ESDAXLC6-1MY2 Extra low capacitance single line TVS Features ■ Extra low capacitance 0.35 pF max on a wide frequency spectrum (200 MHz - 3000 MHz) ■ Unidirectional device ■ Low clamping factor VCL/VBR ■ Fast response time ■ Very thin package: 0.55 mm max ■ Low leakage current ■ High ESD protection level ■ High integration ■ Suitable for high density boards µQFN-2L Figure 1. Functional diagram I/01 Complies with the following standards ■ IEC 61000-4-2 level 4 ■ MIL STD 883G-Method 3015-7: class 3B I/02 GND Applications Where transient over voltage protection and electrical overstress protection in sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and accessories ■ Video equipment Portable equipment Description The ESDAXLC6-1MY2 is a single line Transil™ diode designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to ESD transient over voltages. Packaged in µQFN-2L, it minimizes PCB consumption. TM: Transil is a trademark of STMicroelectronics September 2011 Doc ID 16923 Rev 2 1/11 www.st.com 11 Characteristics ESDAXLC6-1MY2 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter VPP Peak pulse voltage: IEC 61000-4-2, level 4 : contact discharge PPP Peak pulse power dissipation (8/20 µs) (1) IPP Tj Value Unit kV 8 Tj initial = Tamb 12 W Peak pulse current typical value (8/20 µs) 2.8 A Maximum junction temperature 125 °C Top Operating junction temperature range - 30 to + 85 °C Tstg Storage temperature range - 55 to +150 °C 1. For a surge greater than the maximum values, the diode will fail in short-circuit Figure 2. Electrical characteristics (definitions) I Symbol VBR IRM VRM IR Table 2. = = = = Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Breakdown current VBR VRM V IRM IR Electrical characteristics (values, Tamb = 25 °C) Symbol Test condition Min. Typ. Max. Unit VBR IR = 1 mA 6 - - V IRM VRM = 3 V - - 100 nA Cline VR = 0 V, F = (200 MHz - 3000 MHz), Vosc = 30 mV - - 0.35 pF 2/11 Doc ID 16923 Rev 2 ESDAXLC6-1MY2 Figure 3. Characteristics Junction capacitance versus reverse voltage applied (typical values) Figure 4. 500 500 Junction capacitance versus frequency (Vr = 0 V, typical values) C (fF) Capacitance (fF) Vr = 0 V Vosc = 30 mV 450 F = 200 MHz Vosc = 30 mV 450 400 400 350 350 300 300 250 250 200 200 150 Voltage (V) 100 0 1 2 3 4 5 150 Frequency (MHz) 100 1 Figure 5. 0.00 S21 (dB) attenuation 10 Figure 6. S21 (dB) 100 1000 10000 Relative variation of leakage current versus junction temperature (typical values) IR[Tj]/IR[Tj = 25 °C] VR = 3 V Tjinitial = 25 °C - 2.00 10000 -4.00 1000 -6.00 -8.00 100 -10.00 10 - 12.00 -14.00 10.0M Figure 7. f (Hz) 30.0M 100.0M 300.0M 1.0G 3.0G 25 10.0G ESD response to IEC 61000-4-2 (+ 8 kV contact discharge) Tj (°C) 1 Figure 8. 50 75 100 125 ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20 V/div 20 V/div C2 C2 20 ns/div Doc ID 16923 Rev 2 20 ns/div 3/11 Ordering information scheme 2 ESDAXLC6-1MY2 Ordering information scheme Figure 9. Ordering information scheme ESDAX LC ESDA array Low capacitance Breakdown voltage 6 = 6 V minimum Package 1 = 1 line MY = µQFN-2L, max. height: 0.55 mm 2 = 2 pads 4/11 Doc ID 16923 Rev 2 6 - 1MY2 ESDAXLC6-1MY2 3 Package information Package information ● Epoxy meets UL 94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. µQFN-2L dimensions Dimensions D INDEX AREA (D/2 x E/2) Ref. A1 Typ. Max. Min. A 0.45 0.50 0.55 0.017 0.020 0.022 A1 0.00 0.05 0.000 b1 0.20 0.25 0.30 0.008 0.010 0.012 b2 0.20 0.25 0.30 0.008 0.010 0.012 b2 b1 D INDEX AREA (D/2 x E/2) L1 OPTIONAL PIN # 1 ID L2 e Inches Min. E A Millimeters 1.00 Typ. Max. 0.002 0.039 E 0.60 0.024 e 0.65 0.026 L1 0.45 0.50 0.55 0.018 0.020 0.022 L2 0.45 0.50 0.55 0.018 0.020 0.022 Figure 10. Footprint (dimensions in mm) Figure 11. Marking 0.55 0.55 0.50 Pin1 7 Pin 2 0.40 Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Doc ID 16923 Rev 2 5/11 Package information ESDAXLC6-1MY2 Figure 12. µQFN-2L tape and reel specification 2.0 ± 0.05 Ø 1.50 +0.1/-0.0 4.0 ± 0.1 1.75 ± 0.1 Cathode bar 3.5 ±- 0.05 1.15 ± 0.05 2.0 ± 0.1 User direction of unreeling Doc ID 16923 Rev 2 7 7 7 0.70 ± 0.05 7 6/11 7 All dimensions in mm 7 0.59 ± 0.04 7 8.0 + 0.3 /-0.1 0.20 ± 0.05 ESDAXLC6-1MY2 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 13. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 14. Recommended stencil window position Package footprint Lead footprint on PCB Lead footprint on PCB Stencil window position 0.39 mm Stencil window position 0.45 mm 0.05 mm Doc ID 16923 Rev 2 0.05 mm 7/11 Recommendation on PCB assembly 4.2 4.3 4.4 8/11 ESDAXLC6-1MY2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 16923 Rev 2 ESDAXLC6-1MY2 4.5 Recommendation on PCB assembly Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 16923 Rev 2 9/11 Ordering information 5 Ordering information Table 4. 6 Ordering information Order code Marking Package Weight Base qty Delivery mode ESDAXLC6-1MY2 7 µQFN-2L 0.942 mg 12000 Tape and reel Revision history Table 5. 10/11 ESDAXLC6-1MY2 Document revision history Date Revision Changes 18-Jan-2010 1 Initial release. 23-Sep-2011 2 Updated package name. Doc ID 16923 Rev 2 ESDAXLC6-1MY2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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