Material Content Data Sheet Sales Product Name IPP70N04S3-07 MA# MA000366362 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2034.71 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 2.588 0.13 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.13 1272 1272 401 0.245 0.01 815.335 40.08 40.13 400711 120 401233 6.250 0.31 0.31 3072 3072 8.926 0.44 4387 98.190 4.83 487.975 23.98 29.25 239826 292471 21.462 1.05 1.05 10548 10548 0.244 0.01 0.001 0.00 0.061 0.00 0.049 0.00 2.333 0.11 0.177 0.01 0.590 0.03 589.466 28.97 48258 120 0.01 1 24 0.11 1147 2. 3. 290 29.01 289706 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1201 87 Important Remarks: 1. 120 30 290083 1000000