Shoulder HDBF09024C64 This specification shall cover the characteristics of saw filter hd bf09024c64 Datasheet

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
MODEL NO 型 号:
SAW FILTER
HDBF09024C64 SF6-4
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2008-12-18
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 6
SAW FILTER
HDBF09024C64
SF6-4
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规格书编号
Spec. No.
产品型号
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客户产品型号
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Page 2 of 6
SAW FILTER
HDBF09024C64
SF6-4
1. SCOPE
This specification shall cover the characteristics of SAW filter HD BF09024C64
2. ELECTRICAL SPECIFICATION
Operation temperature
Storage temperature
DC Voltage VDC
Input Power
-40℃ to +85℃
-40℃ to +105℃
0V
10dBm Max
2.2Electronic Characteristics
Minimum Typical
Maximum
Center Frequency
MHz
Insertion Loss
dB
2dB Bandwidth
MHz
3dB Bandwidth
MHz
24.1
40dB Bandwidth
MHz
24.8
Passband variation
dB
-
0.9
Absolute delay
us
-
3.93
4
F0±12.4MHz
dB
25
28
-
F0±12.6MHz
dB
40
53
F0±13.0MHz
dB
50
53
F0±17.0MHz
dB
50
53
Ultimate rejection
89.875
90
-
34
38
24.01
-
24
Material Temperature coefficient
KHz/℃
-8.46
Ambient temperature
℃
25
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90.125
Page 3 of 6
SAW FILTER
HDBF09024C64
SF6-4
Typical frequency response
Smith Chart
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Page 4 of 6
SAW FILTER
HDBF09024C64
SF6-4
3. DIMENSION
4.TEST CIRCUIT
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Page 5 of 6
SAW FILTER
HDBF09024C64
SF6-4
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
5-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2.2.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 2.2.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2.2.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 2.2.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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Page 6 of 6
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