Freescale Semiconductor Data Sheet: Product Preview K40 Sub-Family Data Sheet Document Number: K40P144M100SF2 Rev. 4, 3/2011 K40P144M100SF2 Supports the following: MK40X128VLQ100, MK40X128VMD100, MK40X256VLQ100, MK40X256VMD100, MK40N512VLQ100, MK40N512VMD100 Features • Operating Characteristics – Voltage range: 1.71 to 3.6 V – Flash write voltage range: 1.71 to 3.6 V – Temperature range (ambient): -40 to 105°C • Performance – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz • Memories and memory interfaces – Up to 512 KB program flash memory on nonFlexMemory devices – Up to 256 KB program flash memory on FlexMemory devices – Up to 256 KB FlexNVM on FlexMemory devices – 4 KB FlexRAM on FlexMemory devices – Up to 128 KB RAM – Serial programming interface (EzPort) – FlexBus external bus interface • Clocks – 3 to 32 MHz crystal oscillator – 32 kHz crystal oscillator – Multi-purpose clock generator • System peripherals – 10 low-power modes to provide power optimization based on application requirements – Memory protection unit with multi-master protection – 16-channel DMA controller, supporting up to 64 request sources – External watchdog monitor – Software watchdog – Low-leakage wakeup unit • Security and integrity modules – Hardware CRC module to support fast cyclic redundancy checks – 128-bit unique identification (ID) number per chip • Human-machine interface – Segment LCD controller supporting up to 40 frontplanes and 8 backplanes, or 44 frontplanes and 4 backplanes – Low-power hardware touch sensor interface (TSI) – General-purpose input/output • Analog modules – Two 16-bit SAR ADCs – Programmable gain amplifier (up to x64) integrated into each ADC – Two 12-bit DACs – Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input – Voltage reference • Timers – Programmable delay block – Eight-channel motor control/general purpose/PWM timer – Two 2-channel quadrature decoder/general purpose timers – Periodic interrupt timers – 16-bit low-power timer – Carrier modulator transmitter – Real-time clock This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. © 2010–2011 Freescale Semiconductor, Inc. Preliminary • Communication interfaces – USB full-/low-speed On-the-Go controller with on-chip transceiver – Two Controller Area Network (CAN) modules – Three SPI modules – Two I2C modules – Five UART modules – Secure Digital host controller (SDHC) – I2S module K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 2 Preliminary Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts...........................................................................5 6 Peripheral operating requirements and behaviors....................21 1.1 Determining valid orderable parts......................................5 6.1 Core modules....................................................................22 2 Part identification......................................................................5 6.1.1 Debug trace timing specifications.......................22 2.1 Description.........................................................................5 6.1.2 JTAG electricals..................................................22 2.2 Format...............................................................................5 6.2 System modules................................................................26 2.3 Fields.................................................................................5 6.3 Clock modules...................................................................26 2.4 Example............................................................................6 6.3.1 MCG specifications.............................................26 3 Terminology and guidelines......................................................6 6.3.2 Oscillator electrical specifications.......................28 3.1 Definition: Operating requirement......................................6 6.3.3 32kHz Oscillator Electrical Characteristics.........30 3.2 Definition: Operating behavior...........................................7 6.4 Memories and memory interfaces.....................................31 3.3 Definition: Attribute............................................................7 6.4.1 Flash (FTFL) electrical specifications.................31 3.4 Definition: Rating...............................................................8 6.4.2 EzPort Switching Specifications.........................35 3.5 Result of exceeding a rating..............................................8 6.4.3 Flexbus Switching Specifications........................36 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................39 requirements......................................................................8 6.6 Analog...............................................................................39 3.7 Guidelines for ratings and operating requirements............9 6.6.1 ADC electrical specifications..............................39 3.8 Definition: Typical value.....................................................9 6.6.2 CMP and 6-bit DAC electrical specifications......47 3.9 Typical value conditions....................................................10 6.6.3 12-bit DAC electrical characteristics...................50 4 Ratings......................................................................................10 6.6.4 Voltage reference electrical specifications..........53 4.1 Thermal handling ratings...................................................11 6.7 Timers................................................................................54 4.2 Moisture handling ratings..................................................11 6.8 Communication interfaces.................................................54 4.3 ESD handling ratings.........................................................11 6.8.1 USB electrical specifications...............................55 4.4 Voltage and current operating ratings...............................11 6.8.2 USB DCD electrical specifications......................55 5 General.....................................................................................12 6.8.3 USB VREG electrical specifications...................55 5.1 Nonswitching electrical specifications...............................12 6.8.4 CAN switching specifications..............................56 6.8.5 DSPI switching specifications (low-speed 5.1.1 Voltage and current operating requirements......12 5.1.2 LVD and POR operating requirements...............13 5.1.3 Voltage and current operating behaviors............14 5.1.4 Power mode transition operating behaviors.......14 5.1.5 Power consumption operating behaviors............15 6.8.7 I2C switching specifications................................59 5.1.6 EMC radiated emissions operating behaviors....18 6.8.8 UART switching specifications............................59 5.1.7 Designing with radiated emissions in mind.........19 6.8.9 SDHC specifications...........................................59 5.1.8 Capacitance attributes........................................19 6.8.10 I2S switching specifications................................60 5.2 Switching specifications.....................................................19 mode)..................................................................56 6.8.6 DSPI switching specifications (high-speed mode)..................................................................57 6.9 Human-machine interfaces (HMI)......................................62 5.2.1 Device clock specifications.................................19 6.9.1 TSI electrical specifications................................62 5.2.2 General switching specifications.........................20 6.9.2 LCD electrical characteristics.............................63 5.3 Thermal specifications.......................................................21 7 Dimensions...............................................................................64 5.3.1 Thermal operating requirements.........................21 7.1 Obtaining package dimensions.........................................64 5.3.2 Thermal attributes...............................................21 8 Pinout........................................................................................65 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 3 8.1 K40 Signal Multiplexing and Pin Assignments..................65 9 Revision History........................................................................73 8.2 K40 Pinouts.......................................................................71 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 4 Preliminary Freescale Semiconductor, Inc. Ordering parts 1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.freescale.com and perform a part number search for the following device numbers: PK40 and MK40. 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: Q K## M FFF T PP CCC N 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Description Values Q Qualification status • M = Fully qualified, general market flow • P = Prequalification K## Kinetis family • K40 M Flash memory type • N = Program flash only • X = Program flash and FlexMemory Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 5 Terminology and guidelines Field Description Values FFF Program flash memory size • • • • • • 32 = 32 KB 64 = 64 KB 128 = 128 KB 256 = 256 KB 512 = 512 KB 1M0 = 1 MB T Temperature range (°C) • V = –40 to 105 • C = –40 to 85 PP Package identifier • • • • • • • • • • • • • FM = 32 QFN (5 mm x 5 mm) FT = 48 QFN (7 mm x 7 mm) LF = 48 LQFP (7 mm x 7 mm) EX = 64 QFN (9 mm x 9 mm) LH = 64 LQFP (10 mm x 10 mm) LK = 80 LQFP (12 mm x 12 mm) MB = 81 MAPBGA (8 mm x 8 mm) LL = 100 LQFP (14 mm x 14 mm) MC = 121 MAPBGA (8 mm x 8 mm) LQ = 144 LQFP (20 mm x 20 mm) MD = 144 MAPBGA (13 mm x 13 mm) MF = 196 MAPBGA (15 mm x 15 mm) MJ = 256 MAPBGA (17 mm x 17 mm) CCC Maximum CPU frequency (MHz) • • • • • 50 = 50 MHz 72 = 72 MHz 100 = 100 MHz 120 = 120 MHz 150 = 150 MHz N Packaging type • R = Tape and reel • (Blank) = Trays 2.4 Example This is an example part number: MK40N512VMD100 3 Terminology and guidelines 3.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 6 Preliminary Freescale Semiconductor, Inc. Terminology and guidelines 3.1.1 Example This is an example of an operating requirement, which you must meet for the accompanying operating behaviors to be guaranteed: Symbol VDD Description 1.0 V core supply voltage Min. 0.9 Max. 1.1 Unit V 3.2 Definition: Operating behavior An operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 3.2.1 Example This is an example of an operating behavior, which is guaranteed if you meet the accompanying operating requirements: Symbol IWP Description Min. Digital I/O weak pullup/ 10 pulldown current Max. 130 Unit µA 3.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. 3.3.1 Example This is an example of an attribute: Symbol CIN_D Description Input capacitance: digital pins Min. — Max. 7 Unit pF K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 7 Terminology and guidelines 3.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: • Operating ratings apply during operation of the chip. • Handling ratings apply when the chip is not powered. 3.4.1 Example This is an example of an operating rating: Symbol VDD Description 1.0 V core supply voltage Min. –0.3 Max. 1.2 Unit V 3.5 Result of exceeding a rating Failures in time (ppm) 40 30 The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. 20 10 0 Operating rating Measured characteristic K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 8 Preliminary Freescale Semiconductor, Inc. Terminology and guidelines 3.6 Relationship between ratings and operating requirements era Op go tin a rh lin nd g in rat n.) mi g( tin era Op e gr em ir qu n. mi t( en ) Op tin e gr era em ir qu x ma t( en .) x.) ma g( g lin nd ha tin era Op r go in rat Fatal range Limited operating range Normal operating range Limited operating range Fatal range - Probable permanent failure - No permanent failure - Possible decreased life - Possible incorrect operation - No permanent failure - Correct operation - No permanent failure - Possible decreased life - Possible incorrect operation - Probable permanent failure Handling range - No permanent failure ∞ –∞ 3.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: • Never exceed any of the chip’s ratings. • During normal operation, don’t exceed any of the chip’s operating requirements. • If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 3.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: • Lies within the range of values specified by the operating behavior • Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. 3.8.1 Example 1 This is an example of an operating behavior that includes a typical value: K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 9 Ratings Symbol Description IWP Digital I/O weak pullup/pulldown current Min. 10 Typ. 70 Max. 130 Unit µA 3.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 5000 4500 4000 TJ IDD_STOP (μA) 3500 150 °C 3000 105 °C 2500 25 °C 2000 –40 °C 1500 1000 500 0 0.90 0.95 1.00 1.05 1.10 VDD (V) 3.9 Typical value conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol Description Value Unit TA Ambient temperature 25 °C VDD 3.3 V supply voltage 3.3 V 4 Ratings K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 10 Preliminary Freescale Semiconductor, Inc. Ratings 4.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 Solder temperature, leaded — 245 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 85°C -100 +100 mA ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 4.4 Voltage and current operating ratings Symbol Description Min. Max. Unit VDD Digital supply voltage –0.3 3.8 V IDD Digital supply current — 185 mA –0.3 5.5 V VDIO Digital input voltage (except RESET, EXTAL, and XTAL) Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 11 General Symbol VAIO ID Description Min. Max. Unit Analog, RESET, EXTAL, and XTAL input voltage –0.3 VDD + 0.3 V Instantaneous maximum current single pin limit (applies to all port pins) –25 25 mA VDDA Analog supply voltage VDD – 0.3 VDD + 0.3 V VUSB_DP USB_DP input voltage –0.3 3.63 V VUSB_DM USB_DM input voltage –0.3 3.63 V VREGIN USB regulator input –0.3 6.0 V RTC battery supply voltage –0.3 3.8 V VBAT 5 General 5.1 Nonswitching electrical specifications 5.1.1 Voltage and current operating requirements Table 1. Voltage and current operating requirements Symbol Description Min. Max. Unit VDD Supply voltage 1.71 3.6 V VDDA Analog supply voltage 1.71 3.6 V VDD – VDDA VDD-to-VDDA differential voltage –0.1 0.1 V VSS – VSSA VSS-to-VSSA differential voltage –0.1 0.1 V 1.71 3.6 V • 2.7 V ≤ VDD ≤ 3.6 V 0.7 × VDD — V • 1.7 V ≤ VDD ≤ 2.7 V 0.75 × VDD — V • 2.7 V ≤ VDD ≤ 3.6 V — 0.35 × VDD V • 1.7 V ≤ VDD ≤ 2.7 V — 0.3 × VDD V 0.06 × VDD — V VBAT VIH VIL VHYS RTC battery supply voltage Notes Input high voltage Input low voltage Input hysteresis Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 12 Preliminary Freescale Semiconductor, Inc. General Table 1. Voltage and current operating requirements (continued) Symbol IIC Description Min. Notes 1 0 DC injection current — total MCU limit, includes sum of all stressed pins • VIN < VSS VRFVBAT Unit DC injection current — single pin • VIN < VSS VRAM Max. –0.2 mA 1 VDD voltage required to retain RAM VBAT voltage required to retain the VBAT register file 0 –5 mA 1.2 — V TBD — V 1. All functional non-supply pins are internally clamped to VSS, and induce an injection current when VIN is less than VSS. The IIC maximum operating requirement should not be exceeded. If this requirement cannot be met, the input must be current limited to the value specified. 5.1.2 LVD and POR operating requirements Table 2. VDD supply LVD and POR operating requirements Symbol Description Min. Typ. Max. Unit VPOR Falling VDD POR detect voltage TBD 1.1 TBD V VLVDH Falling low-voltage detect threshold — high range (LVDV=01) TBD 2.56 TBD V Low-voltage warning thresholds — high range 1 VLVW1H • Level 1 falling (LVWV=00) TBD 2.70 TBD V VLVW2H • Level 2 falling (LVWV=01) TBD 2.80 TBD V VLVW3H • Level 3 falling (LVWV=10) TBD 2.90 TBD V VLVW4H • Level 4 falling (LVWV=11) TBD 3.00 TBD V VHYSH Low-voltage inhibit reset/recover hysteresis — high range VLVDL Falling low-voltage detect threshold — low range (LVDV=00) 60 TBD 1.60 mV TBD V Low-voltage warning thresholds — low range 1 VLVW1L • Level 1 falling (LVWV=00) TBD 1.80 TBD V VLVW2L • Level 2 falling (LVWV=01) TBD 1.90 TBD V VLVW3L • Level 3 falling (LVWV=10) TBD 2.00 TBD V VLVW4L • Level 4 falling (LVWV=11) TBD 2.10 TBD V VHYSL Notes Low-voltage inhibit reset/recover hysteresis — low range 40 mV VBG Bandgap voltage reference TBD 1.00 TBD V tLPO Internal low power oscillator period TBD 1000 TBD μs factory trimmed K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 13 General 1. Rising thresholds are falling threshold + hysteresis voltage Table 3. VBAT power operating requirements Symbol Description VPOR_VBAT Falling VBAT supply POR detect voltage Min. Typ. Max. Unit TBD 1.1 TBD V Notes 5.1.3 Voltage and current operating behaviors Table 4. Voltage and current operating behaviors Symbol Min. Max. Unit • 2.7 V ≤ VDD ≤ 3.6 V, IOH = -10mA VDD – 0.5 — V • 1.71 V ≤ VDD ≤ 2.7 V, IOH = -3mA VDD – 0.5 — V • 2.7 V ≤ VDD ≤ 3.6 V, IOH = -2mA VDD – 0.5 — V • 1.71 V ≤ VDD ≤ 2.7 V, IOH = -0.6mA VDD – 0.5 — V — 100 mA • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 10mA — 0.5 V • 1.71 V ≤ VDD ≤ 2.7 V, IOL = 3mA — 0.5 V • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 2mA — 0.5 V • 1.71 V ≤ VDD ≤ 2.7 V, IOL = 0.6mA — 0.5 V Output low current total for all ports — 100 mA IIN Input leakage current (per pin) — 1 μA IOZ Hi-Z (off-state) leakage current (per pin) — 1 μA RPU Internal pullup resistors 30 50 kΩ 2 RPD Internal pulldown resistors 30 50 kΩ 3 VOH Description Notes Output high voltage — high drive strength Output high voltage — low drive strength IOHT Output high current total for all ports VOL Output low voltage — high drive strength Output low voltage — low drive strength IOLT 1 1. Measured at VDD=3.6V 2. Measured at VDD supply voltage = VDD min and Vinput = VSS 3. Measured at VDD supply voltage = VDD min and Vinput = VDD 5.1.4 Power mode transition operating behaviors All specifications except tPOR, and VLLSx→RUN recovery times in the following table assume this clock configuration: K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 14 Preliminary Freescale Semiconductor, Inc. General • CPU and system clocks = 100 MHz • Bus and FlexBus clocks = 50 MHz • Flash clock = 25 MHz Table 5. Power mode transition operating behaviors Symbol tPOR Description Min. Max. Unit Notes — 300 μs 1 • RUN → VLLS1 — 4.1 μs • VLLS1 → RUN — 123.8 μs • RUN → VLLS2 — 4.1 μs • VLLS2 → RUN — 49.3 μs • RUN → VLLS3 — 4.1 μs • VLLS3 → RUN — 49.2 μs • RUN → LLS — 4.1 μs • LLS → RUN — 5.9 μs • RUN → STOP — 4.1 μs • STOP → RUN — 4.2 μs • RUN → VLPS — 4.1 μs • VLPS → RUN — 5.8 μs After a POR event, amount of time from the point VDD reaches 1.8V to execution of the first instruction across the operating temperature range of the chip. RUN → VLLS1 → RUN RUN → VLLS2 → RUN RUN → VLLS3 → RUN RUN → LLS → RUN RUN → STOP → RUN RUN → VLPS → RUN 1. Normal boot (FTFL_OPT[LPBOOT]=1) 5.1.5 Power consumption operating behaviors Table 6. Power consumption operating behaviors Symbol IDDA Description Analog supply current Min. Typ. Max. Unit Notes — — TBD mA 1 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 15 General Table 6. Power consumption operating behaviors (continued) Symbol Description Min. IDD_RUN Run mode current — all peripheral clocks disabled, code executing from flash Max. Unit Notes 2 • @ 1.8V • @ 3.0V IDD_RUN Typ. — 40 TBD mA — 42 TBD mA Run mode current — all peripheral clocks enabled, code executing from flash 3 • @ 1.8V • @ 3.0V IDD_RUN_M Run mode current — all peripheral clocks enabled and peripherals active, code executing AX from flash • @ 1.8V • @ 3.0V — 55 TBD mA — 56 TBD mA 4 — 85 TBD mA — 85 TBD mA IDD_WAIT Wait mode high frequency current at 3.0 V — all peripheral clocks disabled — 35 TBD mA 2 IDD_WAIT Wait mode reduced frequency current at 3.0 V — all peripheral clocks disabled — 15 TBD mA 5 IDD_STOP Stop mode current at 3.0 V — 0.4 TBD mA IDD_VLPR Very-low-power run mode current at 3.0 V — all peripheral clocks disabled — 1.25 TBD mA 6 IDD_VLPR Very-low-power run mode current at 3.0 V — all peripheral clocks enabled — TBD TBD mA 7 IDD_VLPW Very-low-power wait mode current at 3.0 V — 1.05 TBD mA 8 IDD_VLPS Very-low-power stop mode current at 3.0 V — 50 TBD μA IDD_LLS Low leakage stop mode current at 3.0 V — 12 TBD μA • 128KB RAM devices — 8 TBD μA • 64KB RAM devices — 6 TBD μA • 32KB RAM devices — 5 TBD μA IDD_VLLS3 Very low-leakage stop mode 3 current at 3.0 V IDD_VLLS2 Very low-leakage stop mode 2 current at 3.0 V — 4 TBD μA IDD_VLLS1 Very low-leakage stop mode 1 current at 3.0 V — 2 TBD μA IDD_VBAT Average current when CPU is not accessing RTC registers at 3.0 V — 550 TBD nA 9 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock . MCG configured for FEI mode. All peripheral clocks disabled. 3. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled, but peripherals are not in active operation. 4. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled, and peripherals are in active operation. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 16 Preliminary Freescale Semiconductor, Inc. General 5. 25MHz core and system clock, 25MHz bus clock, and 12.5MHz FlexBus and flash clock. MCG configured for FEI mode. 6. 2 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks disabled. Code executing from flash. 7. 2 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks enabled but peripherals are not in active operation. Code executing from flash. 8. 2 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks disabled. 9. Includes 32kHz oscillator current and RTC operation. 5.1.5.1 Diagram: Typical IDD_RUN operating behavior The following data was measured under these conditions: • • • • • MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE) All peripheral clocks disabled except FTFL LVD disabled, USB regulator disabled No GPIOs toggled Code execution from flash Figure 1. Run mode supply current vs. core frequency — all peripheral clocks disabled The following data was measured under these conditions: K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 17 General • • • • • MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE) All peripheral clocks enabled but peripherals are not in active operation LVD disabled, USB regulator disabled No GPIOs toggled Code execution from flash Figure 2. Run mode supply current vs. core frequency — all peripheral clocks enabled K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 18 Preliminary Freescale Semiconductor, Inc. General 5.1.6 EMC radiated emissions operating behaviors Table 7. EMC radiated emissions operating behaviors Symbol Description Frequency band (MHz) Typ. Unit Notes dBμV 1, 2 — 2, 3 VRE1 Radiated emissions voltage, band 1 0.15–50 TBD VRE2 Radiated emissions voltage, band 2 50–150 TBD VRE3 Radiated emissions voltage, band 3 150–500 TBD VRE4 Radiated emissions voltage, band 4 500–1000 TBD 0.15–1000 TBD VRE_IEC_SAE IEC and SAE level 1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/ Wideband TEM (GTEM) Cell Method. 2. VDD = 3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz 3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/Wideband TEM (GTEM) Cell Method. 5.1.7 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to http://www.freescale.com. 2. Perform a keyword search for “EMC design.” 5.1.8 Capacitance attributes Table 8. Capacitance attributes Symbol Description Min. Max. Unit CIN_A Input capacitance: analog pins — 7 pF CIN_D Input capacitance: digital pins — 7 pF 5.2 Switching specifications K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 19 General 5.2.1 Device clock specifications Symbol Description Min. Max. Unit System and core clock — 100 MHz System and core clock when USB in operation 20 — MHz Bus clock — 50 MHz FlexBus clock — 50 MHz Flash clock — 25 MHz Notes Normal run mode fSYS fSYS_USB fBUS FB_CLK fFLASH VLPR mode fSYS System and core clock — 2 MHz fBUS Bus clock — 2 MHz FlexBus clock — 2 MHz Flash clock — 1 MHz FB_CLK fFLASH 5.2.2 General switching specifications These general purpose specifications apply to all signals configured for GPIO, UART, CAN, CMT, and I2C signals. Symbol Description Min. Max. Unit Notes GPIO pin interrupt pulse width (digital glitch filter disabled) — Synchronous path 1.5 — Bus clock cycles 1 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter enabled) — Asynchronous path 100 — ns 2 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter disabled) — Asynchronous path 16 — ns 2 External reset pulse width (digital glitch filter disabled) TBD — 2 — Mode select (EZP_CS) hold time after reset deassertion Bus clock cycles Port rise and fall time (high drive strength) 3 • Slew disabled — 12 ns • Slew enabled — 36 ns Port rise and fall time (low drive strength) 4 • Slew disabled — 32 ns • Slew enabled — 36 ns 1. The greater synchronous and asynchronous timing must be met. 2. This is the shortest pulse that is guaranteed to be recognized. 3. 75pF load K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 20 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 4. 15pF load 5.3 Thermal specifications 5.3.1 Thermal operating requirements Table 9. Thermal operating requirements Symbol Description Min. Max. Unit TJ Die junction temperature –40 125 °C TA Ambient temperature –40 105 °C 5.3.2 Thermal attributes Board type Symbol Description 144 Unit MAPBGA Notes Singlelayer (1s) RθJA Thermal resistance, junction to ambient (natural convection) 52 50 °C/W 1 Four-layer (2s2p) RθJA Thermal resistance, junction to ambient (natural convection) 44 30 °C/W 1 Singlelayer (1s) RθJMA Thermal resistance, junction to ambient (200 ft./ min. air speed) 43 41 °C/W 1 Four-layer (2s2p) RθJMA Thermal resistance, junction to ambient (200 ft./ min. air speed) 38 27 °C/W 1 — RθJB Thermal resistance, junction to board 33 17 °C/W 2 — RθJC Thermal resistance, junction to case 11 10 °C/W 3 — ΨJT Thermal characterization parameter, junction to package top outside center (natural convection) 2 2 °C/W 4 1. 144 LQFP Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions—Forced Convection (Moving Air). 6 Peripheral operating requirements and behaviors All digital I/O switching characteristics assume: 1. output pins • have CL=30pF loads, • are configured for fast slew rate (PORTx_PCRn[SRE]=0), and • are configured for high drive strength (PORTx_PCRn[DSE]=1) K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 21 Peripheral operating requirements and behaviors 2. input pins • have their passive filter disabled (PORTx_PCRn[PFE]=0) 6.1 Core modules 6.1.1 Debug trace timing specifications Table 10. Debug trace operating behaviors Symbol Description Min. Max. Unit Tcyc Clock period Frequency dependent MHz Twl Low pulse width 2 — ns Twh High pulse width 2 — ns Tr Clock and data rise time — 3 ns Tf Clock and data fall time — 3 ns Ts Data setup 3 — ns Th Data hold 2 — ns Figure 3. TRACE_CLKOUT specifications TRACE_CLKOUT Ts Th Ts Th TRACE_D[3:0] Figure 4. Trace data specifications K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 22 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.1.2 JTAG electricals Table 11. JTAG limited voltage range electricals Symbol J1 Description Min. Max. Unit Operating voltage 2.7 3.6 V TCLK frequency of operation MHz • Boundary Scan 0 10 • JTAG and CJTAG 0 25 • Serial Wire Debug 0 50 1/J1 — J2 TCLK cycle period J3 TCLK clock pulse width ns ns • Boundary Scan 50 — • JTAG and CJTAG 20 — • Serial Wire Debug 10 J4 TCLK rise and fall times — 3 ns J5 Boundary scan input data setup time to TCLK rise 20 — ns J6 Boundary scan input data hold time after TCLK rise 0 — ns J7 TCLK low to boundary scan output data valid — 25 ns J8 TCLK low to boundary scan output high-Z — 25 ns J9 TMS, TDI input data setup time to TCLK rise 8 — ns J10 TMS, TDI input data hold time after TCLK rise 1 — ns J11 TCLK low to TDO data valid — 17 ns J12 TCLK low to TDO high-Z — 17 ns J13 TRST assert time 100 — ns J14 TRST setup time (negation) to TCLK high 8 — ns Table 12. JTAG full voltage range electricals Symbol J1 J2 Description Min. Max. Unit Operating voltage 1.71 3.6 V TCLK frequency of operation MHz • Boundary Scan 0 10 • JTAG and CJTAG 0 20 • Serial Wire Debug 0 40 1/J1 — TCLK cycle period ns Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 23 Peripheral operating requirements and behaviors Table 12. JTAG full voltage range electricals (continued) Symbol J3 Description Min. Max. TCLK clock pulse width Unit ns • Boundary Scan 50 — • JTAG and CJTAG 25 — • Serial Wire Debug 12.5 J4 TCLK rise and fall times — 3 ns J5 Boundary scan input data setup time to TCLK rise 20 — ns J6 Boundary scan input data hold time after TCLK rise 0 — ns J7 TCLK low to boundary scan output data valid — 25 ns J8 TCLK low to boundary scan output high-Z — 25 ns J9 TMS, TDI input data setup time to TCLK rise 8 — ns J10 TMS, TDI input data hold time after TCLK rise 1.4 — ns J11 TCLK low to TDO data valid — 22.1 ns J12 TCLK low to TDO high-Z — 22.1 ns J13 TRST assert time 100 — ns J14 TRST setup time (negation) to TCLK high 8 — ns J2 J3 J3 TCLK (input) J4 J4 Figure 5. Test clock input timing K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 24 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors TCLK J5 Data inputs J6 Input data valid J7 Data outputs Output data valid J8 Data outputs J7 Data outputs Output data valid Figure 6. Boundary scan (JTAG) timing TCLK J9 TDI/TMS J10 Input data valid J11 TDO Output data valid J12 TDO J11 TDO Output data valid Figure 7. Test Access Port timing K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 25 Peripheral operating requirements and behaviors TCLK J14 J13 TRST Figure 8. TRST timing 6.2 System modules There are no specifications necessary for the device's system modules. 6.3 Clock modules 6.3.1 MCG specifications Table 13. MCG specifications Symbol Description Min. Typ. Max. Unit — 32.768 — kHz 31.25 — 39.0625 kHz Internal reference (slow clock) current — TBD — µA Internal reference (slow clock) startup time — TBD 4 µs Δfdco_res_t Resolution of trimmed DCO output frequency at fixed voltage and temperature — using SCTRIM and SCFTRIM — ± 0.1 ± 0.3 %fdco 1 Δfdco_res_t Resolution of trimmed DCO output frequency at fixed voltage and temperature — using SCTRIM only — ± 0.2 ± 0.5 %fdco 1 Δfdco_t Total deviation of trimmed average DCO output frequency over voltage and temperature — + 0.5 ± 3.5 %fdco 1 Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0–70°C — ± 0.5 ± TBD %fdco 1 fintf_ft Internal reference frequency (fast clock) — factory trimmed at nominal VDD and 25°C 3.4 — 4 MHz fintf_t Internal reference frequency (fast clock) — user trimmed 3 — 5 MHz fints_ft Internal reference frequency (slow clock) — factory trimmed at nominal VDD and 25°C fints_t Internal reference frequency (slow clock) — user trimmed Iints tirefsts Δfdco_t Notes - 1.0 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 26 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 13. MCG specifications (continued) Symbol Iintf tirefstf Description Min. Typ. Max. Unit Internal reference (fast clock) current — TBD — µA Internal reference startup time (fast clock) — TBD TBD µs floc_low Loss of external clock minimum frequency — RANGE = 00 (3/5) x fints_t — — kHz floc_high Loss of external clock minimum frequency — RANGE = 01, 10, or 11 (16/5) x fints_t — — kHz 31.25 — 39.0625 kHz 20 20.97 25 MHz 40 41.94 50 MHz 60 62.91 75 MHz 80 83.89 100 MHz — 23.99 — MHz — 47.97 — MHz — 71.99 — MHz — 95.98 — MHz Notes FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS=00) 2, 3 640 × ffll_ref Mid range (DRS=01) 1280 × ffll_ref Mid-high range (DRS=10) 1920 × ffll_ref High range (DRS=11) 2560 × ffll_ref fdco_t_DMX3 DCO output frequency 2 Low range (DRS=00) 4, 5 732 × ffll_ref Mid range (DRS=01) 1464 × ffll_ref Mid-high range (DRS=10) 2197 × ffll_ref High range (DRS=11) 2929 × ffll_ref Jcyc_fll FLL period jitter — TBD TBD ps 6 Jacc_fll FLL accumulated jitter of DCO output over a 1µs time window — TBD TBD ps 6 FLL target frequency acquisition time — — 1 ms 7 48.0 — 100 MHz — 950 — µA tfll_acquire PLL fvco VCO operating frequency Ipll PLL operating current • PLL @ 96 MHz (fosc_hi_1=8MHz, fpll_ref=2MHz, VDIV multiplier=48) 8 fpll_ref PLL reference frequency range 2.0 — 4.0 MHz Jcyc_pll PLL period jitter — 400 — ps 9, 10 Jacc_pll PLL accumulated jitter over 1µs window — TBD — ps 9, 10 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 27 Peripheral operating requirements and behaviors Table 13. MCG specifications (continued) Symbol Description Min. Typ. Max. Unit Dlock Lock entry frequency tolerance ± 1.49 — ± 2.98 % Dunl Lock exit frequency tolerance ± 4.47 — ± 5.97 % tpll_lock Lock detector detection time — — 0.15 + 1075(1/ fpll_ref) ms Notes 11 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0. 3. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation (Δfdco_t) over voltage and temperature should be considered. 4. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1. 5. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. 6. This specification was obtained at TBD frequency. 7. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 8. Excludes any oscillator currents that are also consuming power while PLL is in operation. 9. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of each PCB and results will vary. 10. This specification was obtained at internal frequency of TBD. 11. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 6.3.2 Oscillator electrical specifications This section provides the electrical characteristics of the module. 6.3.2.1 Symbol VDD IDDOSC Oscillator DC electrical specifications Table 14. Oscillator DC electrical specifications Description Min. Typ. Max. Unit Supply voltage 1.71 — 3.6 V Supply current — low-power mode (HGO=0) Notes 1 • 32 kHz — 500 — nA • 4 MHz — 200 — μA • 8 MHz — 300 — μA • 16 MHz — 700 — μA • 24 MHz — 1.2 — mA • 32 MHz — 1.5 — mA Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 28 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 14. Oscillator DC electrical specifications (continued) Symbol Description Min. IDDOSC Supply current — high gain mode (HGO=1) Typ. Max. Unit Notes 1 • 32 kHz — 25 — μA • 4 MHz — 400 — μA • 8 MHz — 800 — μA • 16 MHz — 1.5 — mA • 24 MHz — 3 — mA • 32 MHz — 4 — mA Cx EXTAL load capacitance — — — 2, 3 Cy XTAL load capacitance — — — 2, 3 RF Feedback resistor — low-frequency, low-power mode (HGO=0) — — — MΩ Feedback resistor — low-frequency, high-gain mode (HGO=1) — 10 — MΩ Feedback resistor — high-frequency, low-power mode (HGO=0) — — — MΩ Feedback resistor — high-frequency, high-gain mode (HGO=1) — 1 — MΩ Series resistor — low-frequency, low-power mode (HGO=0) — — — kΩ Series resistor — low-frequency, high-gain mode (HGO=1) — 200 — kΩ Series resistor — high-frequency, low-power mode (HGO=0) — — — kΩ — 0 — kΩ Peak-to-peak amplitude of oscillation (oscillator mode) — low-frequency, low-power mode (HGO=0) — 0.6 — V Peak-to-peak amplitude of oscillation (oscillator mode) — low-frequency, high-gain mode (HGO=1) — VDD — V Peak-to-peak amplitude of oscillation (oscillator mode) — high-frequency, low-power mode (HGO=0) — 0.6 — V Peak-to-peak amplitude of oscillation (oscillator mode) — high-frequency, high-gain mode (HGO=1) — VDD — V RS 2, 4 Series resistor — high-frequency, high-gain mode (HGO=1) Vpp5 1. 2. 3. 4. VDD=3.3 V, Temperature =25 °C See crystal or resonator manufacturer's recommendation Cx,Cy can be provided by using either the integrated capacitors or by using external components. When low power mode is selected, RF is integrated and must not be attached externally. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 29 Peripheral operating requirements and behaviors 5. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any other devices. 6.3.2.2 Symbol Oscillator frequency specifications Table 15. Oscillator frequency specifications Description Min. Typ. Max. Unit fosc_lo Oscillator crystal or resonator frequency — low frequency mode (MCG_C2[RANGE]=00) 32 — 40 kHz fosc_hi_1 Oscillator crystal or resonator frequency — high frequency mode (low range) (MCG_C2[RANGE]=01) 3 — 8 MHz fosc_hi_2 Oscillator crystal or resonator frequency — high frequency mode (high range) (MCG_C2[RANGE]=1x) 8 — 32 MHz fec_extal Input clock frequency (external clock mode) — — 50 MHz tdc_extal Input clock duty cycle (external clock mode) 40 50 60 % Crystal startup time — 32 kHz low-frequency, low-power mode (HGO=0) — TBD — ms Crystal startup time — 32 kHz low-frequency, high-gain mode (HGO=1) — 800 — ms Crystal startup time — 8 MHz high-frequency (MCG_C2[RANGE]=01), low-power mode (HGO=0) — 4 — ms Crystal startup time — 8 MHz high-frequency (MCG_C2[RANGE]=01), high-gain mode (HGO=1) — 3 — ms tcst Notes 1 2, 3 1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL 2. Proper PC board layout procedures must be followed to achieve specifications. 3. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register being set. 6.3.3 32kHz Oscillator Electrical Characteristics This section describes the module electrical characteristics. 6.3.3.1 Symbol VBAT RF Cpara 32kHz oscillator DC electrical specifications Table 16. 32kHz oscillator DC electrical specifications Description Min. Typ. Max. Unit Supply voltage 1.71 — 3.6 V Internal feedback resistor — 100 — MΩ Parasitical capacitance of EXTAL32 and XTAL32 — 2.5 — pF Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 30 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 16. 32kHz oscillator DC electrical specifications (continued) Symbol Cload Vpp 6.3.3.2 Symbol fosc_lo tstart Description Min. Typ. Max. Unit Internal load capacitance (programmable) — 15 — pF Peak-to-peak amplitude of oscillation — 0.6 — V Notes 32kHz oscillator frequency specifications Table 17. 32kHz oscillator frequency specifications Description Min. Typ. Max. Unit Oscillator crystal — 32 — kHz Crystal start-up time — 1000 — ms 1 1. Proper PC board layout procedures must be followed to achieve specifications. 6.4 Memories and memory interfaces 6.4.1 Flash (FTFL) electrical specifications This section describes the electrical characteristics of the FTFL module. 6.4.1.1 Flash timing specifications — program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 18. NVM program/erase timing specifications Symbol Description Min. Typ. Max. Unit thvpgm4 thversscr Longword Program high-voltage time — 20 TBD μs Sector Erase high-voltage time — 20 100 ms 1 — 160 800 ms 1 thversblk256k Erase Block high-voltage time for 256 KB Notes 1. Maximum time based on expectations at cycling end-of-life. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 31 Peripheral operating requirements and behaviors 6.4.1.2 Symbol Flash timing specifications — commands Table 19. Flash command timing specifications Description Min. Typ. Max. Unit — — 1.4 ms Notes Read 1s Block execution time trd1blk256k • 256 KB data flash trd1sec2k Read 1s Section execution time (flash sector) — — 40 μs 1 tpgmchk Program Check execution time — — 35 μs 1 trdrsrc Read Resource execution time — — 35 μs 1 tpgm4 Program Longword execution time — 50 TBD μs Erase Flash Block execution time tersblk256k tersscr 2 • 256 KB data flash Erase Flash Sector execution time — 160 800 ms — 20 100 ms 2 Program Section execution time tpgmsec512 • 512 B flash — TBD TBD ms tpgmsec1k • 1 KB flash — TBD TBD ms tpgmsec2k • 2 KB flash — TBD TBD ms trd1all Read 1s All Blocks execution time — — 2.8 ms trdonce Read Once execution time — — 35 μs Program Once execution time — 50 TBD μs tersall Erase All Blocks execution time — 320 1600 ms 2 tvfykey Verify Backdoor Access Key execution time — — 35 μs 1 — 175 TBD ms tpgmonce 1 Program Partition for EEPROM execution time tpgmpart256k • 256 KB FlexNVM Set FlexRAM Function execution time: tsetram32k • 32 KB EEPROM backup — TBD TBD ms tsetram256k • 256 KB EEPROM backup — TBD TBD ms Byte-write to FlexRAM for EEPROM operation teewr8bers Byte-write to erased FlexRAM location execution time — 100 TBD μs 3 Byte-write to FlexRAM execution time: teewr8b32k • 32 KB EEPROM backup — TBD TBD ms teewr8b64k • 64 KB EEPROM backup — TBD 1.5 ms teewr8b128k • 128 KB EEPROM backup — TBD TBD ms teewr8b256k • 256 KB EEPROM backup — TBD 2.5 ms Word-write to FlexRAM for EEPROM operation Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 32 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 19. Flash command timing specifications (continued) Symbol teewr16bers Description Word-write to erased FlexRAM location execution time Min. Typ. Max. Unit — 100 TBD μs Notes Word-write to FlexRAM execution time: teewr16b32k • 32 KB EEPROM backup — TBD TBD ms teewr16b64k • 64 KB EEPROM backup — TBD 1.5 ms teewr16b128k • 128 KB EEPROM backup — TBD TBD ms teewr16b256k • 256 KB EEPROM backup — TBD 2.5 ms Longword-write to FlexRAM for EEPROM operation teewr32bers Longword-write to erased FlexRAM location execution time — 200 TBD μs Longword-write to FlexRAM execution time: teewr32b32k • 32 KB EEPROM backup — TBD TBD ms teewr32b64k • 64 KB EEPROM backup — TBD 2.7 ms teewr32b128k • 128 KB EEPROM backup — TBD TBD ms teewr32b256k • 256 KB EEPROM backup — TBD 3.7 ms 1. Assumes 25MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. 3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased. 6.4.1.3 Flash (FTFL) current and power specfications Table 20. Flash (FTFL) current and power specfications Symbol Description IDD_PGM Worst case programming current in program flash 6.4.1.4 Symbol Typ. Unit 10 mA Reliability specifications Table 21. NVM reliability specifications Description Min. Typ.1 Max. Unit Notes Program Flash tnvmretp10k Data retention after up to 10 K cycles 5 TBD — years 2 tnvmretp1k Data retention after up to 1 K cycles 10 TBD — years 2 tnvmretp100 Data retention after up to 100 cycles 15 TBD — years 2 10 K TBD — cycles 3 TBD — years 2 nnvmcycp Cycling endurance Data Flash tnvmretd10k Data retention after up to 10 K cycles 5 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 33 Peripheral operating requirements and behaviors Table 21. NVM reliability specifications (continued) Symbol Description tnvmretd1k tnvmretd100 nnvmcycd Min. Typ.1 Max. Unit Notes Data retention after up to 1 K cycles 10 TBD — years 2 Data retention after up to 100 cycles 15 TBD — years 2 10 K TBD — cycles 3 Cycling endurance FlexRAM as EEPROM tnvmretee100 Data retention up to 100% of write endurance 5 TBD — years 2 tnvmretee10 Data retention up to 10% of write endurance 10 TBD — years 2 tnvmretee1 Data retention up to 1% of write endurance 15 TBD — years 2 Write endurance 4 nnvmwree16 • EEPROM backup to FlexRAM ratio = 16 35 K TBD — writes nnvmwree128 • EEPROM backup to FlexRAM ratio = 128 315 K TBD — writes nnvmwree512 • EEPROM backup to FlexRAM ratio = 512 1.27 M TBD — writes nnvmwree4k • EEPROM backup to FlexRAM ratio = 4096 10 M TBD — writes nnvmwree32k • EEPROM backup to FlexRAM ratio = 32,768 80 M TBD — writes 1. Typical data retention values are based on intrinsic capability of the technology measured at high temperature derated to 25°C. For additional information on how Freescale defines typical data retention, please refer to Engineering Bulletin EB618. 2. Data retention is based on Tjavg = 55°C (temperature profile over the lifetime of the application). 3. Cycling endurance represents number of program/erase cycles at -40°C ≤ Tj ≤ 125°C. 4. Write endurance represents the number of writes to each FlexRAM location at -40°C ≤Tj ≤ 125°C influenced by the cycling endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup per subsystem. Minimum value assumes all byte-writes to FlexRAM. 6.4.1.5 Write endurance to FlexRAM for EEPROM When the FlexNVM partition code is not set to full data flash, the EEPROM data set size can be set to any of several non-zero values. The bytes not assigned to data flash via the FlexNVM partition code are used by the FTFL to obtain an effective endurance increase for the EEPROM data. The built-in EEPROM record management system raises the number of program/erase cycles that can be attained prior to device wear-out by cycling the EEPROM data through a larger EEPROM NVM storage space. While different partitions of the FlexNVM are available, the intention is that a single choice for the FlexNVM partition code and EEPROM data set size is used throughout the entire lifetime of a given application. The EEPROM endurance equation and graph shown below assume that only one configuration is ever used. Writes_subsystem = EEPROM – 2 × EEESPLIT × EEESIZE EEESPLIT × EEESIZE × Write_efficiency × nnvmcycd K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 34 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors where • Writes_subsystem — minimum number of writes to each FlexRAM location for subsystem (each subsystem can have different endurance) • EEPROM — allocated FlexNVM for each EEPROM subsystem based on DEPART; entered with Program Partition command • EEESPLIT — FlexRAM split factor for subsystem; entered with the Program Partition command • EEESIZE — allocated FlexRAM based on DEPART; entered with Program Partition command • Write_efficiency — • 0.25 for 8-bit writes to FlexRAM • 0.50 for 16-bit or 32-bit writes to FlexRAM • nnvmcycd — data flash cycling endurance Figure 9. EEPROM backup writes to FlexRAM K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 35 Peripheral operating requirements and behaviors 6.4.2 EzPort Switching Specifications Table 22. EzPort switching specifications Num Description Min. Max. Unit Operating voltage 2.7 3.6 V EP1 EZP_CK frequency of operation (all commands except READ) — fSYS/2 MHz EP1a EZP_CK frequency of operation (READ command) — fSYS/8 MHz EP2 EZP_CS negation to next EZP_CS assertion 2 x tEZP_CK — ns EP3 EZP_CS input valid to EZP_CK high (setup) 5 — ns EP4 EZP_CK high to EZP_CS input invalid (hold) 5 — ns EP5 EZP_D input valid to EZP_CK high (setup) 2 — ns EP6 EZP_CK high to EZP_D input invalid (hold) 5 — ns EP7 EZP_CK low to EZP_Q output valid (setup) — 12 ns EP8 EZP_CK low to EZP_Q output invalid (hold) 0 — ns EP9 EZP_CS negation to EZP_Q tri-state — 12 ns EZP_CK EP3 EP2 EP4 EZP_CS EP9 EP7 EP8 EZP_Q (output) EP5 EP6 EZP_D (input) Figure 10. EzPort Timing Diagram 6.4.3 Flexbus Switching Specifications All processor bus timings are synchronous; input setup/hold and output delay are given in respect to the rising edge of a reference clock, FB_CLK. The FB_CLK frequency may be the same as the internal system bus frequency or an integer divider of that frequency. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 36 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors The following timing numbers indicate when data is latched or driven onto the external bus, relative to the Flexbus output clock (FB_CLK). All other timing relationships can be derived from these values. Table 23. Flexbus switching specifications Num Description Min. Max. Unit Notes Operating voltage 2.7 3.6 V Frequency of operation — 50 Mhz FB1 Clock period 20 — ns FB2 Address, data, and control output valid TBD 11.5 ns 1 FB3 Address, data, and control output hold 0 — ns 1 FB4 Data and FB_TA input setup 8.5 — ns 2 FB5 Data and FB_TA input hold 0.5 — ns 2 1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE, and FB_TS. 2. Specification is valid for all FB_AD[31:0] and FB_TA. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 37 Peripheral operating requirements and behaviors FB1 FB_CLK FB3 FB5 FB_A[Y] Address FB4 FB2 FB_D[X] Address Data FB_RW FB_TS FB_ALE AA=1 FB_CSn AA=0 FB_OEn FB4 FB_BEn FB5 AA=1 FB_TA FB_TSIZ[1:0] AA=0 TSIZ Figure 11. FlexBus read timing diagram K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 38 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors FB1 FB_CLK FB2 FB3 FB_A[Y] FB_D[X] Address Address Data FB_RW FB_TS FB_ALE AA=1 FB_CSn AA=0 FB_OEn FB4 FB_BEn FB5 AA=1 FB_TA FB_TSIZ[1:0] AA=0 TSIZ Figure 12. FlexBus write timing diagram 6.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 6.6 Analog K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 39 Peripheral operating requirements and behaviors 6.6.1 ADC electrical specifications The 16-bit accuracy specifications listed in Table 24 and Table 25 are achievable on the differential pins ADCx_DP0, ADCx_DM0, ADCx_DP1, ADCx_DM1, ADCx_DP3, and ADCx_DP3. The ADCx_DP2 and ADCx_DM2 ADC inputs are used as the PGA inputs and are not direct device pins. Accuracy specifications for these pins are defined in Table 26 and Table 27. All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. 6.6.1.1 16-bit ADC operating conditions Table 24. 16-bit ADC operating conditions Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 — 3.6 V ΔVDDA Supply voltage Delta to VDD (VDDVDDA) -100 0 +100 mV 2 ΔVSSA Ground voltage Delta to VSS (VSSVSSA) -100 0 +100 mV 2 VREFH ADC reference voltage high 1.13 VDDA VDDA V VREFL Reference voltage low VSSA VSSA VSSA V VADIN Input voltage VREFL — VREFH V CADIN Input capacitance • 16 bit modes — 8 10 pF • 8/10/12 bit modes — 4 5 — 2 5 Symbol RADIN RAS fADCK fADCK Input resistance Analog source resistance 13/12 bit modes ADC conversion clock frequency ≤13 bit modes ADC conversion clock frequency 16 bit modes fADCK < 4MHz Notes kΩ 3 — — 5 kΩ 4 1.0 — 18.0 MHz 5 2.0 — 12.0 MHz Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 40 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 24. 16-bit ADC operating conditions (continued) Symbol Crate Description Conditions ADC conversion rate ≤13 bit modes Min. Typ.1 Max. Unit Notes 6 18.484 — 818.330 Ksps No ADC hardware averaging Continuous conversions enabled Peripheral clock = 50MHz Crate ADC conversion rate 16 bit modes No ADC hardware averaging 7 37.037 — 361.402 Ksps Continuous conversions enabled Peripheral clock = 50MHz 1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. DC potential difference. 3. This resistance is external to MCU. The analog source resistance should be kept as low as possible in order to achieve the best results. The results in this datasheet were derived from a system which has <8 Ω analog source resistance. The RAS/ CAS time constant should be kept to <1ns. 4. In order to use the maximum ADC conversion clock frequency ADHSC bit should be set and the ADLPC should be clear. 5. In order to use the maximum ADC conversion clock frequency ADHSC bit should be set and the ADLPC should be clear. 6. For guidelines and examples of conversion rate calculation please download the ADC calculator tool http:// cache.freescale.com/files/soft_dev_tools/software/app_software/converters/ADC_CALCULATOR_CNV.zip?fpsp=1 7. For guidelines and examples of conversion rate calculation please download the ADC calculator tool http:// cache.freescale.com/files/soft_dev_tools/software/app_software/converters/ADC_CALCULATOR_CNV.zip?fpsp=1 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 41 Peripheral operating requirements and behaviors SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Z ADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Pad leakage due to input protection Z AS R AS ADC SAR ENGINE R ADIN V ADIN C AS V AS R ADIN INPUT PIN R ADIN INPUT PIN R ADIN INPUT PIN C ADIN Figure 13. ADC input impedance equivalency diagram 6.6.1.2 Symbol IDDA fADACK 16-bit ADC electrical characteristics Table 25. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Description Conditions1 Min. Typ.2 Max. Unit Notes 0.215 — 1.7 mA 3 • ADLPC=1, ADHSC=0 — 2.4 — MHz • ADLPC=1, ADHSC=1 — 4.0 — MHz tADACK = 1/ fADACK • ADLPC=0, ADHSC=0 — 5.2 — MHz • ADLPC=0, ADHSC=1 — 6.2 — MHz Supply current ADC asynchronous clock source Sample Time See Reference Manual chapter for sample times Conversion Time The ADC calculator tool can be used to determine ADC conversion times for different ADC configurations: http://cache.freescale.com/files/soft_dev_tools/software/app_software/ converters/ADC_CALCULATOR_CNV.zip?fpsp=1 TUE Total unadjusted error • ≤13 bit modes ±0.8 ±TBD • <12 bit modes ±0.5 ±1 LSB4 ADC conversion clock <12MHz, Max hardware averaging (AVGE = %1, AVGS = %11) Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 42 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 25. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol DNL INL EFS EQ ENOB Description Conditions1 Min. Typ.2 Max. Unit Notes LSB4 ADC conversion clock <12MHz, Max hardware averaging (AVGE = %1, AVGS = %11) LSB4 Max averaging LSB4 VADIN = VDDA Differential nonlinearity • ≤13 bit modes ±0.7 ±TBD • <12 bit modes ±0.2 ±0.5 Integral nonlinearity • ≤13 bit modes — ±1.0 ±TBD • <12 bit modes — ±0.5 ±TBD Full-scale error • ≤13 bit modes — ±0.4 ±TBD • <12 bit modes — ±1.0 ±TBD • 16 bit modes — -1 to 0 — • ≤13 bit modes — — ±0.5 Quantization error Effective number 16 bit differential mode of bits • Avg=32 LSB4 5 • Avg=1 TBD 13.6 TBD bits TBD 13.2 TBD bits TBD TBD TBD bits TBD TBD TBD bits 16 bit single-ended mode • Avg=32 • Avg=1 SINAD THD Signal-to-noise plus distortion See ENOB Total harmonic distortion 16 bit differential mode 6.02 × ENOB + 1.76 dB 5 • Avg=32 — -94 TBD dB — TBD TBD dB 16 bit single-ended mode • Avg=32 SFDR Spurious free dynamic range 16 bit differential mode 5 • Avg=32 TBD 95 — dB TBD TBD — dB 16 bit single-ended mode • Avg=32 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 43 Peripheral operating requirements and behaviors Table 25. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol Description EIL Input leakage error Conditions1 Typ.2 Min. Max. IIn × RAS Unit Notes mV IIn = leakage current (refer to the MCU's voltage and current operating ratings) Temp sensor slope VTEMP25 Temp sensor voltage • –40°C to 25°C — TBD — mV/°C • 25°C to 105°C — TBD — mV/°C — TBD — mV 25°C 1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA 2. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and the ADLPC bit (low power). For lowest power operation the ADLPC bit should be set, the HSC bit should be clear with 1MHz ADC conversion clock speed. 4. 1 LSB = (VREFH - VREFL)/2N 5. Input data is 1 kHz sine wave. FIGURE TBD Figure 14. Typical TUE vs. ADC conversion rate 12-bit single-ended mode FIGURE TBD Figure 15. Typical ENOB vs. Averaging for 16-bit differential and 16-bit single-ended modes 6.6.1.3 16-bit ADC with PGA operating conditions Table 26. 16-bit ADC with PGA operating conditions Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 — 3.6 V VREFPGA PGA ref voltage Symbol VADIN VCM VREFOUT VREFOUT VREFOUT V Input voltage VSSA — VDDA V Input Common Mode range VSSA — VDDA V Notes 2, 3 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 44 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 26. 16-bit ADC with PGA operating conditions (continued) Min. Typ.1 Max. Unit Notes Gain = 1, 2, 4, 8 — 128 — kΩ IN+ to IN-4 Gain = 16, 32 — 64 — Gain = 64 — 32 — Symbol Description Conditions RPGAD Differntial input impedance RAS Analog source resistance — 100 — Ω 5 TS ADC sampling time 1.25 — — µs 6 1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 6 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. ADC must be configured to use the internal voltage reference (VREFOUT) 3. PGA reference connected to the VREFOUT pin. If the user wishes to drive VREFOUT with a voltage other than the output of the VREF module, the VREF module must be disabled. 4. For single ended configurations the input impedence of the driven input is 1/2. 5. The analog source resistance (RAS), external to MCU, should be kept as minimum as possible. Increased RAS causes drop in PGA gain without affecting other performances. This is not dependent on ADC clock frequency. 6. The minimum sampling time is dependent on input signal frequency and ADC mode of operation. A minimum of 1.25µs time should be allowed for Fin=4 kHz at 16-bit differential mode. Recommended ADC setting is: ADLSMP=1, ADLSTS=2 at 8 MHz ADC clock. 6.6.1.4 16-bit ADC with PGA characteristics Table 27. 16-bit ADC with PGA characteristics Symbol Description IDDA_PGA Supply current IDC_PGA Input DC current IILKG G BW PSRR Input Leakage current Gain4 Input signal bandwidth Power supply rejection ration Conditions Min. Typ.1 Max. Unit — 590 TBD μA PGA disabled A 2 μA 3 — TBD TBD • PGAG=0 TBD 0.98 TBD • PGAG=1 TBD 1.99 TBD • PGAG=2 TBD 3.97 TBD • PGAG=3 TBD 7.95 TBD • PGAG=4 TBD 15.8 TBD • PGAG=5 TBD 31.4 TBD • PGAG=6 TBD 61.2 TBD — — 4 kHz — — 40 kHz TBD TBD — dB • 16-bit modes • < 16-bit modes Gain=1 Notes RAS < 100Ω VDDA= 3V ±100mV, fVDDA= 50Hz, 60Hz Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 45 Peripheral operating requirements and behaviors Table 27. 16-bit ADC with PGA characteristics (continued) Symbol Description CMRR Common mode rejection ratio Min. Typ.1 Max. Unit Notes • Gain=1 TBD TBD — dB • Gain=64 TBD TBD — dB VCM= 500mVpp, fVCM= 50Hz, 100Hz Conditions VOFS Input offset voltage — 0.2 TBD mV Gain=1, ADC Averaging=32 TGSW Gain switching settling time — — 10 µs 5 dG/dT Gain drift over temperature — TBD TBD ppm/°C 0 to 50°C — TBD TBD ppm/°C — TBD TBD ppm/°C 0 to 50°C, ADC Averaging=32 — TBD TBD %/V — TBD TBD %/V VDDA from 1.71 to 3.6V dVOFS/dT Offset drift over temperature dG/dVDDA Gain drift over supply voltage EIL Input leakage error • Gain=1 • Gain=64 Gain=1 • Gain=1 • Gain=64 All modes IIn × RAS mV IIn = leakage current (refer to the MCU's voltage and current operating ratings) VPP,DIFF SNR THD SFDR Maximum differential input signal swing V 6 16-bit differential mode, Average=32 where VX = VREFPGA × 0.583 Signal-to-noise ratio • Gain=1 • Gain=64 TBD 83.0 — dB TBD 57.5 — dB Total harmonic distortion • Gain=1 • Gain=64 TBD 89.4 — dB TBD 90.0 — dB Spurious free dynamic range • Gain=1 • Gain=64 TBD 90.9 — dB TBD 77.0 — dB 16-bit differential mode, Average=32, fin=500Hz 16-bit differential mode, Average=32, fin=500Hz Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 46 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 27. 16-bit ADC with PGA characteristics (continued) Symbol Description ENOB Effective number of bits SINAD Signal-to-noise plus distortion ratio Min. Typ.1 Max. Unit Notes • Gain=1, Average=4 TBD 12.3 — bits • Gain=1, Average=8 TBD 12.7 — bits • Gain=64, Average=4 TBD 8.4 — bits 16-bit differential mode, fin=500Hz • Gain=64, Average=8 TBD 8.7 — bits • Gain=1, Average=32 TBD 13.3 — bits • Gain=2, Average=32 TBD 13.1 — bits • Gain=4, Average=32 TBD 12.5 — bits • Gain=8, Average=32 TBD 11.8 — bits • Gain=16, Average=32 TBD 11.1 — bits • Gain=32, Average=32 TBD 10.2 — bits • Gain=64, Average=32 TBD 9.3 — bits Conditions See ENOB 6.02 × ENOB + 1.76 dB 1. Typical values assume VDDA =3.0V, Temp=25°C, fADCK=6MHz unless otherwise stated. 2. Between IN+ and IN-. The PGA draws a DC current from the input terminals. The magnitude of the DC current is a strong function if input common mode voltage (VCM) and the PGA gain. 3. This is the input leakage current of the module in addition to the PAD leakage current. 4. Gain = 2PGAG 5. When the PGA gain is changed, it takes some time to settle the output for the ADC to work properly. During a gain switching, a few ADC outputs should be discarded (minimum two data samples, may be more depending on ADC sampling rate and time of the switching). 6. Limit the input signal swing so that the PGA does not saturate during operation. Input signal swing is dependent on the PGA reference voltage and gain setting. 6.6.2 CMP and 6-bit DAC electrical specifications Table 28. Comparator and 6-bit DAC electrical specifications Symbol VDD Description Min. Typ. Max. Unit Supply voltage 1.71 — 3.6 V IDDHS Supply current, High-speed mode (EN=1, PMODE=1) — — 200 μA IDDLS Supply current, low-speed mode (EN=1, PMODE=0) — — 20 μA VAIN Analog input voltage VSS – 0.3 — VDD V VAIO Analog input offset voltage — — 20 mV Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 47 Peripheral operating requirements and behaviors Table 28. Comparator and 6-bit DAC electrical specifications (continued) Symbol VH Description Min. Typ. Max. Unit • CR0[HYSTCTR] = 00 — 5 — mV • CR0[HYSTCTR] = 01 — 10 — mV • CR0[HYSTCTR] = 10 — 20 — mV • CR0[HYSTCTR] = 11 — 30 — mV Analog comparator hysteresis1 VCMPOh Output high VDD – 0.5 — — V VCMPOl Output low — — 0.5 V tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 120 250 600 ns Analog comparator initialization delay2 — — TBD ns 6-bit DAC current adder (enabled) — 7 — μA IDAC6b INL 6-bit DAC integral non-linearity –0.5 — 0.5 LSB3 DNL 6-bit DAC differential non-linearity –0.3 — 0.3 LSB 1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6V. 2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to DACEN, VRSEL, PSEL, MSEL, VOSEL) and the comparator output settling to a stable level. 3. 1 LSB = Vreference/64 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 48 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 0.08 0.07 0.06 HYSTCTR Setting CM P Hystereris (V) 0.05 00 0.04 01 10 11 0.03 0.02 0.01 0 0.1 0.4 0.7 1 1.3 1.6 1.9 Vin level (V) 2.2 2.5 2.8 3.1 Figure 16. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=0) K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 49 Peripheral operating requirements and behaviors 0.18 0.16 0.14 CMP P Hystereris (V) 0.12 HYSTCTR Setting 0.1 00 01 0 08 0.08 10 11 0.06 0.04 0.02 0 0.1 0.4 0.7 1 1.3 1.6 Vin level (V) 1.9 2.2 2.5 2.8 3.1 Figure 17. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=1) 6.6.3 12-bit DAC electrical characteristics 6.6.3.1 Symbol 12-bit DAC operating requirements Table 29. 12-bit DAC operating requirements Desciption Min. Max. Unit VDDA Supply voltage 1.71 3.6 V VDACR Reference voltage 1.13 3.6 V TA Temperature −40 105 °C CL Output load capacitance — 100 pF IL Output load current — 1 mA Notes 1 2 1. The DAC reference can be selected to be VDDA or the voltage output of the VREF module (VREFO) 2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 50 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.6.3.2 Symbol 12-bit DAC operating behaviors Table 30. 12-bit DAC operating behaviors Description Min. Typ. Max. Unit IDDA_DACLP Supply current — low-power mode — — 150 μA IDDA_DACH Supply current — high-speed mode — — 700 μA Notes P tDACLP Full-scale settling time (0x080 to 0xF7F) — lowpower mode — 100 200 μs 1 tDACHP Full-scale settling time (0x080 to 0xF7F) — highpower mode — 15 30 μs 1 tCCDACLP Code-to-code settling time (0xBF8 to 0xC08) — low-power mode — — 5 μs 1 tCCDACHP Code-to-code settling time (0xBF8 to 0xC08) — high-speed mode 1 TBD — μs 1 Vdacoutl DAC output voltage range low — high-speed mode, no load, DAC set to 0x000 — 100 TBD mV Vdacouth DAC output voltage range high — high-speed mode, no load, DAC set to 0xFFF VDACR −100 — VDACR mV INL Integral non-linearity error — high speed mode — — ±8 LSB 2 DNL Differential non-linearity error — VDACR > 2 V — — ±1 LSB 3 DNL Differential non-linearity error — VDACR = VREFO (1.15 V) — — ±1 LSB 4 VOFFSET Offset error ±0.4 — ±0.8 %FSR 5 EG Gain error ±0.1 — ±0.6 %FSR 5 90 dB PSRR 1. 2. 3. 4. Power supply rejection ratio, VDDA > = 2.4 V 60 TCO Temperature coefficient offset voltage — TBD — μV/C TGE Temperature coefficient gain error — TBD — ppm of FSR/C AC Offset aging coefficient — — TBD μV/yr Rop Output resistance load = 3 kΩ — — 250 Ω SR Slew rate -80h→ F7Fh→ 80h V/μs • High power (SPHP) 1.2 1.7 — • Low power (SPLP) 0.05 0.12 — — — -80 CT Channel to channel cross talk BW 3dB bandwidth dB kHz • High power (SPHP) 550 — — • Low power (SPLP) 40 — — Settling within ±1 LSB The INL is measured for 0+100mV to VDACR−100 mV The DNL is measured for 0+100 mV to VDACR−100 mV The DNL is measured for 0+100mV to VDACR−100 mV with VDDA > 2.4V K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 51 Peripheral operating requirements and behaviors 5. Calculated by a best fit curve from VSS+100 mV to VREF−100 mV Figure 18. Typical INL error vs. digital code K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 52 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Figure 19. Offset at half scale vs. temperature 6.6.4 Voltage reference electrical specifications Table 31. VREF full-range operating requirements Symbol Description Min. Max. Unit Supply voltage 1.71 3.6 V TA Temperature −40 105 °C CL Output load capacitance — 100 nF VDDA Notes Table 32. VREF full-range operating behaviors Symbol Vout Description Min. Typ. Max. Unit Voltage reference output with factory trim at nominal VDDA and temperature=25C TBD 1.2 TBD V Notes Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 53 Peripheral operating requirements and behaviors Table 32. VREF full-range operating behaviors (continued) Symbol Description Min. Typ. Max. Unit Vout Voltage reference output with factory trim TBD — TBD V Vout Voltage reference output user trim 1.198 — 1.202 V Vstep Voltage reference trim step — 0.5 — mV Vdrift Temperature drift (Vmax -Vmin across the full temperature range) — — 20 mV Ac Aging coefficient — — TBD ppm/year Ibg Bandgap only (MODE_LV = 00) current — — TBD µA Itr Tight-regulation buffer (MODE_LV =10) current — — 1.1 mA Load regulation (MODE_LV = 10) current = ±1.0mA — — TBD V Tstup Buffer startup time — — 100 µs DC Line regulation (power supply rejection) — — TBD mV –60 — TBD dB Notes See Figure 20 Table 33. VREF limited-range operating requirements Symbol Description Min. Max. Unit TA Temperature 0 50 °C Notes Table 34. VREF limited-range operating behaviors Symbol Vout Description Min. Max. Unit Voltage reference output with factory trim TBD TBD V Notes TBD Figure 20. Typical output vs.temperature TBD Figure 21. Typical output vs. VDD 6.7 Timers See General switching specifications. 6.8 Communication interfaces K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 54 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.8.1 USB electrical specifications The USB electricals for the USB On-the-Go module conform to the standards documented by the Universal Serial Bus Implementers Forum. For the most up-to-date standards, visit http://www.usb.org. 6.8.2 USB DCD electrical specifications Table 35. USB DCD electrical specifications Symbol Description Min. Typ. Max. Unit VDP_SRC USB_DP source voltage (up to 250 μA) TBD TBD TBD V 0.8 — 2.0 V VLGC Threshold voltage for logic high IDP_SRC USB_DP source current 7 10 13 μA IDM_SINK USB_DM sink current 50 100 150 μA RDM_DWN D- pulldown resistance for data pin contact detect 14.25 — 24.8 kΩ VDAT_REF Data detect voltage 0.25 TBD 0.4 V 6.8.3 USB VREG electrical specifications Table 36. USB VREG electrical specifications Symbol Description Min. Typ. Max. Unit VREGIN Input supply voltage 2.7 — 5.5 V IDDon Quiescent current — Run mode, load current equal zero, input supply (VREGIN) > 3.6 V — 120 TBD μA IDDstby Quiescent current — Standby mode, load current equal zero — 1 TBD μA IDDoff Quiescent current — Shutdown mode — 500 — nA — — TBD μA • VREGIN = 5.0 V and temperature=25C • Across operating voltage and temperature ILOADrun Maximum load current — Run mode — — 120 mA ILOADstby Maximum load current — Standby mode — — 1 mA VReg33out Regulator output voltage — Input supply (VREGIN) > 3.6 V 3 3.3 3.6 V 2.5 2.8 3.6 V • Run mode • Standby mode Notes Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 55 Peripheral operating requirements and behaviors Table 36. USB VREG electrical specifications (continued) Symbol Description Min. Typ. Max. Unit Notes VReg33out Regulator output voltage — Input supply (VREGIN) < 3.6 V, pass-through mode 2.3 — 3.6 V 1 COUT External output capacitor 1.76 2.2 8.16 μF ESR External output capacitor equivalent series resistance 1 — 100 mΩ ILIM Current limitation threshold 185 290 395 mA 1. Operating in pass-through mode: regulator output voltage equal to the input voltage minus a drop proportional to ILoad. 6.8.4 CAN switching specifications See General switching specifications. 6.8.5 DSPI switching specifications (low-speed mode) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provides DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 37. Master mode DSPI timing (low-speed mode) Num Description Operating voltage Frequency of operation Min. Max. Unit Notes 1.71 3.6 V 1 — 12.5 MHz 4 x tBCLK — ns DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns DS3 DSPI_PCSn to DSPI_SCK output valid (tSCK/2) - 4 — ns DS4 DSPI_SCK to DSPI_PCSn output hold (tSCK/2) - 4 — ns DS5 DSPI_SCK to DSPI_SOUT valid — 10 ns DS6 DSPI_SCK to DSPI_SOUT invalid -2 — ns DS7 DSPI_SIN to DSPI_SCK input setup 15 — ns DS8 DSPI_SCK to DSPI_SIN input hold 0 — ns 1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 56 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors DSPI_PCSn DS3 DS1 DS2 DS4 DSPI_SCK DS8 DS7 (CPOL=0) DSPI_SIN Data First data Last data DS5 DSPI_SOUT DS6 First data Data Last data Figure 22. DSPI classic SPI timing — master mode Table 38. Slave mode DSPI timing (low-speed mode) Num Description Operating voltage Frequency of operation Min. Max. Unit 1.71 3.6 V — 6.25 MHz 8 x tBCLK — ns (tSCK/2) - 4 (tSCK/2) + 4 ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid — 20 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 — ns DS13 DSPI_SIN to DSPI_SCK input setup 5 — ns DS14 DSPI_SCK to DSIP_SIN input hold 15 — ns DS15 DSPI_SS active to DSPI_SOUT driven — 15 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven — 15 ns DSPI_SS DS10 DS9 DSPI_SCK DS15 (CPOL=0) DSPI_SOUT DS12 First data DS13 DSPI_SIN DS16 DS11 Data Last data DS14 First data Data Last data Figure 23. DSPI classic SPI timing — slave mode K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 57 Peripheral operating requirements and behaviors 6.8.6 DSPI switching specifications (high-speed mode) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 39. Master mode DSPI timing (high-speed mode) Num Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation — 25 MHz 2 x tBCLK — ns DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) − 2 (tSCK/2) + 2 ns DS3 DSPI_PCSn to DSPI_SCK output valid (tSCK/2) − 2 — ns DS4 DSPI_SCK to DSPI_PCSn output hold (tSCK/2) − 2 — ns DS5 DSPI_SCK to DSPI_SOUT valid — 8.5 ns DS6 DSPI_SCK to DSPI_SOUT invalid −2 — ns DS7 DSPI_SIN to DSPI_SCK input setup TBD — ns DS8 DSPI_SCK to DSPI_SIN input hold 0 — ns Min. Max. Unit 2.7 3.6 V 12.5 MHz 4 x tBCLK — ns (tSCK/2) − 2 (tSCK/2 + 2 ns DSPI_PCSn DS3 DS1 DS2 DS4 DSPI_SCK DS8 DS7 (CPOL=0) DSPI_SIN Data First data Last data DS5 DSPI_SOUT First data DS6 Data Last data Figure 24. DSPI classic SPI timing — master mode Table 40. Slave mode DSPI timing (high-speed mode) Num Description Operating voltage Frequency of operation DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 58 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 40. Slave mode DSPI timing (high-speed mode) (continued) Num Description Min. Max. Unit DS11 DSPI_SCK to DSPI_SOUT valid — TBD ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 — ns DS13 DSPI_SIN to DSPI_SCK input setup 2 — ns DS14 DSPI_SCK to DSIP_SIN input hold 7 — ns DS15 DSPI_SS active to DSPI_SOUT driven — 14 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven — 14 ns DSPI_SS DS10 DS9 DSPI_SCK DS15 (CPOL=0) DSPI_SOUT DS12 First data DS13 DSPI_SIN DS16 DS11 Data Last data DS14 First data Data Last data Figure 25. DSPI classic SPI timing — slave mode 6.8.7 I2C switching specifications See General switching specifications. 6.8.8 UART switching specifications See General switching specifications. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 59 Peripheral operating requirements and behaviors 6.8.9 SDHC specifications The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive at timing specs/constraints for the physical interface. Table 41. SDHC switching specifications Num Symbol Description Min. Max. Unit Operating voltage 2.7 3.6 V Card input clock SD1 fpp Clock frequency (low speed) 0 400 kHz fpp Clock frequency (SD\SDIO full speed) 0 25 MHz fpp Clock frequency (MMC full speed) 0 20 MHz fOD Clock frequency (identification mode) 0 400 kHz SD2 tWL Clock low time 7 — ns SD3 tWH Clock high time 7 — ns SD4 tTLH Clock rise time — 3 ns SD5 tTHL Clock fall time — 3 ns SDHC output / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK) SD6 tOD SDHC output delay (output valid) -5 6.5 ns SDHC input / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK) SD7 tTHL SDHC input setup time 5 — ns SD8 tTHL SDHC input hold time 0 — ns SD3 SD2 SD1 SDHC_CLK SD6 Output SDHC_CMD Output SDHC_DAT[3:0] SD7 SD8 Input SDHC_CMD Input SDHC_DAT[3:0] Figure 26. SDHC timing K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 60 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.8.10 I2S switching specifications This section provides the AC timings for the I2S in master (clocks driven) and slave modes (clocks input). All timings are given for non-inverted serial clock polarity (TCR[TSCKP] = 0, RCR[RSCKP] = 0) and a non-inverted frame sync (TCR[TFSI] = 0, RCR[RFSI] = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timings remain valid by inverting the clock signal (I2S_BCLK) and/or the frame sync (I2S_FS) shown in the figures below. Table 42. I2S master mode timing Num Description Min. Max. Unit Operating voltage 2.7 3.6 V S1 I2S_MCLK cycle time 2 x tSYS S2 I2S_MCLK pulse width high/low S3 I2S_BCLK cycle time S4 I2S_BCLK pulse width high/low S5 I2S_BCLK to I2S_FS output valid S6 I2S_BCLK to I2S_FS output invalid S7 ns 45% 55% MCLK period 5 x tSYS — ns 45% 55% BCLK period — 15 ns -2.5 — ns I2S_BCLK to I2S_TXD valid — 15 ns S8 I2S_BCLK to I2S_TXD invalid -3 — ns S9 I2S_RXD/I2S_FS input setup before I2S_BCLK 20 — ns S10 I2S_RXD/I2S_FS input hold after I2S_BCLK 0 — ns S1 S2 S2 I2S_MCLK (output) S3 I2S_BCLK (output) S4 S4 S6 S5 I2S_FS (output) S10 S9 I2S_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 27. I2S timing — master mode K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 61 Peripheral operating requirements and behaviors Table 43. I2S slave mode timing Num Description Min. Max. Unit Operating voltage 2.7 3.6 V 8 x tSYS — ns S11 I2S_BCLK cycle time (input) S12 I2S_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_FS input setup before I2S_BCLK 10 — ns S14 I2S_FS input hold after I2S_BCLK 3 — ns S15 I2S_BCLK to I2S_TXD/I2S_FS output valid — 20 ns S16 I2S_BCLK to I2S_TXD/I2S_FS output invalid 0 — ns S17 I2S_RXD setup before I2S_BCLK 10 — ns S18 I2S_RXD hold after I2S_BCLK 2 — ns S11 S12 I2S_BCLK (input) S12 S15 S16 I2S_FS (output) S13 S14 I2S_FS (input) S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 28. I2S timing — slave modes 6.9 Human-machine interfaces (HMI) 6.9.1 TSI electrical specifications Table 44. TSI electrical specifications Symbol Description Min. Typ. Max. Unit VDDTSI Operating voltage 1.71 — 3.6 V Target electrode capacitance range 1 20 500 pF fREFmax Reference oscillator frequency — 5.5 TBD MHz fELEmax Electrode oscillator frequency — 0.5 TBD MHz CELE Notes 1 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 62 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 44. TSI electrical specifications (continued) Symbol Description Min. Typ. Max. Unit Internal reference capacitor TBD 1 TBD pF Oscillator delta voltage TBD 600 TBD mV IREF Reference oscillator current source base current TBD 1 TBD μA 2 IELE Electrode oscillator current source base current TBD 1 TBD μA 2 Pres5 Electrode capacitance measurement precision — TBD TBD % 3 Pres20 Electrode capacitance measurement precision — TBD TBD % 4 Pres100 Electrode capacitance measurement precision — TBD TBD % 5 MaxSens2 Maximum sensitivity @ 20 pF electrode 0 0.003 0.25 — fF/count 6 MaxSens 0.003 — — fF/count 7 Resolution — — 16 bits Response time @ 20 pF 8 15 25 μs Current added in run mode — TBD — μA Low power mode current adder — 1 TBD μA CREF VDELTA Res TCon20 ITSI_RUN ITSI_LP Maximum sensitivity Notes 8 1. 2. 3. 4. 5. 6. The TSI module is functional with capacitance values outside this range. However, optimal performance is not guaranteed. The programmable current source value is generated by multiplying the SCANC[REFCHRG] value and the base current. Measured with a 5 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 8; Iext = 16. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 2; Iext = 16. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 16, NSCN = 3; Iext = 16. Measured with a 20 pF electrode, reference oscillator frequency of ~5 MHz (IREF = 5 μA, REFCHRG = 4), PS = 128, NSCN = 2; Iext = 16 (EXTCHRG = 15). 7. Typical value depends on the configuration used. 8. Time to do one complete measurement of the electrode. Sensitivity resolution of 0.0133 pF, PS = 0, NSCN = 0, 1 electrode, DELVOL = 2, EXTCHRG = 15. 6.9.2 LCD electrical characteristics Table 45. LCD electricals Symbol Description Min. Typ. Max. Unit Notes fFrame LCD frame frequency 28 30 58 Hz CLCD LCD charge pump capacitance — nominal value — 100 — nF 1 CBYLCD LCD bypass capacitance — nominal value — 100 — nF 1 CGlass LCD glass capacitance — 2000 8000 pF VIREG VIREG — HREFSEL = 0 ΔRTRIM 2 • HREFSEL = 0 0.89 1.00 1.15 V • HREFSEL = 1 1.49 1.67 1.85 V 3.0 — — % VIREG VIREG TRIM resolution Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 63 Dimensions Table 45. LCD electricals (continued) Symbol Description Min. Typ. Max. Unit — VIREG ripple • HREFSEL = 0 — — 30 mV • HREFSEL = 1 — — 50 mV — 1 — µA IVIREG VIREG current adder — RVEN = 1 IRBIAS RBIAS current adder RRBIAS • HREFSEL = 0 — 10 — µA • HREFSEL = 1 — 1 — µA — 0.28 — MΩ — 2.98 — MΩ • HREFSEL = 0 2.0 − 5% 2.0 — V • HREFSEL = 1 3.3 − 5% 3.3 — V • HREFSEL = 0 3.0 − 5% 3.0 — V • HREFSEL = 1 5 − 5% 5 — V RBIAS resistor values • LADJ = 10 or 11 — High load (LCD glass capacitance ≤ 8000 pF) VLL3 3 3 • LADJ = 00 or 01 — Low load (LCD glass capacitance ≤ 2000 pF) VLL2 Notes VLL2 voltage VLL3 voltage 1. The actual value used could vary with tolerance. 2. VIREG maximum should never be externally driven to any level other than VDD - 0.15 V 3. 2000 pF load LCD, 32 Hz frame frequency 7 Dimensions 7.1 Obtaining package dimensions Package dimensions are provided in package drawings. To find a package drawing, go to http://www.freescale.com and perform a keyword search for the drawing’s document number: If you want the drawing for this package Then use this document number 144-pin LQFP 98ASS23177W 144-pin MAPBGA 98ASA00222D K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 64 Preliminary Freescale Semiconductor, Inc. Pinout 8 Pinout 8.1 K40 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control Module is responsible for selecting which ALT functionality is available on each pin. 144 144 LQF MAP P BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 — L5 NC NC NC — M5 NC NC NC 1 D3 PTE0 ADC1_SE4 a ADC1_SE4 a PTE0 SPI1_PCS1 UART1_TX SDHC0_D1 FB_AD27 I2C1_SDA 2 D2 PTE1 ADC1_SE5 a ADC1_SE5 a PTE1 SPI1_SOUT UART1_RX SDHC0_D0 FB_AD26 I2C1_SCL 3 D1 PTE2 ADC1_SE6 a ADC1_SE6 a PTE2 SPI1_SCK UART1_CT S_b SDHC0_DC FB_AD25 LK 4 E4 PTE3 ADC1_SE7 a ADC1_SE7 a PTE3 SPI1_SIN UART1_RT S_b SDHC0_CM FB_AD24 D 5 E5 VDD VDD VDD 6 F6 VSS VSS VSS 7 E3 PTE4 DISABLED PTE4 SPI1_PCS0 UART3_TX SDHC0_D3 FB_CS3_b/ FB_TA_b FB_BE7_0_ BLS31_24_ b 8 E2 PTE5 DISABLED PTE5 SPI1_PCS2 UART3_RX SDHC0_D2 FB_TBST_b /FB_CS2_b/ FB_BE15_8 _BLS23_16 _b 9 E1 PTE6 DISABLED PTE6 SPI1_PCS3 UART3_CT S_b I2S0_MCLK FB_ALE/ FB_CS1_b/ FB_TS_b 10 F4 PTE7 DISABLED PTE7 UART3_RT S_b 11 F3 PTE8 DISABLED 12 F2 PTE9 13 F1 14 G4 15 G3 I2S0_RXD FB_CS0_b PTE8 I2S0_RX_F S FB_AD4 DISABLED PTE9 I2S0_RX_B CLK FB_AD3 PTE10 DISABLED PTE10 I2S0_TXD FB_AD2 PTE11 DISABLED PTE11 I2S0_TX_F S FB_AD1 PTE12 DISABLED PTE12 I2S0_TX_B CLK FB_AD0 ALT7 EzPort I2S0_CLKIN K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 65 Pinout 144 144 LQF MAP P BGA Pin Name Default ALT0 16 E6 VDD VDD VDD 17 F7 VSS VSS VSS 18 H3 VSS VSS VSS 19 H1 USB0_DP USB0_DP USB0_DP 20 H2 USB0_DM USB0_DM USB0_DM 21 G1 VOUT33 VOUT33 VOUT33 22 G2 VREGIN VREGIN VREGIN 23 J1 ADC0_DP1 ADC0_DP1 ADC0_DP1 24 J2 ADC0_DM1 ADC0_DM1 ADC0_DM1 25 K1 ADC1_DP1 26 K2 ADC1_DM1 ADC1_DM1 ADC1_DM1 27 L1 PGA0_DP/ PGA0_DP/ PGA0_DP/ ADC0_DP0/ ADC0_DP0/ ADC0_DP0/ ADC1_DP3 ADC1_DP3 ADC1_DP3 28 L2 PGA0_DM/ PGA0_DM/ PGA0_DM/ ADC0_DM0/ ADC0_DM0/ ADC0_DM0/ ADC1_DM3 ADC1_DM3 ADC1_DM3 29 M1 PGA1_DP/ PGA1_DP/ PGA1_DP/ ADC1_DP0/ ADC1_DP0/ ADC1_DP0/ ADC0_DP3 ADC0_DP3 ADC0_DP3 30 M2 PGA1_DM/ PGA1_DM/ PGA1_DM/ ADC1_DM0/ ADC1_DM0/ ADC1_DM0/ ADC0_DM3 ADC0_DM3 ADC0_DM3 31 H5 VDDA VDDA VDDA 32 G5 VREFH VREFH VREFH 33 G6 VREFL VREFL VREFL 34 H6 VSSA VSSA VSSA 35 K3 ADC1_SE1 6/ CMP2_IN2/ ADC0_SE2 2 ADC1_SE1 6/ CMP2_IN2/ ADC0_SE2 2 ADC1_SE1 6/ CMP2_IN2/ ADC0_SE2 2 36 J3 ADC0_SE1 6/ CMP1_IN2/ ADC0_SE2 1 ADC0_SE1 6/ CMP1_IN2/ ADC0_SE2 1 ADC0_SE1 6/ CMP1_IN2/ ADC0_SE2 1 37 M3 VREF_OUT/ VREF_OUT VREF_OUT/ CMP1_IN5/ CMP1_IN5/ CMP0_IN5/ CMP0_IN5/ ADC1_SE1 ADC1_SE1 8 8 38 L3 DAC0_OUT/ DAC0_OUT DAC0_OUT/ CMP1_IN3/ CMP1_IN3/ ADC0_SE2 ADC0_SE2 3 3 ADC1_DP1 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort ADC1_DP1 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 66 Preliminary Freescale Semiconductor, Inc. Pinout 144 144 LQF MAP P BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort 39 L4 DAC1_OUT/ DAC1_OUT DAC1_OUT/ CMP2_IN3/ CMP2_IN3/ ADC1_SE2 ADC1_SE2 3 3 40 M7 XTAL32 XTAL32 XTAL32 41 M6 EXTAL32 EXTAL32 EXTAL32 42 L6 VBAT VBAT VBAT 43 — VDD VDD VDD 44 — VSS VSS VSS 45 M4 PTE24 ADC0_SE1 7 ADC0_SE1 7 PTE24 CAN1_TX UART4_TX 46 K5 PTE25 ADC0_SE1 8 ADC0_SE1 8 PTE25 CAN1_RX UART4_RX FB_AD23 EWM_IN 47 K4 PTE26 DISABLED PTE26 UART4_CT S_b FB_AD22 RTC_CLKO USB_CLKIN UT 48 J4 PTE27 DISABLED PTE27 UART4_RT S_b FB_AD21 49 H4 PTE28 DISABLED PTE28 50 J5 PTA0 JTAG_TCL K/ SWD_CLK/ EZP_CLK TSI0_CH1 PTA0 UART0_CT S_b FTM0_CH5 JTAG_TCL K/ SWD_CLK EZP_CLK 51 J6 PTA1 JTAG_TDI/ EZP_DI TSI0_CH2 PTA1 UART0_RX FTM0_CH6 JTAG_TDI EZP_DI 52 K6 PTA2 JTAG_TDO/ TSI0_CH3 TRACE_SW O/EZP_DO PTA2 UART0_TX FTM0_CH7 JTAG_TDO/ EZP_DO TRACE_SW O 53 K7 PTA3 JTAG_TMS/ TSI0_CH4 SWD_DIO PTA3 UART0_RT S_b FTM0_CH0 JTAG_TMS/ SWD_DIO 54 L7 PTA4 NMI_b/ EZP_CS_b PTA4 FTM0_CH1 NMI_b 55 M8 PTA5 DISABLED PTA5 FTM0_CH2 CMP2_OUT I2S0_RX_B CLK JTAG_TRS T 56 E7 VDD VDD VDD 57 G7 VSS VSS VSS 58 J7 PTA6 DISABLED PTA6 FTM0_CH3 FB_CLKOU T TRACE_CL KOUT 59 J8 PTA7 ADC0_SE1 0 ADC0_SE1 0 PTA7 FTM0_CH4 FB_AD18 TRACE_D3 60 K8 PTA8 ADC0_SE1 1 ADC0_SE1 1 PTA8 FTM1_CH0 FB_AD17 FTM1_QD_ PHA TRACE_D2 61 L8 PTA9 DISABLED PTA9 FTM1_CH1 FB_AD16 FTM1_QD_ PHB TRACE_D1 62 M9 PTA10 DISABLED PTA10 FTM2_CH0 FB_AD15 FTM2_QD_ PHA TRACE_D0 63 L9 PTA11 DISABLED PTA11 FTM2_CH1 FB_OE_b FTM2_QD_ PHB TSI0_CH5 EWM_OUT _b FB_AD20 EZP_CS_b K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 67 Pinout 144 144 LQF MAP P BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 64 K9 PTA12 CMP2_IN0 CMP2_IN0 PTA12 CAN0_TX FTM1_CH0 FB_CS5_b/ I2S0_TXD FB_TSIZ1/ FB_BE23_1 6_BLS15_8 _b FTM1_QD_ PHA 65 J9 PTA13 CMP2_IN1 CMP2_IN1 PTA13 CAN0_RX FTM1_CH1 FB_CS4_b/ I2S0_TX_F FB_TSIZ0/ S FB_BE31_2 4_BLS7_0_ b FTM1_QD_ PHB 66 L10 PTA14 DISABLED PTA14 SPI0_PCS0 UART0_TX FB_AD31 I2S0_TX_B CLK 67 L11 PTA15 DISABLED PTA15 SPI0_SCK UART0_RX FB_AD30 I2S0_RXD 68 K10 PTA16 DISABLED PTA16 SPI0_SOUT UART0_CT S_b FB_AD29 I2S0_RX_F S 69 K11 PTA17 ADC1_SE1 7 ADC1_SE1 7 PTA17 SPI0_SIN FB_AD28 I2S0_MCLK I2S0_CLKIN 70 E8 VDD VDD VDD 71 G8 VSS VSS VSS 72 M12 PTA18 EXTAL EXTAL PTA18 FTM0_FLT2 FTM_CLKIN 0 73 M11 PTA19 XTAL XTAL PTA19 FTM1_FLT0 FTM_CLKIN 1 74 L12 RESET_b RESET_b RESET_b 75 K12 PTA24 DISABLED PTA24 FB_AD14 76 J12 PTA25 DISABLED PTA25 FB_AD13 77 J11 PTA26 DISABLED PTA26 FB_AD12 78 J10 PTA27 DISABLED PTA27 FB_AD11 79 H12 PTA28 DISABLED PTA28 FB_AD10 80 H11 PTA29 DISABLED PTA29 FB_AD19 81 H10 PTB0 LCD_P0/ ADC0_SE8/ ADC1_SE8/ TSI0_CH0 LCD_P0/ PTB0 ADC0_SE8/ ADC1_SE8/ TSI0_CH0 I2C0_SCL FTM1_CH0 FTM1_QD_ PHA LCD_P0 82 H9 LCD_P1/ ADC0_SE9/ ADC1_SE9/ TSI0_CH6 LCD_P1/ PTB1 ADC0_SE9/ ADC1_SE9/ TSI0_CH6 I2C0_SDA FTM1_CH1 FTM1_QD_ PHB LCD_P1 83 G12 PTB2 LCD_P2/ LCD_P2/ PTB2 ADC0_SE1 ADC0_SE1 2/TSI0_CH7 2/TSI0_CH7 I2C0_SCL UART0_RT S_b FTM0_FLT3 LCD_P2 84 G11 PTB3 LCD_P3/ LCD_P3/ PTB3 ADC0_SE1 ADC0_SE1 3/TSI0_CH8 3/TSI0_CH8 I2C0_SDA UART0_CT S_b FTM0_FLT0 LCD_P3 85 G10 PTB4 LCD_P4/ ADC1_SE1 0 PTB1 LCD_P4/ ADC1_SE1 0 UART0_RT S_b EzPort LPT0_ALT1 PTB4 FTM1_FLT0 LCD_P4 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 68 Preliminary Freescale Semiconductor, Inc. Pinout 144 144 LQF MAP P BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 86 G9 PTB5 LCD_P5/ ADC1_SE1 1 LCD_P5/ ADC1_SE1 1 PTB5 FTM2_FLT0 LCD_P5 87 F12 PTB6 LCD_P6/ ADC1_SE1 2 LCD_P6/ ADC1_SE1 2 PTB6 LCD_P6 88 F11 PTB7 LCD_P7/ ADC1_SE1 3 LCD_P7/ ADC1_SE1 3 PTB7 LCD_P7 89 F10 PTB8 LCD_P8 LCD_P8 PTB8 UART3_RT S_b LCD_P8 90 F9 LCD_P9 LCD_P9 PTB9 SPI1_PCS1 UART3_CT S_b LCD_P9 91 E12 PTB10 LCD_P10/ ADC1_SE1 4 LCD_P10/ ADC1_SE1 4 PTB10 SPI1_PCS0 UART3_RX FTM0_FLT1 LCD_P10 92 E11 PTB11 LCD_P11/ ADC1_SE1 5 LCD_P11/ ADC1_SE1 5 PTB11 SPI1_SCK FTM0_FLT2 LCD_P11 93 H7 VSS VSS VSS 94 F5 VDD VDD VDD 95 E10 PTB16 LCD_P12/ TSI0_CH9 LCD_P12/ TSI0_CH9 PTB16 SPI1_SOUT UART0_RX EWM_IN LCD_P12 96 E9 PTB17 LCD_P13/ TSI0_CH10 LCD_P13/ TSI0_CH10 PTB17 SPI1_SIN UART0_TX EWM_OUT _b LCD_P13 97 D12 PTB18 LCD_P14/ TSI0_CH11 LCD_P14/ TSI0_CH11 PTB18 CAN0_TX FTM2_CH0 I2S0_TX_B CLK FTM2_QD_ PHA LCD_P14 98 D11 PTB19 LCD_P15/ TSI0_CH12 LCD_P15/ TSI0_CH12 PTB19 CAN0_RX FTM2_CH1 I2S0_TX_F S FTM2_QD_ PHB LCD_P15 99 D10 PTB20 LCD_P16 LCD_P16 PTB20 SPI2_PCS0 CMP0_OUT LCD_P16 100 D9 PTB21 LCD_P17 LCD_P17 PTB21 SPI2_SCK CMP1_OUT LCD_P17 101 C12 PTB22 LCD_P18 LCD_P18 PTB22 SPI2_SOUT CMP2_OUT LCD_P18 102 C11 PTB23 LCD_P19 LCD_P19 PTB23 SPI2_SIN 103 B12 PTC0 LCD_P20/ ADC0_SE1 4/ TSI0_CH13 LCD_P20/ ADC0_SE1 4/ TSI0_CH13 PTC0 SPI0_PCS4 PDB0_EXT RG I2S0_TXD LCD_P20 104 B11 PTC1 LCD_P21/ ADC0_SE1 5/ TSI0_CH14 LCD_P21/ ADC0_SE1 5/ TSI0_CH14 PTC1 SPI0_PCS3 UART1_RT S_b FTM0_CH0 LCD_P21 105 A12 PTC2 LCD_P22/ ADC0_SE4 b/ CMP1_IN0/ TSI0_CH15 LCD_P22/ ADC0_SE4 b/ CMP1_IN0/ TSI0_CH15 PTC2 SPI0_PCS2 UART1_CT S_b FTM0_CH1 LCD_P22 106 A11 PTC3 LCD_P23/ CMP1_IN1 LCD_P23/ CMP1_IN1 PTC3 SPI0_PCS1 UART1_RX FTM0_CH2 LCD_P23 PTB9 UART3_TX SPI0_PCS5 EzPort LCD_P19 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 69 Pinout 144 144 LQF MAP P BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 107 H8 VSS VSS VSS 108 C10 VLL3 VLL3 VLL3 109 C9 VLL2 VLL2 VLL2 110 B9 VLL1 VLL1 VLL1 111 B10 VCAP2 VCAP2 VCAP2 112 A10 VCAP1 VCAP1 VCAP1 113 A9 PTC4 LCD_P24 LCD_P24 PTC4 SPI0_PCS0 UART1_TX FTM0_CH3 CMP1_OUT LCD_P24 114 D8 PTC5 LCD_P25 LCD_P25 PTC5 SPI0_SCK LPT0_ALT2 CMP0_OUT LCD_P25 115 C8 PTC6 LCD_P26/ CMP0_IN0 LCD_P26/ CMP0_IN0 PTC6 SPI0_SOUT PDB0_EXT RG LCD_P26 116 B8 PTC7 LCD_P27/ CMP0_IN1 LCD_P27/ CMP0_IN1 PTC7 SPI0_SIN LCD_P27 117 A8 PTC8 LCD_P28/ ADC1_SE4 b/ CMP0_IN2 LCD_P28/ ADC1_SE4 b/ CMP0_IN2 PTC8 I2S0_MCLK I2S0_CLKIN LCD_P28 118 D7 PTC9 LCD_P29/ ADC1_SE5 b/ CMP0_IN3 LCD_P29/ ADC1_SE5 b/ CMP0_IN3 PTC9 I2S0_RX_B CLK FTM2_FLT0 LCD_P29 119 C7 PTC10 LCD_P30/ ADC1_SE6 b/ CMP0_IN4 LCD_P30/ ADC1_SE6 b/ CMP0_IN4 PTC10 I2C1_SCL I2S0_RX_F S LCD_P30 120 B7 PTC11 LCD_P31/ ADC1_SE7 b LCD_P31/ ADC1_SE7 b PTC11 I2C1_SDA I2S0_RXD LCD_P31 121 A7 PTC12 LCD_P32 LCD_P32 PTC12 UART4_RT S_b LCD_P32 122 D6 PTC13 LCD_P33 LCD_P33 PTC13 UART4_CT S_b LCD_P33 123 C6 PTC14 LCD_P34 LCD_P34 PTC14 UART4_RX LCD_P34 124 B6 PTC15 LCD_P35 LCD_P35 PTC15 UART4_TX LCD_P35 125 A6 PTC16 LCD_P36 LCD_P36 PTC16 CAN1_RX UART3_RX LCD_P36 126 D5 PTC17 LCD_P37 LCD_P37 PTC17 CAN1_TX UART3_TX LCD_P37 127 C5 PTC18 LCD_P38 LCD_P38 PTC18 UART3_RT S_b LCD_P38 128 B5 PTC19 LCD_P39 LCD_P39 PTC19 UART3_CT S_b LCD_P39 129 A5 PTD0 LCD_P40 LCD_P40 PTD0 SPI0_PCS0 UART2_RT S_b LCD_P40 130 D4 PTD1 LCD_P41/ ADC0_SE5 b LCD_P41/ ADC0_SE5 b PTD1 SPI0_SCK UART2_CT S_b LCD_P41 131 C4 PTD2 LCD_P42 LCD_P42 PTD2 SPI0_SOUT UART2_RX LCD_P42 132 B4 PTD3 LCD_P43 LCD_P43 PTD3 SPI0_SIN LCD_P43 UART2_TX EzPort K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 70 Preliminary Freescale Semiconductor, Inc. Pinout 144 144 LQF MAP P BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 133 A4 PTD4 LCD_P44 LCD_P44 PTD4 SPI0_PCS1 UART0_RT S_b FTM0_CH4 EWM_IN LCD_P44 134 A3 PTD5 LCD_P45/ ADC0_SE6 b LCD_P45/ ADC0_SE6 b PTD5 SPI0_PCS2 UART0_CT S_b FTM0_CH5 EWM_OUT _b LCD_P45 135 A2 PTD6 LCD_P46/ ADC0_SE7 b LCD_P46/ ADC0_SE7 b PTD6 SPI0_PCS3 UART0_RX FTM0_CH6 FTM0_FLT0 LCD_P46 136 M10 VSS VSS VSS 137 F8 VDD VDD VDD 138 A1 PTD7 LCD_P47 LCD_P47 PTD7 CMT_IRO FTM0_CH7 FTM0_FLT1 LCD_P47 139 B3 PTD10 DISABLED PTD10 140 B2 PTD11 DISABLED PTD11 SPI2_PCS0 SDHC0_CL KIN FB_AD8 141 B1 PTD12 DISABLED PTD12 SPI2_SCK SDHC0_D4 FB_AD7 142 C3 PTD13 DISABLED PTD13 SPI2_SOUT SDHC0_D5 FB_AD6 143 C2 PTD14 DISABLED PTD14 SPI2_SIN SDHC0_D6 FB_AD5 144 C1 PTD15 DISABLED PTD15 SPI2_PCS1 SDHC0_D7 FB_RW_b UART0_TX EzPort FB_AD9 8.2 K40 Pinouts The below figure shows the pinout diagram for the devices supported by this document. Many signals may be multiplexed onto a single pin. To determine what signals can be used on which pin, see the previous section. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 71 PTD15 PTD14 PTD13 PTD12 PTD11 PTD10 PTD7 VDD VSS PTD6 PTD5 PTD4 PTD3 PTD2 PTD1 PTD0 PTC19 PTC18 PTC17 PTC16 PTC15 PTC14 PTC13 PTC12 PTC11 PTC10 PTC9 PTC8 PTC7 PTC6 PTC5 PTC4 VCAP1 VCAP2 VLL1 VLL2 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 Pinout PTE0 1 108 VLL3 PTE1 2 107 VSS PTE2 3 106 PTC3 PTE3 4 105 PTC2 VDD 5 104 PTC1 VSS 6 103 PTC0 PTE4 7 102 PTB23 PTE5 8 101 PTB22 PTE6 9 100 PTB21 PTE7 10 99 PTB20 RESET_b ADC0_SE16/CMP1_IN2/ADC0_SE21 36 73 PTA19 72 74 PTA18 35 71 PTA24 ADC1_SE16/CMP2_IN2/ADC0_SE22 VSS 75 70 34 VDD PTA25 VSSA 69 PTA26 76 PTA17 77 33 68 32 VREFL PTA16 VREFH 67 PTA27 PTA15 78 66 31 PTA14 PTA28 VDDA 65 79 PTA13 30 64 PTA29 PGA1_DM/ADC1_DM0/ADC0_DM3 PTA12 80 63 29 PTA11 PTB0 PGA1_DP/ADC1_DP0/ADC0_DP3 62 81 PTA10 28 61 PTB1 PGA0_DM/ADC0_DM0/ADC1_DM3 PTA9 82 60 27 PTA8 PTB2 PGA0_DP/ADC0_DP0/ADC1_DP3 59 83 PTA7 26 58 PTB3 ADC1_DM1 PTA6 84 57 25 VSS PTB4 ADC1_DP1 56 85 VDD 24 55 PTB5 ADC0_DM1 PTA5 86 54 23 PTA4 PTB6 ADC0_DP1 53 87 PTA3 22 52 PTB7 VREGIN PTA2 88 51 21 PTA1 PTB8 VOUT33 50 89 PTA0 20 49 PTB9 USB0_DM PTE28 90 48 19 PTE27 PTB10 USB0_DP 47 91 PTE26 18 46 PTB11 VSS PTE25 92 45 17 PTE24 VSS VSS 44 93 VSS 16 43 VDD VDD VDD 94 42 15 VBAT PTB16 PTE12 41 95 EXTAL32 14 40 PTB17 PTE11 XTAL32 96 39 13 DAC1_OUT/CMP2_IN3/ADC1_SE23 PTB18 PTE10 38 PTB19 97 37 98 12 DAC0_OUT/CMP1_IN3/ADC0_SE23 11 VREF_OUT/CMP1_IN5/CMP0_IN5/ADC1_SE18 PTE8 PTE9 Figure 29. K40 144 LQFP Pinout Diagram K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 72 Preliminary Freescale Semiconductor, Inc. Revision History 1 2 3 4 5 6 7 8 9 10 11 12 A PTD7 PTD6 PTD5 PTD4 PTD0 PTC16 PTC12 PTC8 PTC4 VCAP1 PTC3 PTC2 A B PTD12 PTD11 PTD10 PTD3 PTC19 PTC15 PTC11 PTC7 VLL1 VCAP2 PTC1 PTC0 B C PTD15 PTD14 PTD13 PTD2 PTC18 PTC14 PTC10 PTC6 VLL2 VLL3 PTB23 PTB22 C D PTE2 PTE1 PTE0 PTD1 PTC17 PTC13 PTC9 PTC5 PTB21 PTB20 PTB19 PTB18 D E PTE6 PTE5 PTE4 PTE3 VDD VDD VDD VDD PTB17 PTB16 PTB11 PTB10 E F PTE10 PTE9 PTE8 PTE7 VDD VSS VSS VDD PTB9 PTB8 PTB7 PTB6 F G VOUT33 VREGIN PTE12 PTE11 VREFH VREFL VSS VSS PTB5 PTB4 PTB3 PTB2 G H USB0_DP USB0_DM VSS PTE28 VDDA VSSA VSS VSS PTB1 PTB0 PTA29 PTA28 H J ADC0_DP1 ADC0_DM1 ADC0_SE16/ CMP1_IN2/ ADC0_SE21 PTE27 PTA0 PTA1 PTA6 PTA7 PTA13 PTA27 PTA26 PTA25 J K ADC1_DP1 ADC1_DM1 PTE26 PTE25 PTA2 PTA3 PTA8 PTA12 PTA16 PTA17 PTA24 K ADC1_SE16/ CMP2_IN2/ ADC0_SE22 PGA0_DP/ PGA0_DM/ DAC0_OUT/ DAC1_OUT/ ADC0_DP0/ ADC1_DP3 ADC0_DM0/ ADC1_DM3 CMP1_IN3/ ADC0_SE23 CMP2_IN3/ ADC1_SE23 NC VBAT PTA4 PTA9 PTA11 PTA14 PTA15 RESET_b L PGA1_DP/ M ADC1_DP0/ ADC0_DP3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 PTE24 NC EXTAL32 XTAL32 PTA5 PTA10 VSS PTA19 PTA18 M 2 3 4 5 6 7 8 9 10 11 12 L 1 Figure 30. K40 144 MAPBGA Pinout Diagram 9 Revision History The following table provides a revision history for this document. Table 46. Revision History Rev. No. Date 1 11/2010 Substantial Changes Initial public revision Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 73 Revision History Table 46. Revision History (continued) Rev. No. Date Substantial Changes 2 3/2011 Many updates throughout 3 3/2011 Added sections that were inadvertently removed in previous revision 4 3/2011 Reworded IIC footnote in "Voltage and Current Operating Requirements" table. Added paragraph to "Peripheral operating requirements and behaviors" section. Added "JTAG full voltage range electricals" table to the "JTAG electricals" section. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 74 Preliminary Freescale Semiconductor, Inc. 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