ON MC33164P-3G Micropower undervoltage sensing circuit Datasheet

MC34164, MC33164,
NCV33164
Micropower Undervoltage
Sensing Circuits
The MC34164 series are undervoltage sensing circuits specifically
designed for use as reset controllers in portable microprocessor based
systems where extended battery life is required. These devices offer
the designer an economical solution for low voltage detection with a
single external resistor. The MC34164 series features a bandgap
reference, a comparator with precise thresholds and built−in hysteresis
to prevent erratic reset operation, an open collector reset output
capable of sinking in excess of 6.0 mA, and guaranteed operation
down to 1.0 V input with extremely low standby current. The MC
devices are packaged in 3−pin TO−226AA, micro size TSOP−5, 8−pin
SOIC−8 and Micro8™ surface mount packages. The NCV device is
packaged in SOIC−8.
Applications include direct monitoring of the 3.0 V or 5.0 V
MPU/logic power supply used in appliance, automotive, consumer,
and industrial equipment.
• Temperature Compensated Reference
• Monitors 3.0 V (MC34164−3) or 5.0 V (MC34164−5) Power Supplies
• Precise Comparator Thresholds Guaranteed Over Temperature
• Comparator Hysteresis Prevents Erratic Reset
• Reset Output Capable of Sinking in Excess of 6.0 mA
• Internal Clamp Diode for Discharging Delay Capacitor
• Guaranteed Reset Operation With 1.0 V Input
• Extremely Low Standby Current: As Low as 9.0 A
• Economical TO−226AA, TSOP−5, SOIC−8 and Micro8 Surface
Mount Packages
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
• Pb−Free Packages are Available
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8
1
1
2
3
TO−226AA
P SUFFIX
CASE 29
5
8
1
1
PIN CONNECTIONS
Reset 1
8 N.C.
Input 2
7 N.C.
N.C. 3
6 N.C.
Ground 4
5 N.C.
(Top View)
Pin 1.
2.
3.
4.
5.
Reset
TSOP−5
SN SUFFIX
CASE 483
Micro8
DM SUFFIX
CASE 846A
TSOP−5
Input
SOIC−8
D SUFFIX
CASE 751
Ground
Input
Reset
NC
NC
TO−226AA
Pin 1. Reset
2. Input
3. Ground
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
1.2 Vref
= Sink Only
Positive True Logic
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 9 of this data sheet.
GND
Figure 1. Representative Block Diagram
This device contains 28 active transistors.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 16
1
Publication Order Number:
MC34164/D
MC34164, MC33164, NCV33164
MAXIMUM RATINGS
Symbol
Value
Unit
Power Input Supply Voltage
Rating
Vin
−1.0 to 12
V
Reset Output Voltage
VO
−1.0 to 12
V
Reset Output Sink Current
ISink
Internally
Limited
mA
IF
100
mA
PD
RJA
700
178
mW
°C/W
PD
RJA
700
178
mW
°C/W
PD
RJA
520
240
mW
°C/W
Operating Junction Temperature
TJ
+150
°C
Operating Ambient Temperature Range
MC34164 Series
MC33164 Series, NCV33164
TA
Storage Temperature Range
Tstg
Clamp Diode Forward Current, Reset to Input Pin (Note 1)
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
°C
0 to +70
− 40 to +125
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
°C
− 65 to +150
ESD
V
4000
200
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
MC34164−3, MC33164−3 SERIES, NCV33164−3
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 2 & 3], unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
VIH
VIL
VH
2.55
2.55
0.03
2.71
2.65
0.06
2.80
2.80
−
−
−
0.14
0.1
0.4
0.3
6.0
12
30
−
−
0.02
0.02
0.5
1.0
VF
0.6
0.9
1.2
V
Operating Input Voltage Range
Vin
1.0 to 10
−
−
V
Quiescent Input Current
Vin = 3.0 V
Vin = 6.0 V
Iin
−
−
9.0
24
15
40
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
V
RESET OUTPUT
Output Sink Saturation
(Vin = 2.4 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
VOL
Output Sink Current (Vin, Reset = 2.4 V)
ISink
V
Output Off−State Leakage
(Vin, Reset = 3.0 V)
(Vin, Reset = 10 V)
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA)
mA
A
IR(leak)
TOTAL DEVICE
A
1. Maximum package power dissipation limits must be observed.
2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
3. Tlow = 0°C for MC34164
Thigh = +70°C for MC34164
= − 40°C for MC33164, NCV33164
= +125°C for MC33164, NCV33164
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2
MC34164, MC33164, NCV33164
MC34164−5, MC33164−5 SERIES, NCV33164−5
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 5 & 6], unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
VIH
VIL
VH
4.15
4.15
0.02
4.33
4.27
0.09
4.45
4.45
−
−
−
0.14
0.1
0.4
0.3
7.0
20
50
−
−
0.02
0.02
0.5
2.0
VF
0.6
0.9
1.2
V
Operating Input Voltage Range
Vin
1.0 to 10
−
−
V
Quiescent Input Current
Vin = 5.0 V
Vin = 10 V
Iin
−
−
12
32
20
50
COMPARATOR
V
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
VOL
Output Sink Current (Vin, Reset = 4.0 V)
V
ISink
mA
A
IR(leak)
Output Off−State Leakage
(Vin, Reset = 5.0 V)
(Vin, Reset = 10 V)
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA)
TOTAL DEVICE
A
4. Maximum package power dissipation limits must be observed.
5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Tlow = 0°C for MC34164
Thigh = +70°C for MC34164
= − 40°C for MC33164, NCV33164
= +125°C for MC33164, NCV33164
7. NCV prefix is for automotive and other applications requiring site and change control.
10
RL = 82 k to Vin
TA = 25°C
8.0
VO , OUTPUT VOLTAGE (V)
VO , OUTPUT VOLTAGE (V)
10
6.0
4.0
2.0
0
RL = 82 k to Vin
TA = 25°C
8.0
6.0
4.0
2.0
0
0
2.0
4.0
6.0
Vin, INPUT VOLTAGE (V)
8.0
0
10
Figure 2. MC3X164−3 Reset Output
Voltage versus Input Voltage
2.0
4.0
6.0
Vin, INPUT VOLTAGE (V)
8.0
Figure 3. MC3X164−5 Reset Output
Voltage versus Input Voltage
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3
10
5.0
5.0
4.0
4.0
V O , OUTPUT VOLTAGE (V)
V O , OUTPUT VOLTAGE (V)
MC34164, MC33164, NCV33164
3.0
2.0
1.0
3.0
2.0
1.0
RL = 82 k to Vin
TA = 25°C
RL = 82 k to Vin
TA = 25°C
0
2.62
2.66
2.70
2.74
0
4.22
2.78
4.26
Vin, INPUT VOLTAGE (V)
Figure 4. MC3X164−3 Reset Output
Voltage versus Input Voltage
Upper Threshold
High State Output
V in , THRESHOLD VOLTAGE (V)
V in , THRESHOLD VOLTAGE (V)
4.38
4.36
2.72
2.68
2.64
Lower Threshold
Low State Output
2.60
−50
−25
0
25
50
75
100
Upper Threshold
High State Output
4.32
4.28
4.24
Lower Threshold
Low State Output
4.20
−50
125
−25
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 6. MC3X164−3 Comparator Threshold
Voltage versus Temperature
Figure 7. MC3X164−5 Comparator Threshold
Voltage versus Temperature
50
50
TA = 25°C
40
I in, INPUT CURRENT (μ A)
I in, INPUT CURRENT (μ A)
4.34
Figure 5. MC3X164−5 Reset Output
Voltage versus Input Voltage
2.76
30
TA = 0°C
20
TA = 70°C
10
0
4.30
Vin, INPUT VOLTAGE (V)
0
2.0
4.0
6.0
8.0
40
20
TA = 0°C
TA = 70°C
10
0
10
TA = 25°C
30
0
2.0
4.0
6.0
8.0
Vin, INPUT VOLTAGE (V)
Vin, INPUT VOLTAGE (V)
Figure 8. MC3X164−3 Input Current
versus Input Voltage
Figure 9. MC3X164−5 Input Current
versus Input Voltage
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4
10
MC34164, MC33164, NCV33164
4.0
Vin = 2.4 V
3.0
V OL, OUTPUT SATURATION (V)
V OL, OUTPUT SATURATION (V)
4.0
TA = 70°C
TA = 25°C
2.0
TA = 0°C
TA = 25°C
TA = 0°C
1.0
TA = 70°C
0
TA = 25°C
Vin, Reset = 4 V
TA = 70°C
TA = 0°C
3.0
TA = 25°C
2.0
TA = 0°C
1.0
TA = 70°C
0
0
4.0
8.0
12
16
20
4.0
0
8.0
12
16
VSink, SINK CURRENT (mA)
ISink, SINK CURRENT (mA)
Figure 10. MC3X164−3 Reset Output
Saturation versus Sink Current
Figure 11. MC3X164−5 Reset Output
Saturation versus Sink Current
I F , FORWARD CURRENT (mA)
32
Vin = 5.0 V to 4.0 V
RL = 43 k
TA = 25°C
Reset
Vin = 0 V
TA = 25°C
24
90%
Vin
5.0 V
16
4.0 V
Vin
8.0
10
%
43k
5.0V
4.0V
Reset
Ref
0
0
0.4
0.8
1.2
5.0 s/DIV
1.6
VF , FORWARD VOLTAGE (V)
Figure 12. Clamp Diode Forward Current
versus Voltage
Figure 13. Reset Delay Time
(MC3X164−5 Shown)
R
Input
Power
Supply
Reset
Microprocessor
Circuit
Reset
CDLY
1.2 Vref
tDLY = RCDLY In
ǒ
1−
GND
1
Vth(MPU)
Vin
A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power
supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 s. Vth(MPU) is
the microprocessor reset input threshold.
Figure 14. Low Voltage Microprocessor Reset
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5
Ǔ
20
MC34164, MC33164, NCV33164
Test Data
RH
Iin
Vin
RL
Power
Supply
Microprocessor
Circuit
Reset
1.2 Vref
MC3X164−5
VH ≈
4.3 RH
RL
+ 0.06
Vth(lower) ≈ 10 RH x 10−6
GND
where: RH ≤ 1.0 k
43 k ≥ RL ≥ 4.3 k
VH
(mV)
Vth
(mV)
RH
()
RL
(k)
60
103
123
160
155
199
280
262
306
357
421
530
0
1.0
1.0
1.0
2.2
2.2
2.2
4.7
4.7
4.7
4.7
4.7
0
100
100
100
220
220
220
470
470
470
470
470
43
10
6.8
4.3
10
6.8
4.3
10
8.2
6.8
5.6
4.3
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current
Iin as Vin crosses the comparator threshold (Figure 8). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 10 A at 4.3 V. The
equations are accurate to ±10% with RH less than 1.0 k and RL between 4.3 k and 43 k.
Figure 15. Low Voltage Microprocessor Reset With Additional Hysteresis
(MC3X164−5 Shown)
Input
1.0 k
Input
Power
Supply
Reset
Reset
Solar
Cells
1.2 Vref
1.2 Vref
GND
GND
Figure 16. Voltage Monitor
Figure 17. Solar Powered Battery Charger
VCC
RL
MTP3055EL
270
4.3V
Input
Reset
Overheating of the logic level power MOSFET due to insufficient
gate voltage can be prevented with the above circuit. When the
input signal is below the 4.3 V threshold of the MC3X164−5, its
output grounds the gate of the L2 MOSFET.
1.2 Vref
GND MC3X164−5
Figure 18. MOSFET Low Voltage Gate Drive Protection Using the MC3X164−5
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6
MC34164, MC33164, NCV33164
ORDERING INFORMATION
Device
Package
MC33164D−3
Shipping †
SOIC−8
MC33164D−3G
SOIC−8
(Pb−Free)
MC33164D−3R2
SOIC−8
MC33164D−3R2G
SOIC−8
(Pb−Free)
NCV33164D−3R2*
SOIC−8
NCV33164D−3R2G*
98 Units / Rail
2500 Units / Tape & Reel
SOIC−8
(Pb−Free)
MC33164DM−3R2
Micro8
MC33164DM−3R2G
Micro8
(Pb−Free)
MC33164P−3
4000 Units / Tape & Reel
TO−92
MC33164P−3G
TO−92
(Pb−Free)
MC33164P−3RA
2000 Units / Box
TO−92
MC33164P−3RAG
TO−92
(Pb−Free)
MC33164P−3RP
2000 Units / Tape & Reel
TO−92
MC33164P−3RPG
TO−92
(Pb−Free)
MC33164D−5
2000 Units / Pack
SOIC−8
MC33164D−5G
SOIC−8
(Pb−Free)
MC33164D−5R2
SOIC−8
MC33164D−5R2G
SOIC−8
(Pb−Free)
NCV33164D−5R2*
SOIC−8
NCV33164D−5R2G*
98 Units / Rail
2500 Units / Tape & Reel
SOIC−8
(Pb−Free)
MC33164DM−5R2
Micro8
MC33164DM−5R2G
Micro8
(Pb−Free)
MC33164P−5
4000 Units / Tape & Reel
TO−92
MC33164P−5G
TO−92
(Pb−Free)
MC33164P−5RA
2000 Units / Box
TO−92
MC33164P−5RAG
TO−92
(Pb−Free)
MC33164P−5RP
2000 Units / Tape & Reel
TO−92
MC33164P−5RPG
TO−92
(Pb−Free)
MC34164D−3
2000 Units / Pack
SOIC−8
MC34164D−3G
SOIC−8
(Pb−Free)
MC34164D−3R2
SOIC−8
MC34164D−3R2G
SOIC−8
(Pb−Free)
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7
98 Units / Rail
2500 Units / Tape & Reel
MC34164, MC33164, NCV33164
ORDERING INFORMATION
Device
Package
MC34164DM−3R2
Shipping †
Micro8
MC34164DM−3R2G
MC34164P−3
MC34164P−3G
MC34164P−3RP
MC34164P−3RPG
MC34164D−5
Micro8
(Pb−Free)
4000 Units / Tape & Reel
TO−92
2000 Units / Box
TO−92
(Pb−Free)
2000 Units / Box
TO−92
2000 Units / Pack
TO−92
(Pb−Free)
2000 Units / Pack
SOIC−8
MC34164D−5G
SOIC−8
(Pb−Free)
98 Units / Rail
MC34164D−5R2
SOIC−8
2500 Units / Tape & Reel
MC34164D−5R2G
SOIC−8
(Pb−Free)
2500 Units / Tape & Reel
MC34164DM−5R2
Micro8
4000 Units / Tape & Reel
Micro8
(Pb−Free)
4000 Units / Tape & Reel
MC34164DM−5R2G
MC34164SN−5T1
TSOP−5
MC34164SN−5T1G
MC34164P−5
MC34164P−5G
MC34164P−5RA
TSOP−5
(Pb−Free)
3000 Units / Tape & Reel
TO−92
2000 Units / Box
TO−92
(Pb−Free)
2000 Units / Box
TO−92
MC34164P−5RAG
MC34164P−5RP
MC34164P−5RPG
TO−92
(Pb−Free)
2000 Units / Tape & Reel
TO−92
2000 Units / Pack
TO−92
(Pb−Free)
2000 Units / Pack
*NCV33164: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring
site and change control.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
MC34164, MC33164, NCV33164
PIN CONNECTIONS AND MARKING DIAGRAMS
SOIC−8
D SUFFIX
CASE 751
TSOP−5
SN SUFFIX
CASE 483
5
4
8
2 3
Micro8
MC34164DM
CASE 846A
8
MIy0
YWW
AWL
3x164
ALYWy
G
SRCYWG
1
Micro8
MC33164DM
CASE 846A
8
MCy0
YWW
AWL
TO−92
MC3x164P−yRA
MC3x164P−yRP
MC3x164P−y
CASE 29
MC3x1
64P−y
YWW
1
1
SRC
x
y
A
WL, L
YY, Y
WW, W
G
1
= Device Code
= Device Number 3 or 4
= Suffix Number 3 or 5
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free
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9
123
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
TO−226AA
P SUFFIX
CASE 29−11
ISSUE AL
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
B
R
P
L
SEATING
PLANE
K
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
D
X X
G
J
H
V
C
SECTION X−X
1
N
N
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10
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
−−−
0.250
−−−
0.080
0.105
−−− 0.100
0.115
−−−
0.135
−−−
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
−−−
6.35
−−−
2.04
2.66
−−−
2.54
2.93
−−−
3.43
−−−
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
PLASTIC PACKAGE
CASE 483−02
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
D
5
S
4
1
2
B
3
L
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
J
C
0.05 (0.002)
H
M
K
MILLIMETERS
MIN
MAX
2.90
3.10
1.30
1.70
0.90
1.10
0.25
0.50
0.85
1.05
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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11
INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0_
10 _
0.0985 0.1181
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
SOIC−8
D SUFFIX
CASE 751−07
ISSUE AG
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
12
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8 _
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC34164, MC33164, NCV33164
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
−A−
−B−
K
PIN 1 ID
G
D 8 PL
0.08 (0.003)
M
T B
S
A
DIM
A
B
C
D
G
H
J
K
L
S
SEATING
−T− PLANE
0.038 (0.0015)
C
L
J
H
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
3.20
0.126
6X
8X
4.24
0.167
0.65
0.0256
5.28
0.208
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
−−−
1.10
0.25
0.40
0.65 BSC
0.05
0.15
0.13
0.23
4.75
5.05
0.40
0.70
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
−−− 0.043
0.010
0.016
0.026 BSC
0.002
0.006
0.005
0.009
0.187
0.199
0.016
0.028
MC34164, MC33164, NCV33164
Micro8 is a trademark of International Rectifier.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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LITERATURE FULFILLMENT:
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14
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For additional information, please contact your
local Sales Representative.
MC34164/D
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