PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151J OBSOLETE CDIP J 16 TBD Call TI Call TI SN74LS151J OBSOLETE CDIP J 16 TBD Call TI Call TI SN74LS151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) SN74LS151N3 OBSOLETE PDIP N 16 TBD Call TI SN74LS151NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S151NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54150J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SNJ54150J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9558001QJA ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC 5962-9558001QKA ACTIVE CFP W 24 1 TBD Call TI Level-NC-NC-NC 1 Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9558001QKA ACTIVE CFP W 24 TBD Call TI Level-NC-NC-NC 5962-9751601Q2A OBSOLETE LCCC FK 20 TBD Call TI Call TI 5962-9751601QCA OBSOLETE CDIP J 14 TBD Call TI Call TI 5962-9751601QDA OBSOLETE CFP W 14 TBD Call TI Call TI 76010012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 76010012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 7601001EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7601001EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7601001FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC 7601001FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/01401BKA ACTIVE CFP W 24 1 TBD Call TI Level-NC-NC-NC JM38510/01401BKA ACTIVE CFP W 24 1 TBD Call TI Level-NC-NC-NC JM38510/07901BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/07901BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30901B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30901B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30901BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30901BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30901BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30901BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SN54150J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SN54150J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SN54LS151J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54LS151J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S151J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC Call TI SN54S15J OBSOLETE CDIP J 14 TBD Call TI SN74150N ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74150N ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74150NE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74150NE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74151AN OBSOLETE PDIP N 16 TBD Call TI Call TI Call TI SN74151AN OBSOLETE PDIP N 16 TBD Call TI SN74LS151D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS151DE4 ACTIVE SOIC D 16 SN74LS151DR ACTIVE SOIC D SN74LS151DR ACTIVE SOIC SN74LS151DRE4 ACTIVE SN74LS151DRE4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151J OBSOLETE CDIP J 16 TBD Call TI Call TI SN74LS151J OBSOLETE CDIP J 16 TBD Call TI Call TI SN74LS151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS151NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S151N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S151NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S151NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S151NSR ACTIVE SO NS 16 CU NIPDAU Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S151NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54150J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SNJ54150J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SNJ54150W ACTIVE CFP W 24 1 TBD Call TI Level-NC-NC-NC Lead/Ball Finish MSL Peak Temp (3) SNJ54150W ACTIVE CFP W 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS151FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS151FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS151J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS151J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS151W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS151W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S151FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S151J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54S151W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S15FK OBSOLETE LCCC FK 20 TBD Call TI Call TI SNJ54S15J OBSOLETE CDIP J 14 TBD Call TI Call TI SNJ54S15W OBSOLETE CFP W 14 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 MECHANICAL DATA MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997 J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN B 13 24 C 1 12 0.065 (1,65) 0.045 (1,14) Lens Protrusion (Lens Optional) 0.010 (0.25) MAX 0.175 (4,45) 0.140 (3,56) 0.090 (2,29) 0.060 (1,53) A Seating Plane 0.018 (0,46) MIN 24 PINS ** DIM ”A” ”B” ”C” NARR 0.125 (3,18) MIN 0.022 (0,56) 0.014 (0,36) 0.100 (2,54) 0.012 (0,30) 0.008 (0,20) 28 WIDE NARR 40 32 WIDE NARR WIDE NARR WIDE MAX 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) MIN 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) MAX 1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53) MIN 1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61) MAX 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) MIN 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 4040084/C 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin). This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCFP007 – OCTOBER 1994 W (R-GDFP-F24) CERAMIC DUAL FLATPACK 0.375 (9,53) 0.340 (8,64) Base and Seating Plane 0.006 (0,15) 0.004 (0,10) 0.090 (2,29) 0.045 (1,14) 0.045 (1,14) 0.026 (0,66) 0.395 (10,03) 0.360 (9,14) 0.360 (9,14) 0.240 (6,10) 1 0.360 (9,14) 0.240 (6,10) 24 0.019 (0,48) 0.015 (0,38) 0.050 (1,27) 0.640 (16,26) 0.490 (12,45) 0.030 (0,76) 0.015 (0,38) 12 13 30° TYP 1.115 (28,32) 0.840 (21,34) 4040180-5 / B 03/95 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD Index point is provided on cap for terminal identification only. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002 N (R–PDIP–T24) PLASTIC DUAL–IN–LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0’–15’ 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051–3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS–010 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI008 – OCTOBER 1994 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PIN SHOWN A 24 13 0.560 (14,22) 0.520 (13,21) 1 12 0.060 (1,52) TYP 0.200 (5,08) MAX 0.610 (15,49) 0.590 (14,99) 0.020 (0,51) MIN Seating Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.125 (3,18) MIN 0.010 (0,25) M PINS ** 0°– 15° 0.010 (0,25) NOM 24 28 32 40 48 52 A MAX 1.270 (32,26) 1.450 (36,83) 1.650 (41,91) 2.090 (53,09) 2.450 (62,23) 2.650 (67,31) A MIN 1.230 (31,24) 1.410 (35,81) 1.610 (40,89) 2.040 (51,82) 2.390 (60,71) 2.590 (65,79) DIM 4040053 / B 04/95 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Falls within JEDEC MS-011 Falls within JEDEC MS-015 (32 pin only) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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