AVAGO ACPL-074L Single-channel and dual-channel high speed 15 mbd cmos optocoupler with glitch-free power-up feature Datasheet

ACPL-071L and ACPL-074L
Single-channel and Dual-channel High Speed 15 MBd
CMOS optocoupler with Glitch-Free Power-Up Feature
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
Features
The ACPL-071L (single-channel) and ACPL-074L (dualchannel) are 15 MBd CMOS optocouplers in SOIC-8 package. The optocouplers utilize the latest CMOS IC technology to achieve outstanding performance with very low
power consumption. Basic building blocks of ACPL-071L
and ACPL-074L are high speed LEDs and CMOS detector
ICs. Each detector incorporates an integrated photodiode,
a high speed transimpedance amplifier, and a voltage
comparator with an output driver.
• +3.3V and +5 V CMOS compatibility
NC
1
8
VDD
ANODE
2
7
NC
6
VO
5
GND
NC
4
SHIELD
1
CATHODE1
2
CATHODE2
3
ANODE2
4
• High speed: 15 MBd min
• 10 kV/µs minimum common mode rejection
• –40 to 105°C temperature range
8 VDD
SHIELD
• UL recognized
• 3750 V rms for 1 min. per UL 1577
• CSA component acceptance Notice #5
• IEC/EN/DIN EN 60747-5-2 approved Option 060
Applications
• Digital field bus isolation:
• CANBus, RS485, USB
• Multiplexed data transmission
ACPL-074L
ANODE1
• 30 ns max. propagation delay skew
• Safety and regulatory approvals pending:
ACPL-071L
3
• 40ns max. propagation delay (for 3.3V supply voltage)
• Glitch-Free Power-Up Feature
Component Image
CATHODE
• 30 ns max. pulse width distortion
7
Vo1
6
Vo2
5
GND
• Computer peripheral interface
• Microprocessor system interface
• DC/DC converter
TRUTH TABLE
LED
OFF
ON
VO, OUTPUT
H
L
A 0.1uF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
ACPL-071L/074L are UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part number
RoHS Compliant
Package
-000E
ACPL-071L
-500E
-060E
ACPL-074L
Surface
Mount
SO-8
X
-000E
X
-560E
IEC/EN/DIN EN
60747-5-2
SO-8
X
X
X
1500 per reel
X
100 per tube
X
1500 per reel
100 per tube
X
X
X
Quantity
100 per tube
X
X
-060E
UL 5000 Vrms/
1 Minute
rating
X
-560E
-500E
Gull Wing
Tape&
Reel
X
1500 per reel
X
100 per tube
X
1500 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
ACPL-071L-500E to order product of Small Outline SO-8 package in Tape and Reel packaging in RoHS compliant.
Example 2:
ACPL-074L-000E to order product of Small Outline SO-8 package in tube packaging and RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Package Dimensions
ACPL-071L and ACPL-074L (Small Outline S0-8 Package)
LAND PATTERN RECOMMENDATION
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXXV
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
PIN ONE
1
2
3
4
0.406 ± 0.076
(0.016 ± 0.003)
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
7
1.524
(0.060)
45 X
0.432
(0.017)
0~7
0.228 ± 0.025
(0.009 ± 0.001)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.305 MIN.
(0.012)
Solder Reflow Thermal profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
200
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
TEMPERATURE (°C)
2.5 C ± 0.5 C/SEC.
30
SEC.
160°C
150°C
140°C
SOLDERING
TIME
200°C
30
SEC.
3oC + 1°C/–0.5°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
PEAK
TEMP.
230°C
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Regulatory Information
Recommended Pb-Free IR Flow
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
260 +0/-5 °C
TEMPERATURE
Tp
217 °C
TL
Tsmax
Tsmin
150 - 200 °C
20-40 SEC.
RAMP-UP
3 C/SEC. MAX.
RAMP-DOWN
6 °C/SEC. MAX.
ts
PREHEAT
60 to 180 SEC.
25
tp
tL
60 to 150 SEC.
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
t 25 °C to PEAK
TIME
Notes:
The time from 25 °C to peak temperature = 8 minutes max.
Tsmax = 200 °C, Tsmin = 150 °C
Non-halide flux should be used
The ACPL-071L and ACPL-074L have been approved by
the following organizations:
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01 (Option 060
only)
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Units
Conditions
Minimum External Air
Gap (Clearance)
L(I01)
4.9
mm
Measured from input terminals to output terminals,
shortest distance through air.
Minimum External
Tracking (Creepage)
L(I02)
4.8
mm
Measured from input terminals to output terminals,
shortest distance path along body.
Minimum Internal Plastic
Gap (Internal Clearance)
0.08
mm
Insulation thickness between emitter and detector;
also known as distance through insulation.
Tracking Resistance
CTI
(Comparative Tracking Index)
≥175
Volts
DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa
All Avago Technologies data sheets report the creepage
and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point for
the equipment designer when determining the circuit
insulation requirements. However, once mounted on a
printed circuit board,
minimum creepage and clearance requirements must be met as specified for individual
equipment standards. For creepage, the shortest distance
Material Group (DIN VDE 0110, 1/89, Table 1)
path along the surface of a printed circuit board between
the solder fillets of the input and output leads must be
considered. There are recommended techniques such as
grooves and ribs which may be used on a printed circuit
board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending
on factors such as pollution degree and insulation level.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (Option 060)
Description
Symbol
Option 060
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤150 V rms
for rated mains voltage ≤300 V rms
I-IV
I-III
Climatic Classification
55/105/21
Pollution Degree (DIN VDE 0110/1.89)
2
Units
Maximum Working Insulation Voltage
VIORM
560
VPEAK
Input to Output Test Voltage, Method b†
VIORM x 1.875 = VPR, 100% Production
Test with tm = 1 sec, Partial Discharge < 5 pC
VPR
1050
VPEAK
Input to Output Test Voltage, Method a†
VIORM x 1.5 = VPR, Type and Sample Test,
tm = 60 sec, Partial Discharge < 5 pC
VPR
840
VPEAK
Highest Allowable Overvoltage†
(Transient Overvoltage, tini = 10 sec)
VIOTM
4000
VPEAK
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Thermal Derating curve, Figure 11.)
Case Temperature
Input Current
Output Power
Ts
Is, INPUT
Ps,OUTPUT
150
150
600
°C
mA
mW
Insulation Resistance at TS, V10 = 500 V
RIO
≥109
Ω
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
–55
+125
°C
Ambient Operating Temperature
TA
–40
+105
°C
Supply Voltages
VDD
0
6.0
Volts
Output Voltage
VO
–0.5
VDD +0.5
Volts
Average Forward Input Current
IF
-
20.0
mA
Average Output Current
Io
-
10.0
mA
Lead Solder Temperature
260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Solder Reflow Temperature Profile Section
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Ambient Operating Temperature
TA
–40
+105
°C
Supply Voltages
VDD
4.5
5.5
V
3.0
3.6
V
Input Current (ON)
IF
9
18
mA
Supply Voltage Slew Rate[1]
SR
0.5
500
V/ms
Electrical Specifications
Over recommended temperature (TA = –40°C to +105°C), 3.0V ≤ VDD ≤ 3.6V and 4.5 V ≤ VDD ≤ 5.5 V.
All typical specifications are at TA=+25°C, VDD= +3.3V.
Parameter
Symbol
Input Forward Voltage
Input Reverse
Breakdown Voltage
Part Number
Min.
Typ.
Max.
Units
Test Conditions
VF
1.3
1.5
1.8
V
IF = 14mA
BVR
5.0
V
IR = 10 µA
Logic High Output Voltage VOH
VDD-1
VDD-0.3
V
IF = 0, IO = -4 mA, VDD=3.3V
VDD-1
VDD-0.2
V
IF = 0, IO = -4 mA, VDD=5V
Logic Low Output Voltage VOL
Input Threshold Current
ITH
Logic Low Output Supply
Current
IDDL
Logic Low Output Supply
Current
IDDH
0.35
0.8
V
IF = 14mA, IO =4mA, VDD=3.3V
0.2
0.8
V
IF = 14mA, IO = 4mA, VDD=5V
4.5
8.8
mA
IOL = 20 µA
ACPL-071L
4.1
6.0
mA
IF = 14 mA
ACPL-074L
8.3
12.0
mA
IF = 14 mA
ACPL-071L
3.8
6.0
mA
IF = 0
ACPL-074L
7.6
12.0
mA
IF = 0
Switching Specifications
Over recommended temperature (TA = –40°C to +105°C), 3.0V ≤ VDD ≤ 3.6V and 4.5 V ≤ VDD ≤ 5.5 V.
All typical specifications are at TA=+25°C, VDD = +3.3V.
Parameter
Symbol
Propagation Delay Time to
Logic Low Output[2]
tPHL
Propagation Delay Time to
Logic High Output[2]
Min.
tPLH
Typ.
Max.
Units
Test Conditions
29
40
ns
IF = 14mA, CL= 15pF, VDD=3.3V
CMOS Signal Levels
50
ns
IF = 14mA, CL= 15pF, VDD=5V
CMOS Signal Levels
40
ns
IF = 14mA, CL= 15pF, VDD=3.3V,
CMOS Signal Levels
50
ns
IF = 14mA, CL= 15pF, VDD=5V,
CMOS Signal Levels
22
Pulse Width
tPW
66.7
Pulse Width Distortion[3]
|PWD |
0
ns
7
25
ns
IF = 14mA, CL= 15pF, VDD=3.3V,
CMOS Signal Levels
30
ns
IF = 14mA, CL= 15pF, VDD=5V,
CMOS Signal Levels
30
ns
IF = 14mA, CL= 15pF
CMOS Signal Levels
Propagation Delay Skew[4]
tPSK
Output Rise Time
(10% – 90%)
tR
20
ns
IF = 14mA, CL= 15pF
CMOS Signal Levels
Output Fall Time
(90% - 10%)
tF
25
ns
IF = 14mA, CL= 15pF
CMOS Signal Levels
Common Mode Transient
Immunity at Logic High Output[5]
| CMH |
10
15
kV/µs
VCM = 1000 V, TA = 25°C, IF = 0 mA
Common Mode Transient
Immunity at Logic Low Output[6]
| CML |
10
15
kV/µs
VCM = 1000 V, TA = 25°C, IF = 14 mA
Package Characteristics
All Typical at TA = 25°C.
Parameter
Symbol
Input-Output Insulation
II-O
Input-Output Momentary
Withstand Voltage
VISO
Input-Output Resistance
R I-O
Input-Output Capacitance
C I-O
Min.
Typ.
Max.
Units
Test Conditions
1.0
µA
45% RH, t = 5 s
VI-O = 3 kV DC,
TA = 25°C
Vrms
RH ≤ 50%, t = 1 min.,
TA = 25°C
10 12
W
V I-O = 500 V dc
0.6
pF
f = 1 MHz, TA = 25°C
3750
Notes:
1. Slew rate of supply voltage ramping is recommended to ensure no glitch more than 1V to appear at the output pin.
2. tPHL propagation delay is measured from the 50% level on the rising edge of the input pulse to the 50% level of the falling edge of the VO signal.
tPLH propagation delay is measured from the 50% level on the falling edge of the input pulse to the 50% level of the rising edge of the VO signal.
3. PWD is defined as |tPHL - tPLH|.
4. tPSK is equal to the magnitude of the worst case difference in tPHL and/or tPLH that will be seen between units at any given temperature within the
recommended operating conditions.
5. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state.
6. CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state.
6
IF -FORWARD CURRENT-mA
100
TA=25°C
VF
10
Ith -INPUT THRESHOLD CURRENT-mA
IF
1
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
V F -FORWARD VOLTAGE-V
IDDH-LOGIC HIGH OUTPUT SUPPLY CURRENT -mA
Figure 1. Typical input diode forward characteristic.
10
8
6
4
0
VDD=5.0V
VDD=3.3V
-40
-20
0
20
40
60
T A -TEMPERATURE-o C
80
100
Figure 3. Typical logic high O/P supply current vs. temperature for ACPL-074L.
4
3
I oL =20uA
2
5V
3.3V
1
-40
-20
0
20
40
60
TA -TEMPERATURE-o C
80
100
120
Figure 2. Typical input threshold current vs. temperature.
12
2
5
0
1.6
IDDl -LOGIC LOW OUTPUT SUPPLY CURRENT-mA
1000
12
10
8
6
4
VDD=5.0V
VDD=3.3V
2
0
-40
-20
0
20
40
60
T A -TEMPERATURE-oC
80
100
Figure 4. Typical logic low O/P supply current vs. temperature for ACPL-074L.
TPHL CH1
TPLH CH2
TPLH CH1
PWD CH2
9 10 11 12 13 14
IF – PULSE INPUT CURRENT – mA
15
16
Figure 5. Typical switching speed vs. pulse input current at 5V supply voltage.
V F -FORWARD VOLTAGE-V
TPHL CH1
35
30
25
20
15
10
5
0
TPHL CH2
TPLH CH2
TPLH CH1
PWD CH1
PWD CH2
VDD=3.3V
TA=25°C
6
7
8
9 10 11 12 13 14
IF – PULSE INPUT CURRENT – mA
15
16
Figure 6. Typical switching speed vs. pulse input current at 3.3V supply
voltage.
Bypassing and PC Board Layout
1.6
The ACPL-071L and ACPL-074L optocouplers are extremely easy to use. ACPL-071L and ACPL-074L provide CMOS
logic output due to the high-speed CMOS IC technology
used.
1.55
1.5
1.45
The external components required for proper operation
are the input limiting resistor and the output bypass capacitor. Capacitor values should be between 0.01 µF and
0.1 µF.
1.4
-20
0
20
40
60
TA -TEMPERATURE-oC
80
100
Figure 7 Typical VF vs. temperature.
8
1
GND1
3
7 NC
6
5
4
C
VDD
VO
GND2
ACPL-071L
C = 0.01mF to 0.1mF
Figure 8. Recommended printed circuit board layout
For each capacitor, the total lead length between both
ends of the capacitor and the power-supply pins should
not exceed 20 mm.
IF1
1
8
GND 1
2
7
GND 1
3
IF2
4
XXX
YWW
2
XXX
YWW
IF
50
45
40
Application Information
1.65
1.35
-40
tp– PROPAGATION DELAY; PWD-PULSE WIDTH
DISTORTION – ns
tp – PROPAGATION DELAY; PWD-PULSE WIDTH
DISTORTION – ns
50
45
40
35
TPHL CH2
30
25
20
15
PWD CH1
10
VDD=5V
5 TA=25°C
0
6
7
8
VDD
VO1
VO2
6
5
ACPL-074L
C
GND 2
Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
Propagation delay is a figure of merit which describes how
quickly a logic signal propagates through a system. The
propagation delay from low to high (tPLH) is the amount
of time required for an input signal to propagate to the
output, causing the output to change from low to high.
Similarly, the propagation delay from high to low (tPHL) is
the amount of time required for the input signal to propagate to the output, causing the output to change from
high to low (see Figure 9).
Pulse-width distortion (PWD) results when tPLH and tPHL
differ in value. PWD is defined as the difference between
tPLH and tPHL and often PWD is defined as the difference
between tPLH and tPHL and often determines the maximum data rate capability of a transmission system. PWD
can be expressed in percent by dividing the PWD (in ns)
by the minimum pulse width (in ns) being transmitted.
Typically, PWD on the order of 20-30% of the minimum
pulse width is tolerable; the exact figure depends on the
particular application (RS232, RS422, T-1, etc.).
Propagation delay skew, tPSK, is an important parameter
to consider in parallel data applications where synchronization of signals on parallel data lines is a concern.
If the parallel data is being sent through a group of optocouplers, differences in propagation delays will cause the
data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delays is large
enough, it will determine the maximum rate at which parallel data can be sent through the optocouplers.
Propagation delay skew is defined as the difference between the minimum and maximum propagation delays,
IF
either tPLH or tPHL, for any given group of optocouplers
which are operating under the same conditions (i.e., the
same supply voltage, output load, and operating temperature). As illustrated in Figure 10, if the inputs of a group of
optocouplers are switched either ON or OFF at the same
time, tPSK is the difference between the shortest propagation delay, either tPLH or tPHL, and the longest propagation
delay, either tPLH or tPHL. As mentioned earlier, tPSK can determine the maximum parallel data transmission rate.
Figure 10 is the timing diagram of a typical parallel data
application with both the clock and the data lines being
sent through optocouplers. The figure shows data and
clock signals at the inputs and outputs of the optocouplers. To obtain the maximum data transmission rate, both
edges of the clock signal are being used to clock the data;
if only one edge were used, the clock signal would need
to be twice as fast.
Propagation delay skew represents the uncertainty of
where an edge might be after being sent through an optocoupler. Figure 10 shows that there will be uncertainty in
both the data and the clock lines. It is important that these
two areas of uncertainty not overlap, otherwise the clock
signal might arrive before all of the data outputs have
settled, or some of the data outputs may start to change
before the clock signal has arrived.
From these considerations, the absolute minimum pulse
width that can be sent through optocouplers in a parallel
application is twice tPSK. A cautious design should use a
slightly longer pulse width to ensure that any additional
uncertainty in the rest of the circuit does not cause a
problem.
DATA
50%
INPUTS
50%,
CMOS
VO
CLOCK
tPSK
IF
50%
DATA
OUTPUTS
VO
Figure 9. Propagation delay and skew waveform
10
50%,
CMOS
tPSK
CLOCK
tPSK
Figure 10. Parallel data transmission example
Powering Sequence
VDD needs to achieve a minimum level of 3.0V before
powering up the output connecting component.
Input Limiting Resistors
ACPL-071L and ACPL-074L are direct current driven (Figure
8), and thus eliminate the need for input power supply. To
limit the amount of current flowing through the LED, it is
recommended that a 210ohm resistor is connected in series with anode of LED (i.e. Pin 2 for ACPL-071L and Pin 1
and 4 for ACPL-074L) at 5V input signal. At 3.3V input signal, it is recommended to connect 80ohm resistor in series
with anode of LED.
t p - PROPAGATION DELAY; PWD-PULSE WIDTH
DISTORTION -ns
The recommended limiting resistors are based on the
assumption that the driver output impedence is 50Ω (as
shown in Figure 11).
35.00
tPHL
30.00
25.00
20.00
15.00
With peaking cap
Without peaking cap
tPLH
tPHL
tPLH
10.00
5.00
0.00
-40
|PWD|
-20
0
20
40
60
TA - TEMPERATURE - o C
(i) VDD=3.3V, Cpeak=100pF, Rlimit=80Ω
80
100
Speed Improvement
A peaking capacitor can be placed across the input current limit resistor (Figure 11) to achieve enhanced speed
performance. The value of the peaking cap is dependent
to the rise and fall time of the input signal and supply voltages and LED input driving current (If ). Figure 12 shows
significant improvement of propagation delay and pulse
with distortion with added peak capacitor at driving current of 14mA and 3.3V or 5V power supply.
Cpeak
R drv =50Ω
+
VDD2
R limit
V in
GND1
GND 2
SHIELD
Figure 11 Connection of peaking capacitor (Cpeak) in parallel of the input
limiting resistor (Rllimit) to improve speed performance
30.00
tPHL
25.00
20.00
15.00
10.00
With peaking cap
Without peaking cap
tPHL
5.00
0.00
-40
tPLH
tPLH
|PWD|
-20
0
20
40
60
TA - TEMPERATURE - o C
(ii) VDD=5V, Cpeak=100pF, Rlimit=210Ω
Figure 12. Improvement of tp and PWD with added 100pF peaking capacitor in parallel of input limiting resistor.
11
VO
0.1µF
-
t p - PROPAGATION DELAY; PWD-PULSE WIDTH
DISTORTION -ns
The tPSK specified optocouplers offer the advantages of
guaranteed specifications for propagation delays, pulsewidth distortion and propagation delay skew over the recommended temperature, and power supply ranges.
80
100
Rlimit
VCM
A
B
V DD2
IF
V O monitoring VCM
0.1µF
note
VO
VCM (PEAK)
0V
VDD
SWITCH AT A: I F = 0 mA
SWITCH AT B: I F = 14 mA
GND 2
SHIELD
Pulse Gen.
Zo=50Ω
+
VO
VO (min.)
VO (max.)
GND2
-
Figure 13. Test circuit for common mode transient immunity and typical waveforms. Rtotal is the total resistance of the driver output impedence (which is
assumed to be 50 Ω) and the limiting resistor (Rtotal=Rdrv+Rlimit) .
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved.
AV02-0963EN - June 2, 2008
CM H
CM L