NSR10F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package (CSP) to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. http://onsemi.com Features • • • • • • Low Forward Voltage Drop − 420 mV @ 1.0 A Low Reverse Current − 20 mA @ 10 V VR 1.0 A of Continuous Forward Current ESD Rating − Human Body Model: Class 3B ESD Rating − Machine Model: Class C High Switching Speed These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 30 V SCHOTTKY BARRIER DIODE 1 CATHODE 2 MARKING DIAGRAM Typical Applications • • • • • 2 ANODE PIN 1 1 LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc−dc Converters Reverse Voltage and Current Protection Clamping & Protection 10F30 YYY DSN2 (0502) CASE 152AD 10F30 YYY = Specific Device Code = Year Code Markets • • • • • Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs & PDAs GPS ORDERING INFORMATION Device NSR10F30NXT5G MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage VR 30 V Forward Current (DC) IF 1.0 A Forward Surge Current (60 Hz @ 1 cycle) IFSM 18 A Repetitive Peak Forward Current (Pulse Wave = 1 sec, Duty Cycle = 66%) IFRM 4.0 A ESD Rating: ESD >8 > 400 kV V Human Body Model Machine Model Package Shipping† DSN2 5000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2013 October, 2013 − Rev. 2 1 Publication Order Number: NSR10F30/D NSR10F30NXT5G THERMAL CHARACTERISTICS Characteristic Max Unit RqJA PD 228 548 °C/W mW Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C RqJA PD 85 1.47 °C/W W Storage Temperature Range Tstg −40 to +125 °C Junction Temperature TJ +150 °C Max Unit Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25°C Symbol Min Typ 1. Mounted onto a 4 in square FR−4 board 50 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Characteristic Reverse Leakage (VR = 10 V) (VR = 30 V) IR Forward Voltage (IF = 0.5 A) (IF = 1.0 A) VF Typ mA 20 100 0.400 0.450 V 0.420 0.470 100,000 10 150°C 10,000 IR, REVERSE CURRENT (mA) IF, FORWARD CURRENT (A) Min TJ = 125°C 1 TJ = 150°C 0.1 0.01 −25°C 75°C 25°C 1,000 125°C 100 75°C 10 1 25°C 0.1 0.01 −25°C 0.001 0.001 0.1 0.2 0.3 0.4 0.5 0.6 0 5 10 15 20 25 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 1. Forward Voltage Figure 2. Typical Reverse Current 300 TA = 25°C 250 C, CAPACITANCE (pF) 0 200 150 100 50 0 0 5 10 15 20 VR, REVERSE VOLTAGE (V) Figure 3. Typical Capacitance http://onsemi.com 2 25 30 30 NSR10F30NXT5G PACKAGE DIMENSIONS DSN2, 1.4x0.6, 0.75P CASE 152AD ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2 L3 E 0.05 C TOP VIEW 0.05 C A 0.05 C A1 C SIDE VIEW CATHODE BAND MONTH CODING SEATING PLANE DEC NOV OCT SEP 0.05 C A B L L/2 MILLIMETERS MIN MAX 0.25 0.31 −−− 0.05 0.45 0.55 1.40 BSC 0.60 BSC 1.20 1.30 0.70 0.80 0.20 0.30 XXXX YYY JUN b 1 MAR FEB JAN 0.05 C A B L2 L3 XXXX Y09 BOTTOM VIEW MOUNTING FOOTPRINT* 1.55 0.47 DEVICE CODE YEAR CODE (EXAMPLE) INDICATES AUG 2009 PIN 1 0.60 0.95 DIMENSIONS: MILLIMETERS See Application Note AND8464/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 3 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NSR10F30/D