Mitsubishi Electric Corp. Datasheet MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 2.7Gbps Multi-Rate CWDM SFP Transceiver with Digital Diagnostic Monitoring Interface MF-27WXC Series 1. Description This transceiver is compliant with Small Form-factor Pluggable (SFP) MSA, and optimized for 155Mbps to 2.7Gbps Coarse Wavelength Division Multiplexing (CWDM) applications. The optical subassembly consists of two parts, the transmitter with an uncooled DFB laser in a hermetic sealed coaxial module, the receiver with a PD preamp in a hermetic sealed coaxial module and integrated circuits for reshaping received optical signals. The built-in serial ID recognition is incorporated, which allows users to interface with two wire serial interface that displays information on manufacturer, part number, link, distance, and other parameters. The Digital Diagnostic Monitoring interface is incorporated, which monitors transceiver parameters including Temperature, Supply voltage, Laser bias current, Laser power and Received optical power. 2. Features • • • • • • • • • • • • • Small Form-factor Pluggable (SFP) MSA compliant transceiver with SONET/SDH system Quality Full 8 wavelength line-up for CWDM grid 155Mbps to 2.7Gbps Multi-Rate operation capability LC duplex receptacle Single +3.3V power supply Differential data inputs and outputs Operating case temperature range 0°C to +70°C Comply with SFF-8472 MSA Built-in Programmable receiver low pass filter as application select Incorporating Digital Diagnostic Monitoring Interface with External calibration (Internal calibration is optional) Serial ID Functionality Bail latch type RoHS Compliant UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 1 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 3. Block diagram Rx Received Po Monitor Circuit Signal Detect RX_LOS Circuit RD- PD OPT_IN Limiting Amp &Low pass Fil. RD+ TIA MOD DEF 2 Memory MOD DEF 1 Control Circuits (DDM) ROSA Temperature Monitor Circuit Supply Voltage Monitor Circuit TX_Fault LD Bias & Pout Monitor Circuit Fault Detector TDDriver LD TD+ OPT_OUT L Bias TX_Disable Monitor PD circuit TOSA 4. Absolute Maximum Ratings Stress below listed absolute maximum rating may cause permanent damage to the module. This is a stress only and functional operation of the module at these or any other conditions in excess of those given in the operational sections of this data sheet. Exposure to Absolute Maximum Rating for extended periods may affect module reliability. Parameters Supply voltage Storage temperature Operating case temperature Relative humidity (non condensation) UQ9-06-009 Ed:1.0 Symbol Vcc Tstg Tc - Ratings 0 to +4.0 -40 to +85 0 to +70 5 to 85 Unit V °C °C % Date:10.Oct.2006 Page 2 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 5. Electrical characteristics All parameters are specified over the operating case temperature. Measurement conditions are at 2.48832Gbps +/-20ppm, NRZ PN223-1 and 50%duty cycle data signal. The DATA input/output signal interface is AC-coupled internally. TX_DISABLE input signal level is LVTTL compatible. (With internally pull-up 4.7k to 10kΩ) TX_FAULT and LOS (Loss Of Signal) output are Open-Collector/drain, and the levels indicated assuming 4.7k to 10k ohm pull up resistor to Host_Vcc is present. Parameters Supply voltage Power consumption TX_DISABLE Input voltage TX_FAULT Output voltage RX_LOS Output voltage MOD_DEF[2] Output voltage MOD_DEF[1], [2] Input voltage Input Amplitude, Differential Input Impedance, Differential Output Amplitude, Differential Output Impedance, Differential Data Output Rise/Fall Time (20% to 80%) Electrical Input Data Return Loss 100MHz < f < 1.2GHz(Differential) Electrical Input Data Return Loss 1.2GHz < f < 2.7GHz(Differential) UQ9-06-009 Ed:1.0 Symbol Vcc Pc VIH VIL VOH VOL VOH VOL VOH VOL VIH VIL VT RT VO RO Min. 3.13 2.0 0 2.0 0 2.0 0 Vcc × 0.8 0 Vcc × 0.7 0 500 370 - Typ. 3.3 0.8 100 100 Max. 3.47 1.2 Vcc 0.8 Vcc 0.5 Vcc 0.5 Vcc 0.4 Vcc Vcc × 0.3 2400 1600 - Unit V W V V V V V V V V V V mVP-P Ω mVP-P Ω Tr/Tf - - 150 ps Rld1 12 - - dB Rld2 8 - - dB Date:10.Oct.2006 Page 3 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 6. Optical characteristics All parameters are specified over the operating case temperature. Measurement conditions are at 2.48832Gbps +/-20ppm, NRZ PN223-1 and 50%duty cycle data signal. Transmitter Parameter Min. Max. Target Distance 50 Wavelength note 1 Optical source SLM Optical power BOL (3.3V, 25degC) +1 +5 Optical power EOL 0 +5 Optical power when disable -40 Spectral width (-20dB) 1.0 SMSR 30 Extinction ratio 8.2 12 Optical waveform SONET/SDH Mask compliant Return Loss at S 24 Path penalty (note 2) 1 Jitter Generation (note 3) 0.01 -Bandwidth 12KHz to 20MHz Jitter Generation (note 3) 0.1 -Bandwidth 12KHz to 20MHz note 1: The wavelength range is –5.5 to +7.5 nm from each center wavelength. Min. 1604.5 1584.5 1564.5 1544.5 1524.5 1504.5 1484.5 1464.5 Typ. 1610 1590 1570 1550 1530 1510 1490 1470 note 2: Support 50km of normal single-mode fiber. Chromatic Dispersion is required by each wavelength. Wavelength Chromatic Dispersion 1610nm 1000 1590nm 900 1570nm 900 1550nm 900 1530nm 800 1510nm 800 1490nm 700 1470nm 700 UQ9-06-009 Ed:1.0 Max. 1617.5 1597.5 1577.5 1557.5 1537.5 1517.5 1497.5 1477.5 Unit Km nm dBm dBm dBm nm dB dB dB dB Uirms Uipp Unit nm Unit ps/nm Date:10.Oct.2006 Page 4 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE note 3: Jitter Generation (ITU-T G.783 compliant) Optical Input Power =Overload BOL RxD+ Jitter Analyzer Opt. ATT SFP Rx Opt. ATT SFP Tx RxDTxDTxD+ Receiver Parameter Min. Max. Wavelength 1270 1620 Sensitivity BOL -19 (3.3V, 25degC, BER=1E-10) Sensitivity EOL (BER=1E-10) -18 Overload BOL (3.3V, 25degC) +1 Overload EOL 0 RX_LOS Assert Level -30 RX_LOS De-assert Level -20 RX_LOS Hysteresis 0.3 4.0 CID Penalty (note 1) 1.0 Jitter Tolerance, Transfer ITU-T G.783 Compliant (with reference CDR) Maximum reflectance of receiver at R -27 note 1: Penalty between PRBS 2E23-1 and Consecutive Identical Digits according to ITU-T G957 UQ9-06-009 Ed:1.0 Unit nm dBm dBm dBm dBm dBm dBm dB dB dB Date:10.Oct.2006 Page 5 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 7. Digital Diagnostic Monitoring Accuracy The diagnostic monitoring features external calibration, and is calibrated over operating temperature and voltage range. The monitor parameters are represented as defined in SFF-8472. These parameters of the monitoring accuracy are guaranteed, as long as operating conditions of this SFP transceiver do not exceed ranges defined below. Digital Diagnostic Monitoring Accuracy Parameter Min. Max. Unit Range for Accurate Monitoring Transceiver Temperature*1 -3 +3 °C 0 to 70°C Supply Voltage -3 +3 % 3 to 3.6 V TX Bias Current -10 +10 % TX Optical Power -3(-1.5*2) +3(+1.5*2) dB 0 to 5 dBm RX Optical Power -3(-2*2) +3(+2*2) dB -19 to 0 dBm *1:Transceiver Temperature is defined as an internal ambient temperature. *2:These specs are optional. 8. Selective Bandwidth filtering function Receiver bandwidth is selected by the Rate Select pins (7pin and 9pin). Each bit rates for the selective bandwidth and adaptable protocols are as follows. No. 1 2 3 4 Rate Select 0 (7pin) Low High Low High Rate Select 1 (9pin) Low Low High High Bandwidth Full 1.25Gbps 622Mbps 155Mbps Adaptable protocols STM-16/OC-48, OTN-1 Gigabit Ethernet STM-4/OC-12, ESCON STM-1/OC-3, FDDI *Optional Bandwidth: 2.125Gbps and 1.062Gbps bandwidth can be selected by the internal setting. 9. Transceiver pin allocation No. Symbol Description No. Symbol Description 1 TX GND Transmitter Ground 11 RX GND Receiver Ground 2 TX_FAULT Transmitter Fault Indication 12 RD- Receiver Data Output-Bar 3 TX_DISABLE Transmitter Disable 13 RD+ Receiver Data Output 4 MOD_DEF[2] Module Definition 2 14 RX GND Receiver Ground 5 MOD_DEF[1] Module Definition 1 15 RX Vcc Receiver Power Supply 6 MOD_DEF[0] Module Definition 0 16 TX Vcc Transmitter Power Supply 7 Rate Select 0 Rate Select pin 0 17 TX GND Transmitter Ground 8 RX_LOS Loss of Signal 18 TD+ Transmitter Data in 9 Rate Select 1 Rate Select pin 1 19 TD- Transmitter Data in-Bar 10 RX GND Receiver Ground 20 TX GND Transmitter Ground UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 6 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 10. Pin Descriptions Pin No. 1,17,20 Function TX GND 10, 11,14 16 RX GND I TX Vcc * I 15 RX Vcc * I 18,19 TD+ / TD- I 3 TX_DISAB LE I 12,13 RD+ / RD- O 8 RX_LOS O 2 TX_FAULT O 6,5,4 MOD_DEF [0:2] - 7,9 Rate Select 0, 1 I UQ9-06-009 Ed:1.0 I/O I Pin description These pins are the Transmitter ground connections. They should be connected to a low impedance ground plane (0V). These pins are the Receiver ground connections. They should be connected to a low impedance ground plane (0V). This is the power supply pin for the Transceiver part. It should be connected to +3.3V. Recommended power supply decoupling. (See Figure 8) This is the power supply pin for the Receiver part. It should be connected to +3.3V. Recommended power supply decoupling. (See Figure 8) * Both TX Vcc and RX Vcc have been internally connected due to supply of control circuit Vcc. This data input pin modulates the laser diode. When the TD+ input is asserted, the laser diode is turned on. They are internally AC-coupled into an equivalent load of RI differential, as shown in Figure 8. Active high TTL input, with internal 7.4k ohm pull-up resistor to Vcc. Asserting the transmitter disable will deactivate the laser within the assert time. Table 1 indicates the timing of TX_DISABLE. Received Data Out and Inverted Received Data Out are differential serial output from the receiver. These are AC-coupled 100 ohm differential lines which should be terminated with a 100 ohm (differential) at the user SERDES, as shown in Figure 8. AC coupling is done inside the module and is thus not required on the host board. Active high open collector/drain output that indicates a loss-of-signal condition (LOS). When the average optical power received by the module is below the Assert Level, RX_LOS is indicated. Table 1 indicates the timing of RX_LOS. RX_LOS requires a 4.7k to 10k ohm pull-up resistor external to the module, i.e., in the host system Host_Vcc, as shown in Figure 8. The pull-up voltage is between 2.0 V and VccR (VccT) + 0.3 V. Active high open collector/drain output that indicates a fault in the module. This can be failure of the laser diode. Under this condition, TX_FAULT will activate and be latched. And then the laser will be deactivated within the assert time. TX_FAULT also requires a 4.7k to 10k ohm pull-up resistor externally, i.e. in the host system Host_Vcc, as shown in Figure 8. The pull-up voltage is between 2.0 V and VccT (VccR) +0.3V. Toggling TX_DISABLE high for at least t_reset can reset it. See Figure 8 and Figure 5. This module has a serial ID function, which provides information about the transceiver’s capabilities, standard interfaces, manufacturer and other information. This function is provided via a two wire serial EEPROM interface. MOD_DEF[0] is connected to ground inside the module. (LOW) MOD_DEF[1] is the serial clock signal input. (SCL) MOD_DEF[2] is the data output/input. (SDA) They should be pulled up with 4.7Kohm -10Kohm resistor on the host board. The pull-up voltage shall be VccT or VccR. The serial ID definitions are as given in the “SFP-MSA” standard. See Figure 9. These pins defined the bandwidth filters. 7pin/9pin setting=[*/*]: [0/0]: Full bandwidth, [1/0]: 1.25Gbps, [0/1]: 622Mbps, [1/1]: 155Mbps These input pins are internally pulled down to GND with 33Kohm resistor. If this function is not used, both pins should be left open or connected to GND. Date:10.Oct.2006 Page 7 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE Table 1 Timing of control and status I/O The timing of the control and status line are listed in below and Figure 1 to 7. Parameter TX_DISABLE Assert Time TX_DISABLE Negate Time Time to Initialize, Including Reset of TX_FAULT TX_FAULT Assert Time TX_DISABLE to Reset RX_LOS Assert Time RX_LOS Negate Time Serial ID Clock Rate Symbol Min Max Unit Condition Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal From power on or negation of TX_FAULT using TX_DISABLE t_off - 10 μs t_on - 1 ms t_init - 300 ms T_fault - 100 μs Time from fault to TX_FAULT on T_reset 10 - μs t_losson - 100 μs t_lossoff - 100 μs f_clock - 100 kHz Time TX_DISABLE must be held high to reset TX_FAULT Time from LOS state to RX_LOS Assert Time from non-LOS state to RX_LOS de-assert - Figure 1 Power on initialization of SFP transceiver, TX_DISABLE negated Figure 2 Power on initialization of SFP transceiver, TX_DISABLE asserted Figure 3 SFP TX_DISABLE timing during normal operation UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 8 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE Figure 4 Detection of transmitter fault condition Figure 5 Successful recovery from transient fault condition Figure 6 Unsuccessful recovery from fault condition Figure 7 Timing of RX_LOS detection UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 9 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE Figure 8 Example of SFP Host Board Schematic SFP Module Host Board Protocol Vcc TD+ LASER DRIVER 100 ohm TD- 4.7k to 10k ohm TX_FAULT TX_DISABLE 7.4k ohm TX GND TX Vcc 0.1 uF 1 uH 10 uF +3.3V 1 uH RX Vcc PROTOCOL IC 0.1 uF 10 uF RX GND SERDES IC 0.1 uF 10 uF RD+ PREAMP & POSTAMP 100 ohm RDRX_LOS 4.7k to 10k ohm Rate Select 0 Rate Select 1 33k ohm 33k ohm +3.3V 4.7k to 10k ohm 4.7k to 10k ohm MOD_DEF[0] SERIAL ID MOD_DEF[1] PLD/PAL MOD_DEF[2] 4.7k to 10k ohm UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 10 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE Figure 9 Serial ID Table Data Address 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 Name of Field Identifier Ext. Identifier Connector Transceiver Transceiver Transceiver Transceiver Transceiver Transceiver Transceiver Transceiver Encoding BR, Nominal Reserved Length(9um)-km Length(9um) Length(50um) Length(62.5um) Length(Copper) Reserved Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Vendor name Reserved Vendor OUI Vendor OUI Vendor OUI Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor PN Vendor rev Vendor rev Vendor rev Vendor rev Wavelength (*) Wavelength (*) Reserved CC_BASE Data [HEX] 03 04 07 00 0A 00 00 00 00 00 00 03 19 00 32 FF 00 00 00 00 4D 49 54 53 55 42 49 53 48 49 20 45 4C 45 43 20 00 08 00 70 4D 46 2D 32 37 57 58 43 4D 34 31 5A 41 43 note 1 note 1 note 2 note 2 00 note 3 Data Name of Field Address 64 Options 65 Options 66 BR, max 67 BR, min 68 Vendor SN 69 Vendor SN 70 Vendor SN 71 Vendor SN 72 Vendor SN 73 Vendor SN 74 Vendor SN 75 Vendor SN 76 Vendor SN 77 Vendor SN 78 Vendor SN 79 Vendor SN 80 Vendor SN 81 Vendor SN 82 Vendor SN 83 Vendor SN M 84 Date code I 85 Date code T 86 Date code S 87 Date code U 88 Date code B 89 Date code I 90 Date code S 91 Date code H 92 Diagnostic Monitoring Type I 93 Enhanced Options SPACE 94 SFF-8472 Compliance E 95 CC_EXT L 96 Vendor Specific E 97 Vendor Specific C 98 Vendor Specific SPACE 99 Vendor Specific 100 Vendor Specific 101 Vendor Specific 102 Vendor Specific 103 Vendor Specific M 104 Vendor Specific F 105 Vendor Specific 106 Vendor Specific 2 107 Vendor Specific 7 108 Vendor Specific W 109 Vendor Specific X 110 Vendor Specific C 111 Vendor Specific M 112 Vendor Specific 4 113 Vendor Specific 1 114 Vendor Specific Z 115 Vendor Specific A 116 Vendor Specific C 117 Vendor Specific * 118 Vendor Specific * 119 Vendor Specific 120 Vendor Specific 121 Vendor Specific 122 Vendor Specific 123 Vendor Specific 124 Vendor Specific 125 Vendor Specific 126 Vendor Specific 127 Vendor Specific ASCII note 1 : These PN ASCII codes depend on wavelength.. Data Address(54/55): 1470nm;4/7, 1490nm;4/9, 1510nm;5/1, 1530nm;5/3, 1550nm;5/5, 1570nm;5/7, 1590nm;5/9, 1610nm;6/1 note 2 : These codes depend on wavelength. Data [HEX] 00 1A 00 00 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 4 note 5 note 5 note 5 note 5 note 5 note 5 note 5 note 5 58 F0 01 note 3 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 note 6 ASCII * * * * * * * * * * * * * * * * * * * * * * * * note 3 : This code is check sum code. note 4 : These address shows unique device serial number. note 5 : These address shows date code. note 6 : These address are vendor specific area. Read only. Data Address(60/61): 1470nm;05/BE, 1490nm;05/D2, 1510nm;05/E6, 1530nm;05/FA, 1550nm; 06/0E, 1570nm;06/22, 1590nm;06/36, 1610nm;06/4A UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 11 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 11. Type Number MF – 27WXC – M 4 1 Z A C 47 Center Wavelength C47: 1470nm C49: 1490nm C51: 1510nm C53: 1530nm C55: 1550nm C57: 1570nm C59: 1590nm C61: 1610nm 12. Implemented Digital Diagnostic Monitoring options RATE SELECT (7 & 9 pin : refer to Section 8. Selective Bandwidth filtering function) TX_DISABLE (3pin) TX_FAULT (2pin) Los Of Signal (8pin) Alarm/warning flags Soft TX_DISABLE control and monitoring Soft TX_FAULT monitoring Soft RX_LOS monitoring 13. Reliability reference Telcordia GR-468-CORE Radiated Emission:IEC61000-6-3 Immunity:IEC61000-4-2,IEC61000-4-3 Flammability: UL94V-0 ESD for PIN Interface: 500V by Human body model (with Rd=1500ohm and Cd=100pF) 14. Laser Safety Information Class 1 Laser Product (IEC60825 and CDRH compliant) 15. Data sheet Data sheet which is attached the SFP includes the below parameters. Condition: T-ambient 25deg. Nominal Voltage Data rate 2.48832Gbps Data pattern PRBS2E23-1 Parameters: ・ Optical Output Power ・ Wavelength ・ Spectral Width ・ Supply Current ・ Receiver Sensitivity ・ Receiver Overload UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 12 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 16. General Outline Drawing [unit: mm] UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 13 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE 17. Packing Ten SFPs are packed up in this packing box. Presses Plate SFP Dust Cap Packing box - Capacity: 10pcs. / box - Packing box and Presses Plate material: Cardboard with ESD protection coat. This product is sensitive to electrostatic discharge. Take precautions to prevent ESD; use wrist straps, grounded work surfaces and recognized anti-static techniques when handling SFP module. Mitsubishi reserves the right to change the circuitry and specifications without notice at any time. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 14 of 15 MITSUBISHI (OPTICAL DEVICES) MF-27WXC Series 2.5Gbps SFP TRANSCEIVER MODULE Safety Cautions for Use of Optoelectronic Devices General: Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that result in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly observed. Warning! 1. Eye safety : Semiconductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-viewer, or other appropriate instruments. 2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it. 3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and general garbage. Handling Cautions for Optoelectronic Devices 1. General: (1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability. (2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi Electric or an authorized distributor. 2. Shipping Conditions: (1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems. (2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices. (3) Take strict precautions to keep the devices dry when shipping under rain or snow. 3. Storage Conditions: When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions): (1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long-term storage for six months or more. (2) The atmosphere should be particularly free from toxic gases and dust. (3) Do not apply any load on the product. (4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering problems in the customer’s assembling process. (5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing. Temperature in storage locations should be stable. (6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere. (7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products. 4. Design Conditions and Environment under Use: (1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may lead to serious accidents. (2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed those ratings even for a short time. 5. ESD Safety Cautions: The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this product, please observe the following countermeasures: <Countermeasures against Static Electricity and Surge> To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line: (1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder irons and other items for which the commercial power supplies are prone to leakage. (2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly recommended. (3) Use conductive materials for this product’s container, etc. (4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc. (5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts. ESD may damage the product. (6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading. The end of document UQ9-06-009 Ed:1.0 Date:10.Oct.2006 Page 15 of 15