MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
Features
Chip Outlines2
Low Insertion Loss and Noise Figure
High Peak and Average Operating Power
Various P1dB Compression Powers
Low Flat Leakage Power
Proven Reliable, Silicon Nitride Passivation
RoHS Compliant
ODS134
ODS1421
A
A
C
(Anode)
Description
The MA4L and MADL Series are silicon PIN limiter
diodes with small and medium I-region lengths
which are specifically designed for high signal
applications. The devices are designed to provide
low insertion loss, at zero bias, as well as low flat
leakage power with fast signal response/recovery
times. Parts are available as discrete die or
assembled into a variety of surface mount or
ceramic pill packages. See the Available Case Style
table for the specific ceramic package styles and
their availability for individual part numbers.
B
Full Area Cathode
ODS
134, 1421
Dimension
mils
mm
A (squared)
15 ±2
0.381 ±0.51
B
7 ±1*
0.178 ±0.025
C
2.6 x 5.8
0.067 x 0.147
Applications
The MA4L and MADL Series of PIN limiter diodes
are designed for use in passive limiter control
circuits to protect sensitive receiver components
such as low noise amplifiers (LNA), detectors, and
mixers covering the 10 MHz to 18 GHz frequency
range.
1421
2. For the MADL-000301-01340W, MADL-000301-13880G,
MA4L401-134 and MADL-000401-13880G, “B” dimension, is
10 ±1 mils.
Available Packages1
Chip with
Flying
Chip
30
120
31,32
134
137
186
1088
1056
1249
1387
1388
1. Package dimensions can be found on the MACOM website.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1421
MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
Un-Packaged Die Electrical Specifications @ TA = +25°C
Nominal Characteristics
Part Number
MA4L011-134
MA4L021-134
MADL-011021-14210G
MA4L022-134
MADL-011009-01340W
MA4L031-134
MA4L032-134
MADL-011010-01340W
MA4L062-134
MADL-011011-01340W
MA4L101-134
MADL-000301-01340W
MA4L401-134
Carrier
I-Region Contact Thermal
Minimum Maximum Minimum Maximum Maximum
Lifetime
Thickness Diameter Resistance
Cj0V
Cj0V
VREV
VREV
RS 10 mA IFOR = +10 mA
1 MHz
1 MHz
10 µA
10 µA
500 MHz IREV = -6 mA
VR
15
20
20
20
20
30
30
30
60
60
100
200
250
VR
35
35
35
35
35
50
50
50
75
75
—
—
—
pF
0.08
0.10
0.17
0.09
0.16
0.14
0.13
0.17
0.07
0.05
—
—
—
Ohms3
2.10
2.10
2.00
2.00
1.50
2.00
2.50
1.50
2.50
2.30
2.00
1.50
1.20
pF
0.18
0.20
0.24
0.19
0.23
0.21
0.20
0.24
0.15
0.17
0.15
0.20
0.30
ns3
10
10
10
10
10
20
15
15
10
10
90
200
800
µm
2
2
2
2
2
3
3
3
4
4
13
20
25
mils
1.2
1.2
2.6 x 5.8
1.2
3.0
1.4
1.5
3.0
1.5
3.0
3.5
3.0
4.5
°C/W 3
175
175
175
175
175
150
150
150
150
150
30
30
25
3. Test performed with the chip bonded into a ceramic pill package,ODS-30, mounted to an infinite heat-sink. Chip only thermal resistance is
approximately 2°C/W less.
Nominal High Signal Performance4 @ TA = +25°C
Incident Peak
Power for
1 dB Limiting
Incident Peak
Power for
10 dB Limiting
Incident Peak
Power for
15 dB Limiting
Recovery Time
3 dB
Maximum
Incident
Maximum
CW
Peak Power
Input Power
Watts
80
90
90
90
90
125
125
125
200
200
250
500
1000
Watts
2
3
3
3
3
4
4
4
5
5
6
7
10
Part Number
Freq. = 9.4 GHz Freq. = 9.4 GHz Freq. = 9.4 GHz Peak Power = 50 W
MA4L011-134
MA4L021-134
MA4L022-134
MADL-011009-01340W
MADL-011021-14210G
MA4L031-134
MA4L032-134
MADL-011010-01340W
MA4L062-134
MADL-011011-01340W
MA4L101-134
MADL-000301-01340W
MA4L401-134
dBm
7
8
8
8
8
10
11
11
15
15
20
23
30
dBm
30
31
31
31
31
33
34
34
38
38
45
46
52
dBm
40
41
41
41
41
43
44
44
50
50
53
59
60
ns
10
15
15
10
10
25
25
25
75
75
100
50
250
4. High Signal Performance: Measured in a single shunt diode (die) configuration attached directly to the gold plated RF ground of a 50 Ω,
SMA connectorized, test fixture using 2 mil thick conductive silver epoxy . Chip anode contact is thermo-compression wire bonded using a
1 mil. diameter gold wire onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt coil provides the DC return.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
Absolute Maximum Ratings5 TA = +25°C
Parameter
Absolute Maximum
Forward Current
100 mA
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
RF Peak & CW Incident Power
Per Performance Table
Mounting Temperature
+320°C for 10 sec.
5. Exceeding any one or combination of these limits may cause permanent damage to this device.
Typical High Signal Peak Power Performance in a Single Shunt 50 Ω Circuit
Frequency = 9.4 GHz, Pulse Width = 1 µs, Duty Cycle = 0.001%
45
MA4L011-134, MA4L021-134, MA4L022-134,
MADL-011009-01340W, MADL-011021-14210G
40
MA4L031-134, MA4L032-134, MADL-011010-0134W
MA4L062-134, MADL-011011-01340W
35
Output Power (dBm)
MA4L101-134
30
MA4L401-132
25
20
15
10
0 dB
Loss Line
5
10 dB
Loss Line
20 dB
Loss Line
30 dB
Loss Line
0
0
10
20
30
40
50
Input Power (dBm)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
Application Circuits
Typical 60 dBm Peak Power, 1 µS P.W., 0.001% Duty Cycle, 20 dBm Flat Leakage Limiter Circuit
Transmission Line: 90º @ Fo
Transmission Line: 90º @ Fo
RF Input
RF Output
MA4L101-134
MA4L401-134
MA4L032-134
Coil: DC Return
Typical 50 dBm Peak Power, 1 µS P.W., 0.001% Duty Cycle, 20 dBm Flat Leakage Limiter Circuit
Transmission Line: 90º @ Fo
RF Input
RF Output
MA4L022-134
MA4L032-134
Coil: DC Return
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
Notes for Specification and Nominal High Signal Performance Tables:
Maximum Series Resistance: RS, is measured at 500 MHz in the ODS-30 package and is equivalent to the
total diode resistance: RS = Rj (Chip Junction Resistance) + RO (Package Ohmic Resistance)
Maximum High Signal Performance: Test freq.= 9.4 GHz, RF pulse width = 1.0 µS, Duty Cycle = 0.001%.
Measured with a single shunt diode (die) attached directly to the gold plated RF housing ground with 2 mil thick
conductive silver epoxy in a 50 Ω, SMA, connectorized test fixture. Chip anode contact is thermo-compression
wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt
coil provides the DC return.
Maximum CW Incident Power: Measured in a 50 Ω, SMA, connectorized housing @ 4 GHz utilizing a TWT
amplifier and the same single diode assembly configuration as stated above.
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination from
particulates, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up tools is
strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Die Attach: The die have Ti-Pt-Au back and anode metal, with a final gold thickness of 1.0 µm. Die can be
mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness or < ±2 mils.
Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold / tin eutectic solder perform is
recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot
gas is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be
exposed to a temperatures in excess of 320°C for more than 10 seconds.
Eutectic Die Attachment Using Reflow Oven: Refer to Application Note M538 “Surface Mounting
Instructions”.
Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied,
approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible
around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive
silver epoxy per the manufacturer’s schedule, typically 150˚C for 1 hour.
Wire Bonding: The chip’s top contact (anode) metallization layer is comprised of Ti/Pt/Au with a final gold
thickness of 1.0 µm. Thermo-compression wedge bonding using a 0.7 or 1.0 mil diameter gold wire is
recommended. The heat stage temperature should be set to approximately 200°C with a tool tip temperature of
125˚C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary should be adjusted
to the minimum setting required to achieve a good bond. Excessive energy or force applied to the top contact will
cause the metallization to dislodge and lift off. Automatic ball bonding may also be used.
See Application Note M541 “Bonding and Handling Procedures for Chip Diode Devices” for more detailed
handling and assembly information.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
Part Numbering and Ordering Information
When ordering : Use the base part number followed by a dash plus the desired package style suffix or base part
only as defined in Table I “Available Case Styles” below.
For example: The MA4L011 in the 186 style package becomes MA4L011-186 or for just the chip MA4L011-134.
Table I Available Case Styles6
Base Part
Available Package Styles
MA4L011
30, 31, 32, 54, 134 (chip), 137,186, 1056, 1088
MADL-000011-13880G
Base part (MA4L011-134 chip with flying leads)
MA4L021
31, 120, 134 (chip), 1056
MADL-011021-14210G
Base part (MA4L021-134 chip with rectangular contact)
MA4L022
30, 32, 120, 134 (chip), 137, 186, 1056
MADL-011009-01340W
Base part (134 chip)
MA4L031
31, 36, 134 (chip), 186, 1056
MADL-000031-13880G
Base part (MA4L031-134 chip with flying leads)
MA4L032
31, 32, 134 (chip), 186, 1056
MADL-000032-00300
Base part (MA4L032 chip in 30 package)
MADL-011010-01340W
Base part (134 chip)
MA4L062-134
Base part (134 chip)
MADL-000062-105600
Base part (MA4L062 chip in 1056 package)
MADL-000062-13880G
Base part (MA4L062-134 chip with flying leads)
MADL-011011-01340W
Base part (134 chip)
MA4L101
30, 134 (chip), 186
MADL-000101-13880G
Base part (MA4L101-134 chip with flying leads)
MA4L301
31,1056
MADL-000301-01340W
Base part (MA4L301 chip)
MADL-000301-13870G
Base part (MA4L301-134 chip with flying leads)
MA4L401
30, 31, 120,134 (chip), 1056
MADL-000401-13870G
Base part (MA4L401-134 chip with flying leads)
6. See Table I Associated Package Parasitics.
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
Table I Associated Package Parasitics7
Nominal
Package Style
Package Description
30
CPKG
pF
LS
nH
Ceramic Pill
0.18
0.60
31
Ceramic Pill
0.18
0.60
32
Ceramic Pill
0.30
0.40
120
Ceramic Pill
0.13
0.40
134
Chip
—
—
137
Epoxy Encapsulated Ceramic Surface Mount with Leads
0.14
0.70
186
Ceramic Surface Mount with Leads
0.15
0.70
1056
Ceramic Surface Mount with Wrap Around Contacts
0.20
0.70
1088
Epoxy Encapsulated Ceramic Surface Mount with Leads
0.12
0.70
1387
Chip with Flying Leads
—
—
1388
Chip with Flying Leads
—
—
1421
Chip with Rectangular Contact
—
—
Chip with
Flying
Chip
30
120
31,32
134
137
186
1088
1056
1249
1387
1388
7
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1421
MA4L & MADL Series
Silicon PIN Limiter Diodes
Rev. V20
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
8
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support