IRF IRFHM4231PBF Compatible with existing surface mount technique Datasheet

FastIRFET™
IRFHM4231TRPbF
HEXFET® Power MOSFET
VDSS
RDS(on) max
(@ VGS = 10V)
(@ VGS = 4.5V)
25
V
3.4
m
4.6
Qg (typical)
9.7
nC
ID
(@TC (Bottom) = 25°C)
40
A
PQFN 3.3 x 3.3 mm
Applications

Control MOSFET for synchronous buck converter
Features
Low Charge (typical 9.7nC)
Low RDSon (<3.4m)
Low Thermal Resistance to PCB (<4.3°C/W)
Low Profile (<0.9mm)
Industry-Standard Pinout
Compatible with Existing Surface Mount Techniques
RoHS Compliant, Halogen-Free
MSL1, Industrial Qualification
Base part number
Package Type
IRFHM4231PbF
PQFN 3.3mm x 3.3mm
Benefits
Low Switching Losses
Lower Conduction Losses
Enable better Thermal Dissipation
results in Increased Power Density
 Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
Standard Pack
Form
Quantity
Tape and Reel
4000
Orderable Part Number
IRFHM4231TRPbF
Absolute Maximum Ratings
Parameter
Max.
Units
V
VGS
Gate-to-Source Voltage
± 20
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V
22
ID @ TC(Bottom) = 25°C
Continuous Drain Current, VGS @ 10V
72
ID @ TC(Bottom) = 100°C
Continuous Drain Current, VGS @ 10V
46
IDM
Continuous Drain Current, VGS @ 10V
(Source Bonding Technology Limited)
Pulsed Drain Current 
PD @TA = 25°C
Power Dissipation 
ID @ TC = 25°C
PD @TC(Bottom) = 25°C
40
288
2.7
Power Dissipation
A
W
29
Linear Derating Factor
0.021
W/°C
TJ
Operating Junction and
-55 to + 150
°C
TSTG
Storage Temperature Range
Notes  through  are on page 9
1
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IRFHM4231TRPbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter
BVDSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
BVDSS/TJ
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
VGS(th)
IDSS
IGSS
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
gfs
Forward Transconductance
Qg
Total Gate Charge
Qg
Total Gate Charge
Qgs1
Pre-Vth Gate-to-Source Charge
Qgs2
Post-Vth Gate-to-Source Charge
Qgd
Gate-to-Drain Charge
Qgodr
Gate Charge Overdrive
Qsw
Switch Charge (Qgs2 + Qgd)
Qoss
Output Charge
RG
Gate Resistance
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Avalanche Characteristics
Parameter
EAS
Single Pulse Avalanche Energy 
IAR
Avalanche Current 
Diode Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) 
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Min.
25
–––
–––
–––
1.1
–––
–––
–––
–––
120
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
22
2.7
3.7
1.6
-5.4
–––
–––
–––
–––
20
9.7
1.9
1.2
3.6
3.0
4.8
9.6
1.4
8.7
28
12
5.9
1270
360
97
Max.
–––
–––
3.4
4.6
2.1
–––
1.0
100
-100
–––
–––
15
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
Units
Conditions
V
VGS = 0V, ID = 250µA
mV/°C Reference to 25°C, ID = 1mA
m VGS = 10V, ID = 30A 
VGS = 4.5V, ID = 30A 
V
VDS = VGS, ID = 35µA
mV/°C
µA VDS = 20V, VGS = 0V
nA VGS = 20V
VGS = -20V
S
VDS = 10V, ID = 30A
nC VGS = 10V, VDS = 13V, ID = 30A
nC
nC

VDS = 13V
VGS = 4.5V
ID = 30A
VDS = 16V, VGS = 0V
ns
VDD = 13V, VGS = 4.5V
ID = 30A
RG=1.8
pF
VGS = 0V
VDS = 13V
ƒ = 1.0MHz
Max.
42
30
Min.
–––
Typ.
–––
Max.
40
–––
–––
288
Units
mJ
A
Units
Conditions
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
V
TJ = 25°C, IS = 30A, VGS = 0V 
ns TJ = 25°C, IF = 30A, VDD = 13V
nC di/dt = 280A/µs 
D
G
S
–––
–––
–––
–––
16
13
1.0
24
20
Thermal Resistance
Parameter
RJC (Bottom) Junction-to-Case 
Junction-to-Case 
RJC (Top)
Typ.
–––
Max.
4.3
Units
–––
37
°C/W
RJA
Junction-to-Ambient 
–––
47
RJA (<10s)
Junction-to-Ambient 
–––
31
2
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IRFHM4231TRPbF
1000
1000
100
BOTTOM
10
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
VGS
10V
5.0V
4.5V
4.0V
3.5V
3.25V
3.0V
2.75V
100
2.75V
60µs PULSE WIDTH
BOTTOM
2.75V
10
60µs PULSE WIDTH
Tj = 150°C
Tj = 25°C
1
1
0.1
1
10
0.1
100
100
1.8
RDS(on) , Drain-to-Source On Resistance
(Normalized)
1000
ID, Drain-to-Source Current (A)
10
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
100
TJ = 150°C
10
TJ = 25°C
V DS = 10V
60µs PULSE WIDTH
1.0
ID = 30A
V GS = 10V
1.6
1.4
1.2
1.0
0.8
0.6
1.0
2.0
3.0
4.0
5.0
6.0
-60 -40 -20 0
V GS, Gate-to-Source Voltage (V)
100000
Fig 4. Normalized On-Resistance vs. Temperature
14.0
VGS = 0V,
f = 1 MHZ
Ciss = C gs + Cgd, C ds SHORTED
Crss = C gd
V GS, Gate-to-Source Voltage (V)
ID= 30A
Coss = Cds + Cgd
10000
Ciss
Coss
1000
Crss
100
20 40 60 80 100 120 140 160
TJ , Junction Temperature (°C)
Fig 3. Typical Transfer Characteristics
C, Capacitance (pF)
1
V DS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
10
12.0
V DS= 20V
V DS= 13V
10.0
V DS= 5.0V
8.0
6.0
4.0
2.0
0.0
1
10
100
0
V DS, Drain-to-Source Voltage (V)
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5
10
15
20
25
QG, Total Gate Charge (nC)
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
3
VGS
10V
5.0V
4.5V
4.0V
3.5V
3.25V
3.0V
2.75V
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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IRFHM4231TRPbF
1000
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
1000
100
TJ = 150°C
10
TJ = 25°C
1
OPERATION IN THIS AREA
LIMITED BY RDS(on)
100
10
100µsec
Limited by package
1
1msec
10msec
0.1
Tc = 25°C
Tj = 150°C
Single Pulse
V GS = 0V
0.01
0.1
0.2
0.4
0.6
0.8
1.0
1.2
0.1
1.4
1
10
100
VDS, Drain-to-Source Voltage (V)
V SD, Source-to-Drain Voltage (V)
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode Forward Voltage
80
2.2
V GS(th) , Gate threshold Voltage (V)
Limited by package
60
ID, Drain Current (A)
DC
40
20
0
1.8
1.4
1.0
ID = 25µA
ID = 250µA
ID = 1.0mA
ID = 1.0mA
0.6
25
50
75
100
125
150
-75 -50 -25
TC , Case Temperature (°C)
0
25
50
75 100 125 150
TJ , Temperature ( °C )
Fig 10. Drain-to-Source Breakdown Voltage
Fig 9. Maximum Drain Current vs. Case Temperature
Thermal Response ( Z thJC ) °C/W
10
D = 0.50
1
0.20
0.10
0.05
0.02
0.01
0.1
0.01
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRFHM4231TRPbF
200
ID = 30A
EAS , Single Pulse Avalanche Energy (mJ)
RDS(on), Drain-to -Source On Resistance (m )
10.0
8.0
6.0
TJ = 125°C
4.0
TJ = 25°C
ID
6.8A
13A
BOTTOM 30A
TOP
160
120
80
40
0
2.0
2
4
6
8
10
12
14
16
18
25
20
50
75
100
125
150
Starting TJ , Junction Temperature (°C)
V GS, Gate -to -Source Voltage (V)
Fig 13. Maximum Avalanche Energy vs. Drain Current
Fig 12. On-Resistance vs. Gate Voltage
100
Avalanche Current (A)
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming Tj = 125°C and
Tstart =25°C (Single Pulse)
10
1
0.1
1.0E-06
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming  j = 25°C and
Tstart = 125°C.
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 14. Typical Avalanche Current vs. Pulse Width
5
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IRFHM4231TRPbF
Fig 15. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
V(BR)DSS
tp
15V
L
VDS
D.U.T
RG
IAS
20V
tp
DRIVER
+
V
- DD
A
I AS
0.01
Fig 16a. Unclamped Inductive Test Circuit
Fig 16b. Unclamped Inductive Waveforms
Fig 17b. Switching Time Waveforms
Fig 17a. Switching Time Test Circuit
Id
Vds
Vgs
VDD
Vgs(th)
Qgs1 Qgs2
Fig 18. Gate Charge Test Circuit
6
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Qgd
Qgodr
Fig 19. Gate Charge Waveform
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IRFHM4231TRPbF
PQFN 3.3 x 3.3 Package Details
For more information on board mounting, including footprint and stencil recommendation, please refer to application note
AN-1136: http://www.irf.com/technical-info/appnotes/an-1136.pdf
For more information on package inspection techniques, please refer to application note AN-1154:
http://www.irf.com/technical-info/appnotes/an-1154.pdf
PQFN 3.3 x 3.3 Part Marking
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
7
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IRFHM4231TRPbF
PQFN 3.3 x 3.3 Tape and Reel
REEL DIMENSIONS
TAPE DIMENSIONS
CODE
Ao
Bo
Ko
DIMENSION (MM)
MIN
MAX
3.50
3.70
3.50
3.70
1.10
1.30
7.90
P1
11.80
W
12.30
W1
Qty
Reel Diameter
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
CODE
Ao
Bo
Ko
W
P1
DIMENSION (INCH)
MIN
MAX
.138
.146
.138
.146
.043
.051
8.10
12.20
12.50
.311
.465
.484
.319
.480
.492
4000
13 Inches
DESCRIPTION
Dimension design to accommodate the component width
Dimension design to accommodate the component lenght
Dimension design to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
8
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IRFHM4231TRPbF
Qualification Information†
Industrial
Qualification Level
(per JEDEC JESD47F†† guidelines)
PQFN 3.3mm x 3.3mm
Moisture Sensitivity Level
MSL1
(per JEDEC J-STD-020D††)
Yes
RoHS Compliant
† Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability
†† Applicable version of JEDEC standard at the time of product release.
Notes:
 Repetitive rating; pulse width limited by max. junction temperature.
 Starting TJ = 25°C, L = 0.093mH, RG = 50, IAS = 30A.
 Pulse width  400µs; duty cycle  2%.
 R is measured at TJ of approximately 90°C.
 When mounted on 1 inch square PCB (FR-4). Please refer to AN-994 for more details:
http://www.irf.com/technical-info/appnotes/an-994.pdf
 Calculated continuous current based on maximum allowable junction temperature.
 Current is limited to 40A by source bonding technology.
Revision History
Date
6/5/14
Comments


Updated schematic on page 1
Updated tape and reel on page 9
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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June 5, 2014
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