TI LMV393IDDURE4 Genral-purpose low-voltage comparator Datasheet

 SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
D 2.7-V and 5-V Performance
D Low Supply Current:
D
D
D
LMV339 . . . D OR PW PACKAGE
(TOP VIEW)
LMV331 . . . 60 µA Typ
LMV393 . . . 100 µA Typ
LMV339 . . . 170 µA Typ
Input Common-Mode Voltage Range
Includes Ground
Low Output Saturation Voltage
. . . 200 mV Typ
Open-Collector Output for Maximum
Flexibility
2OUT
1OUT
VCC+
1IN−
1IN+
2IN−
2IN+
1
14
2
13
3
12
4
11
5
10
6
9
7
8
3OUT
4OUT
GND
4IN+
4IN−
3IN+
3IN−
LMV393 . . . D, DDU, DGK, OR PW PACKAGE
(TOP VIEW)
description/ordering information
1OUT
1IN−
1IN+
GND
The LMV393 and LMV339 devices are
low-voltage (2.7 V to 5.5 V) versions of the dual
and quad comparators, LM393 and LM339, which
operate from 5 V to 30 V. The LMV331 is the
single-comparator version.
1
8
2
7
3
6
4
5
VCC+
2OUT
2IN−
2IN+
LMV331 . . . DBV OR DCK PACKAGE
(TOP VIEW)
The LMV331, LMV339, and LMV393 are the most
cost-effective solutions for applications where
low-voltage operation, low power, space saving,
and price are the primary specifications in circuit
design for portable consumer products. These
devices offer specifications that meet or exceed
the familiar LM339 and LM393 devices at a
fraction of the supply current.
IN+
GND
IN−
1
5
VCC+
4
OUT
2
3
ORDERING INFORMATION
SC-70 (DCK)
Single
SOT23-5 (DBV)
MSOP/VSSOP (DGK)
SOIC (D)
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
Dual
TSSOP (PW)
VSSOP (DDU)
SOIC (D)
Quad
TSSOP (PW)
Reel of 3000
LMV331IDCKR
Reel of 250
LMV331IDCKT
Reel of 3000
LMV331IDBVR
Reel of 250
LMV331IDBVT
Reel of 2500
LMV393IDGKR
Tube of 75
LMV393ID
Reel of 2500
LMV393IDR
Tube of 90
LMV393IPW
Reel of 2000
LMV393IPWR
Reel of 2000
LMV393IDDUR
Tube of 50
LMV339ID
Reel of 2500
LMV339IDR
Tube of 150
LMV339IPW
Reel of 2000
LMV339IPWR
TOP-SIDE
MARKING‡
R2_
R1I_
R9_
MV393I
MV393I
RABR
LMV339I
MV339I
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK/DGK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
symbol (each comparator)
IN−
−
IN+
+
OUT
simplified schematic
VCC+
Q6
Q7
M
IN+
Q1
Q2
Q3
Q4
OUT
Q5
IN−
R1
R2
R3
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5.5 V
Input voltage range, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V
Package thermal impedance, θJA (see Notes 3 and 4): D (8-pin) package . . . . . . . . . . . . . . . . . . . . . . 97°C/W
D (14-pin) package . . . . . . . . . . . . . . . . . . . . 86°C/W
DBV package . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . 252°C/W
DDU package . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W
DGK package . . . . . . . . . . . . . . . . . . . . . . . 172°C/W
PW (8-pin) package . . . . . . . . . . . . . . . . . . 149°C/W
PW (14-pin) package . . . . . . . . . . . . . . . . . . 113°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC+ specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN−.
3. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability.
4. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
recommended operating conditions
MIN
VCC+
VOUT
Supply voltage (single-supply operation)
TA
Operating free-air temperature
MAX
UNIT
2.7
5.5
V
−40
VCC+ + 0.3
85
°C
Output voltage
V
electrical characteristics at specified free-air temperature, VCC+ = 2.7 V, GND = 0 V (unless
otherwise noted)
PARAMETER
VIO
Input offset voltage
aV
Average temperature coefficient
of input offset voltage
IO
IIB
Input bias current
IIO
Input offset current
IO
Output current (sinking)
TEST CONDITIONS
TA
25°C
MIN
1.7
7
5
25°C
10
−40°C to 85°C
5
−40°C to 85°C
VO ≤ 1.5 V
25°C
Output leakage current
Common-mode input voltage range
Saturation voltage
Supply current
nA
50
23
nA
mA
0.003
−40°C to 85°C
mV
250
150
5
UNIT
mV/°C
400
25°C
ICC
MAX
−40°C to 85°C
25°C
VICR
VSAT
TYP
1
25°C
−0.1 to 2
IO ≤ 1 mA
LMV331
25°C
200
25°C
40
100
LMV393 (both comparators)
25°C
70
140
LMV339 (all four comparators)
25°C
140
200
A
mA
V
mV
mA
switching characteristics, TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tPHL
Propagation delay, high- to low-level output switching
tPLH
Propagation delay, low- to high-level output switching
POST OFFICE BOX 655303
TYP
Input overdrive = 10 mV
1000
Input overdrive = 100 mV
350
Input overdrive = 10 mV
500
Input overdrive = 100 mV
400
• DALLAS, TEXAS 75265
UNIT
ns
ns
3
SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
electrical characteristics at specified free-air temperature, VCC+ = 5 V, GND = 0 V (unless otherwise
noted)
PARAMETER
VIO
Input offset voltage
aV
Average temperature coefficient
of input offset voltage
IO
IIB
Input bias current
IIO
Input offset current
IO
Output current (sinking)
TEST CONDITIONS
TA
25°C
MIN
MAX
1.7
7
−40°C to 85°C
9
25°C
5
25°C
25
−40°C to 85°C
2
−40°C to 85°C
VO ≤ 1.5 V
25°C
10
Output leakage current
VICR
AVD
Common-mode input voltage range
25°C
Large-signal differential voltage gain
25°C
VSAT
Saturation voltage
−40°C to 85°C
25°C
LMV331
25°C
LMV393 (both comparators)
60
−40°C to 85°C
400
mV
120
150
100
−40°C to 85°C
25°C
LMV339 (all four comparators)
V/mV
700
−40°C to 85°C
mA
A
V
50
200
nA
mA
−0.1 to 4.2
25°C
IO ≤ 4 mA
Supply current
84
1
20
nA
50
0.003
−40°C to 85°C
mV
250
150
25°C
UNIT
mV/°C
400
25°C
ICC
TYP
200
250
170
mA
A
300
350
switching characteristics, TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
4
TEST CONDITIONS
tPHL
Propagation delay, high- to low-level output switching
tPLH
Propagation delay, low- to high-level output switching
POST OFFICE BOX 655303
TYP
Input overdrive = 10 mV
600
Input overdrive = 100 mV
200
Input overdrive = 10 mV
450
Input overdrive = 100 mV
300
• DALLAS, TEXAS 75265
UNIT
ns
ns
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
3-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LMV331IDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDBVRE4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDCKRE4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV331IDCKTG4
ACTIVE
SC70
DCK
5
250
TBD
Call TI
LMV339ID
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IDE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IDRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV339IPWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393ID
ACTIVE
SOIC
D
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IDDUR
ACTIVE
VSSOP
DDU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IDDURE4
ACTIVE
VSSOP
DDU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IDE4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
75
75
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
3-May-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LMV393IDG4
ACTIVE
SOIC
D
8
LMV393IDGKR
ACTIVE
MSOP
DGK
LMV393IDGKRG4
ACTIVE
MSOP
LMV393IDR
ACTIVE
LMV393IDRE4
75
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV393IPWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
30-Apr-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LMV339IDR
D
14
MLA
330
16
6.5
9.0
2.1
8
16
Q1
LMV339IPWR
PW
14
MLA
330
12
7.0
5.6
1.6
8
12
Q1
LMV393IDGKR
DGK
8
HNT
180
13
5.3
3.4
1.4
8
12
Q1
LMV393IDR
D
8
FMX
330
12
6.4
5.2
2.1
8
12
Q1
LMV393IPWR
PW
8
MLA
330
12
7.0
3.6
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
LMV339IDR
D
14
MLA
333.2
333.2
28.58
LMV339IPWR
PW
14
MLA
338.1
340.5
20.64
LMV393IDGKR
DGK
8
HNT
0.0
0.0
0.0
LMV393IDR
D
8
FMX
338.1
340.5
20.64
LMV393IPWR
PW
8
MLA
338.1
340.5
20.64
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Pack Materials-Page 3
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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