Material Content Data Sheet Sales Product Name ITS716G Issued MA# MA001361858 Package PG-DSO-20-32 30. April 2015 Weight* 478.55 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper aluminium carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7.009 1.46 0.036 0.01 0.143 0.03 299 2.862 0.60 5980 116.197 24.28 24.92 242807 249161 0.430 0.09 0.09 899 899 0.692 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.46 14647 14647 75 1446 31.821 6.65 313.370 65.49 72.28 654827 722768 2.780 0.58 0.58 5810 5810 1.177 0.25 0.25 2459 2459 0.356 0.07 1.680 0.35 66495 745 0.42 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3511 4256 1000000