LP2982 www.ti.com SNVS128J – MARCH 2000 – REVISED APRIL 2013 LP2982 Micropower 50 mA Ultra Low-Dropout Regulator in SOT-23 Package Check for Samples: LP2982 FEATURES DESCRIPTION • • • • • • • • • • • • The LP2982 is a 50 mA, fixed-output voltage regulator designed to provide ultra low dropout and lower noise in battery powered applications. 1 23 Ultra Low Dropout Voltage Ensured 50 mA Output Current Typical Dropout Voltage 180 mV @ 80 mA Requires Minimum External Components < 1 μA Quiescent Current when Shutdown Low Ground Pin Current at All Loads Output Voltage Accuracy 1.0% (A Grade) High Peak Current Capability (150 mA Typical) Wide Supply Voltage Range (16V Max) Low ZOUT 0.3Ω Typical (10 Hz to 1 MHz) Over-Temperature/Over-Current Protection −40°C to +125°C Junction Temperature Range APPLICATIONS • • • • Cellular Phone Palmtop/Laptop Computer Personal Digital Assistant (PDA) Camcorder, Personal Stereo, Camera Using an optimized VIP™ (Vertically Integrated PNP) process, the LP2982 delivers unequaled performance in all specifications critical to battery-powered designs: Dropout Voltage: Typically 120 mV @ 50 mA load, and 7 mV @ 1 mA load. Ground Pin Current: Typically 375 μA @ 50 mA load, and 80 μA @ 1 mA load. Sleep Mode: Less than 1 μA quiescent current when on/off pin is pulled low. Precision Output: 1.0% tolerance output voltages available (A grade). Low Noise: By adding an external bypass capacitor, output noise can be reduced to 30 μV (typical). Four output voltage versions, from 3.0V to 5.0V, are available as standard products. Block Diagram 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. VIP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LP2982 SNVS128J – MARCH 2000 – REVISED APRIL 2013 www.ti.com Connection Diagram Top View Figure 1. 5-Lead Small Outline SOT-23 Package See Package Number DBV0005A Pin Descriptions Name Pin Number VIN 1 Input Voltage Function GND 2 Common Ground (device substrate) ON/OFF 3 Logic high enable input BYPASS 4 Bypass capacitor for low noise operation VOUT 5 Regulated output voltage These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Lead Temperature (Soldering, 5 sec.) 260°C ESD Rating (3) 2 kV Power Dissipation (4) Internally Limited −0.3V to +16V Input Supply Voltage (Survival) Input Supply Voltage (Operating) 2.1V to +16V −0.3V to +16V Shutdown Input Voltage (Survival) Output Voltage (Survival (5)) −0.3V to +9V IOUT (Survival) Short Circuit Protected Input-Output Voltage (Survival (6)) (1) (2) (3) (4) (5) (6) 2 −0.3V to +16V Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The ESD rating of pins 3 and 4 for the SOT-23 package, or pins 5 and 2 for the DSBGA package, is 1 kV. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: The value of θJA for the SOT-23 package is 220°C/W. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2982 output must be diode-clamped to ground. The output PNP structure contains a diode between the VIN and VOUT terminals that is normally reverse-biased. Reversing the polarity from VIN to VOUT will turn on this diode. (See REVERSE CURRENT PATH.) Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 LP2982 www.ti.com SNVS128J – MARCH 2000 – REVISED APRIL 2013 Electrical Characteristics Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range. Unless otherwise specified: VIN = VO(NOM) + 1V, IL = 1 mA, CIN = 1 μF, COUT = 4.7 μF, VON/OFF = 2V. Symbol Parameter ΔVO Output Voltage Tolerance Output Voltage Line Regulation VIN–VO Dropout Voltage (2) IGND Ground Pin Current Conditions ION/OFF IO(PK) VIN–VO IGND en IO(MAX) (1) (2) (3) (4) ON/OFF Input Voltage (3) ON/OFF Input Current Peak Output Current Dropout Voltage Ground Pin Current LP2982AI-X.X (1) LP2982I-X.X (1) Min Max Min Max IL = 1 mA −1.0 +1.0 −1.5 +1.5 1 mA < IL < 50 mA −1.5 +1.5 −2.0 +2.0 −2.0 +2.0 −3.5 +3.5 VO(NOM) + 1V ≤ VIN ≤ 16V 0.007 0.014 0.014 0.032 0.032 3 IL = 0 1 3 5 5 IL = 1 mA 7 10 10 15 15 60 IL = 10 mA 40 60 90 90 IL = 50 mA 120 150 150 225 225 IL = 0 65 IL = 1 mA 80 IL = 10 mA 140 IL = 50 mA VON/OFF Typ 375 95 95 125 125 110 110 170 170 220 220 460 460 600 600 1200 1200 0.8 0.8 VON/OFF < 0.3V 0.01 VON/OFF < 0.15V 0.10 High = O/P ON 1.4 Low = O/P OFF 0.55 0.15 0.15 VON/OFF = 0 0.01 −2 −2 5 15 15 VON/OFF = 5V VOUT ≥ VO(NOM) − 5% 150 IL = 80 mA 180 IL = 80 mA 525 2.0 1.6 Units %VNOM mV μA 2.0 1.6 100 %/V 100 V μA mA 225 225 325 325 750 750 1400 1400 mV μA μV Output Noise Voltage (RMS) BW = 300 Hz–50 kHz, COUT = 10 μF CBYPASS = 0.01 μF 30 Ripple Rejection f = 1 kHz COUT = 10 μF 45 dB Short Circuit Current RL = 0 (Steady State) (4) 150 mA Temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate Average Outgoing Quality Level (AOQL). Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a 1V differential. The ON/OFF inputs must be properly driven to prevent possible misoperation. For details, refer to Application Hints. See Typical Performance Characteristics curve(s). Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 3 LP2982 SNVS128J – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Application Circuit *ON/OFF input must be actively terminated. Tie to VIN if this function is not to be used. **Minimum capacitance is shown to insure stability over full load current range. More capacitance provides superior dynamic performance (see Application Hints). ***See Application Hints. 4 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 LP2982 www.ti.com SNVS128J – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/OFF pin tied to VIN. Output Voltage vs Temperature Output Voltage vs Temperature Figure 2. Figure 3. Output Voltage vs Temparature Dropout Characteristics Figure 4. Figure 5. Dropout Characteristics Dropout Characteristics Figure 6. Figure 7. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 5 LP2982 SNVS128J – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/OFF pin tied to VIN. Dropout Voltage vs Temperature Dropout Voltage vs Load Current Figure 8. Figure 9. Ground Pin Current vs Temperature Ground Pin Current vs Load Current Figure 10. Figure 11. Input Current vs VIN Input Current vs VIN Figure 12. 6 Figure 13. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 LP2982 www.ti.com SNVS128J – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/OFF pin tied to VIN. Line Transient Response Line Transient Response Figure 14. Figure 15. Load Transient Response Load Transient Response Figure 16. Figure 17. Load Transient Response Load Transient Response Figure 18. Figure 19. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 7 LP2982 SNVS128J – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/OFF pin tied to VIN. 8 Short Circuit Current Instantaneous Short Circuit Current vs Temperature Figure 20. Figure 21. Short Circuit Current Instantaneous Short Circuit Current vs Output Voltage Figure 22. Figure 23. Output Impedance vs Frequency Output Impedance vs Frequency Figure 24. Figure 25. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 LP2982 www.ti.com SNVS128J – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/OFF pin tied to VIN. ON/OFF Pin Current vsVON/OFF ON/OFF Threshold vs Temperature Figure 26. Figure 27. Input to Output Leakage vs Temperature Output Reverse Leakage vs Temperature Figure 28. Figure 29. Output Noise Density Output Noise Density Figure 30. Figure 31. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 9 LP2982 SNVS128J – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/OFF pin tied to VIN. Output Noise Density Ripple Rejection Figure 32. Figure 33. Turn-ON Waveform Turn-ON Waveform Figure 34. Figure 35. Turn-ON Waveform Figure 36. 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 LP2982 www.ti.com SNVS128J – MARCH 2000 – REVISED APRIL 2013 APPLICATION HINTS EXTERNAL CAPACITORS Like any low-dropout regulator, the external capacitors used with the LP2982 must be carefully selected to assure regulator loop stability. Input Capacitor: An input capacitor whose value is ≥ 1 μF is required with the LP2982 (amount of capacitance can be increased without limit). This capacitor must be located a distance of not more than 0.5″ from the input pin of the LP2982 and returned to a clean analog ground. Any good quality ceramic or tantalum can be used for this capacitor. Output Capacitor: The output capacitor must meet both the requirement for minimum amount of capacitance and E.S.R. (equivalent series resistance) value. Curves are provided which show the allowable ESR range as a function of load current for various output voltages and capacitor values (refer to Figure 37 and Figure 38). Important: The output capacitor must maintain its ESR in the stable region over the full operating temperature to assure stability. Also, capacitor tolerance and variation with temperature must be considered to assure the minimum amount of capacitance is provided at all times. This capacitor should be located not more than 0.5″ from the output pin of the LP2982 and returned to a clean analog ground. Low-current Operation: In applications where the load current is < 1 mA, special consideration must be given to the output capacitor. Circuitry inside the LP2982 is specially designed to reduce operating (quiescent) current at light loads down to about 65 μA. The mode of operation which yields this very low quiescent current also means that the output capacitor ESR is critical. For optimum stability and minimum output noise, it is recommended that a 10Ω resistor be placed in series with the output capacitor in any applications where IL < 1 mA. CAPACITOR CHARACTERISTICS Tantalum: Tantalum capacitors are the best choice for use with the LP2982. Most good quality tantalum can be used with the LP2982, but check the manufacturer's data sheet to be sure the ESR is in range. It is important to remember that ESR increases sharply at lower temperatures (< 10°C) and a capacitor that is near the upper limit for stability at room temperature can cause instability when it gets cold. In applications which must operate at very low temperatures, it may be necessary to parallel the output tantalum capacitor with a ceramic capacitor to prevent the ESR from going up too high (see next section for important information on ceramic capacitors). Ceramic: Ceramic capacitors are not recommended for use at the output of the LP2982. This is because the ESR of a ceramic can be low enough to go below the minimum stable value for the LP2982. A good 2.2 μF ceramic was measured and found to have an ESR of about 15 mΩ, which is low enough to cause oscillations. If a ceramic capacitor is used on the output, a 1Ω resistor should be placed in series with the capacitor. Aluminum: Because of large physical size, aluminum electrolytic are not typically used with the LP2982. They must meet the same ESR requirements over the operating temperature range, which is more difficult because of their large increase in ESR at cold temperature. An aluminum electrolytic can exhibit an ESR increase of as much as 50X when going from 20°C to −40°C. Also, some aluminum electrolytic are not operational below −25°C because the electrolyte can freeze. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 11 LP2982 SNVS128J – MARCH 2000 – REVISED APRIL 2013 www.ti.com Figure 37. 5V/2.2 μF ESR Curves Figure 38. 3V/4.7 μF ESR Curves BYPASS CAPACITOR The 0.01 μF capacitor connected to the bypass pin to reduce noise must have very low leakage. The current flowing out of the bypass pin comes from the bandgap reference, which is used to set the output voltage. This capacitor leakage current causes the output voltage to decline by an amount proportional to the current. Typical values are −0.015%/nA @ −40°C, −0.021%/nA @ 25°C, and −0.035%/nA @ +125°C. This data is valid up to a maximum leakage current of about 500 nA, beyond which the bandgap is so severely loaded that it can not function. Care must be taken to ensure that the capacitor selected will not have excessive leakage current over the operating temperature range of the application. A high quality ceramic capacitor which uses either NPO or COG type dielectric material will typically have very low leakage. Small surface mount polypropylene or polycarbonate film capacitors also have extremely low leakage, but are slightly larger than ceramics. REVERSE CURRENT PATH The internal PNP power transistor used as the pass element in the LP2982 has an inherent diode connected between the regulator output and input. During normal operation (where the input voltage is higher than the output) this diode is reverse biased (See Figure 39). LP2982 VIN VOUT PNP GND Figure 39. LP2982 Reverse Current Path However, if the input voltage is more than a VBE below the output voltage, this diode will turn ON and current will flow into the regulator output. In such cases, a parasitic SCR can latch which will allow a high current to flow into the VIN pin and out the ground pin, which can damage the part. The internal diode can also be turned on if the input voltage is abruptly stepped down to a voltage which is a VBE below the output voltage. In any application where the output voltage may be higher than the input voltage, an external Schottky diode must be connected from VIN to VOUT (cathode on VIN, anode on VOUT. See Figure 40), to limit the reverse voltage across the LP2982 to 0.3V (see Absolute Maximum Ratings). 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 LP2982 www.ti.com SNVS128J – MARCH 2000 – REVISED APRIL 2013 SCHOTTKY DIODE LP2982 VIN VOUT PNP GND Figure 40. Adding External Schottky Diode Protection ON/OFF INPUT OPERATION The LP2982 is shut off by pulling the ON/OFF input low, and turned on by driving the input high. If this feature is not to be used, the ON/OFF input should be tied to VIN to keep the regulator on at all times (the ON/OFF input must not be left floating). To ensure proper operation, the signal source used to drive the ON/OFF input must be able to swing above and below the specified turn-on/turn-off voltage thresholds which ensure an ON or OFF state (see Electrical Characteristics). The ON/OFF signal may come from either a totem-pole output, or an open-collector output with pull-up resistor to the LP2982 input voltage or another logic supply. The high-level voltage may exceed the LP2982 input voltage, but must remain within the Absolute Maximum Ratings for the ON/OFF pin. It is also important that the turn-on/turn-off voltage signals applied to the ON/OFF input have a slew rate which is greater than 40 mV/μs. IMPORTANT: The regulator shutdown function will not operate correctly if a slow-moving signal is applied to the ON/OFF input. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 13 LP2982 SNVS128J – MARCH 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision I (April 2013) to Revision J • 14 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 13 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP2982 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2014 PACKAGING INFORMATION Orderable Device Status (1) LP2982AIM5-3.0/NOPB Package Type Package Pins Package Drawing Qty ACTIVE SOT-23 DBV 5 1000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L20A (4/5) LP2982AIM5-3.3 NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 L19A LP2982AIM5-3.3/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L19A LP2982AIM5-5.0 NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 L18A LP2982AIM5-5.0/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L18A LP2982AIM5X-3.0/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L20A LP2982AIM5X-3.3/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L19A LP2982AIM5X-5.0/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L18A LP2982IM5-3.0/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L20B LP2982IM5-3.3/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L19B LP2982IM5-5.0/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L18B LP2982IM5X-3.0/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L20B LP2982IM5X-3.3/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L19B LP2982IM5X-5.0/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L18B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2014 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LP2982AIM5-3.0/NOPB SOT-23 DBV 5 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 LP2982AIM5-3.3 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982AIM5-3.3/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982AIM5-5.0 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982AIM5-5.0/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982AIM5X-3.0/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982AIM5X-3.3/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982AIM5X-5.0/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982IM5-3.0/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982IM5-3.3/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982IM5-5.0/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982IM5X-3.0/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982IM5X-3.3/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP2982IM5X-5.0/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP2982AIM5-3.0/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982AIM5-3.3 SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982AIM5-3.3/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982AIM5-5.0 SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982AIM5-5.0/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982AIM5X-3.0/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP2982AIM5X-3.3/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP2982AIM5X-5.0/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP2982IM5-3.0/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982IM5-3.3/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982IM5-5.0/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP2982IM5X-3.0/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP2982IM5X-3.3/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP2982IM5X-5.0/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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