MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor−based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmed−in−package bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3−pin TO-92, micro size TSOP−5, 8−pin SOIC−8 and Micro8t surface mount packages. The NCV device is packaged in SOIC−8 and TO−92. Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. http://onsemi.com • • Trimmed−In−Package Temperature Compensated Reference Comparator Threshold of 4.6 V at 25°C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Reset Reset Output Capable of Sinking in Excess of 10 mA Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Reset Operation with 1.0 V Input Low Standby Current Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount Packages NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Pb−Free Packages are Available 1 Micro8 DM SUFFIX CASE 846A 1 TSOP−5 SN SUFFIX CASE 483 8 5 Features • • • • • • • • • 1 SOIC−8 D SUFFIX CASE 751 8 Pin 1. 2. 3. 4. 5. Ground Input Reset NC NC TO−92 P SUFFIX CASE 29 12 1 3 STRAIGHT LEAD BULK PACK 2 3 BENT LEAD TAPE & REEL AMMO PACK Pin 1. Reset 2. Input 3. Ground Input Reset PIN CONNECTIONS Reset 1 8 N.C. Input 2 7 N.C. N.C. 3 6 N.C. Ground 4 5 N.C. (Top View) 1.2 Vref ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. GND = Sink Only Positive True Logic DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. This device contains 21 active transistors. Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2008 August, 2008 − Rev. 18 1 Publication Order Number: MC34064/D MC34064, MC33064, NCV33064 MAXIMUM RATINGS Symbol Value Unit Power Input Supply Voltage Rating Vin −1.0 to 10 V Reset Output Voltage VO 10 V Reset Output Sink Current (Note 2) ISink Internally Limited mA IF 100 mA PD RqJA 625 200 mW °C/W PD RqJA 625 200 mW °C/W PD RqJA 520 240 mW °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature MC34064 MC33064 NCV33064 TA Storage Temperature Range Tstg Clamp Diode Forward Current, Reset to Input Pin (Note 2) Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air D Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air DM Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air 0 to +70 −40 to +85 −40 to +125 −65 to +150 °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. ESD data available upon request. ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.) Characteristics Symbol Min Typ Max Unit VIH VIL VH 4.5 4.5 0.01 4.61 4.59 0.02 4.7 4.7 0.05 − − − 0.46 0.15 − 1.0 0.4 0.1 10 27 60 mA COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis V RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 8.0 mA) (Vin = 4.0 V, ISink = 2.0 mA) (Vin = 1.0 V, ISink = 0.1 mA) VOL V Output Sink Current (Vin, Reset = 4.0 V) ISink Output Off-State Leakage (Vin, Reset = 5.0 V) IOH − 0.02 0.5 mA Clamp Diode Forward Voltage, Reset to Input Pin (IF = 10 mA) VF 0.6 0.9 1.2 V Operating Input Voltage Range Vin 1.0 to 6.5 − − V Quiescent Input Current (Vin = 5.0 V) Iin − 390 500 mA TOTAL DEVICE 2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Thigh = +70°C for MC34064 4. Tlow = 0°C for MC34064 −40°C for MC33064 +85°C for MC33064 −40°C for NCV33064 +125°C for NCV33064 5. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 2 MC34064, MC33064, NCV33064 10 5.0 8.0 VO , OUTPUT VOLTAGE (V) VO , OUTPUT VOLTAGE (V) RL = 10 k to Vin TA = 25°C 6.0 4.0 2.0 0 0 2.0 4.0 6.0 Vin, INPUT VOLTAGE (V) 8.0 RL = 10 k to Vin TA = 25°C 4.0 3.0 2.0 1.0 0 10 4.560 Figure 2. Reset Output Voltage versus Input Voltage 4.600 Vin, INPUT VOLTAGE (V) 4.620 4.640 Figure 3. Reset Output Voltage versus Input Voltage 1.0 4.630 RL = 10 k to Vin 4.620 Upper Threshold High State Output I in , INPUT CURRENT (mA) V th, THRESHOLD VOLTAGE (V) 4.580 4.610 4.600 4.590 Lower Threshold Low State Output 4.580 4.570 -55 -25 0 25 50 75 100 TA = +25°C 0.8 -40°C 0.6 +85°C 0.4 TA = +25°C +85°C 0.2 0 125 -40°C 0 2.0 4.0 6.0 8.0 TA, AMBIENT TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 4. Comparator Threshold Voltage versus Temperature Figure 5. Input Current versus Input Voltage 2.0 Reset V OL, OUTPUT SATURATION (V) Vin = 4.0 V TA = 25°C Vin = 5.0 V to 4.0 V RL = 10 k TA = 25°C 90% 1.5 TA = 85°C Vin TA = -40°C 5.0 V - 1.0 4.0 V Vin 10k 5.0V 4.0V 0.5 Reset 10% 0 REF 0 10 20 30 ISink, SINK CURRENT (mA) 40 200 ns/DIV Figure 6. Reset Output Saturation versus Sink Current Figure 7. Reset Delay Time http://onsemi.com 3 10 MC34064, MC33064, NCV33064 I F , FORWARD CURRENT (mA) 80 Vin = 0 V TA = 25°C 60 40 20 0 0 0.4 0.8 1.2 VF, FORWARD VOLTAGE (V) 1.6 Figure 8. Clamp Diode Forward Current versus Voltage + R Input Reset Power Supply - Microprocessor Circuit CDLY + A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 ms. Vth(MPU) is the microprocessor reset input threshold. 1.2 Vref GND 1 tDLY = RCDLY In Vth(MPU) 1Vin Figure 9. Low Voltage Microprocessor Reset TEST DATA VH (mV) RH + Iin Input RL Power Supply - Reset Microprocessor Circuit + 1.2Vref GND VH ≈ 4.6 RH + 0.02 RL DVth(lower) ≈ 340 RH x 10-6 Where:RH ≤ 150 W Where:RL ≥ 1.5 W, ≤ 10 kW 20 51 40 81 71 112 100 164 190 327 276 480 Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold DVth(lower) will be observed due to Iin which is typically 340 mA at 4.59V. The equations are accurate to ±10% with RH less than 150 W and RL between 1.5 kW and 10 kW . Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis http://onsemi.com 4 DVth (mV) RH (W) RL (kW) 0 3.4 6.8 6.8 10 10 16 16 34 34 51 51 0 10 20 20 30 30 47 47 100 100 150 150 0 1.5 4.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 MC34064, MC33064, NCV33064 + 1.0k + - Input Power Supply Input Reset - Reset - - + + 1.2Vref 1.2Vref Solar Cells GND GND Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger 25mH MPSW51A Vin = 11.5 to 14.5V + 470 22 + 680 VO = 5.0 V IO = 50 mA + 470 1N5819 1.2k 4.7k 330 Input 1N756 Conditions Test Reset + Results Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp Efficiency Vin = 12.6 V, IO = 50 mA 77% 1.2Vref GND Figure 13. Low Power Switching Regulator VCC RL MTP3055EL 270 4.6V Input Reset + 1.2Vref GND Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2 MOSFET. Figure 14. MOSFET Low Voltage Gate Drive Protection http://onsemi.com 5 MC34064, MC33064, NCV33064 ORDERING INFORMATION Package Shipping† MC34064D−005 SOIC−8 98 Units / Rail MC34064D−5G SOIC−8 (Pb−Free) MC34064D−5R2 SOIC−8 Device Operating Temperature Range MC34064D−5R2G SOIC−8 (Pb−Free) MC34064DM−5R2 Micro8 MC34064DM−5R2G TO−92 MC34064P−5G TO−92 (Pb−Free) TA = 0°C to +70°C TO−92 MC34064P−5RAG 2000 Units / Bag 2000 Units / Tape & Reel TO−92 (Pb−Free) MC34064P−5RP TO−92 MC34064P−5RPG 2000 Units / Ammo Pack TO−92 (Pb−Free) MC34064P−5RM TO−92 MC34064P−5RMG TO−92 (Pb−Free) MC34064SN−5T1 TSOP−5 MC34064SN−5T1G 3000 Units / Tape & Reel TSOP−5 (Pb−Free) MC33064D−005 SOIC−8 MC33064D−5G SOIC−8 (Pb−Free) MC33064D−5R2 SOIC−8 MC33064D−5R2G SOIC−8 (Pb−Free) MC33064DM−5R2 Micro8 MC33064DM−5R2G 98 Units / Rail 2500 Units / Tape & Reel 4000 Units / Tape & Reel Micro8 (Pb−Free) MC33064P−005 MC33064P−5G 4000 Units / Tape & Reel Micro8 (Pb−Free) MC34064P−005 MC34064P−5RA 2500 Units/ Tape & Reel TO−92 TA = −40°C to +85°C 2000 Units / Bag TO−92 (Pb−Free) MC33064P−5RA TO−92 MC33064P−5RAG 2000 Units / Tape & Reel TO−92 (Pb−Free) MC33064P−5RP TO−92 MC33064P−5RPG TO−92 (Pb−Free) MC33064SN−5T1 TSOP−5 MC33064SN−5T1G 2000 Units / Ammo Pack 3000 Units / Tape & Reel TSOP−5 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 6 MC34064, MC33064, NCV33064 ORDERING INFORMATION Device Operating Temperature Range Package Shipping† SOIC−8 2500 Units / Tape & Reel NCV33064D−5R2* NCV33064D−5R2G* SOIC−8 (Pb−Free) NCV33064P−5RA* 2000 Units / Tape & Reel TO−92 NCV33064P−5RAG* TO−92 (Pb−Free) TA = −40°C to +125°C NCV33064P−5RP* 2000 Units / Ammo Pack TO−92 NCV33064P−5RPG* TO−92 (Pb−Free) NCV33064DM−5R2* Micro8 NCV33064DM−5R2G* 4000 Units / Tape & Reel Micro8 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. MARKING DIAGRAMS SOIC−8 D SUFFIX CASE 751 8 8 1 8 V3064 ALYW5 G 3x064 ALYW5 G TO−92 P SUFFIX CASE 29 Micro8 DM SUFFIX CASE 846A 8 Ly50 AYW G G 1 VI50 AYW G G 1 1 TSOP−5 SN SUFFIX CASE 483 5 5 SRB AYW G G SSN AYW G G 1 1 MC34064 x y A L Y W, WW G MC33064 = = = = = = = 3 or 4 C or I Assembly Location Wafer Lot Year Work Week Pb−Free Package (Note: Microdot may be in either location) http://onsemi.com 7 MC3x0 64P−5 ALYWW G G NCV30 64P−5 ALYWW G G 1 1 2 3 2 3 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS SOIC−8 D SUFFIX CASE 751−07 ISSUE AJ −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) Y M M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS Micro8 DM SUFFIX CASE 846A−02 ISSUE G D HE PIN 1 ID NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. E e b 8 PL 0.08 (0.003) T B M S A S SEATING −T− PLANE 0.038 (0.0015) A A1 MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 DIM A A1 b c D E e L HE MIN −− 0.05 0.25 0.13 2.90 2.90 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS TSOP−5 SN SUFFIX CASE 483−02 ISSUE H D 5X NOTE 5 2X 0.10 T 2X 0.20 T NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. 0.20 C A B M 5 1 4 2 L 3 B S K DETAIL Z G A DIM A B C D G H J K L M S DETAIL Z J C 0.05 SEATING PLANE H T SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS TO−92 (TO−226) P SUFFIX CASE 29−11 ISSUE AM A B STRAIGHT LEAD BULK PACK R P L SEATING PLANE K D X X G J H V C SECTION X−X N 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 --- N A R BENT LEAD TAPE & REEL AMMO PACK B P T SEATING PLANE G K D X X J V 1 C N SECTION X−X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G J K N P R V MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 --2.04 2.66 1.50 4.00 2.93 --3.43 --- Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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