Surface Mount PPTC FSMD1206 Series FEATURES RoHS ü AGENCY RECOGNITION •1206 size, Surface mount •Application: All high-density boards •Maximum Voltage: 8V ~ 60V •Temperature Range: -40°C to 85°C •RoHS Compliant •UL (E211981) •C-UL (E211981) •TUV (R50090556) ELECTRICAL CHARACTERISTICS (23°C) Part Number Hold Current Trip Current Rated Voltage Maximum Current Typical Power Max Time to Trip Current Time Resistance Tolerance RMIN R1MAX IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec OHMS OHMS FSMD005-1206 0.05 0.15 60 10 0.4 0.25 1.50 3.60 50.00 FSMD010-1206 0.10 0.25 60 10 0.4 0.50 1.00 1.60 15.00 FSMD020-1206 0.20 0.40 30 10 0.4 8.0 0.05 0.60 2.50 FSMD035-1206 0.35 0.75 16 40 0.4 8.0 0.10 0.30 1.20 FSMD050-1206 0.50 1.00 8 40 0.4 8.0 0.10 0.15 0.70 *Devices with hold current up to 1.5amps are in development IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: Tin-plated copper FSMD1206 PRODUCT DIMENSIONS (MILLIMETERS) D B A Top and bottom view Side view Part A B C C D Number Min Max Min Max Min Max Min FSMD005-1206 3.0 3.5 1.5 1.8 0.45 0.75 0.10 FSMD010-1206 3.0 3.5 1.5 1.8 0.45 0.75 0.10 FSMD020-1206 3.0 3.5 1.5 1.8 0.45 0.75 0.10 FSMD035-1206 3.0 3.5 1.5 1.8 0.45 0.75 0.10 FSMD050-1206 3.0 3.5 1.5 1.8 0.25 0.55 0.10 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED01 REV 2007.8.14 Surface Mount PPTC FSMD1206 Series RoHS ü THERMAL DERATING CURVE Thermal Derating Curve, FSMD1206 Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Tempera ture (C) TYPICAL TIME-TO-TRIP AT 23°C A B C D Time-to-trip (S) 100 Z A B C D 10 1 Z 0.1 0.01 0.001 0.1 1 10 = = = = = FSMD005-1206 FSMD010-1206 FSMD020-1206 FSMD035-1206 FSMD050-1206 100 Fault current (A) PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimension in the table below provide the recommended pad layout for each FSMD1206 device NOMINAL PAD DIMENSIONS (MILLIMETERS) SOLDER REFLOW 20 to 40 Seconds 260 °C Ramp-up 3°C/Second Max 1.9 Ramp-down 6°C/Second Max 217 °C f 200 °C 150 °C 1.0 Preheat 1.0 2.0 25 °C 60 to 180 Seconds 60 to 150 Seconds Solder Reflow Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only) 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned by using standard industry methods and solvents. 5. Storage Environment: <30°C / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED01 REV 2007.8.14