2.0 43 150 −150 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 4 MC10EP16T, MC100EP16T Table 7. 100EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1)) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit IEE Power Supply Current 18 25 35 20 27 37 22 29 39 mA VOH Output HIGH Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 2) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV VIH Input HIGH Voltage (Single-Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single-Ended) 1355 1675 1355 1675 1355 1675 mV Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 2.0 3.3 2.0 3.3 2.0 3.3 V RT Internal Termination Resistor 43 57 43 57 43 IIH Input HIGH Current IIL Input LOW Current VIHCMR 50 150 −150 150 −150 57 W 150 mA −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 8. 100EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1)) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 18 25 35 20 27 37 22 29 39 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV VOL Output LOW Voltage (Note 2) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV VIH Input HIGH Voltage (Single-Ended) 3775 4120 3775 4120 3775 4120 mV VIL Input LOW Voltage (Single-Ended) 3055 3375 3055 3375 3055 3375 mV Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 2.0 5.0 2.0 5.0 2.0 5.0 V RT Internal Termination Resistor 43 57 43 57 43 57 W IIH Input HIGH Current 150 mA IIL Input LOW Current VIHCMR 150 −150 50 150 −150 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 5 MC10EP16T, MC100EP16T Table 9. 100EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max Min 85°C Typ Max Min Typ Max Unit IEE Power Supply Current 18 25 35 20 27 37 22 29 39 mA VOH Output HIGH Voltage (Note 2) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 2) −1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV VIH Input HIGH Voltage (Single-Ended) −1225 −880 −1225 −880 −1225 −880 mV VIL Input LOW Voltage (Single-Ended) −1945 −1625 −1945 −1625 −1945 −1625 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 0.0 V RT Internal Termination Resistor IIH Input HIGH Current IIL Input LOW Current VEE + 2.0 0.0 43 VEE + 2.0 57 43 0.0 50 57 150 VEE + 2.0 43 150 −150 −150 57 W 150 mA −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 10. AC CHARACTERISTICS (VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 1)) −40°C Symbol Characteristic fmax Maximum Frequency (Figure 2) tPLH, tPHL Propagation Delay to Output Differential tSKEW tJITTER VPP tr tf Min Typ 25°C Max >3 150 300 Duty Cycle Skew (Note 2) 5.0 Cycle-to-Cycle Jitter (Figure 2) Input Voltage Swing (Differential Configuration) Q, Q Typ Max Min >3 230 Output Rise/Fall Times (20% − 80%) Min 85°C 150 Typ Max >3 240 300 20 5.0 0.2 <1 150 800 1200 70 120 170 200 Unit GHz 275 350 ps 20 5.0 20 ps 0.2 <1 0.2 <1 ps 150 800 1200 150 800 1200 mV 80 130 180 100 140 200 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V. 2. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs. www.onsemi.com 6 900 9 800 8 700 7 600 6 500 5 400 4 300 3 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ 200 (JITTER) 100 0 0 500 1000 1500 2000 2500 3000 3500 JITTEROUT ps (RMS) VOUTpp (mV) MC10EP16T, MC100EP16T ÉÉ ÉÉ 2 1 4000 FREQUENCY (MHz) Figure 2. Fmax/Jitter Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) www.onsemi.com 7 MC10EP16T, MC100EP16T ORDERING INFORMATION Package Shipping† MC10EP16TDG SOIC−8 NB (Pb-Free) 98 Units / Rail MC10EP16TDR2G SOIC−8 NB (Pb-Free) 2500 / Tape & Reel MC10EP16TDTG TSSOP−8 (Pb-Free) 100 Units / Rail MC10EP16TDTR2G TSSOP−8 (Pb-Free) 2500 / Tape & Reel MC10EP16TMNR4G DFN−8 (Pb-Free) 1000 / Tape & Reel MC100EP16TDG SOIC−8 NB (Pb-Free) 98 Units / Rail MC100EP16TDR2G SOIC−8 NB (Pb-Free) 2500 / Tape & Reel MC100EP16TDTG TSSOP−8 (Pb-Free) 100 Units / Rail MC100EP16TDTR2G TSSOP−8 (Pb-Free) 2500 / Tape & Reel MC100EP16TMNR4G DFN−8 (Pb-Free) 1000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 8 MC10EP16T, MC100EP16T PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EP16T, MC100EP16T PACKAGE DIMENSIONS TSSOP−8 CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U V S 0.25 (0.010) B −U− 4 M A −V− S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E www.onsemi.com 10 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10EP16T, MC100EP16T PACKAGE DIMENSIONS DFN−8 2x2, 0.5P CASE 506AA ISSUE F D PIN ONE REFERENCE 2X 0.10 C 2X A B L1 ÇÇ ÇÇ ÇÇ 0.10 C DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉ ÉÉ ÇÇ EXPOSED Cu TOP VIEW A DETAIL B 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L DIM A A1 A3 b D D2 E E2 e K L L1 ÉÉ ÉÉ ÇÇ A3 MOLD CMPD A1 DETAIL B 0.08 C (A3) NOTE 4 SIDE VIEW DETAIL A ALTERNATE CONSTRUCTIONS A1 D2 1 4 C 8X SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.30 REF 0.25 0.35 −−− 0.10 RECOMMENDED SOLDERING FOOTPRINT* L 1.30 PACKAGE OUTLINE 8X 0.50 E2 0.90 K 8 5 e/2 e 8X b 1 0.10 C A B 0.05 C 2.30 8X NOTE 3 0.30 BOTTOM VIEW 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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