8.00mm [0.315"] Ø 0.42mm pad (x68) [Ø 0.017"] 11.60mm [0.457"] 0.80mm typ. 8.80mm [0.346"] 1 0.80mm typ. 7.20mm [0.283"] Top View RoHS 4.55mm [0.179"] 2 2.96mm [0.116"] 0.20mm [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.062" ±0.007"] FR4/G10 or equivalent high temp material. Non-clad. 2 Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Land Socket 64 position BGA SMT pads to 64 position pins. Pin connection is 1:1. Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. LS-BGA64M-61 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev: B Drawing: Vinayak R Date: 7/6/09 File: LS-BGA64M-61Dwg.mcd Modified: 01/17/13, DH