SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005 D 2.7-V and 5-V Performance D Low Supply Current: D D D LMV339 . . . D OR PW PACKAGE (TOP VIEW) LMV331 . . . 60 µA Typ LMV393 . . . 100 µA Typ LMV339 . . . 170 µA Typ Input Common-Mode Voltage Range Includes Ground Low Output Saturation Voltage . . . 200 mV Typ Open-Collector Output for Maximum Flexibility 2OUT 1OUT VCC+ 1IN− 1IN+ 2IN− 2IN+ 1 14 2 13 3 12 4 11 5 10 6 9 7 8 3OUT 4OUT GND 4IN+ 4IN− 3IN+ 3IN− LMV393 . . . D, DDU, DGK, OR PW PACKAGE (TOP VIEW) description/ordering information 1OUT 1IN− 1IN+ GND The LMV393 and LMV339 devices are low-voltage (2.7 V to 5.5 V) versions of the dual and quad comparators, LM393 and LM339, which operate from 5 V to 30 V. The LMV331 is the single-comparator version. 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN− 2IN+ LMV331 . . . DBV OR DCK PACKAGE (TOP VIEW) The LMV331, LMV339, and LMV393 are the most cost-effective solutions for applications where low-voltage operation, low power, space saving, and price are the primary specifications in circuit design for portable consumer products. These devices offer specifications that meet or exceed the familiar LM339 and LM393 devices at a fraction of the supply current. IN+ GND IN− 1 5 VCC+ 4 OUT 2 3 ORDERING INFORMATION SC-70 (DCK) Single SOT23-5 (DBV) MSOP/VSSOP (DGK) SOIC (D) −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA Dual TSSOP (PW) VSSOP (DDU) SOIC (D) Quad TSSOP (PW) Reel of 3000 LMV331IDCKR Reel of 250 LMV331IDCKT Reel of 3000 LMV331IDBVR Reel of 250 LMV331IDBVT Reel of 2500 LMV393IDGKR Tube of 75 LMV393ID Reel of 2500 LMV393IDR Tube of 90 LMV393IPW Reel of 2000 LMV393IPWR Reel of 2000 LMV393IDDUR Tube of 50 LMV339ID Reel of 2500 LMV339IDR Tube of 150 LMV339IPW Reel of 2000 LMV339IPWR TOP-SIDE MARKING‡ R2_ R1I_ R9_ MV393I MV393I RABR LMV339I MV339I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK/DGK: The actual top-side marking has one additional character that designates the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2005, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005 symbol (each comparator) IN− − IN+ + OUT simplified schematic VCC+ Q6 Q7 M IN+ Q1 Q2 Q3 Q4 OUT Q5 IN− R1 R2 R3 GND absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5.5 V Input voltage range, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V Package thermal impedance, θJA (see Notes 3 and 4): D (8-pin) package . . . . . . . . . . . . . . . . . . . . . . 97°C/W D (14-pin) package . . . . . . . . . . . . . . . . . . . . 86°C/W DBV package . . . . . . . . . . . . . . . . . . . . . . . 206°C/W DCK package . . . . . . . . . . . . . . . . . . . . . . . 252°C/W DDU package . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W DGK package . . . . . . . . . . . . . . . . . . . . . . . 172°C/W PW (8-pin) package . . . . . . . . . . . . . . . . . . 149°C/W PW (14-pin) package . . . . . . . . . . . . . . . . . . 113°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values (except differential voltages and VCC+ specified for the measurement of IOS) are with respect to the network GND. 2. Differential voltages are at IN+ with respect to IN−. 3. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability. 4. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005 recommended operating conditions MIN VCC+ VOUT Supply voltage (single-supply operation) TA Operating free-air temperature MAX UNIT 2.7 5.5 V −40 VCC+ + 0.3 85 °C Output voltage V electrical characteristics at specified free-air temperature, VCC+ = 2.7 V, GND = 0 V (unless otherwise noted) PARAMETER VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIB Input bias current IIO Input offset current IO Output current (sinking) TEST CONDITIONS TA 25°C MIN 1.7 7 5 25°C 10 −40°C to 85°C 5 −40°C to 85°C VO ≤ 1.5 V 25°C Output leakage current Common-mode input voltage range Saturation voltage Supply current nA 50 23 nA mA 0.003 −40°C to 85°C mV 250 150 5 UNIT mV/°C 400 25°C ICC MAX −40°C to 85°C 25°C VICR VSAT TYP 1 25°C −0.1 to 2 IO ≤ 1 mA LMV331 25°C 200 25°C 40 100 LMV393 (both comparators) 25°C 70 140 LMV339 (all four comparators) 25°C 140 200 A mA V mV mA switching characteristics, TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS tPHL Propagation delay, high- to low-level output switching tPLH Propagation delay, low- to high-level output switching POST OFFICE BOX 655303 TYP Input overdrive = 10 mV 1000 Input overdrive = 100 mV 350 Input overdrive = 10 mV 500 Input overdrive = 100 mV 400 • DALLAS, TEXAS 75265 UNIT ns ns 3 SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005 electrical characteristics at specified free-air temperature, VCC+ = 5 V, GND = 0 V (unless otherwise noted) PARAMETER VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIB Input bias current IIO Input offset current IO Output current (sinking) TEST CONDITIONS TA 25°C MIN MAX 1.7 7 −40°C to 85°C 9 25°C 5 25°C 25 −40°C to 85°C 2 −40°C to 85°C VO ≤ 1.5 V 25°C 10 Output leakage current VICR AVD Common-mode input voltage range 25°C Large-signal differential voltage gain 25°C VSAT Saturation voltage −40°C to 85°C 25°C LMV331 25°C LMV393 (both comparators) 60 −40°C to 85°C 400 mV 120 150 100 −40°C to 85°C 25°C LMV339 (all four comparators) V/mV 700 −40°C to 85°C mA A V 50 200 nA mA −0.1 to 4.2 25°C IO ≤ 4 mA Supply current 84 1 20 nA 50 0.003 −40°C to 85°C mV 250 150 25°C UNIT mV/°C 400 25°C ICC TYP 200 250 170 mA A 300 350 switching characteristics, TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER 4 TEST CONDITIONS tPHL Propagation delay, high- to low-level output switching tPLH Propagation delay, low- to high-level output switching POST OFFICE BOX 655303 TYP Input overdrive = 10 mV 600 Input overdrive = 100 mV 200 Input overdrive = 10 mV 450 Input overdrive = 100 mV 300 • DALLAS, TEXAS 75265 UNIT ns ns IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 3-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty LMV331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKTG4 ACTIVE SC70 DCK 5 250 TBD Call TI LMV339ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393ID ACTIVE SOIC D 8 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDE4 ACTIVE SOIC D 8 CU NIPDAU Level-1-260C-UNLIM 75 75 Addendum-Page 1 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com 3-May-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty LMV393IDG4 ACTIVE SOIC D 8 LMV393IDGKR ACTIVE MSOP DGK LMV393IDGKRG4 ACTIVE MSOP LMV393IDR ACTIVE LMV393IDRE4 75 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 30-Apr-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMV339IDR D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1 LMV339IPWR PW 14 MLA 330 12 7.0 5.6 1.6 8 12 Q1 LMV393IDGKR DGK 8 HNT 180 13 5.3 3.4 1.4 8 12 Q1 LMV393IDR D 8 FMX 330 12 6.4 5.2 2.1 8 12 Q1 LMV393IPWR PW 8 MLA 330 12 7.0 3.6 1.6 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) LMV339IDR D 14 MLA 333.2 333.2 28.58 LMV339IPWR PW 14 MLA 338.1 340.5 20.64 LMV393IDGKR DGK 8 HNT 0.0 0.0 0.0 LMV393IDR D 8 FMX 338.1 340.5 20.64 LMV393IPWR PW 8 MLA 338.1 340.5 20.64 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 Pack Materials-Page 3 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265