Freescale MMG3013NT1 Heterojunction bipolar transistor Datasheet

Freescale Semiconductor
Technical Data
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
MMG3013NT1
Broadband High Linearity Amplifier
The MMG3013NT1 is a general purpose amplifier that is internally input
matched and internally output matched. It is designed for a broad range of
Class A, small--signal, high linearity, general purpose applications. It is
suitable for applications with frequencies from 0 to 6000 MHz such as
cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general
small--signal RF.
0--6000 MHz, 20 dB
20.5 dBm
InGaP HBT
LIFETIME BUY
Features
• Frequency: 0--6000 MHz
• P1dB: 20.5 dBm @ 900 MHz
• Small--Signal Gain: 20 dB @ 900 MHz
• Third Order Output Intercept Point: 36 dBm @ 900 MHz
• Single 5 Volt Supply
• Internally Matched to 50 Ohms
• Cost--effective SOT--89 Surface Mount Package
• In Tape and Reel. T1 Suffix = 1000 Units, 12 mm Tape Width, 7 inch Reel.
Table 1. Typical Performance (1)
3
CASE 1514--02, STYLE 1
SOT--89
PLASTIC
Table 2. Maximum Ratings
Characteristic
Symbol
900
MHz
2140
MHz
3500
MHz
Unit
Small--Signal Gain
(S21)
Gp
20
17
14.5
dB
--17
12
Input Return Loss
(S11)
IRL
--19
--15
dB
Output Return Loss
(S22)
ORL
--11
--9
--12
dB
Power Output @1dB
Compression
P1dB
20.5
20.5
19
dBm
Third Order Output
Intercept Point
OIP3
36
34
32
dBm
Rating
Symbol
Value
Unit
Supply Voltage
VCC
7
V
Supply Current
ICC
300
mA
RF Input Power
Pin
12
dBm
Storage Temperature Range
Tstg
--65 to +150
°C
Junction Temperature (2)
TJ
150
°C
2. For reliable operation, the junction temperature should not
exceed 150°C.
1. VCC = 5 Vdc, TA = 25°C, 50 ohm system.
Table 3. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 89°C, 5 Vdc, 90 mA, no RF applied
Symbol
Value (3)
Unit
RθJC
42
°C/W
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
© Freescale Semiconductor, Inc., 2005--2008, 2012. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
Document Number: MMG3013NT1
Rev. 7, 2/2012
MMG3013NT1
1
Characteristic
Symbol
Min
Typ
Max
Unit
Gp
19.3
16
20
17
—
—
dB
Input Return Loss (S11)
IRL
—
--17
—
dB
Output Return Loss (S22)
ORL
—
--11
—
dB
Power Output @ 1dB Compression
P1dB
—
20.5
—
dBm
Third Order Output Intercept Point
OIP3
—
36
—
dBm
NF
—
4
—
dB
Supply Current (1)
ICC
80
90
110
mA
(1)
VCC
—
5
—
V
Small--Signal Gain (S21)
Noise Figure
Supply Voltage
900 MHz
2140 MHz
LIFETIME BUY
1. For reliable operation, the junction temperature should not exceed 150°C.
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TA = 25°C, 50 ohm system, in Freescale Application Circuit)
MMG3013NT1
2
RF Device Data
Freescale Semiconductor, Inc.
Table 5. Functional Pin Description
2
Pin Function
1
RFin
2
Ground
3
RFout/DC Supply
1
2
3
Figure 1. Functional Diagram
Table 6. ESD Protection Characteristics
Test Methodology
Class
1A
Machine Model (per EIA/JESD 22--A115)
A
Charge Device Model (per JESD 22--C101)
IV
LIFETIME BUY
Human Body Model (per JESD 22--A114)
Table 7. Moisture Sensitivity Level
Test Methodology
Per JESD 22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
1
260
°C
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
Pin
Number
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
3
50 OHM TYPICAL CHARACTERISTICS
S22
25°C
--10
S11, S22 (dB)
20
--40°C
15
1
0
2
3
--40
1
0
4
2
3
4
f, FREQUENCY (GHz)
f, FREQUENCY (GHz)
Figure 2. Small--Signal Gain (S21) versus
Frequency
Figure 3. Input/Output Return Loss versus
Frequency
23
23
21
P1dB, 1 dB COMPRESSION POINT (dBm)
Gp, SMALL--SIGNAL GAIN (dB)
LIFETIME BUY
S11
VCC = 5 Vdc
VCC = 5 Vdc
10
900 MHz
19
2140 MHz
1960 MHz
17
2600 MHz
15
3500 MHz
13
11
VCC = 5 Vdc
9
10
12
16
14
18
21
20
19
18
17
VCC = 5 Vdc
0.5
20
1
1.5
2
2.5
3
Pout, OUTPUT POWER (dBm)
f, FREQUENCY (GHz)
Figure 4. Small--Signal Gain versus Output
Power
Figure 5. P1dB versus Frequency
160
140
120
100
80
60
40
20
0
4
22
16
180
ICC, COLLECTOR CURRENT (mA)
--20
--30
4.2
4.4
4.6
4.8
5
5.2
VCC, COLLECTOR VOLTAGE (V)
Figure 6. Collector Current versus Collector
Voltage
5.4
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
Gp, SMALL--SIGNAL GAIN (dB)
TC = 85°C
3.5
39
36
33
30
27
VCC = 5 Vdc
100 kHz Tone Spacing
24
0
1
2
3
f, FREQUENCY (GHz)
Figure 7. Third Order Output Intercept Point
versus Frequency
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
0
25
4
MMG3013NT1
4
RF Device Data
Freescale Semiconductor, Inc.
33
30
27
f = 900 MHz
1 MHz Tone Spacing
24
4.9
4.95
5
5.05
5.1
VCC, COLLECTOR VOLTAGE (V)
38
37
36
35
34
33
VCC = 5 Vdc
f = 900 MHz
1 MHz Tone Spacing
32
31
--40
--20
20
40
60
80
100
T, TEMPERATURE (_C)
Figure 9. Third Order Output Intercept Point
versus Case Temperature
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
105
--30
--40
MTTF (YEARS)
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
0
--50
--60
104
VCC = 5 Vdc
f = 900 MHz
100 kHz Tone Spacing
--70
103
--80
5
8
11
14
120
20
17
125
Pout, OUTPUT POWER (dBm)
4
2
VCC = 5 Vdc
0
2
3
140
145
150
Figure 11. MTTF versus Junction Temperature
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
6
1
135
NOTE: The MTTF is calculated with VCC = 5 Vdc, ICC = 90 mA
Figure 10. Third Order Intermodulation Distortion
versus Output Power
0
130
TJ, JUNCTION TEMPERATURE (°C)
4
--20
VCC = 5 Vdc, f = 2140 MHz
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)
--30
--40
--50
--60
--70
6
8
10
12
14
16
f, FREQUENCY (GHz)
Pout, OUTPUT POWER (dBm)
Figure 12. Noise Figure versus Frequency
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
18
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
36
8
NF, NOISE FIGURE (dB)
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
39
LIFETIME BUY
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
50 OHM TYPICAL CHARACTERISTICS
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
5
50 OHM APPLICATION CIRCUIT: 40--800 MHz
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
S21, S11, S22 (dB)
LIFETIME BUY
C1
Z1, Z5
Z2
Z3
Z3
Z4
Z5
C2
VCC
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
RF
OUTPUT
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, εr = 4.1
Figure 14. 50 Ohm Test Circuit Schematic
30
S21
20
R1
10
0
L1
--10
C4
C3
C2
C1
S22
--20
S11
--30
MMG30XX
Rev 2
VCC = 5 Vdc
--40
0
200
400
600
800
f, FREQUENCY (MHz)
Figure 15. S21, S11 and S22 versus Frequency
Figure 16. 50 Ohm Test Circuit Component Layout
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
0.01 μF Chip Capacitors
C0603C103J5RAC
Kemet
C3
0.1 μF Chip Capacitor
C0603C104J5RAC
Kemet
C4
1 μF Chip Capacitor
C0603C105J5RAC
Kemet
L1
470 nH Chip Inductor
BK2125HM471--T
Taiyo Yuden
R1
0 Ω Chip Resistor
ERJ3GEY0R00V
Panasonic
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
VSUPPLY
MMG3013NT1
6
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 800--3600 MHz
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
S21, S11, S22 (dB)
LIFETIME BUY
C1
Z1, Z5
Z2
Z3
Z3
Z4
Z5
C2
VCC
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
RF
OUTPUT
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, εr = 4.1
Figure 17. 50 Ohm Test Circuit Schematic
30
S21
20
R1
10
L1
0
--20
S11
--30
800
1200
1600
C2
C1
S22
--10
C4
C3
2000
MMG30XX
Rev 2
VCC = 5 Vdc
2400
2800
3200
3600
f, FREQUENCY (MHz)
Figure 18. S21, S11 and S22 versus Frequency
Figure 19. 50 Ohm Test Circuit Component Layout
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
150 pF Chip Capacitors
C0603C151J5RAC
Kemet
C3
0.1 μF Chip Capacitor
C0603C104J5RAC
Kemet
C4
1 μF Chip Capacitor
C0603C105J5RAC
Kemet
L1
56 nH Chip Inductor
HK160856NJ--T
Taiyo Yuden
R1
0 Ω Chip Resistor
ERJ3GEY0R00V
Panasonic
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
VSUPPLY
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
7
50 OHM TYPICAL CHARACTERISTICS
S11
S21
S12
S22
f
MHz
|S11|
∠φ
|S21|
∠φ
|S12|
∠φ
|S22|
∠φ
100
0.162717
171.108
11.479238
174.775
0.069393
--1.296
0.106264
--133.221
150
0.160561
167.971
11.415032
171.459
0.069131
--1.887
0.112247
--134.322
200
0.160153
163.027
11.337210
168.606
0.068870
--2.702
0.118610
--135.449
250
0.157910
159.994
11.263950
165.874
0.068640
--3.308
0.127240
--136.522
300
0.155640
156.091
11.200930
163.101
0.068460
--3.908
0.134977
--137.648
350
0.152870
152.178
11.160790
160.282
0.068400
--4.523
0.144410
--138.763
400
0.150710
148.189
11.096270
157.597
0.068380
--5.134
0.154090
--139.895
450
0.148730
144.135
11.027770
154.845
0.068210
--5.794
0.164250
--140.998
500
0.145840
140.465
10.957540
152.097
0.068260
--6.391
0.174550
--142.085
550
0.143950
136.404
10.876040
149.449
0.068090
--6.918
0.185240
--143.132
600
0.141980
132.557
10.785240
146.811
0.068040
--7.57
0.195510
--144.211
650
0.140120
128.67
10.695820
144.176
0.068000
--8.199
0.206040
--145.338
700
0.138450
124.924
10.604510
141.59
0.067790
--8.743
0.216910
--146.461
750
0.137510
121.228
10.504830
139.003
0.067690
--9.285
0.227810
--147.659
800
0.136570
117.62
10.400340
136.446
0.067590
--9.831
0.238140
--148.902
850
0.134433
114.245
10.295550
133.89
0.067520
--10.415
0.248290
--150.118
900
0.132707
110.998
10.186390
131.409
0.067420
--10.866
0.258400
--151.55
950
0.131087
107.842
10.073620
128.963
0.067380
--11.449
0.268360
--153.097
1000
0.129567
104.859
9.965510
126.525
0.067220
--11.901
0.277810
--154.786
1050
0.128275
102.209
9.842290
124.132
0.067050
--12.399
0.287510
--156.435
1100
0.127137
99.637
9.725320
121.744
0.066970
--12.949
0.297010
--158.367
1150
0.125513
97.509
9.610100
119.381
0.066930
--13.483
0.306110
--160.411
1200
0.124020
95.409
9.485500
117.045
0.066790
--13.882
0.314950
--162.397
1250
0.122379
93.482
9.367530
114.76
0.066840
--14.46
0.323700
--164.386
1300
0.121234
91.761
9.251560
112.507
0.066710
--14.928
0.332570
--166.443
1350
0.120081
90.16
9.129800
110.251
0.066685
--15.375
0.339940
--168.554
1400
0.118817
88.664
9.011610
108.055
0.066670
--15.818
0.348650
--170.582
1450
0.116609
87.326
8.892430
105.876
0.066687
--16.365
0.356290
--172.695
1500
0.115374
86.23
8.772640
103.703
0.066764
--16.815
0.360061
--174.724
1550
0.113850
80.021
8.708890
101.399
0.066970
--17.493
0.364627
--177.374
1600
0.113120
77.212
8.598320
99.278
0.067057
--17.963
0.369410
--179.169
1650
0.112080
75.253
8.485180
97.137
0.067090
--18.477
0.374600
179.129
1700
0.111350
72.833
8.379040
95.075
0.067170
--18.984
0.380650
177.406
1750
0.110660
70.651
8.273700
93.021
0.067200
--19.462
0.386070
175.7
1800
0.110070
68.704
8.167240
90.99
0.067260
--19.938
0.391590
174.044
1850
0.109570
66.752
8.063390
88.942
0.067320
--20.42
0.396600
172.328
1900
0.108940
64.808
7.958390
86.97
0.067420
--20.891
0.402290
170.798
1950
0.107610
63.28
7.856150
84.972
0.067460
--21.389
0.407630
169.234
2000
0.106800
61.916
7.751440
83.012
0.067560
--21.917
0.412720
167.75
2050
0.106240
60.415
7.651320
81.047
0.067600
--22.347
0.418620
166.176
2100
0.104410
59.082
7.553170
79.114
0.067810
--22.888
0.423200
164.723
2150
0.103200
57.787
7.452840
77.223
0.067960
--23.444
0.428690
163.19
2200
0.102820
56.94
7.354920
75.325
0.067980
--23.91
0.433410
161.75
2250
0.101220
55.6
7.259510
73.436
0.068230
--24.487
0.438440
160.241
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
LIFETIME BUY
Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25°C, 50 Ohm System)
(continued)
MMG3013NT1
8
RF Device Data
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
S11
f
MHz
|S11|
2300
2350
S21
S12
S22
∠φ
|S21|
∠φ
|S12|
∠φ
|S22|
∠φ
0.100260
54.54
7.163530
71.577
0.068190
--24.984
0.442830
158.869
0.098910
53.312
7.072340
69.734
0.068480
--25.485
0.447010
157.463
2400
0.097870
52.576
6.980770
67.882
0.068550
--26.108
0.451420
155.974
2450
0.096530
51.814
6.892310
66.059
0.068780
--26.694
0.457800
154.6
2500
0.095360
50.69
6.802480
64.259
0.068940
--27.154
0.460110
153.074
2550
0.094140
49.939
6.719330
62.461
0.069120
--27.644
0.464930
151.617
2600
0.093150
49.177
6.634260
60.65
0.069290
--28.295
0.469350
150.014
2650
0.092180
48.019
6.554070
58.859
0.069490
--28.971
0.473140
148.442
2700
0.091130
47.141
6.471630
57.062
0.069610
--29.561
0.477010
146.825
2750
0.090470
46.394
6.392370
55.299
0.069850
--30.111
0.481850
145.214
2800
0.089850
45.454
6.314980
53.505
0.070210
--30.649
0.485260
143.56
2850
0.088790
44.657
6.238550
51.724
0.070340
--31.402
0.489440
141.782
2900
0.088180
44.083
6.166300
50.021
0.070550
--32.044
0.494180
140.078
2950
0.087640
43.291
6.088480
48.207
0.070750
--32.738
0.497180
138.23
3000
0.086490
42.549
6.020040
46.489
0.071030
--33.388
0.501590
136.357
3050
0.087170
42.041
5.950380
44.764
0.071280
--34.097
0.505070
134.738
3100
0.086660
41.37
5.881680
43.022
0.071610
--34.666
0.509400
132.754
3150
0.086130
41.387
5.814190
41.268
0.071920
--35.528
0.514040
130.875
3200
0.086330
41.301
5.749680
39.547
0.072150
--36.302
0.518490
128.954
3250
0.086760
41.239
5.684930
37.829
0.072340
--36.943
0.523620
126.955
3300
0.086510
41.638
5.619060
36.098
0.072640
--37.799
0.525880
124.995
3350
0.086820
41.81
5.557890
34.368
0.072800
--38.546
0.530230
123.081
3400
0.087230
42.12
5.498110
32.629
0.073130
--39.319
0.534740
121.057
3450
0.087680
42.727
5.437290
30.936
0.073490
--40.144
0.538080
119.195
3500
0.087990
43.424
5.376810
29.22
0.073710
--40.92
0.542580
117.253
3550
0.088730
44.082
5.319060
27.529
0.073970
--41.673
0.546650
115.36
3600
0.089200
45.12
5.259990
25.838
0.074200
--42.467
0.550400
113.481
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
LIFETIME BUY
Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25°C, 50 Ohm System) (continued)
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
9
7.62
0.305 diameter
2.49
3.48
5.33
2.54
1.27
1.27
0.58
0.86
0.64
LIFETIME BUY
3.86
Recommended Solder Stencil
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 20. Recommended Mounting Configuration
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
1.7
MMG3013NT1
10
RF Device Data
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
11
MMG3013NT1
12
RF Device Data
Freescale Semiconductor, Inc.
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
13
PRODUCT DOCUMENTATION AND SOFTWARE
Software
• .s2p File
Development Tools
• Printed Circuit Boards
LAST ORDER 1 JUL 11 LAST SHIP 30 JUN 12
Refer to the following documents and software to aid your design process.
Application Notes
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
• AN3100: General Purpose Amplifier and MMIC Biasing
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &
Tools tab on the part’s Product Summary page to download the respective tool.
LIFETIME BUY
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
4
Mar. 2007
• Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS
compliant part numbers, p. 6, 7
5
July 2007
• Replaced Case Outline 1514--01 with 1514--02, Issue D, p. 1, 11--13. Case updated to add missing
dimension for Pin 1 and Pin 3.
6
Mar. 2008
• Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
• Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
• Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, p. 8, 9
7
Feb. 2012
• Corrected temperature at which ThetaJC is measured from 25°C to 89°C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
• Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
• Removed ICC bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading
as bias is not a controlled value, p. 4--9
• Added .s2p File and printed Circuit Boards availability to Product Software, p. 14
MMG3013NT1
14
RF Device Data
Freescale Semiconductor, Inc.
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MMG3013NT1
Document
Number:
RF
Device
Data MMG3013NT1
Rev. 7, 2/2012
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