TriQuint ECG008B-G Ingap hbt gain block Datasheet

ECG008B-G
InGaP HBT Gain Block
Applications
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Wireless Infrastructure
CATV / SATV / MoCA
Point to Point
Defense & Aerospace
Test & Measurement Equipment
General Purpose Wireless
0
G0
EC
-G
SOT-89 Package Style
Product Features


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8B
Functional Block Diagram
DC – 4 GHz
+24 dBm P1dB at 1 GHz
+40 dBm OIP3 at 1 GHz
15 dB Gain at 1 GHz
4.6 dB Noise Figure
Internally matched to 50 Ω
Lead-free / green / RoHS-Compliant SOT-89 Package
Backside Paddle - GND
General Description
1
2
RF IN
GND
3
RF OUT / VCC
Pin Configuration
The ECG008B-G is a general-purpose buffer amplifier
that offers high dynamic range in a low-cost surfacemount package. At 1000 MHz, the ECG008B-G typically
provides 15 dB of gain, +40 dBm Output IP3, and
+24 dBm P1dB.
Pin No.
Label
1
2
3
Backside Paddle
RF IN
GND
RF OUT / VCC
GND
The ECG008B-G consists of Darlington pair amplifiers
using the high reliability InGaP / GaAs HBT process
technology and only requires DC-blocking capacitors, a
bias resistor, and an inductive RF choke for operation.
The device is ideal for wireless applications and is
available in a lead-free/green/RoHS-compliant SOT-89
package. All devices are 100% RF and DC tested.
This broadband MMIC amplifier can be directly applied
to various current and next generation wireless
technologies. In addition, the ECG0038B-G will satisfy
general amplification requirements in the DC to 4 GHz
frequency range such as CATV and mobile wireless.
Ordering Information
Part No.
Description
ECG008B-G
ECG008B-PCB
InGaP HBT Gain Block
500 – 4000 MHz Evaluation Board
Standard T/R size = 1000 pieces on a 7” reel
Datasheet: Rev B 12/04/14
© 2014 TriQuint
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Disclaimer: Subject to change without notice
www.triquint.com
ECG008B-G
InGaP HBT Gain Block
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Parameter
Min
TCASE
Junction Temperature
−40
Rating
−65 to 150 °C
+15 dBm
160 mA
Storage Temperature
RF Input Power (Continuous)
Device Current
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Typ
Max Units
+85
+160
°C
°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: VSUPPLY = +9 V, RBIAS = 14 Ω, Temp.=+25 °C, 50 Ω System
Parameter
Conditions
Operational Bandwidth
Gain
Output P1dB
Output IP3
Noise Figure
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise Figure
Device Voltage
Device Current
Output mismatch w/o spurs
Thermal Resistance
Min
Typ
DC
15
+24
+40
4.6
14.3
25
14
+23
+37
4.8
+7.3
120
10:1
86
Freq.=1000 MHz
Pout=+2 dBm / Tone, Δf = 1 MHz
13
Freq.=2000 MHz
Pout=+2 dBm / Tone, Δf = 1 MHz
+34
+6.8
Typical Device RF Performance
Max
Units
4000
MHz
dB
dBm
dBm
dB
17.2
dB
dB
dB
dBm
dBm
dB
+7.8
V
mA
VSWR
°C / W
(1)
Test conditions unless otherwise noted: VSUPPLY = +9 V, ICC = 120 mA (typ.), RBIAS = 14 Ω, Temp.=+25 °C, 50 Ω System
Parameter
Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Typical
100
14.8
25
20
+24.5
+41.6
4.9
500
14.7
26
19
+24.3
+41
4.7
900
14.6
28.5
17
+24
+40
4.6
1900
14.3
28
13
+23.2
+37
4.7
2140
14.3
25
13
+22.8
+36
4.9
Units
2400
14.2
23.2
12
+21.8
+34
5.2
3500
14.5
15.4
7.9
+17.3
5800
12.4
6
2.7
MHz
dB
dB
dB
dBm
dBm
dB
Notes:
1. Gain and return loss values presented above, and in the plots of the following section, are measured at the device level.
Application specific performance values will differ in accordance with external components selected for the desired frequency
band of operation. P1dB, OIP3 and NF data is measured using the application circuit shown on page 4.
2. Pout = +9 dBm / tone, 1 MHz tone spacing.
Datasheet: Rev B 12/04/14
© 2014 TriQuint
- 2 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com
ECG008B-G
InGaP HBT Gain Block
Typical RF Device Performance (1)
Test conditions unless otherwise noted: VSUPPLY = +9 V, ICC = 120 mA (typ.), RBIAS = 14 Ω, 50 Ω System
Gain vs. Frequency
20
Return Loss vs. Frequency
0
VDE vs. ICC
140
Temp.=+25°C
Temp.=+25°C
-5
18
−40°C
14
100
-15
|S22|
|S11|
-20
ICC (mA)
|S11|, |S22| (dB)
Gain (dB)
+25°C
16
120
-10
+85°C
80
60
-25
40
-30
12
20
-35
-40
10
500
1000
1500
2000
2500
0
0
3000
1
OIP3 vs. Frequency
45
2
3
4
5
6
0.0
35
30
10.0
4.5
−40°C
4.0
NF (dB)
P1dB (dBm)
−40°C
8.0
+25°C
25
+25°C
6.0
Noise Figure vs. Frequency
5.0
+85°C
Ouput IP3 (dBm)
4.0
VDE (V)
P1dB vs. Frequency
30
+85°C
40
2.0
Frequency (GHz)
Frequency (MHz)
20
3.5
3.0
15
2.5
Temp.=+25°C
25
2.0
10
500
1000
1500
2000
2500
3000
500
1000
Frequency (MHz)
1500
2000
2500
500
3000
1000
1500
2000
Frequency (MHz)
Frequency (MHz)
Typical Device S-Parameters
Test Conditions: VDEVICE= +7.3 V, ICC = 120 mA, Temp. =+25 °C, Calibrated to device leads
Freq (MHz)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
S11 (dB)
−24.87
−26.14
−28.46
−30.86
−28.14
−23.15
−18.78
−15.39
−12.91
−10.59
−8.44
−6.76
−5.43
S11 (ang)
176.05
167.68
166.94
−178.22
−144.76
−137.68
−150.37
−171.26
161.38
132.87
105.27
80.71
61.63
S21 (dB)
14.88
14.71
14.60
14.39
14.30
14.20
14.30
14.48
14.65
14.51
14.04
13.17
12.10
S21 (ang)
177.77
161.26
142.99
125.46
108.38
91.08
74.41
56.29
35.57
13.60
−8.75
−31.25
−50.89
S12 (dB)
−18.94
−18.94
−19.02
−18.94
−18.86
−18.64
−18.20
−17.52
−16.85
−16.36
−16.20
−16.26
−16.59
S12 (ang)
−1.51
−5.99
−11.44
−16.56
−21.00
−25.54
−29.98
−36.74
−45.50
−56.53
−68.74
−81.52
−93.75
S22 (dB)
−20.41
−19.43
−17.47
−15.40
−13.40
−11.63
−9.65
−7.83
−6.06
−4.68
−3.62
−2.87
−2.41
S22 (ang)
−4.20
−39.76
−72.27
−95.62
−116.18
−133.34
−151.20
−171.17
165.56
141.33
117.07
94.30
73.89
Notes:
1. Device S-parameters are available for download off of the website at: www.triquint.com
Datasheet: Rev B 12/04/14
© 2014 TriQuint
- 3 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com
ECG008B-G
InGaP HBT Gain Block
ECG008B-PCB Evaluation Board
J3
R3
J4
C4
R3
J3
Vsupply
Bias
Resistor
J4 GND
Bypass Capacitor
C3
U1
R1
C1
L1
C3
R2
C2
0.018 uF
RF
Choke
L1
C1
J1
RF
Input
R1
1
18 
DC Blocking
Capacitor
U1
3
2, Backside
Paddle
C2
R2
4.7 
J2
DC Blocking
Capacitor
RF
Output
Notes:
1. See Evaluation Board PCB Information section for material and stack-up.
Bill of Material: ECG008B-PCB
RBIAS Values for Various VSUPPLY
Ref. Des.
Description
VSUPPLY (VCC)
9
10
12
ECG008B-G
Wirewound Inductor, 0603
Chip Capacitor, 0603
Chip Capacitor, 0603
R3 (Ω)
14
23
39
2010
2512
2512
U1
L1
C1, C2
C3
C4
R1
R2
R3
Value
n/a
39 nH
56 pF
0.018 F
Do Not Place
18 Ω
4.7 Ω
14 Ω
Component Size
Chip Resistor, 0603
Chip Resistor, 0603
1% Tolerance, 2010
Component Values for Specific Frequencies
Frequency (MHz)
L1
C1, C2, C3
50
820 nH
.018 uF
500
220 nH
1000 pF
900
68 nH
100 pF
1900
27 nH
68 pF
2200
22 nH
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
Application Circuit RF Performance
Datasheet: Rev B 12/04/14
© 2014 TriQuint
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Disclaimer: Subject to change without notice
www.triquint.com
ECG008B-G
InGaP HBT Gain Block
Pin Configuration and Description
Backside Paddle - GND
1
2
RF IN
GND
3
RF OUT / VCC
Pin No.
Label
Description
1
RF IN
3
RF OUT / VCC
RF input, matched to 50 ohms. External DC Block is required.
RF output / DC supply, matched to 50 ohms. External DC Block, bias choke,
and dropping resistor is required.
RF/DC ground. Use recommended via pattern to minimize inductance and
thermal resistance. See PCB Mounting Pattern for suggested footprint.
2, Backside Paddle GND Paddle
Evaluation Board PCB Information
TriQuint PCB 1069136 Material and Stack-up
1 oz. Cu top layer
0.014"
Nelco N-4000-13
1 oz. Cu inner layer
0.062" ± 0.006"
Finished Board
Thickness
Core
1 oz. Cu inner layer
0.014"
Nelco N-4000-13
1 oz. Cu bottom layer
50 Ohm Line Dimensions: Width=0.028"
Spacing=0.036"
Datasheet: Rev B 12/04/14
© 2014 TriQuint
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Disclaimer: Subject to change without notice
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ECG008B-G
InGaP HBT Gain Block
Package Marking and Dimensions
Marking: Product Identifier – E008G
Lot Code – YXXX
D
A
D1
E008G
YXXX
D1
HALF ETCHING
DEPTH 0.001"
D1
E1
E
H
L
2X B1
B
Alternate Backside Patterns - Reflow Compatible
(Part may be supplied with either pattern)
C
e
e1
SYMBOL
A
B
7°
B1
C
D
D1
MIN
1.40
(.055)
.44
(.017)
.36
(.014)
.35
(.014)
4.40
(.173)
1.62
(.064)
TYP
1.50
(.059)
.50
(.020)
.42
(.0165)
.40
(.016)
4.50
(.177)
1.73
(.068)
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Dimension and tolerance formats conform to ASME Y14.4M-1994.
3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
4. Contact plating: NiPdAu
MAX
1.60
(.063)
.56
(.022)
.48
(.019)
.44
(.017)
4.60
(.181)
1.83
(.072)
SYMBOL
E
E1
MIN
2.29
(.090)
2.13
(.084)
e
e1
H
L
3.94
(.155)
.89
(.035)
TYP
2.50
(.098)
2.20
(.087)
1.50 BSC
(.059)
3.00 BSC
(.118)
4.10
(.161)
1.10
(.043)
MAX
2.60
(.102)
2.29
(.090)
4.25
(.167)
1.20
(.047)
PCB Mounting Pattern
3.86 [0.152]
0.76 [0.030]
0.38 [0.015]
0.76 [0.030]
4.50 [0.177]
Ø.254 (.010) PLATED THRU VIA HOLES
3
PACKAGE OUTLINE
0.76 [0.030]
1.42 [0.056]
3.03 [0.119]
2X 1.27 [0.050]
2X 0.58 [0.023]
2.65 [0.104]
2X 0.86 [0.034]
0.64 [0.025]
0.86 [0.034]
3.86 [0.152]
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
4. Do not remove or minimize via hole structure in the PCB. Thermal and RF grounding is critical.
5. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
6. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Datasheet: Rev B 12/04/14
© 2014 TriQuint
- 6 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com
ECG008B-G
InGaP HBT Gain Block
Product Compliance Information
ESD Sensitivity Ratings
Solderability
Compatible with both lead-free (260 °C maximum reflow
temperature) and tin/lead (245 °C maximum reflow
temperature) soldering processes.
Caution! ESD-Sensitive Device
Contact plating: NiPdAu
ESD Rating:
Value:
Test:
Standard:
Class 1A
≥ 250 V to < 500 V
Human Body Model (HBM)
ESDA/JEDEC Standard JS-001-2012
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
MSL Rating
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
MSL Rating: Level 3
Test:
260 °C convection reflow
Standard:
JEDEC Standard IPC/JEDEC J-STD-020
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information
about TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
+1.503.615.9000
+1.503.615.8902
For technical questions and application information:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The
information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with
such information is entirely with the user. All information contained herein is subject to change without notice.
Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The
information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or
anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal
injury or death.
Datasheet: Rev B 12/04/14
© 2014 TriQuint
- 7 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com
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